Asus Eee PC 4G Service Overview
Service overvie w 1-1 Ser vice Ov er view Car efully r ead thr ough this chapter for a look at various components of the Eee PC 4G (701) and necessar y ca utions and tools before perfor ming any ser vice and r e pairs. o provide the best service and support fo r the A SUS E ee PC 4G (701), we have provided the below information for technici ans from distribut ors and resellers to perform the complete disassembly and assembly . But before performi ng the procedures, please be sure to read through the overvi ew in this chapter for component overview, cautions and tools to avoid any unwarranted damages to the hardware. The following chapter includes: ⢠Ee e PC 4G (701) Overview ⢠Components ⢠Precautions ⢠Appropriate Tools Chapter 1 T
Service overvie w 1 â 2 E e e PC 4G (701) Ov er view and Components The ASUS Ee e PC 4G (701) is a product combining th e power of Intel® Mobile Processor. In this section, an overview for the Ee e PC 4G (701), along with its components, will be presented. E e e PC 4G (701) Ov er view The illustrations below show the overview from front view, right side view, le ft side view, and rear side view. Most of the parts will be discussed in this manual. OVERVIEW T ouchpad LCD Panel LCD Bezel Keyboard Power switch Camera LED status indicator
Service overvie w 1 - 3 Modem port Card reader Microphone port LAN port Air V ents Front view Kensin g ton Lock USB (2.0) ports DC-IN VGA p ort Battery Pack SPDIF/Headphone USB (2.0) ports
Service overvie w 1 - 4 Components The illustrations below show the components of the Ee e PC 4G (701). LCD Panel The illustration below shows the LCD display pane l. The Ee e PC 4G (701) comes with 7â TFT LCD Panel. Inverter Board The illustration below shows the inverter board, which is hidde n underneath the lower edge of the LCD front bezel. LCD Hinge The illustration below shows the LCD Hinges. LCD COMPONENTS LCD HINGE INVERTER BOARD MODULE
Service overvie w 1 - 5 LCD Case The illustration below shows the LCD case. Here is the LCD front cover, back cover. Keyboard The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, suc h as U.S., France and others. Top Case Module The illustration below shows the top case of the Ee e PC 4G (701). LCD CASE KEYBOARD TOP CASE&
Service overvie w 1 - 6 Touch Pad Module The illustration below shows the Touch Pad module, top and bottom view. Battery Pack The illustration below shows the battery packs of the Ee e PC 4G (701). Itâs located at bottom of the EEE PC 4G (701). Memory Module The illustration below shows the memory module for the Ee e PC 4G (701). MEMORY BATTERY TOUCHPAD
Service overvie w 1 - 7 Motherboard Module The illustration below shows the motherboard module of the Ee e PC 4G (701). Bottom Case Module The illustration below shows the bottom case module of the Ee e PC 4G (701), top and bottom view. Wireless LAN Module The illustration below shows the W ireless LAN Module of the Eee PC 4G (701). It contains W ireless LAN Card. MOTHER BOARD MODULE BOTTOM CASE WIRELESS LAN MODULE
Service overvie w 1 - 8 Ser vice Ov er view Please pay special attention to the cautions below to prevent any damages to the Ee e PC 4G (701) and also please be sure to select the appropriate tools described in this section to perform any services desired. Precautions Before you perform any service and or repair on the Ee e PC 4G (701), please follow the steps below first. 1. Be sure that the Ee e PC 4G (701) is powered down. 2. Disconnect the AC plug from the Ee e PC 4G (701) 3. Turn the E e e PC 4G (7 01) over. U nlock la tch 1 towards the direction of arrow and then unlock and hold the latch 2 to remove the battery. 4. Remove all rings, watches and any ot her metal objects from your hands. CAUTIONS 1 2
Service overvie w 1 - 9 5. Always wear a ground strap on your hand to protect the Ee e PC 4G (701) from static discharge. Appr opriate T ools The illustrations below show the appropriate tools tha t should be used for the Ee e PC 4G (701)âs service and repair. Phillips-hea d Screwdriver Use a Phillips-head screwdriver to fas ten/remove the K- or B-typed screws. Single-Slo tted Screwd river Use a single-slotted screwdriver to lock/u nlock the flexible cable connector locks Tweezers Use a pair of tweezers to remo ve/insert flexible cables. Insertion and extraction tool for FPC conne ctor Use insertion and extraction tool for FPC connector to handle locking and unlocking of FPC connectors. Vacuum Handling Tool FLATHEAD SCREW- DRIVER CROSS SCREW- DRIVER TOOLS INSERTION AND EXTRACTION TOOL FOR FPC CONNECTOR TWEEZERS VACUUM HANDLING TOOL
Service overvie w 1 - 10 Disassembl y Cautions Before you perfo rm any service and or repai r on the E ee PC 4G (701), please read the notice below first. ASUS hereby provides a b asic instruction for the di sassembly of ASUS products, i.e. to remove components and material s that require selective tr eatments, which are d efined by Annex II of the European Union (EU) Waste Elec trical and Electronic Equipm ent (WEEE) Directive 2002/96/ EC. This instruction is intended for the use of end-of-life recy clers or treatment facilities. Following is the list of Annex II of EU WEEE Directive 2002/96/EC. - polychlorinated biphenyl s (PCB) containing capa citors in accordance with Council Dire ctive 96/59/EC of 16 September 1996 on the dispos al of polychlorinated biphe nyls and polychlorinated terphenyls (PCB/PCT), - mercury containing components, su ch as switches or backlighting lamps, - batteries, - printed circuit boards of mobile phones gen era lly, and of other devices if the surface of the printed circuit board is greate r than 10 sq uare centimetres, - toner cartridges, liquid an d pasty, as well as colour toner, - plastic containing brominated flame ret ardants, - asbestos waste and compone nts which contai n asbestos, - cathode ray tubes, - chlorofluorocarbons (CF C), hydrochlorofluorocarbo ns (HCFC) or hydr ofluorocarbons (HFC), hydrocarbons (HC), - gas discharge lamps, - liquid crystal displays (to gether with their ca sing where appropriate) of a su rface greater than 100 square centimeters and all those bac k-lighted wit h gas discharge lamps, - external electric cables, - components containi ng refractory ceramic fibre s as described in Commi ssion Directive 97/69/EC of 5 December 1997 adaptin g to tec hnical progress Council Directiv e 67/548/EEC relating to the classification, packaging and labelling o f dangerous substances, - components containin g radioact ive substances wi th the exc eption of components that are below the exemption thresholds set in Arti cle 3 of and Annex I to Coun cil Directive 96/29/Euratom of 13 May 1996 laying down basic sa fety standards for the protection of the health of workers and the general publi c against the dangers arising from ioni si ng radiation, - electrolyte capacitors containing su bstances of concern (hei ght > 25 mm, diameter > 25 mm or proportionately similar volume) DISASSEMBLY CAUTIONS
Disassembly procedu re 2 - 1 Disassembl y Pr ocedur e Please follow the information provided in this section to perform the com plete disassembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. SUS Eee PC 4G (701)consists of various modules. This chap ter describes the procedures for the complete Eee PC 4G (701) disassembly . In addition, in between procedures, the detailed disassembly procedure of individual modules will be p rovided for your service needs. The disassembly procedure consis ts of the following steps: ⢠Battery Module ⢠Memory Module ⢠Keyboard Module ⢠WLAN Module ⢠Top Case Module ⢠LCD Module ⢠Motherboard Module Chapter 2 A
Disassembly procedu re 2 - 2 Battery Module The illustration below shows how to remove the battery modul e. Remove battery modu le 1 ï¼ Slide the battery lock to open it 2 ï¼ Slide the battery latch and hold the battery to remove it from system . Memory Module The illustra tion shows how to remove the memory module form the Eee PC 4G (701 ). Removing Memory module 1. Remove 2 screws (M2*4) on the memory cover then remove it from the system. BATTERY MEMORY MODULE MEMORY REMOVAL 1
Disassembly procedu re 2 - 3 2. Softly open the two latches to pop the memory mo dule up at 45 degree angles and then remove the memory at that angle. Keyboard Module The illustrati on of below shows h ow to remove the keyb oard Removing Keyboard 1. Turn over the NB and push the 3 latches (F1; F6;Pause) on keyboard module to lift the keyboard plate. KEYBOARD MODULE REMOVAL
Disassembly procedu re 2 - 4 2. Place the keyboard plate on the top case and di sc onnect the keyboard FPC to remove. Remo ving Keyboard Ca ble 1. Use a flexible connector tool to unlock the cable connector on both ends ( no. 1). 2. Carefully pull out the keyboar d cable (no. 2) with a p air of tweezers. 3. Lock the connector (no. 3) again to avoid possible break age. T op Case Module The illustrations below show how to disassemble an d remove the top case module of the Eee PC 4G (701). The module contains the top case itself. Removing Top Case Module 1. Disconnect the touch pad FPC and then re move 9 screws (M2*4) on top case. 1. Unlock 2. Cable out 3. 1. Unlock 3. TOP CASE REMOVAL TOP CASE MODULE
Disassembly procedu re 2 - 5 2. Close and turn the system upside down to remove 6 screws (M2*4) on the bottom case. 3. Softly pry the four sides of the system to open the latch hooks securing the top case with bottom case, then remove the top case.
Disassembly procedu re 2 - 6 4. Remove 1 piece of tape on the touch pad FPC then open the latch to disconnect it from touch pad board. 5. Remove 2 screws (M2*3) securing touch pa d bracket and then remove the bracket. 6. Remove the touch pad board from the top case.
Disassembly procedu re 2 - 7 WLAN Module The illustrati ons below sh ow how to rem ove the WLAN module from the Ee e PC 4G (701). Remove WLAN module 1. Remove 3 pieces of tape fixing the cable and then disconnect the following 4 cables, namely speaker cable, CMR cable, Fan cable, L VDS cable. 2. Remove 1 piece of tape fixing the micr ophone cable and disconnect the microphone cable from the mother board, and th en take the microphone module away . WLAN MODULE WLAN MODULE REMOVAL Speaker ca ble Camera cable Fan cable L VDS cable
Disassembly procedu re 2 - 8 3. Lift the mother board from bottom case by softly separating from the bottom side, two sides to the top. * pay attention not to rem ove the moth er board for now , for that the WLAN antenna is still connected with the m other board. 4 . Turn the LCD with its back cover on th e platform and hold th e mother board while disconnecting the two antennas. 5. Remove the mother board from the bottom case.
Disassembly procedu re 2 - 9 6. Remove 2 screws (M2*4) on the WLAN module to pop up the module at 30 degree angles and then remove it at that angle. Motherboar d The illustrations below show how to di sassemble and remove the Motherboard. Removing Motherboard 1. Tear off 2 pieces of tape fixing the Modem cable and disconnect the Modem cable from mother board. MOTHER BOARD MOTHERBOARD REMOVAL
Disassembly procedu re 2 - 10 2. Remove two screws (M2*3) securing the Modem module and then remove it from the mother board. 3. Remove 2 screws screwing the LCD hing es and then take the LCD display away. 4. Remove 1 piece of tape and 3 screws (M*4) secu ring the Fan module and then take the Fan module away.
Disassembly procedu re 2 - 11 L CD Module The illustrations below show how to remove and disasse mble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. Disassembling LCD Mo dule 1. Remove 8 rubber pads and screws (M2*4) on LCD front bezel. 2. Pry the four inner sides of LCD front bezel and separate it from LCD module. 3. Remove 2 screws (M2*4) on each LCD hinge and remove both hinges. LCD MODULE LCD MODULE DISASSEMBLY
Disassembly procedu re 2 - 12 4.Unscrew 4 (M2*4) screws securing the inve rter board and then take the LCD panel together with the inverter board away from LCD back cover . 5. Disconnect the inverter cable, LCD FPC cable from inverter board and take the board away .
Disassembly procedu re 2 - 13 6. Disconnect the coaxial cable from inverter board. 7. Tear off 1 piece of tape fixing camera cable and take the camera cable o ff cable guide. 8. Remove the camera board from LCD back cover and then take the whole module away.
Disassembly procedu re 2 - 14 9. T ake the WLAN antennas off cable guides and remov e the antennas tog ether with its tape from LCD bac k cov er . 10. T ake the speak er cables off cable guides and remov e both speakers from their slots .
Assembly procedure 3 - 1 Assembl y Pr ocedur e Please follow the infor mation pr ovided in this section to perfor m the complete assembly procedur e of the Eee PC 4G (7 01). Be sur e to use proper tools described befor e. fter you have completed the previous chapter of complete disa ssembly, please follow this chapter to assemble the Ee e PC 4G (701) back together. This chapter describes the procedures of the complete Ee e PC 4G (7 01) assembly. In addition, in between procedures, the detailed assembly procedure of individual modules will be provided for your service needs. The assembly procedure consis ts of the following steps: ⢠LCD Module ⢠Motherboard Module ⢠Top Case Module ⢠WLAN Module ⢠Keyboard Module ⢠Memory Module ⢠Battery Module Chapter 3 A
Assembly procedure 3 - 2 L CD Module The illustrations below show how to assemb le and install the LCD module of the Eee PC 4G (701). 1. Install the two speakers on LCD back cover and arrange the speaker cable well through cable guide . 2. Assembly the black and white antennas on LCD back cover and well arrange the antanna cables through cable guides. LCD MODULE
Assembly procedure 3 - 3 3. Install the camera board on LCD back cover, pay a ttention to the aiming pole. 4. Connect the coaxial cable with inverter board. 5. Connect the inverter cable, LCD FPC cable with inverter board.
Assembly procedure 3 - 4 6. Install the LCD panel together with the inverter board on LCD back cover and then secure 4 screws (M2*4) on it. 7. Assemble both hinges and secure 2 screws (M2*4) on each.*pay attention to differences between the left and right. 8. Install the LCD front bezel on LCD back co ver and press the sides to fix them w ell.
Assembly procedure 3 - 5 9. Secure 6 screws (M2*4)on LCD front bezel and then fix 6 r ubber pads on it. Motherboar d The illustrations below show how to assemble and install the motherboard of the Eee PC 4G (701). 1. Install the Fan module on bottom case, secure 3 screws on it and fix 1 piece of tape on the cable. 2. Hold the LCD to fix its hinges on botto m case and then secure 2 screws(M2*4). MOTHERBOARD MOTHERBOARD ASSEMBLY
Assembly procedure 3 - 6 3. Connect the Modem module with the mother board and then secure 2 scews (M2*3) . 4. Connect the Modem cable with the mother board and then arrange the cable to fix 2 pieces of tape on it.
Assembly procedure 3 - 7 Wireless LAN Module The illustrations below show how to assemb le and install the Wireless Lan Module of the Eee PC 4G (701). Installing Wireless LAN Module 1. Insert WLAN module into its slot at 30 degrees angles and press it down softly, then secure 2 screws (M2*4) on it. 2. Hold the mother board on bottom case an d then connect the WLAN antennas with WLAN module. WIRELESSLAN MODULE INSTALLATION
Assembly procedure 3 - 8 3.Install the mother board on bottom case, to install you should first install the top side,then softly pry the two sides to the ports ends fit the bottom ca se well, finally press the bottom side to lock the two latches. *make sure the antennas arrangeed through the hook at mother board, and all the cables placed above the mother board. 4. Install the microphone , connect it with the mo ther board and then fix 1 piece of tape on the cable.
Assembly procedure 3 - 9 5. Connect the following cables and fix 3 pieces of tape on it. Speaker ca ble Camera cable Fan cable L VDS cable
Assembly procedure 3 - 10 T op case Module The illustrations below show how to assemb le and install the top case module of the Eee PC 4G (701). 1. Install the touch pad board on top case. 2. Install the touch pad bracket and th en secure 2 screws (M2*4) on it. TOP CASE MODULE
Assembly procedure 3 - 11 3. Connect touch pad FPC with touch pad board , fix the connector latch and then fix 1 piece of tape on it. 4. Install the top case with bottom case and pr ess the four sides to make them fixed well. 5. Secure 6 screws (M2* 4) on the bottom case.
Assembly procedure 3 - 12 6. Connect the touch pad FPC and then secure 9 screws (M2*4) on it. Assembling Keyboard The illustrations below show ho w to assem b le and install the Keyboard of the Eee PC 4G (701). 1. Connect keyboard FPC with top case. KEYBOARD ASSEMBLY KEYBOARD
Assembly procedure 3 - 13 2. Assemble the keyboard plate and press the 3 la tches (F1; F6;Pause) in keyboard to lock it. Memor y Module The illustrations below show how to install th e external Memory Module of the Eee PC 4G (701). 1 . Inse rt Memory at the same 45 ° angles and press down until it clicks into the latches. 2. Install the Memory cover and then secure 2 screws (M2*4)on it. MEMORY MODULE INSTALL
Assembly procedure 3 - 14 Battery Module The illustrations below show how to install battery module of the Eee PC 4G (701). Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock . BATTERY MODULE
Upgrade & replacement 5 â 1 Upg r ade & R eplacement F ollow the individual pr ocedur es in this ch apter to perfor m the Eee PC 4G (701)â s upgrade and r eplacement of v arious major components. sus Ee e PC 4G (701) is a 2 spindles product, which means there are less options for you to upgrade and replacement. The key upgradeable and replaceable items include the Memory module. In order to avoid redundancy, please refer to chapters 2 and 3 of this manual for repeated and reused disassembly and assembly procedures, such as keyboard & heat sink replacement, which is used by several different procedures in this chapter. Be sure to follow the safety in structions described in Chapter 1 to safeguard t he Eee PC 4G (70 1) against any potential d amages. For any other components which you need to replace not covered in this chapter, plea se refer to Chapters 2 and 3 for detailed disassembly and assembly and perform necessa ry procedures accordingly. This chapter includes the following items: ⢠Memory Upgrade Chapter 4 A
Upgrade & replacement 4 - 2 Memor y Upg r ade Upgrading Memory Module Remove battery modu le 1 ï¼ Slide the battery lock to open it 2 ï¼ Slide the battery latch and hold the battery to remove it from system . Removing Memory module 1. Remove 2 screws (M2*4) on the Memory cover then remove it from the system. 1 MEMORY REMOVAL MEMORY
Upgrade & replacement 4 - 3 2. Softly open the two latches to pop the Memory module up at 45 degree angles and then remove the Memory module at that angle. Installing Memory Mod ule 1. Insert Memory at the same 45 ° angles and press down until it clicks into the latches. 2. Install the Memory cover and th en secure 2 screws (M2*4) on it.
Upgrade & replacement 4 - 4 Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock .
Hard w are Technical Specification 5-1 Har d ware Specifications You can enjoy and utilize the Eee PC 4G (701) Notebook more effectively with a better comprehension of detailed hardw are specifications of the notebook. his chapter lists the detailed specifications of the notebookâs main system and modules. Please refer to this section when you need to find out specific te chnical data about the notebook. This chapter contains the following information: z MARKETING SPECIFICATION z CHIPSET LIST z KEY PARTS LIST z SYSTEM z I/O PORT PIN ASSIGNMENT z POWER MANAGEMENT z MODULE SPECIFICATION Chapter 5 T
Hard w are Technical Specification 5-2 L IST OF F IGURE S 1 MARKETING SPEC Eee PC 4G (701) Specification (One-Spindle Design) Product Family EEE PC 4G (701) CPU Type Intel Celeron-M-ULV Dothan Speed 900MHz(normal run 630MHz) Package FCBGA 479 Onboard L2 Cache Yes Size 512 KB On-die cache memory Memory Type DDR II SDRAM without ECC Base Memory None Expansion Memory 256/512MB/1GB SO-DIMM x 1 Slot MAX 2GB LCD Size 7â Resolution WVGA Panel Type TFT Interface LVDS Contrast Control None Brightness Control Hot-key HDD type Onboard / Flash Module Flash Module option Ultra DMA 66 Yes Size Onboard 4G / Flash Module 16G Chip Set Intel Sonoma Platform North Bridge Intel 910GML/910GMLE South Bridge Intel ICH6-M Super IO N/A Thermal Sensor G781P8F Micro-Pr ocessor ENE KB3310 KBC ENE KB3310
Hard w are Technical Specification 5-3 Flash ROM (SPI) SST/Winbond/MXIC 4Mbits Graphic Accelerato r Intel 910GML internal GPU 3D Yes Controller Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory Share Memory TV Out Support No Sound System Controller Realtek ALC662 SW wave table Yes FM synthesizer Yes Speaker Stereo I/F Azalia PC99 Yes S/PDIF None 6 channel output Yes Audio Amplifier TPA6017A2PWP Microphone Mono Modem CONEXANT Controller CONEXANT Spec 56K I/F Azalia MDC Jack RJ-11 RJ-11 port ACPI Yes V.90 Yes Voice Phone No Digital Line Protection Yes Wake On Ring Yes LAN Yes Jack RJ-45 RJ-45 port Wake On LAN YES
Hard w are Technical Specification 5-4 Controller Atheros L2 Internal Keyboard Key 80 Keys (W/ MS-Windows function keys) Function Key 12 Function Keys Hot Key Function 1 3 Hot Keys Suspend (STR or STD) Fn F1 Wi-Fi enable Fn F2 802.11b g Application m anager Fn F 6 Brightness Up Fn F4 Brightness Down Fn F3 LCD/CRT Fn F5 PC Speaker Volume Fn F7 On/Mute PC Speaker Volume Fn F9 Volume increase PC Speaker Volume Fn F8 Volume decrease Number Lock Fn F 11 Scroll Lock Fn F 12 Print screen Fn Ins Sys Rq Fn Del Instant Keys None Status Indication 4 LEDs Power Status Yes (Yellow on LED when Power on. Blinking when in SUSPEND mode. OFF when power off.) Battery Charge Status Yes (Orange when ch arging. Blinking when battery low. OFF when fully charged/empty.) HDD LED Yes (Yellow while a ccessing) Number Lock LED None Caps Lock LED None Scroll Lock LED None W-LAN LED Blue Pointing Device Glide Pad Synaptics
Hard w are Technical Specification 5-5 Glide Pad Yes Right Button Yes Left Button Yes Scroll Yes Function Contr ol Power On Button Yes LCD Brightness Yes Hot Keys LCD Lid Switch Yes Sound Volume Yes Hot Keys Password Override Yes (Master Password ) Reset/Force Off Yes (Reset switch ) I/O Port All ports support hot-plug Parallel N/A CRT Yes 15-pin D-Sub Mouse/Keyboa rd N/A IrDA Port N/A Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In Jack N/A Mic In Jack Yes Head Phone Jack Yes Stereo out USB port Yes 3 Ports DC-In Yes 22W Heat Solution Heat Pipe N/A Heat Sink N/A FAN Support Yes AC Adaptor Delta Input AC 100 -24 0Volt, 50~60Hz Output DC 9.5V, 2.315A, 22W 1 st Battery 4 Cells 7.4V 5200mAh Type Li-ION(5 200mAH)
Hard w are Technical Specification 5-6 1st Battery æ°ï¦ç Charging time Li-ION (5200mAH) Machine ON TBD. Machine OFF TBD. Battery Life TBD. PM Off TBD. PM On TBD. Power Managem ent AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.1 Security Password Yes Password overridden by Master passwo rd Security Lock N/A S/W Install OS Linux Flash BIOS Yes Drivers Chipset Driver Yes VGA Driver Yes AUDIO Driver Yes LAN Driver Yes Glide Pad Driver Yes Modem Driver Yes WLAN Driver Yes
Hard w are Technical Specification 5-7 2 CHIPSET LIST Chipset Summary Table Function EEE PC 4G (701) HW ACPI/PC99 CPU Intel Dothan Not required SRAM (L2 Cache) 512KB Not required North Bridge Intel 910GML/910GM LE YES South Bridge Intel ICH6-M YES MEMORY DDR II SDRA M Not required BIOS ROM SST/Winbond/MXIC 4Mb Not required VGA Intel internal graphic YES SUPER I/O N/A PCMCIA N/A AUDIO Azalia CODEC YES AUDIO AMPLIFIER TPA6017A2PWP Not required KB CONTROLLER ENE KB3310 YES IrDA N/A CLOCK Generator CS9LPR426 YES MODEM CONEXANT YES Bluetooth N/A 1394 N/A LAN Atheros L2 YES
Hard w are Technical Specification 5-8 2.1 CPU 2.2 CHIPSET 2.2.1 North Bridg e Function: Full support 32bits AGTL host bu s ad dressing Supports DDR2-400 device Integrates the graphic controller Support Intel Rapid Memory power managem ent Enhanced Intel SpeedStep technology DMI x2/x4 Interface connect to ICH Processor Type: Intel Dothan Processor Intel Celeron-M ULV 353 Processor frequency: 900MHz (normal run 630M Hz) Construction method: FCBGA479 Supply voltage: Core:0.85V(High_Frequen cy_Mode)~0.75V(lowest_Frequen cy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB write- back data cache. On-die , 512KB second level cache with Advanced Transfer Cache Architecture. Data Prefetch. Streaming SIMD extensions 2(SSE2). 400 MHZ FSB support
Hard w are Technical Specification 5-9 Vendor: Intel Parts Number: 910GML/910GMLE Package: 1257 -ball micro-FCBGA 2.2.2 South Brid ge Function: DMI x2/x4 interface link with GMCH Integrated PC/AT compatible system (DMA Co ntroller, INT, Timer/Counters) Integrated one channels IDE controller with Ultra DMA/33/66/100 support Integrated USB 1.1 and 2.0 Host Bus controller with 8 USB ports Integrated HD Audio Interface Build-in RTC LPC Interface Vendor: Intel Parts Number: ICH6-M Package: 609 -ball BGA 2.3 DRAM MEMORY 2.3.1 ON-BOA RD MEMORY None
Hard w are Technical Specification 5-10 2.3.2 EXPANSION ME MORY Number of sockets: Bus: Supply voltage: Functional features: Hardware features: One 200 pin SO-DIMM slot 64-bit data path 1.8V Supports up to 16 simultan eou s open pages Supports DDR2 400 DDR devices Maximum of 2GB of system memory Parity support: without ECC 2.4 BIOS ROM ROM Type: Package: Supply voltage: Serviceability: SST/Winbond/MXIC Flash Memory 8-lead SOIC 3.3V End user upgradeable for the firmware 2.5 INTERNAL VGA CONTROLLER Function features: 3D Setup and Render Engine Integrated 24 bit RAMDAC that can drive a standard progressive scan analo g monitor up to 2048 X 1536 CRT resolution at a maximum refresh rate of 75 Hz Single or dual channel LVDS panel supp ort up to 112MHZ TV out resolution up to 1024x768 Vendor: Intel Chipset 910GML/910GMLE
Hard w are Technical Specification 5-11 2.6 KEYBOARD CONTROLLER Function features: Embedded controller-style host Support hardware speed-up of GateA20 and RC Local 18x8 keyboard switch matrix support Three industry standard serial keyboard interfaces All three ports are bi-directional Vendor: Parts Number: Package: ENE KB3310 128-pin LQFP 2.7 AUDIO CODEC Vendor: Parts Number: Package: Realtek ALC662 48-pin LQFP 2.8 AUDIO AMPLIFIER Function features: Max 1.5w Stereo Audio Amplifier with 8 ohm load Depop Circuitry Fully Differential Input Vendor: Parts Number: Package: TI TPA6017A2 20pin TSSOP
Hard w are Technical Specification 5-12 2.9 LAN & MODEM 2.9.1 LAN Function features: Scatter and gather transmit receive DMA Interrupt coalescing 10Mb/s, 100Mb/s, operation Compliant to ACPI 2.0 specification Compliant to IEEE 802.3u Auto-Negotiation Support Wake-on-LAN fun ction and remote wake up (Magi c Internal transmit and receive FIFO(2KB *2) Vendor: Parts Number: Package: Atheros L2 64-Pin LQFP 2.9.2 MODEM Function features: V.90 and K56 flex support Integrated PnP functionality PC99 compliant Support both APM and ACPI power management Support Wake-on-ring functionality Vendor: Parts Number: Package: Askey 1456VQL-R3(INT-RoHS ) Azalia MDC
Hard w are Technical Specification 5-13 3 KEY PARTS LIST Key Parts Summary: 3.1 Display WVGA Technology: Active color (TFT: Thin Film Transistor) Size: 7âW Resolution: WVGA (800 X 480) Dimension: 164mm(H) * 103mm(V) * 5.1mm(T ) Pixel Pitch: 0.1905mm * 0.1905mm Display Colors: 16M Colors Vendor: AUO VGA Technology: N/A Size: Resolution: Dimension: Pixel Pitch: Display Colors: Vendor: 3.2 Touch Pad Dimensions: S ensor Effective Areas: Interface: X/Y Position Resolution: Customizing: 47.8(W) x31.9(H) x 0.85(T) (Unit: mm) 35.5 (W) x 28.9 (H) (Unit: mm) PS/2 40 points / mm (graphics mode) Custom color can be printed on the sensor pad Functional features: Accurate positioning Low fatigue pointing action Low power consumption Software configurable Scanner function for signat ure Low profile, compact size and low wei ght
Hard w are Technical Specification 5-14 Vendor/Model Synaptics : SYNAPTICS/TM-01058-002 3.3 Keyboard Function Feature: Hardware Feature: Compatibility: Standard Notebook-Keyboard Simultaneously use of internal and external keyboard Easily to assemble or disassemble MS-Windows 2000/ XP Dimensions: Type: Total Travel: Key Top: Language Version s: 211.70 (H) x 80.70 (V) (Unit: mm) Key switch membrane 1.5 /- 0.2 (Unit: mm) According to Attach Drawing English, Japanese, Chinese, Korean and Europ ean etc. 3.4 Battery 3.4.1 Main Battery Purpose: Gas-gauge: Main power supply battery SMBus interface Chemistry: Voltage: Capacity: Power: Vendor: Duration: Charge Metho d: Charging Source: Gas-gauge: Li-ion rechargeable b attery Nominal 7.4V Typical 1300 mAH (Single-cell) 65.12 W-Hrs æ°ï¦ç About 3 hours (Depend on sy stem confi guration) Fast Charge: 2.5 hours (while System off) â85% up AC adapter
Hard w are Technical Specification 5-15 3.4.2 RTC Backup Battery Purpose: Chemistry: Voltage: Capacity: Vendor: Backup the RTC/CMOS data While AC adapter off & Main Battery removed Coin cell 2032 Li-ion battery Nominal 3V 200mAH KTS 3.5 AC/DC Adapter The notebook can be powered eithe r by an external AC adapter or by an internal battery pack. The AC ada pter is used as power source for the DC/DC conve rter and as constant curre nt sou rce for the battery pack. Input Requirements: AC line voltage: AC line current: AC line frequency Efficiency 100V to 240V AC, Full Range 2.315A 50 Hz to 60 Hz 85% min. Output requirements: Output-Voltage Output-Current Ripple voltage 9.5V DC max.2.315A Power cord: DC Cable length: Plug to the adapter 180 mm /- 50mm Regulatory: EMI: Safety: FCC Class B CISPR 22 Class B .Dimension: (L) 1 08 x (W ) 46 x (H) 29.5 mm
Hard w are Technical Specification 5-16 4 SYSTEM 4.1 System diagram 4.2 Main components block diagrams TBD
Hard w are Technical Specification 5-17 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 PS2 Keyboard IRQ 8 System CMOS/RTC IRQ 9 ACPI IRQ Holder IRQ12 PS2 TP IRQ13 Numeric data processor IRQ14 Master IDE Controller IRQ15 Primary IDE Controller IRQ16 PCIE Root Port IRQ16 USB Controller IRQ16 Microsoft UAA IRQ16 910GML Express Chipset Family IRQ17 Lan Controller IRQ17 PCIE Root Port IRQ18 Wireless Network Adaptor IRQ18 PCIE Root Port IRQ18 USB Controller IRQ19 USB Controller IRQ23 USB Controller IRQ23 USB2 Enhance Host Controller 4.3.2 ISA DMA Map DMA Channel Dev ice DMA 4 DMA Controller
Hard w are Technical Specification 5-18 4.3.3 PCI INT Map N/A 4.3.4 PCI Bus Master Map N/A 4.3.5 IDSEL N/A
Hard w are Technical Specification 5-19 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION CRT Display (Ana log) Flash module LCD KEYBOARD TOUCHPAD&LED 1 ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .USB Universal Serial Bus LAN & Modem .Card Reader Universal Serial Bus . WLAN MINI PCIE
Hard w are Technical Specification 5-20 5.1 CRT Vendor Part No. Pin No. ALLTOP C10511-11505-B 15 Pin (DIP) No Pin Assignment (by: sort) Description 1 RED Video (analog) Red this DAC analog o utput drives the CRT interface. 2 GREEN Video (analog) Green this DAC analog output drives the CRT interface. 3 BLUE Video (analog) Blue this DAC analog output drive s the CRT interface. 4 MONITOR ID Bit 2 NC 5 GROUND Ground 6 RED Return (ground) Ground 7 GREEN Return (ground) Ground 8 BLUE Return (ground) Ground 9 Power 5V 10 SYNC Return (ground ) Ground 11 MONITOR ID Bit 0 NC 12 MONITOR ID Bit 1 DDC monitor data 13 HSYNC CRT Horizont al Sync this output is The Horizontal sync pulse for the CRT Monitor. 14 VSYNC CRT Vertical Sync this out put is the Vertical sync pulse for the CRT Monitor. 15 MONITOR ID Bit 3 DD C mo nitor clock
Hard w are Technical Specification 5-21 5.2 Flash module pin assignment Vendor Part No. Pin No. 52 Pin (DIP) Pin No. Pin No. Remark 1. IDE_DD0 2. IDE_DD15 3. IDE_DD1 4. GND 5. IDE_DD2 6. IDE_DD14 7. IDE_DD3 8. IDE_DD13 9. GND 10. IDE_DD12 11. IDE_DD4 12. IDE_DD11 13. IDE_DD5 14. IDE_DD10 15. GND 16. IDE_DD9 17. IDE_DD6 18. GND 19. IDE_DD7 20. IDE_DD8 21. GND 22. IDE_RST#1 23. S_SATA_RXN0 24. IDE_DIOW# 25. S_SATA_RXP0 26. IDE_PCSEL#1 27. GND 28. IDE_DIOR# 29. GND 30. IDE_DDACK# 31. SATA_TXN0 32. IDE_DDREQ 33. SATA_TXP0 34. GND 35. GND 36. USBPN0 37. IDE_DA0 38. USBPP0 39. IDE_DA1 40. GND 41. IDE_DA2 42. IDE_IORDY 43. NC 44. IDE_IRQ 45. IDE_DIAG#1 46. IDE_DCS#1 47. VCC_FLASH 48. IDE_DCS #3 49. VCC_FLASH 50. GND 51. VCC_FLASH 52. FLASH_LED#1
Hard w are Technical Specification 5-22 5.3 LCD pin assignment Vendor Part No. Pin No. I-PEXV WTOB_CON_20P 20 Pin (SMD) No. Signal Description Typ e 1 3V_LCD P 2 LCD_CSB_D O 3 LCD_VSYNC O 4 LCD_SCL I/O 5 LCD_SDA I/O 6 LVDD_EN I 7 GND P 8 LA_DATAN0 I/O 9 LA_DATAP0 I/O 10 LA_DATAN1 I/O 11 LA_DATAP1 I/O 12 GND P 13 LA_DATAN2 O 14 LA_DATAP2 P 15 LA_CLKN O 16 LA_CLKP O 17 GND P 18 BL_PWM_DA I 19 BL_EN I 20 12V_LEDIN P
Hard w are Technical Specification 5-23 5.4 Internal keyboard pin assignment Vendor Part No. Pin No. InnovACE FPC_CON_28P 28 Pin (SMD) No Signal Description Typ e 1 KSO0 O 2 KSI0 I 3 KSO1 O 4 KSO2 O 5 KSI1 I 6 KSO3 O 7 KSI2 I 8 KSO4 O 9 KSI3 I 10 KSO5 O 11 KSI4 I 12 KSI5 I 13 KSO6 O 14 KSI6 I 15 KSI7 I 16 KSO7 O 17 KSO8 O 18 KSO9 O 19 KSO10 O 20 KSO11 O 21 KSO12 O 22 KSO1 O 23 KSO13 O 24 KSO14 O 25 KSO3 O 26 KB_ KSO15 O 27 NC_KSO17 O
Hard w are Technical Specification 5-24 28 NC_KSO16 O *** 5.5 Internal Touch Pad & LED Pin assignment Vendor Part No. Pin No. ENTERY FPC_CON_12P 12 Pin (SMD) No Signal Description Typ e 1 GND Ground P 2 TP_L P 3 TP_L P 4 5V_TP Power I 5 5V_TP Power I 6 TP_DATA Data I/O 7 TP_DATA Data I/O 8 TP_CLK Clock Signal I 9 TP_CLK Clock Signal I 10 TP_R P 11 TP_R P 12 GND Ground I
Hard w are Technical Specification 5-25 5.6 1 ST Battery pin assignment No Signal Description Typ e 1 BAT_IN# Power P 2 BAT I 3 BAT I 4 BAT_ID O 5 GND Ground P 6 BAT_TS O 7 BAT_CONFIG O 8 NC NC 9 GND Ground P 5.7 DC in Jack pin assignment Vendor Part No. Pin No. SINGATRON DC_PWR_JACK_3P 3Pin (DIP) No Signal Description Typ e 1 A/D_DOCK_IN Adapter input voltage P 2 GND Ground P 3 GND Ground P
Hard w are Technical Specification 5-26 5.8 Audio Jack 5.8.1 Internal Speaker Jack Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Type 1 INTSPKR- Internal speaker si gnal right channel negative O 2 INTSPKR Internal speaker sign al right channel positive O 3 INTSPKL- Internal speaker si gnal left channel negative O 4 INTSPKL Internal speak er si gnal left channel positive O 5.8.2 Headphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Typ e 1 GND_AUDIO Ground P 2 HEADPHONE_J ACK_L Headphone left sound O 3 HEADPHONE_J ACK_R Headphone right sound O 4 GND_AUDIO Ground P 5 EAR_SW# S/PDIF/Head phone be plugged in I 6 NC NC NC
Hard w are Technical Specification 5-27 5.8.3 Microphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Type 1 GND_AUDIO Ground P 2 MIC1_JACK_L External microphone input I/O 3 MIC1_JACK_R External microphone input I/O 4 GND_AUDIO Ground P 5 MIC_SW# Control internal MIC O 6 NC NC NC 5.9 Fan Pin Assignment Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Typ e 1 5V 5V Power Supply P 2 FAN_TACH FAN speed signal output O 3 FAN_PWM FAN sp eed signal input I 4 GND Ground P 5.10 MDC signal Vendor Part No. Pin No. TYCO BTOB_CON_12P 12 Pin (SMD) No Signal Description Typ e 1 GND Ground P 2 None None NC 3 ACZ_SDOUT_MD C Azalia data output signal I
Hard w are Technical Specification 5-28 4 None None NC 5 GND Ground P 6 3VAUX_MDC 3.3V power turned off during S4 P 7 ACZ_SYNC_MDC Azalia sync signal I 8 GND Ground P 9 ACZ_SDIN1_MD C Azalia data input signal O 10 GND Ground P 11 ACZ_RST#_MDC _R Azalia reset signal I 12 ACZ_BCLK_MDC Azalia bit clock signal I 5.11 USB pin assignment Vendor Part No. Pin No. SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB12_CON USB 5V power P 2 USBPN1 USB port 1 negative signal I/O 3 USBPP1 USB port 1 positive signal I/O 4 GND ground P Vendor Part No. Pin No. SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB34_CON USB 5V power P 2 USBPN2 USB port 2 negative signal I/O 3 USBPP2 USB port 2 positive signal I/O 4 GND USB 5V ground P Vendor Part No. Pin No.
Hard w are Technical Specification 5-29 SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB34_CON USB 5V power P 2 USBPN3 USB port 3 negative signal I/O 3 USBPP3 USB port 3 positive signal I/O 4 GND USB 5V ground P 5.12 LAN & Modem pin assignment Vendor Part No. Pin No. ALLTOP MODULAR_JACK_12P 12 Pin (SMD) No Signal Description Typ e 1 None Non e NC 2 MODEM_TIP Modem signal I/O 3 MODEM_RING Modem signal I/O 4 None Non e NC 5 LAN_TXP Transmit data positive sig n al O 6 LAN_TXN Transmit data negative signal O 7 LAN_RXP Receive data positive signal I 8 LAN_CON4 5 Connect 75 ohm to ground I 9 LAN_CON4 5 Connect 75 ohm to ground I 10 LAN_RXN Receive data negative si gnal I 11 LAN_CON78 Connect 75 ohm to ground I 12 LAN_CON78 Connect 75 ohm to ground I
Hard w are Technical Specification 5-30 5.13 Card Reader pin assignment Vendor Part No. Pin No. PANASONIC SD_SOCKET_9P 9 Pin (SMD) Pin No Signal Remark 1. UB_SD_DATA3 2. UB_SD_CMD 3 GND 4 3V_SD 5 UB_SD_CLK 6 GND 7 UB_SD_DATA0 8 UB_SD_DATA1 9 UB_SD_DATA2
Hard w are Technical Specification 5-31 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Devices 12V VSUS_ON Other Control 5V SUSB_ON LCD, Flash, Flash & Wlan LED, Fan, Camera, Codec, Audio, SB 3V SUSB_ON NB IO, SB, LCD, Card reader, Codec, Audio 1.8V_DUAL SUSC_O N NB, DDR2 powe r 5VSB VSUS_ON SB, USB, Charge & Power LED 3VSB VSUS_ON SB, Audio, Clock Generator, PCIE interface 1.5V SB Core, NB Core 2.5V SB Core, NB Core, Onboard VGA VTT_DDR DDR2 Power VCORE H_CPURST# CPU power 3VA LCD, EC, BIOS, Keyboard VCC_RTC ICH6-M (RTC) VCCP CPU_VRON CPU power, SB Core, NB Core 6.2 Power management mode 6.2.1 Full-On mo de All system devices are not power managed and the sy stem can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slow do wn but all oth er devices are full on. 6.2.3 Stand by mode A suspend state where all motherboard components ar e still powered-on ex cept for the system clock generator device. The PCI and CPU b uses are driven to the inactive idle state. The system memory is powered and refreshed by the memory bridge, an d the graphi cs frame buffer is powered and refreshed by the graphic chip. The system provides a 32K Hz clock (SUS CLK) in this suspend mode to support refresh of these memory subsystems. Only an enable d âresume eventâ can bring the system out of the stand by state. The south bridge also provides a resu me timer that allows the system to re su me after a programmed time has elap sed. 6.2.4 Suspend to RAM mode (STR) A suspend state where all mother board components are powered-off. The CPU and PCI busses are powered off. All devices connected to the CPU and PC I busses must either be powered-off or isolate their bus interfaces. The system memory is pow ered and refreshed by the memory bridge, and the graphics frame buffer is powered and ref reshed by the graphics chip. The system provides a 32 kHz
Hard w are Technical Specification 5-32 clock (SUSCLK) in this suspend mode to support refresh of these memory subsystems. Only an enabled âresume eventâ can bring the platform out of the susp end to RAM (STR) state. 6.2.5 Suspend to disk mode (STD) A suspend state where the context of the entire sy ste m is saved to di sk, all motherboard components are powered-off, and all clocks are stopped. Any enabled âresume eventâ, such as Power switch or RTC, can bring the platform out of the suspend to disk (STD) st ate. 6.2.6 Soft off mode (SOFF) This is the same as suspend to di sk except the context of memory is not saved. The system will resume from Soft Off as if a hard reset had occurred. 6.2.7 Mechanical off mode (MOFF) All power except the RTC has been removed from the system. 6.3 PMU mode transition event The following table summarizes the entry events and wake-up events of each power management mode. Power State Entry Event Wake up Event Doze Doze Time out Predefined Memory/IO ra n ge access Ring Indicator Keystroke Mouse movement IRQ 1-15 Stand by Stand by Time out Stand by hot key pressed Predefined Memory/IO range acce ss Battery Warning Battery Low Ring Indicator Keystroke Mouse movement Schedule Alarm STR Suspend Time out STR hot key pressed Suspend button Battery Low Power Button Ring Indicator Keystroke (Int. KB) Schedule Alarm STD Suspend Time out STD hot key pressed Hibernate Battery Low Power Button Schedule Alarm Soft Off Power button Execute Windows shutdown command Power Button Schedule Alarm
Hard w are Technical Specification 5-33 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action LCD STR/STD LCD OFF No action Full on No a ction No action Stand by No action No action CRT STR/STD No action No action Full on LCD OFF/CRT ON No action Stand by No action No action SIMUL STR/STD No action No action LCD display will be shut down while closing LCD. 6.3.2 Power button Power button function depend s on the d efinition in Windows power setting or you can force of f by pressing power button for 4 se conds . To reset the system, you need to pre ss the reset button. 6.4 Device Power management Power state of local devices table Power State Component Doze Stand By STR STD/SOff CPU Quick Start Stop Clock Power Off Power Off North Bridge ON Stop Clo ck Power Off Power Off South Bridge ON ON Power Off (except 3VA, RTCVCC ) Power Off (except 3VA, RTCVCC) DDR ON Self Refresh Self Refresh Power Off Onboard FLASH ON Power down Power Off Power Off KBC ON ON Power down Power Off VGA ON Power down Power Off Power Off Audio CODEC ON ON Power Off Power Off Audio Amplifier ON Power down Power Off Power Off LCD Backlight ON Power Off Power Off Power Off LAN ON Power down Power down Power do wn
Hard w are Technical Specification 5-34 Modem ON Power down Power Off Power Off WLAN ON Power down Power Off Power Off 6.4.1 Device PM control during Stand By mode Device Power Controlled by Description CPU Hardware PCMCIA Controller Software Enter PCI PM D3Hot s tate EC Chip Working Keyboard Controller Working KB3310 support power down command USB Working Onboard FLASH Software support power down com mand Audio AMP Hardware Controlled by Jack in detect Modem Software Enter PCI PM D3Hot state LAN Software Enter PCI PM D3Hot state LCD Panel Back light Hardware Clock Synthesizer Hardware WLAN Software 6.4.2 Device PM control during STR mode Device Po wer Do wn Contro lled by Description EC Chip Hardware Power Do wn Onboard FLASH Hardware Power Off Modem Software Power Off LAN Software Power Down USB Hardware Power Down Audio CODEC Software Power Off Audio AMP Hardware Power Off WLAN Software Power Off LCD Panel Ha rdware Power Off LCD Back light Ha rd ware Power Off Clock Synthesizer Hardware Power Off Keyboard Controller Software Controlled by KB3310 power down com mand
Hard w are Technical Specification 5-35 6.4.3 Device PM control during STD mode Device Po wer Do wn Controlled by Description Core Logic Hardwar e Power off (ex cept R es ume Well) EC Chip Hardware Power off VGA Chip Ha rdware Power off Onboard FLASH Hardware Power off PCMCIA Controller Hard war e Power off Modem Hardware Power off LAN Hardware Power off USB Hardware Power off Audio Chip Hard war e Power off Audio AMP Hardware Power off WLAN Hardware Power off LCD Panel Hardware Power off Back light Hardware Power off Clock Synthesizer Hardware Power off Keyboard Controller Hardware Power off
Hard w are Technical Specification 5-36 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the follo w ing PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (FCBGA 479) Main Board Main System board Inverter Board LCD Module Back-lig ht TOUCH PAD&AUDIO DJ BOARD 4 LED Indicators, 2 Touch Pad Button, 5 Audio DJ button SO-DIMM Module Memory Expansion Modem Board MDC 7.2 Processor Feature: Celeron M CPU with on-die L2 ca ch e. FCBGA 479 [CPU Cooling System] Function: Dothan Core FAN is controlled by a thermal sensor and BIOS/ACPI OS.
Hard w are Technical Specification 5-37 7.3 Main board 7.3.1 Main system module spec Feature: CPU Celeron M, NB 910GML, SB ICH6M, Clock generator, SO-DIMM PC/AT compatible syst em (RTC, DMA, INT, Timer, ⦠etc) IDE controller with PIO Mode 4 & Ultra-33/66/100, PCMCIA /Cardbus controll er & their sockets Audio CODEC, Audio amplifier, CPU thermal se nsor, I/O connectors, Power management control circuit, Internal Graphic/Display controll er, Keyboard Controller, Audio analog signal, Power control, DC/DC, Battery power Regulated power SM bus for Battery Indication Charger LE D Indication Power LED Indication WLAN LED Indication FLASN Access LED â¦etc
Hard w are Technical Specification 5-38 7.3.2 DC/DC module spec Controller: ISL6262CRZ, TPS51020, ISL622 7CAZ, Input voltage: 8-20V Output voltage/current: Voltage Current Regulation 3VA 60mA -5% 3VSB 1.74A -5% 5VSB 1.38A -5% 1.5V 1.88A -5% 5V 1.09A -5% 3V 566Ma -5% 2.5V 100mA -5% 1.8V_DUAL 4.5A -5% VTT_DDR 121mA -5% VCCP 2.07A -5% VCORE 2.96A -5% Support OVP Support OCP 7.3.3 Charger Charger spec Controller: MAX8724ETI Input voltage: 9.5~12V Charger Method: CV.CC Li-Ion Battery: Full charger sense I min.: 250mA Max. charge voltage : 4.2V/cell Charger Voltage: 8.36 Charger current: Input: Adapter Contain Min Typ. Max
Hard w are Technical Specification 5-39 Charge c urrent (4S2P) 2.4A 2.46A 2.6A Charge current (4S1P) 1.3A 1.4A 1.5A Ripple & Noise 100mV Efficiency 94% 7.4 Inverter Board Inverter spec Input Voltage: 9~11V Output Current: 160mA(max) Start Voltage: 12V(min) Efficiency: 86%(max) Brightness control duty: Brightness adjust by input voltage: 0~3V Support output short protection Frequency: 25~35KHz Pin no I/O Description 1 Input/ Output Return 2 Input/ Output High voltage Brightness control duty: 0-100% 7.5 Adapter spec 7.5.1 Input Input voltage: 100~240VAC,Full range Input frequency: 50~60Hz Input current: 680Ma(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/2 40VA C Efficiency: 85%(min) 7.5.2 Output 22W power output Output Voltage/Current: 9.5V/2.315A Ripple: 500mV
Hard w are Technical Specification 5-40 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.6 Main Battery spec Battery pack capacity : Vendor Cells Volta g eC a p acit y Watts Li-Ion æ°ï¦ç 4 7.4V 2600m A h Battery warning and low percentage (Li-Ion): Battery low = 7% Battery low low= 0% Gauge controller (BQ2060H) setting: Charging voltage:8.36V Charging efficiency: 95% Low temperature capacit y : 70% 7.7 LAN Spec Controller: Atheros L2 Interface: PCIE Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LAN duri ng S3,S4 Integrated IEEE 802.3x 10BASE-T and 100 BASE-TX com patible PHY and transceiver in one chip Full duplex and half duplex support at both 10 and 1 00Mbps Low power 3.3V device 64-Pin LQFP package
Hard w are Technical Specification 5-41 7.8 Modem spec Part Number: ASUS RD01-D480 Controller: Conexant software modem Interface: AC-link Support Caller ID Support Ring wake up function ITU-T V.90 Data Mode with auto-fall back to K56flex and V.34 V.80 Video ready Modem Data speed: 56Kbps FAX transfer speed: 14.4Kbps Modem modulation format: V.90 PCM
Hard w are Technical Specification 5-42 8 MISCELLANEOUS 8.1 Indicators Power LED Feature: Type: Color: Show System power status LED Yellow Indication: On: System in ON Mode Flash: System in SUSPEND Mode Off: System in OFF Mode Location: MB/TP BRD Charging LED Feature: Type: Color: Show Battery status LED Red Indication: On: Battery in Charging Flash: Battery Low Off: Battery is fully charged or absent Location: TP BRD WLAN Feature: Type: Color: Show Receive mail status LED Blue Indication: On: WLAN on Off: No status Location: TP BRD FLASH Access LED Feature: Type: Color: Location: On: While FLASH Read/Write access LED Yellow MB
Hard w are Technical Specification 5-43 8.2 Power cord list TBD Where Description Vendor US UK Japan Europe Austria South Asia 8.3 Safety/ EMI Appliance : Agency Approv al EMC CE Mark (Europe) BSMI (Taiwan) EMI FCC Class B Certified (USA & Canada ), VCCI (Japan) MIC, IDA Safety UL, CSA or CUL, NEMKO-CB (Norwa y), TUV, CE Mark (Europe) Telecomm. FCC Part 68 (USA), DOC (Canada), JATE (Japan ), AUSTEL (Australia), TELE PERWIT (New Zealand), C TR- 21 (EU) Other Requirements Industry Standards Compliance SPA Energy Star Complianc e Designed for Windows 95/98 and Windows NT Logo (Complia nce with Microsoft PC98)
S o f t w a r e S p e c i f i c a t i o n 6-1 Softw ar e Specifica tions Get to know more about the Eee PC 4G (701) No tebook with a detailed look at the software specifications. he information contained in the chapter can be quit e useful when you are troubleshooting the systemâs har dware. Each item has its individual usage for you to Understand the soft ware side of the notebookâs a rchitecture. Chapter 6 T
S o f t w a r e S p e c i f i c a t i o n 6-2 1. General Description The specification is a guideline for BIOS de velopment on 701 platform s. Anyone who needed the system BIOS information can check this docum e nt for reference. The general device specification, hardware block diagram , SMBUS, GPIO definition and so on are subjected to be depicted in this document. Hotkeys implem entation a nd other BIOS features are also included in the document.
S o f t w a r e S p e c i f i c a t i o n 6-3 2. CPU, Chipsets & Main Devices Item V endor Specification Partâ s Name Revision CPU INTEL Dothan single core North Bridge INTEL 910GML South Bridge INTEL ICH6M VGA In ternal HD Controller Internal Audio Codec REAL TEK ALC66 2 USB INTEL Lan Athros L2 Flash memory DDR2 Clock Gen. ICS ICS9LR367 Thermal EC ENE KB3310 Wir eless Lan Atheros AR5006X Camera Azure W ave AZW A VE CardReader P ANASONIC ICS9LPR42 6AGLF-T modem Askey AFM6010NAM Table 2-1 Chipsets
S o f t w a r e S p e c i f i c a t i o n 6-4 Main component block diagram:
S o f t w a r e S p e c i f i c a t i o n 6-5 3. Device resources 3.1 Subsystem and Sub vendor ID of PCI Devices Device Bus/Dev/ Func Function V endor ID Device ID Sub-V endor ID Sub-System ID INTEL 0,0,0 Host Bridge 0x8086 0x2590 0x1043 0x1882 0.2.0 VGA 0x8086 0x2592 0x1043 0x1882 0.31.2 IDE controller 0x8086 0x2653 0x1043 0x8290 Realtek 0.27.0 Audio controller 0x8086 0x2668 0x1043 0x82A1 Athros 3.0.0 LAN 0x1969 0x2048 0x1969 0x2048 Table3-1 3.2 Devices I/O Base Table3.2 IO Base Address Devices Base Address ACPI Power Management 0x800
S o f t w a r e S p e c i f i c a t i o n 6-6 4. Specified Function Tables The Specified Functions are controlled via Gene ral Purpose Pins of Chipsets, following tables are the definition of The Functions which cont rolled via the GPIO pins of South-Bridge (ICH6M). Table 4-1. SB ICH6M GPIO Definition GPIO# Definition I/O Active Polarity Description 7 S _GPI7 Input EC THRO_CPU 8 KBC_SCI# Input Low Level SCI Event 12 S_GPI12 Input Detect LID level 13 EXTSMI# Input Low Level SMI event 19 WLAN_LED# Output High Level W ireless Lan LED 21 CAMERA_EN# Output High Level Camera Enable 23 SPEAKER_EN# Output Low Level Speaker Enable 24 MINICARD_EN # Output Low Level Minicard Enable 25 WLAN_ON# Output Low Level W ireless Lan Enable 26 S_GPI26 Input Detect PCB V ersion 27 CARD_READE R_EN# Output Low Level Card Read Enable 28 MODEM_EN# Output High Level Modem Enable 29 PCBVER0 Input Detect PCB V ersion 30 S_GPI30 Input Detect PCB V ersion 31 PCBVER1 Input Detect PCB V ersion
S o f t w a r e S p e c i f i c a t i o n 6-7 5. Setup Menu 701 system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST , the setup feature is categorized into 4 menus described as below . 5.1 Main Menu Main menu describes system overall inform ati on with some user ch angeable setting, it contains below items. 1. System Firmware: Current version for the system, EC and VGA BIOS. 2. Ty p e : Show the installed CPU Brand String. 3. Count: Show the CPU c ore number . 4. Installed Size: T otal system available memory . 5. System Time: Current time 6. System Date: Cur rent date .
S o f t w a r e S p e c i f i c a t i o n 6-8 5.2 Advanced Menu In advanced menu the users may configure ID E configuration, onboard devices and OS to install type settings may be changed as we ll. Detailed settings are describ ed below . 1. IDE configuration: See 5.2.1 2. Onboard Devices Configuration: See 5.2.2 3. OS to Install: select OS to Install Linux/W inXP/Normal
S o f t w a r e S p e c i f i c a t i o n 6-9 5.2.1 IDE Configuration 1. IDE Master: See details. 2. IDE Slave: See details.
S o f t w a r e S p e c i f i c a t i o n 6-10 5.2.2 Onboard Devices Configuration: 1. USB Ports: USB Ports enabled/disabled 2. Onboard LAN: Onboard LAN e nabled/disabled 3. Onboard Audio: Onboard Aud io enabled/disabled 4. Onboard Wlan: Onboar d wireless LAN enabl ed/disabled 5. Onboard Camera: Onboard Ca mera enabled/disabled 6. Onboard Speaker: Onb oard Speaker enabled /disabled 7. Onboard Modem: Onboard Mod em enabled/disabled 8. Onboard Card Reader: Onboard Card Reader enabled/disabled
S o f t w a r e S p e c i f i c a t i o n 6-1 1 5.3 Security Menu 701 BIOS supports three kinds of password for se curity protection: 1. Supervisor Passw ord: Users may set, change or erase system password, the password dat a is saved in non-volatile device (CMOS), syste m password check is done durin g POST(Po wer On Self Test). The BIOS will prompt a dialog message to ask user fo r password check when: The system has password store d, and âPassword on bootâ setting in BIOS SETUP is enabled. If password verification fails for 3 times, the sy stem BIOS will halt the machine to inhibit users from operating. User can modify all setup item if user use Supervisor password to enter setup. 2. User Pass word: If your setting of BIOS have been modified by other, You can setting the function [Enable], and Key in your password an d confirm, Donât modify BIOS setting if no password. User is just able to modify some of setup it em if user use user password to enter setup
S o f t w a r e S p e c i f i c a t i o n 6-12 5.4 Boot Menu In this menu users can decide the boot sequen ce, as long as the de vice with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing â â,â-â or space key on the selected (highlighted) item . 3 bootable devices fare listed in this menu ( BIOS default boot sequence ). 1. Boot Device Priority : See 5.6.1 2. Boot Settings Configurat ion: See 5.6.2 3. Onboard LAN Boot ROM: Boot from LAN
S o f t w a r e S p e c i f i c a t i o n 6-13 5. 4 .1 Boot Device Priority In this menu specifies the boot sequence from the available devices. User can change boot devices priority .
S o f t w a r e S p e c i f i c a t i o n 6-14 5. 4 .2 Boot Settings Configuration 1. Quick Boot: [Enabled] decrease time when boot. 2 . Quiet Boot: [ D i s a b l e ] : D i s p l a y n o r m a l P O S T m e s s a g e s . [Enable]: Displays OEM Logo instead of POST m essages.
S o f t w a r e S p e c i f i c a t i o n 6-15 5.5 Exit Menu In Exit BIOS setup, users may m ake final decision if they want to save the change just made or load BIOS default setting. 1 Exit & Save Changes: Exit system setup afte r saving the changes. 2 Exit & Discard Changes: Exit system setup wit hout saving any changes. 3 Discard Changes: Discards changes done so far to any of the setup questions. 4 Load setup Defaults: Load Optimal Default values for all the setup questions.
S o f t w a r e S p e c i f i c a t i o n 6-16 6. Device resources 701 uses ICH6M chipset as its power management co re logic, the chipset supports most features the ACPI 2.0 interface specifies, for ACPI 2.0 co mpliant OS. The BIOS has below features implemented: (1). System sleep states : The system supports: (a). S0 state: The CPU and all dev ices are working. ( b ). S3 state: system is in low power state, with all setting saved into RAM. Most of the devices are power of f ( c ). S4 state: The system is powered o ff, with all settings saved into hard disk. (d). S5 states. Mechanical of f. 6.1 Wake Up Event APM/ Non ACPI ACPI P W M m o d e W ake up Events S1 S1 S3 S4 S5 Power Button V V V V LID switch PME# (Lan) V V Any key V R TC V V USB
S o f t w a r e S p e c i f i c a t i o n 6-17 7 Embedded Controller (EC) 7.1 Hot Key Table 8.1.0 Fn Hot-Key definition Fn key Description A vailable Fn F1 Suspend switch ACPI A SUS010 Fn F2 W ireless lan On/Off ACPI A SUS010 Fn F 3 Brightness Down ACPI A SUS010 Fn F 4 Brightness Up ACPI A SUS010 Fn F 5 Display Devices Switch ACPI A SUS010 Fn F 6 Task Manager ACPI A SUS010 Fn F 7 V olume On/Off (Mute) ACPI A SUS010 Fn F 8 V olume Down ACPI A SUS010 Fn F 9 Vo l u m e U p ACPI A SUS010 Fn F 11 Number lock on/of f ACPI A SUS010 Fn F 12 Scroll lock on/off ACPI A SUS010 Note: 9. The applications/actions would be invoked only while A SUS01 0 driver was installed in O/S. 7.2 Battery Interface Battery T ype: ASUS Battery Command Bus interface: ASUS
S o f t w a r e S p e c i f i c a t i o n 6-18 8. Thermal Policy There is only one CPU fan in this project. The c ontrolling m e thod is to plan several step thermal ranges then every range mapping to dif ferent fan speed. The following table is thermal policy tab le and Fan Curve.
Service overvie w 1 â 2 E e e PC 4G (701) Ov er view and Components The ASUS Ee e PC 4G (701) is a product combining th e power of Intel® Mobile Processor. In this section, an overview for the Ee e PC 4G (701), along with its components, will be presented. E e e PC 4G (701) Ov er view The illustrations below show the overview from front view, right side view, le ft side view, and rear side view. Most of the parts will be discussed in this manual. OVERVIEW T ouchpad LCD Panel LCD Bezel Keyboard Power switch Camera LED status indicator
Service overvie w 1 - 3 Modem port Card reader Microphone port LAN port Air V ents Front view Kensin g ton Lock USB (2.0) ports DC-IN VGA p ort Battery Pack SPDIF/Headphone USB (2.0) ports
Service overvie w 1 - 4 Components The illustrations below show the components of the Ee e PC 4G (701). LCD Panel The illustration below shows the LCD display pane l. The Ee e PC 4G (701) comes with 7â TFT LCD Panel. Inverter Board The illustration below shows the inverter board, which is hidde n underneath the lower edge of the LCD front bezel. LCD Hinge The illustration below shows the LCD Hinges. LCD COMPONENTS LCD HINGE INVERTER BOARD MODULE
Service overvie w 1 - 5 LCD Case The illustration below shows the LCD case. Here is the LCD front cover, back cover. Keyboard The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, suc h as U.S., France and others. Top Case Module The illustration below shows the top case of the Ee e PC 4G (701). LCD CASE KEYBOARD TOP CASE&
Service overvie w 1 - 6 Touch Pad Module The illustration below shows the Touch Pad module, top and bottom view. Battery Pack The illustration below shows the battery packs of the Ee e PC 4G (701). Itâs located at bottom of the EEE PC 4G (701). Memory Module The illustration below shows the memory module for the Ee e PC 4G (701). MEMORY BATTERY TOUCHPAD
Service overvie w 1 - 7 Motherboard Module The illustration below shows the motherboard module of the Ee e PC 4G (701). Bottom Case Module The illustration below shows the bottom case module of the Ee e PC 4G (701), top and bottom view. Wireless LAN Module The illustration below shows the W ireless LAN Module of the Eee PC 4G (701). It contains W ireless LAN Card. MOTHER BOARD MODULE BOTTOM CASE WIRELESS LAN MODULE
Service overvie w 1 - 8 Ser vice Ov er view Please pay special attention to the cautions below to prevent any damages to the Ee e PC 4G (701) and also please be sure to select the appropriate tools described in this section to perform any services desired. Precautions Before you perform any service and or repair on the Ee e PC 4G (701), please follow the steps below first. 1. Be sure that the Ee e PC 4G (701) is powered down. 2. Disconnect the AC plug from the Ee e PC 4G (701) 3. Turn the E e e PC 4G (7 01) over. U nlock la tch 1 towards the direction of arrow and then unlock and hold the latch 2 to remove the battery. 4. Remove all rings, watches and any ot her metal objects from your hands. CAUTIONS 1 2
Service overvie w 1 - 9 5. Always wear a ground strap on your hand to protect the Ee e PC 4G (701) from static discharge. Appr opriate T ools The illustrations below show the appropriate tools tha t should be used for the Ee e PC 4G (701)âs service and repair. Phillips-hea d Screwdriver Use a Phillips-head screwdriver to fas ten/remove the K- or B-typed screws. Single-Slo tted Screwd river Use a single-slotted screwdriver to lock/u nlock the flexible cable connector locks Tweezers Use a pair of tweezers to remo ve/insert flexible cables. Insertion and extraction tool for FPC conne ctor Use insertion and extraction tool for FPC connector to handle locking and unlocking of FPC connectors. Vacuum Handling Tool FLATHEAD SCREW- DRIVER CROSS SCREW- DRIVER TOOLS INSERTION AND EXTRACTION TOOL FOR FPC CONNECTOR TWEEZERS VACUUM HANDLING TOOL
Service overvie w 1 - 10 Disassembl y Cautions Before you perfo rm any service and or repai r on the E ee PC 4G (701), please read the notice below first. ASUS hereby provides a b asic instruction for the di sassembly of ASUS products, i.e. to remove components and material s that require selective tr eatments, which are d efined by Annex II of the European Union (EU) Waste Elec trical and Electronic Equipm ent (WEEE) Directive 2002/96/ EC. This instruction is intended for the use of end-of-life recy clers or treatment facilities. Following is the list of Annex II of EU WEEE Directive 2002/96/EC. - polychlorinated biphenyl s (PCB) containing capa citors in accordance with Council Dire ctive 96/59/EC of 16 September 1996 on the dispos al of polychlorinated biphe nyls and polychlorinated terphenyls (PCB/PCT), - mercury containing components, su ch as switches or backlighting lamps, - batteries, - printed circuit boards of mobile phones gen era lly, and of other devices if the surface of the printed circuit board is greate r than 10 sq uare centimetres, - toner cartridges, liquid an d pasty, as well as colour toner, - plastic containing brominated flame ret ardants, - asbestos waste and compone nts which contai n asbestos, - cathode ray tubes, - chlorofluorocarbons (CF C), hydrochlorofluorocarbo ns (HCFC) or hydr ofluorocarbons (HFC), hydrocarbons (HC), - gas discharge lamps, - liquid crystal displays (to gether with their ca sing where appropriate) of a su rface greater than 100 square centimeters and all those bac k-lighted wit h gas discharge lamps, - external electric cables, - components containi ng refractory ceramic fibre s as described in Commi ssion Directive 97/69/EC of 5 December 1997 adaptin g to tec hnical progress Council Directiv e 67/548/EEC relating to the classification, packaging and labelling o f dangerous substances, - components containin g radioact ive substances wi th the exc eption of components that are below the exemption thresholds set in Arti cle 3 of and Annex I to Coun cil Directive 96/29/Euratom of 13 May 1996 laying down basic sa fety standards for the protection of the health of workers and the general publi c against the dangers arising from ioni si ng radiation, - electrolyte capacitors containing su bstances of concern (hei ght > 25 mm, diameter > 25 mm or proportionately similar volume) DISASSEMBLY CAUTIONS
Disassembly procedu re 2 - 1 Disassembl y Pr ocedur e Please follow the information provided in this section to perform the com plete disassembly procedure of the Eee PC 4G (701). Be sure to use proper tools described before. SUS Eee PC 4G (701)consists of various modules. This chap ter describes the procedures for the complete Eee PC 4G (701) disassembly . In addition, in between procedures, the detailed disassembly procedure of individual modules will be p rovided for your service needs. The disassembly procedure consis ts of the following steps: ⢠Battery Module ⢠Memory Module ⢠Keyboard Module ⢠WLAN Module ⢠Top Case Module ⢠LCD Module ⢠Motherboard Module Chapter 2 A
Disassembly procedu re 2 - 2 Battery Module The illustration below shows how to remove the battery modul e. Remove battery modu le 1 ï¼ Slide the battery lock to open it 2 ï¼ Slide the battery latch and hold the battery to remove it from system . Memory Module The illustra tion shows how to remove the memory module form the Eee PC 4G (701 ). Removing Memory module 1. Remove 2 screws (M2*4) on the memory cover then remove it from the system. BATTERY MEMORY MODULE MEMORY REMOVAL 1
Disassembly procedu re 2 - 3 2. Softly open the two latches to pop the memory mo dule up at 45 degree angles and then remove the memory at that angle. Keyboard Module The illustrati on of below shows h ow to remove the keyb oard Removing Keyboard 1. Turn over the NB and push the 3 latches (F1; F6;Pause) on keyboard module to lift the keyboard plate. KEYBOARD MODULE REMOVAL
Disassembly procedu re 2 - 4 2. Place the keyboard plate on the top case and di sc onnect the keyboard FPC to remove. Remo ving Keyboard Ca ble 1. Use a flexible connector tool to unlock the cable connector on both ends ( no. 1). 2. Carefully pull out the keyboar d cable (no. 2) with a p air of tweezers. 3. Lock the connector (no. 3) again to avoid possible break age. T op Case Module The illustrations below show how to disassemble an d remove the top case module of the Eee PC 4G (701). The module contains the top case itself. Removing Top Case Module 1. Disconnect the touch pad FPC and then re move 9 screws (M2*4) on top case. 1. Unlock 2. Cable out 3. 1. Unlock 3. TOP CASE REMOVAL TOP CASE MODULE
Disassembly procedu re 2 - 5 2. Close and turn the system upside down to remove 6 screws (M2*4) on the bottom case. 3. Softly pry the four sides of the system to open the latch hooks securing the top case with bottom case, then remove the top case.
Disassembly procedu re 2 - 6 4. Remove 1 piece of tape on the touch pad FPC then open the latch to disconnect it from touch pad board. 5. Remove 2 screws (M2*3) securing touch pa d bracket and then remove the bracket. 6. Remove the touch pad board from the top case.
Disassembly procedu re 2 - 7 WLAN Module The illustrati ons below sh ow how to rem ove the WLAN module from the Ee e PC 4G (701). Remove WLAN module 1. Remove 3 pieces of tape fixing the cable and then disconnect the following 4 cables, namely speaker cable, CMR cable, Fan cable, L VDS cable. 2. Remove 1 piece of tape fixing the micr ophone cable and disconnect the microphone cable from the mother board, and th en take the microphone module away . WLAN MODULE WLAN MODULE REMOVAL Speaker ca ble Camera cable Fan cable L VDS cable
Disassembly procedu re 2 - 8 3. Lift the mother board from bottom case by softly separating from the bottom side, two sides to the top. * pay attention not to rem ove the moth er board for now , for that the WLAN antenna is still connected with the m other board. 4 . Turn the LCD with its back cover on th e platform and hold th e mother board while disconnecting the two antennas. 5. Remove the mother board from the bottom case.
Disassembly procedu re 2 - 9 6. Remove 2 screws (M2*4) on the WLAN module to pop up the module at 30 degree angles and then remove it at that angle. Motherboar d The illustrations below show how to di sassemble and remove the Motherboard. Removing Motherboard 1. Tear off 2 pieces of tape fixing the Modem cable and disconnect the Modem cable from mother board. MOTHER BOARD MOTHERBOARD REMOVAL
Disassembly procedu re 2 - 10 2. Remove two screws (M2*3) securing the Modem module and then remove it from the mother board. 3. Remove 2 screws screwing the LCD hing es and then take the LCD display away. 4. Remove 1 piece of tape and 3 screws (M*4) secu ring the Fan module and then take the Fan module away.
Disassembly procedu re 2 - 11 L CD Module The illustrations below show how to remove and disasse mble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. Disassembling LCD Mo dule 1. Remove 8 rubber pads and screws (M2*4) on LCD front bezel. 2. Pry the four inner sides of LCD front bezel and separate it from LCD module. 3. Remove 2 screws (M2*4) on each LCD hinge and remove both hinges. LCD MODULE LCD MODULE DISASSEMBLY
Disassembly procedu re 2 - 12 4.Unscrew 4 (M2*4) screws securing the inve rter board and then take the LCD panel together with the inverter board away from LCD back cover . 5. Disconnect the inverter cable, LCD FPC cable from inverter board and take the board away .
Disassembly procedu re 2 - 13 6. Disconnect the coaxial cable from inverter board. 7. Tear off 1 piece of tape fixing camera cable and take the camera cable o ff cable guide. 8. Remove the camera board from LCD back cover and then take the whole module away.
Disassembly procedu re 2 - 14 9. T ake the WLAN antennas off cable guides and remov e the antennas tog ether with its tape from LCD bac k cov er . 10. T ake the speak er cables off cable guides and remov e both speakers from their slots .
Assembly procedure 3 - 1 Assembl y Pr ocedur e Please follow the infor mation pr ovided in this section to perfor m the complete assembly procedur e of the Eee PC 4G (7 01). Be sur e to use proper tools described befor e. fter you have completed the previous chapter of complete disa ssembly, please follow this chapter to assemble the Ee e PC 4G (701) back together. This chapter describes the procedures of the complete Ee e PC 4G (7 01) assembly. In addition, in between procedures, the detailed assembly procedure of individual modules will be provided for your service needs. The assembly procedure consis ts of the following steps: ⢠LCD Module ⢠Motherboard Module ⢠Top Case Module ⢠WLAN Module ⢠Keyboard Module ⢠Memory Module ⢠Battery Module Chapter 3 A
Assembly procedure 3 - 2 L CD Module The illustrations below show how to assemb le and install the LCD module of the Eee PC 4G (701). 1. Install the two speakers on LCD back cover and arrange the speaker cable well through cable guide . 2. Assembly the black and white antennas on LCD back cover and well arrange the antanna cables through cable guides. LCD MODULE
Assembly procedure 3 - 3 3. Install the camera board on LCD back cover, pay a ttention to the aiming pole. 4. Connect the coaxial cable with inverter board. 5. Connect the inverter cable, LCD FPC cable with inverter board.
Assembly procedure 3 - 4 6. Install the LCD panel together with the inverter board on LCD back cover and then secure 4 screws (M2*4) on it. 7. Assemble both hinges and secure 2 screws (M2*4) on each.*pay attention to differences between the left and right. 8. Install the LCD front bezel on LCD back co ver and press the sides to fix them w ell.
Assembly procedure 3 - 5 9. Secure 6 screws (M2*4)on LCD front bezel and then fix 6 r ubber pads on it. Motherboar d The illustrations below show how to assemble and install the motherboard of the Eee PC 4G (701). 1. Install the Fan module on bottom case, secure 3 screws on it and fix 1 piece of tape on the cable. 2. Hold the LCD to fix its hinges on botto m case and then secure 2 screws(M2*4). MOTHERBOARD MOTHERBOARD ASSEMBLY
Assembly procedure 3 - 6 3. Connect the Modem module with the mother board and then secure 2 scews (M2*3) . 4. Connect the Modem cable with the mother board and then arrange the cable to fix 2 pieces of tape on it.
Assembly procedure 3 - 7 Wireless LAN Module The illustrations below show how to assemb le and install the Wireless Lan Module of the Eee PC 4G (701). Installing Wireless LAN Module 1. Insert WLAN module into its slot at 30 degrees angles and press it down softly, then secure 2 screws (M2*4) on it. 2. Hold the mother board on bottom case an d then connect the WLAN antennas with WLAN module. WIRELESSLAN MODULE INSTALLATION
Assembly procedure 3 - 8 3.Install the mother board on bottom case, to install you should first install the top side,then softly pry the two sides to the ports ends fit the bottom ca se well, finally press the bottom side to lock the two latches. *make sure the antennas arrangeed through the hook at mother board, and all the cables placed above the mother board. 4. Install the microphone , connect it with the mo ther board and then fix 1 piece of tape on the cable.
Assembly procedure 3 - 9 5. Connect the following cables and fix 3 pieces of tape on it. Speaker ca ble Camera cable Fan cable L VDS cable
Assembly procedure 3 - 10 T op case Module The illustrations below show how to assemb le and install the top case module of the Eee PC 4G (701). 1. Install the touch pad board on top case. 2. Install the touch pad bracket and th en secure 2 screws (M2*4) on it. TOP CASE MODULE
Assembly procedure 3 - 11 3. Connect touch pad FPC with touch pad board , fix the connector latch and then fix 1 piece of tape on it. 4. Install the top case with bottom case and pr ess the four sides to make them fixed well. 5. Secure 6 screws (M2* 4) on the bottom case.
Assembly procedure 3 - 12 6. Connect the touch pad FPC and then secure 9 screws (M2*4) on it. Assembling Keyboard The illustrations below show ho w to assem b le and install the Keyboard of the Eee PC 4G (701). 1. Connect keyboard FPC with top case. KEYBOARD ASSEMBLY KEYBOARD
Assembly procedure 3 - 13 2. Assemble the keyboard plate and press the 3 la tches (F1; F6;Pause) in keyboard to lock it. Memor y Module The illustrations below show how to install th e external Memory Module of the Eee PC 4G (701). 1 . Inse rt Memory at the same 45 ° angles and press down until it clicks into the latches. 2. Install the Memory cover and then secure 2 screws (M2*4)on it. MEMORY MODULE INSTALL
Assembly procedure 3 - 14 Battery Module The illustrations below show how to install battery module of the Eee PC 4G (701). Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock . BATTERY MODULE
Upgrade & replacement 5 â 1 Upg r ade & R eplacement F ollow the individual pr ocedur es in this ch apter to perfor m the Eee PC 4G (701)â s upgrade and r eplacement of v arious major components. sus Ee e PC 4G (701) is a 2 spindles product, which means there are less options for you to upgrade and replacement. The key upgradeable and replaceable items include the Memory module. In order to avoid redundancy, please refer to chapters 2 and 3 of this manual for repeated and reused disassembly and assembly procedures, such as keyboard & heat sink replacement, which is used by several different procedures in this chapter. Be sure to follow the safety in structions described in Chapter 1 to safeguard t he Eee PC 4G (70 1) against any potential d amages. For any other components which you need to replace not covered in this chapter, plea se refer to Chapters 2 and 3 for detailed disassembly and assembly and perform necessa ry procedures accordingly. This chapter includes the following items: ⢠Memory Upgrade Chapter 4 A
Upgrade & replacement 4 - 2 Memor y Upg r ade Upgrading Memory Module Remove battery modu le 1 ï¼ Slide the battery lock to open it 2 ï¼ Slide the battery latch and hold the battery to remove it from system . Removing Memory module 1. Remove 2 screws (M2*4) on the Memory cover then remove it from the system. 1 MEMORY REMOVAL MEMORY
Upgrade & replacement 4 - 3 2. Softly open the two latches to pop the Memory module up at 45 degree angles and then remove the Memory module at that angle. Installing Memory Mod ule 1. Insert Memory at the same 45 ° angles and press down until it clicks into the latches. 2. Install the Memory cover and th en secure 2 screws (M2*4) on it.
Upgrade & replacement 4 - 4 Install battery module. 1. Slide the battery module into its compartment 2. Slide on the battery lock .
Hard w are Technical Specification 5-1 Har d ware Specifications You can enjoy and utilize the Eee PC 4G (701) Notebook more effectively with a better comprehension of detailed hardw are specifications of the notebook. his chapter lists the detailed specifications of the notebookâs main system and modules. Please refer to this section when you need to find out specific te chnical data about the notebook. This chapter contains the following information: z MARKETING SPECIFICATION z CHIPSET LIST z KEY PARTS LIST z SYSTEM z I/O PORT PIN ASSIGNMENT z POWER MANAGEMENT z MODULE SPECIFICATION Chapter 5 T
Hard w are Technical Specification 5-2 L IST OF F IGURE S 1 MARKETING SPEC Eee PC 4G (701) Specification (One-Spindle Design) Product Family EEE PC 4G (701) CPU Type Intel Celeron-M-ULV Dothan Speed 900MHz(normal run 630MHz) Package FCBGA 479 Onboard L2 Cache Yes Size 512 KB On-die cache memory Memory Type DDR II SDRAM without ECC Base Memory None Expansion Memory 256/512MB/1GB SO-DIMM x 1 Slot MAX 2GB LCD Size 7â Resolution WVGA Panel Type TFT Interface LVDS Contrast Control None Brightness Control Hot-key HDD type Onboard / Flash Module Flash Module option Ultra DMA 66 Yes Size Onboard 4G / Flash Module 16G Chip Set Intel Sonoma Platform North Bridge Intel 910GML/910GMLE South Bridge Intel ICH6-M Super IO N/A Thermal Sensor G781P8F Micro-Pr ocessor ENE KB3310 KBC ENE KB3310
Hard w are Technical Specification 5-3 Flash ROM (SPI) SST/Winbond/MXIC 4Mbits Graphic Accelerato r Intel 910GML internal GPU 3D Yes Controller Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory Share Memory TV Out Support No Sound System Controller Realtek ALC662 SW wave table Yes FM synthesizer Yes Speaker Stereo I/F Azalia PC99 Yes S/PDIF None 6 channel output Yes Audio Amplifier TPA6017A2PWP Microphone Mono Modem CONEXANT Controller CONEXANT Spec 56K I/F Azalia MDC Jack RJ-11 RJ-11 port ACPI Yes V.90 Yes Voice Phone No Digital Line Protection Yes Wake On Ring Yes LAN Yes Jack RJ-45 RJ-45 port Wake On LAN YES
Hard w are Technical Specification 5-4 Controller Atheros L2 Internal Keyboard Key 80 Keys (W/ MS-Windows function keys) Function Key 12 Function Keys Hot Key Function 1 3 Hot Keys Suspend (STR or STD) Fn F1 Wi-Fi enable Fn F2 802.11b g Application m anager Fn F 6 Brightness Up Fn F4 Brightness Down Fn F3 LCD/CRT Fn F5 PC Speaker Volume Fn F7 On/Mute PC Speaker Volume Fn F9 Volume increase PC Speaker Volume Fn F8 Volume decrease Number Lock Fn F 11 Scroll Lock Fn F 12 Print screen Fn Ins Sys Rq Fn Del Instant Keys None Status Indication 4 LEDs Power Status Yes (Yellow on LED when Power on. Blinking when in SUSPEND mode. OFF when power off.) Battery Charge Status Yes (Orange when ch arging. Blinking when battery low. OFF when fully charged/empty.) HDD LED Yes (Yellow while a ccessing) Number Lock LED None Caps Lock LED None Scroll Lock LED None W-LAN LED Blue Pointing Device Glide Pad Synaptics
Hard w are Technical Specification 5-5 Glide Pad Yes Right Button Yes Left Button Yes Scroll Yes Function Contr ol Power On Button Yes LCD Brightness Yes Hot Keys LCD Lid Switch Yes Sound Volume Yes Hot Keys Password Override Yes (Master Password ) Reset/Force Off Yes (Reset switch ) I/O Port All ports support hot-plug Parallel N/A CRT Yes 15-pin D-Sub Mouse/Keyboa rd N/A IrDA Port N/A Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In Jack N/A Mic In Jack Yes Head Phone Jack Yes Stereo out USB port Yes 3 Ports DC-In Yes 22W Heat Solution Heat Pipe N/A Heat Sink N/A FAN Support Yes AC Adaptor Delta Input AC 100 -24 0Volt, 50~60Hz Output DC 9.5V, 2.315A, 22W 1 st Battery 4 Cells 7.4V 5200mAh Type Li-ION(5 200mAH)
Hard w are Technical Specification 5-6 1st Battery æ°ï¦ç Charging time Li-ION (5200mAH) Machine ON TBD. Machine OFF TBD. Battery Life TBD. PM Off TBD. PM On TBD. Power Managem ent AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.1 Security Password Yes Password overridden by Master passwo rd Security Lock N/A S/W Install OS Linux Flash BIOS Yes Drivers Chipset Driver Yes VGA Driver Yes AUDIO Driver Yes LAN Driver Yes Glide Pad Driver Yes Modem Driver Yes WLAN Driver Yes
Hard w are Technical Specification 5-7 2 CHIPSET LIST Chipset Summary Table Function EEE PC 4G (701) HW ACPI/PC99 CPU Intel Dothan Not required SRAM (L2 Cache) 512KB Not required North Bridge Intel 910GML/910GM LE YES South Bridge Intel ICH6-M YES MEMORY DDR II SDRA M Not required BIOS ROM SST/Winbond/MXIC 4Mb Not required VGA Intel internal graphic YES SUPER I/O N/A PCMCIA N/A AUDIO Azalia CODEC YES AUDIO AMPLIFIER TPA6017A2PWP Not required KB CONTROLLER ENE KB3310 YES IrDA N/A CLOCK Generator CS9LPR426 YES MODEM CONEXANT YES Bluetooth N/A 1394 N/A LAN Atheros L2 YES
Hard w are Technical Specification 5-8 2.1 CPU 2.2 CHIPSET 2.2.1 North Bridg e Function: Full support 32bits AGTL host bu s ad dressing Supports DDR2-400 device Integrates the graphic controller Support Intel Rapid Memory power managem ent Enhanced Intel SpeedStep technology DMI x2/x4 Interface connect to ICH Processor Type: Intel Dothan Processor Intel Celeron-M ULV 353 Processor frequency: 900MHz (normal run 630M Hz) Construction method: FCBGA479 Supply voltage: Core:0.85V(High_Frequen cy_Mode)~0.75V(lowest_Frequen cy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB write- back data cache. On-die , 512KB second level cache with Advanced Transfer Cache Architecture. Data Prefetch. Streaming SIMD extensions 2(SSE2). 400 MHZ FSB support
Hard w are Technical Specification 5-9 Vendor: Intel Parts Number: 910GML/910GMLE Package: 1257 -ball micro-FCBGA 2.2.2 South Brid ge Function: DMI x2/x4 interface link with GMCH Integrated PC/AT compatible system (DMA Co ntroller, INT, Timer/Counters) Integrated one channels IDE controller with Ultra DMA/33/66/100 support Integrated USB 1.1 and 2.0 Host Bus controller with 8 USB ports Integrated HD Audio Interface Build-in RTC LPC Interface Vendor: Intel Parts Number: ICH6-M Package: 609 -ball BGA 2.3 DRAM MEMORY 2.3.1 ON-BOA RD MEMORY None
Hard w are Technical Specification 5-10 2.3.2 EXPANSION ME MORY Number of sockets: Bus: Supply voltage: Functional features: Hardware features: One 200 pin SO-DIMM slot 64-bit data path 1.8V Supports up to 16 simultan eou s open pages Supports DDR2 400 DDR devices Maximum of 2GB of system memory Parity support: without ECC 2.4 BIOS ROM ROM Type: Package: Supply voltage: Serviceability: SST/Winbond/MXIC Flash Memory 8-lead SOIC 3.3V End user upgradeable for the firmware 2.5 INTERNAL VGA CONTROLLER Function features: 3D Setup and Render Engine Integrated 24 bit RAMDAC that can drive a standard progressive scan analo g monitor up to 2048 X 1536 CRT resolution at a maximum refresh rate of 75 Hz Single or dual channel LVDS panel supp ort up to 112MHZ TV out resolution up to 1024x768 Vendor: Intel Chipset 910GML/910GMLE
Hard w are Technical Specification 5-11 2.6 KEYBOARD CONTROLLER Function features: Embedded controller-style host Support hardware speed-up of GateA20 and RC Local 18x8 keyboard switch matrix support Three industry standard serial keyboard interfaces All three ports are bi-directional Vendor: Parts Number: Package: ENE KB3310 128-pin LQFP 2.7 AUDIO CODEC Vendor: Parts Number: Package: Realtek ALC662 48-pin LQFP 2.8 AUDIO AMPLIFIER Function features: Max 1.5w Stereo Audio Amplifier with 8 ohm load Depop Circuitry Fully Differential Input Vendor: Parts Number: Package: TI TPA6017A2 20pin TSSOP
Hard w are Technical Specification 5-12 2.9 LAN & MODEM 2.9.1 LAN Function features: Scatter and gather transmit receive DMA Interrupt coalescing 10Mb/s, 100Mb/s, operation Compliant to ACPI 2.0 specification Compliant to IEEE 802.3u Auto-Negotiation Support Wake-on-LAN fun ction and remote wake up (Magi c Internal transmit and receive FIFO(2KB *2) Vendor: Parts Number: Package: Atheros L2 64-Pin LQFP 2.9.2 MODEM Function features: V.90 and K56 flex support Integrated PnP functionality PC99 compliant Support both APM and ACPI power management Support Wake-on-ring functionality Vendor: Parts Number: Package: Askey 1456VQL-R3(INT-RoHS ) Azalia MDC
Hard w are Technical Specification 5-13 3 KEY PARTS LIST Key Parts Summary: 3.1 Display WVGA Technology: Active color (TFT: Thin Film Transistor) Size: 7âW Resolution: WVGA (800 X 480) Dimension: 164mm(H) * 103mm(V) * 5.1mm(T ) Pixel Pitch: 0.1905mm * 0.1905mm Display Colors: 16M Colors Vendor: AUO VGA Technology: N/A Size: Resolution: Dimension: Pixel Pitch: Display Colors: Vendor: 3.2 Touch Pad Dimensions: S ensor Effective Areas: Interface: X/Y Position Resolution: Customizing: 47.8(W) x31.9(H) x 0.85(T) (Unit: mm) 35.5 (W) x 28.9 (H) (Unit: mm) PS/2 40 points / mm (graphics mode) Custom color can be printed on the sensor pad Functional features: Accurate positioning Low fatigue pointing action Low power consumption Software configurable Scanner function for signat ure Low profile, compact size and low wei ght
Hard w are Technical Specification 5-14 Vendor/Model Synaptics : SYNAPTICS/TM-01058-002 3.3 Keyboard Function Feature: Hardware Feature: Compatibility: Standard Notebook-Keyboard Simultaneously use of internal and external keyboard Easily to assemble or disassemble MS-Windows 2000/ XP Dimensions: Type: Total Travel: Key Top: Language Version s: 211.70 (H) x 80.70 (V) (Unit: mm) Key switch membrane 1.5 /- 0.2 (Unit: mm) According to Attach Drawing English, Japanese, Chinese, Korean and Europ ean etc. 3.4 Battery 3.4.1 Main Battery Purpose: Gas-gauge: Main power supply battery SMBus interface Chemistry: Voltage: Capacity: Power: Vendor: Duration: Charge Metho d: Charging Source: Gas-gauge: Li-ion rechargeable b attery Nominal 7.4V Typical 1300 mAH (Single-cell) 65.12 W-Hrs æ°ï¦ç About 3 hours (Depend on sy stem confi guration) Fast Charge: 2.5 hours (while System off) â85% up AC adapter
Hard w are Technical Specification 5-15 3.4.2 RTC Backup Battery Purpose: Chemistry: Voltage: Capacity: Vendor: Backup the RTC/CMOS data While AC adapter off & Main Battery removed Coin cell 2032 Li-ion battery Nominal 3V 200mAH KTS 3.5 AC/DC Adapter The notebook can be powered eithe r by an external AC adapter or by an internal battery pack. The AC ada pter is used as power source for the DC/DC conve rter and as constant curre nt sou rce for the battery pack. Input Requirements: AC line voltage: AC line current: AC line frequency Efficiency 100V to 240V AC, Full Range 2.315A 50 Hz to 60 Hz 85% min. Output requirements: Output-Voltage Output-Current Ripple voltage 9.5V DC max.2.315A Power cord: DC Cable length: Plug to the adapter 180 mm /- 50mm Regulatory: EMI: Safety: FCC Class B CISPR 22 Class B .Dimension: (L) 1 08 x (W ) 46 x (H) 29.5 mm
Hard w are Technical Specification 5-16 4 SYSTEM 4.1 System diagram 4.2 Main components block diagrams TBD
Hard w are Technical Specification 5-17 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 PS2 Keyboard IRQ 8 System CMOS/RTC IRQ 9 ACPI IRQ Holder IRQ12 PS2 TP IRQ13 Numeric data processor IRQ14 Master IDE Controller IRQ15 Primary IDE Controller IRQ16 PCIE Root Port IRQ16 USB Controller IRQ16 Microsoft UAA IRQ16 910GML Express Chipset Family IRQ17 Lan Controller IRQ17 PCIE Root Port IRQ18 Wireless Network Adaptor IRQ18 PCIE Root Port IRQ18 USB Controller IRQ19 USB Controller IRQ23 USB Controller IRQ23 USB2 Enhance Host Controller 4.3.2 ISA DMA Map DMA Channel Dev ice DMA 4 DMA Controller
Hard w are Technical Specification 5-18 4.3.3 PCI INT Map N/A 4.3.4 PCI Bus Master Map N/A 4.3.5 IDSEL N/A
Hard w are Technical Specification 5-19 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION CRT Display (Ana log) Flash module LCD KEYBOARD TOUCHPAD&LED 1 ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .USB Universal Serial Bus LAN & Modem .Card Reader Universal Serial Bus . WLAN MINI PCIE
Hard w are Technical Specification 5-20 5.1 CRT Vendor Part No. Pin No. ALLTOP C10511-11505-B 15 Pin (DIP) No Pin Assignment (by: sort) Description 1 RED Video (analog) Red this DAC analog o utput drives the CRT interface. 2 GREEN Video (analog) Green this DAC analog output drives the CRT interface. 3 BLUE Video (analog) Blue this DAC analog output drive s the CRT interface. 4 MONITOR ID Bit 2 NC 5 GROUND Ground 6 RED Return (ground) Ground 7 GREEN Return (ground) Ground 8 BLUE Return (ground) Ground 9 Power 5V 10 SYNC Return (ground ) Ground 11 MONITOR ID Bit 0 NC 12 MONITOR ID Bit 1 DDC monitor data 13 HSYNC CRT Horizont al Sync this output is The Horizontal sync pulse for the CRT Monitor. 14 VSYNC CRT Vertical Sync this out put is the Vertical sync pulse for the CRT Monitor. 15 MONITOR ID Bit 3 DD C mo nitor clock
Hard w are Technical Specification 5-21 5.2 Flash module pin assignment Vendor Part No. Pin No. 52 Pin (DIP) Pin No. Pin No. Remark 1. IDE_DD0 2. IDE_DD15 3. IDE_DD1 4. GND 5. IDE_DD2 6. IDE_DD14 7. IDE_DD3 8. IDE_DD13 9. GND 10. IDE_DD12 11. IDE_DD4 12. IDE_DD11 13. IDE_DD5 14. IDE_DD10 15. GND 16. IDE_DD9 17. IDE_DD6 18. GND 19. IDE_DD7 20. IDE_DD8 21. GND 22. IDE_RST#1 23. S_SATA_RXN0 24. IDE_DIOW# 25. S_SATA_RXP0 26. IDE_PCSEL#1 27. GND 28. IDE_DIOR# 29. GND 30. IDE_DDACK# 31. SATA_TXN0 32. IDE_DDREQ 33. SATA_TXP0 34. GND 35. GND 36. USBPN0 37. IDE_DA0 38. USBPP0 39. IDE_DA1 40. GND 41. IDE_DA2 42. IDE_IORDY 43. NC 44. IDE_IRQ 45. IDE_DIAG#1 46. IDE_DCS#1 47. VCC_FLASH 48. IDE_DCS #3 49. VCC_FLASH 50. GND 51. VCC_FLASH 52. FLASH_LED#1
Hard w are Technical Specification 5-22 5.3 LCD pin assignment Vendor Part No. Pin No. I-PEXV WTOB_CON_20P 20 Pin (SMD) No. Signal Description Typ e 1 3V_LCD P 2 LCD_CSB_D O 3 LCD_VSYNC O 4 LCD_SCL I/O 5 LCD_SDA I/O 6 LVDD_EN I 7 GND P 8 LA_DATAN0 I/O 9 LA_DATAP0 I/O 10 LA_DATAN1 I/O 11 LA_DATAP1 I/O 12 GND P 13 LA_DATAN2 O 14 LA_DATAP2 P 15 LA_CLKN O 16 LA_CLKP O 17 GND P 18 BL_PWM_DA I 19 BL_EN I 20 12V_LEDIN P
Hard w are Technical Specification 5-23 5.4 Internal keyboard pin assignment Vendor Part No. Pin No. InnovACE FPC_CON_28P 28 Pin (SMD) No Signal Description Typ e 1 KSO0 O 2 KSI0 I 3 KSO1 O 4 KSO2 O 5 KSI1 I 6 KSO3 O 7 KSI2 I 8 KSO4 O 9 KSI3 I 10 KSO5 O 11 KSI4 I 12 KSI5 I 13 KSO6 O 14 KSI6 I 15 KSI7 I 16 KSO7 O 17 KSO8 O 18 KSO9 O 19 KSO10 O 20 KSO11 O 21 KSO12 O 22 KSO1 O 23 KSO13 O 24 KSO14 O 25 KSO3 O 26 KB_ KSO15 O 27 NC_KSO17 O
Hard w are Technical Specification 5-24 28 NC_KSO16 O *** 5.5 Internal Touch Pad & LED Pin assignment Vendor Part No. Pin No. ENTERY FPC_CON_12P 12 Pin (SMD) No Signal Description Typ e 1 GND Ground P 2 TP_L P 3 TP_L P 4 5V_TP Power I 5 5V_TP Power I 6 TP_DATA Data I/O 7 TP_DATA Data I/O 8 TP_CLK Clock Signal I 9 TP_CLK Clock Signal I 10 TP_R P 11 TP_R P 12 GND Ground I
Hard w are Technical Specification 5-25 5.6 1 ST Battery pin assignment No Signal Description Typ e 1 BAT_IN# Power P 2 BAT I 3 BAT I 4 BAT_ID O 5 GND Ground P 6 BAT_TS O 7 BAT_CONFIG O 8 NC NC 9 GND Ground P 5.7 DC in Jack pin assignment Vendor Part No. Pin No. SINGATRON DC_PWR_JACK_3P 3Pin (DIP) No Signal Description Typ e 1 A/D_DOCK_IN Adapter input voltage P 2 GND Ground P 3 GND Ground P
Hard w are Technical Specification 5-26 5.8 Audio Jack 5.8.1 Internal Speaker Jack Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Type 1 INTSPKR- Internal speaker si gnal right channel negative O 2 INTSPKR Internal speaker sign al right channel positive O 3 INTSPKL- Internal speaker si gnal left channel negative O 4 INTSPKL Internal speak er si gnal left channel positive O 5.8.2 Headphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Typ e 1 GND_AUDIO Ground P 2 HEADPHONE_J ACK_L Headphone left sound O 3 HEADPHONE_J ACK_R Headphone right sound O 4 GND_AUDIO Ground P 5 EAR_SW# S/PDIF/Head phone be plugged in I 6 NC NC NC
Hard w are Technical Specification 5-27 5.8.3 Microphone Jack Vendor Part No. Pin No. SUYIN PHONE_JACK_6P 6 Pin (DIP) No Signal Description Type 1 GND_AUDIO Ground P 2 MIC1_JACK_L External microphone input I/O 3 MIC1_JACK_R External microphone input I/O 4 GND_AUDIO Ground P 5 MIC_SW# Control internal MIC O 6 NC NC NC 5.9 Fan Pin Assignment Vendor Part No. Pin No. ACES WtoB_CON_4P 4 Pin (SMD) No Signal Description Typ e 1 5V 5V Power Supply P 2 FAN_TACH FAN speed signal output O 3 FAN_PWM FAN sp eed signal input I 4 GND Ground P 5.10 MDC signal Vendor Part No. Pin No. TYCO BTOB_CON_12P 12 Pin (SMD) No Signal Description Typ e 1 GND Ground P 2 None None NC 3 ACZ_SDOUT_MD C Azalia data output signal I
Hard w are Technical Specification 5-28 4 None None NC 5 GND Ground P 6 3VAUX_MDC 3.3V power turned off during S4 P 7 ACZ_SYNC_MDC Azalia sync signal I 8 GND Ground P 9 ACZ_SDIN1_MD C Azalia data input signal O 10 GND Ground P 11 ACZ_RST#_MDC _R Azalia reset signal I 12 ACZ_BCLK_MDC Azalia bit clock signal I 5.11 USB pin assignment Vendor Part No. Pin No. SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB12_CON USB 5V power P 2 USBPN1 USB port 1 negative signal I/O 3 USBPP1 USB port 1 positive signal I/O 4 GND ground P Vendor Part No. Pin No. SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB34_CON USB 5V power P 2 USBPN2 USB port 2 negative signal I/O 3 USBPP2 USB port 2 positive signal I/O 4 GND USB 5V ground P Vendor Part No. Pin No.
Hard w are Technical Specification 5-29 SUYIN USB_CON_1X4P 4 Pin (SMD) No Signal Description Typ e 1 5V_USB34_CON USB 5V power P 2 USBPN3 USB port 3 negative signal I/O 3 USBPP3 USB port 3 positive signal I/O 4 GND USB 5V ground P 5.12 LAN & Modem pin assignment Vendor Part No. Pin No. ALLTOP MODULAR_JACK_12P 12 Pin (SMD) No Signal Description Typ e 1 None Non e NC 2 MODEM_TIP Modem signal I/O 3 MODEM_RING Modem signal I/O 4 None Non e NC 5 LAN_TXP Transmit data positive sig n al O 6 LAN_TXN Transmit data negative signal O 7 LAN_RXP Receive data positive signal I 8 LAN_CON4 5 Connect 75 ohm to ground I 9 LAN_CON4 5 Connect 75 ohm to ground I 10 LAN_RXN Receive data negative si gnal I 11 LAN_CON78 Connect 75 ohm to ground I 12 LAN_CON78 Connect 75 ohm to ground I
Hard w are Technical Specification 5-30 5.13 Card Reader pin assignment Vendor Part No. Pin No. PANASONIC SD_SOCKET_9P 9 Pin (SMD) Pin No Signal Remark 1. UB_SD_DATA3 2. UB_SD_CMD 3 GND 4 3V_SD 5 UB_SD_CLK 6 GND 7 UB_SD_DATA0 8 UB_SD_DATA1 9 UB_SD_DATA2
Hard w are Technical Specification 5-31 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Devices 12V VSUS_ON Other Control 5V SUSB_ON LCD, Flash, Flash & Wlan LED, Fan, Camera, Codec, Audio, SB 3V SUSB_ON NB IO, SB, LCD, Card reader, Codec, Audio 1.8V_DUAL SUSC_O N NB, DDR2 powe r 5VSB VSUS_ON SB, USB, Charge & Power LED 3VSB VSUS_ON SB, Audio, Clock Generator, PCIE interface 1.5V SB Core, NB Core 2.5V SB Core, NB Core, Onboard VGA VTT_DDR DDR2 Power VCORE H_CPURST# CPU power 3VA LCD, EC, BIOS, Keyboard VCC_RTC ICH6-M (RTC) VCCP CPU_VRON CPU power, SB Core, NB Core 6.2 Power management mode 6.2.1 Full-On mo de All system devices are not power managed and the sy stem can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slow do wn but all oth er devices are full on. 6.2.3 Stand by mode A suspend state where all motherboard components ar e still powered-on ex cept for the system clock generator device. The PCI and CPU b uses are driven to the inactive idle state. The system memory is powered and refreshed by the memory bridge, an d the graphi cs frame buffer is powered and refreshed by the graphic chip. The system provides a 32K Hz clock (SUS CLK) in this suspend mode to support refresh of these memory subsystems. Only an enable d âresume eventâ can bring the system out of the stand by state. The south bridge also provides a resu me timer that allows the system to re su me after a programmed time has elap sed. 6.2.4 Suspend to RAM mode (STR) A suspend state where all mother board components are powered-off. The CPU and PCI busses are powered off. All devices connected to the CPU and PC I busses must either be powered-off or isolate their bus interfaces. The system memory is pow ered and refreshed by the memory bridge, and the graphics frame buffer is powered and ref reshed by the graphics chip. The system provides a 32 kHz
Hard w are Technical Specification 5-32 clock (SUSCLK) in this suspend mode to support refresh of these memory subsystems. Only an enabled âresume eventâ can bring the platform out of the susp end to RAM (STR) state. 6.2.5 Suspend to disk mode (STD) A suspend state where the context of the entire sy ste m is saved to di sk, all motherboard components are powered-off, and all clocks are stopped. Any enabled âresume eventâ, such as Power switch or RTC, can bring the platform out of the suspend to disk (STD) st ate. 6.2.6 Soft off mode (SOFF) This is the same as suspend to di sk except the context of memory is not saved. The system will resume from Soft Off as if a hard reset had occurred. 6.2.7 Mechanical off mode (MOFF) All power except the RTC has been removed from the system. 6.3 PMU mode transition event The following table summarizes the entry events and wake-up events of each power management mode. Power State Entry Event Wake up Event Doze Doze Time out Predefined Memory/IO ra n ge access Ring Indicator Keystroke Mouse movement IRQ 1-15 Stand by Stand by Time out Stand by hot key pressed Predefined Memory/IO range acce ss Battery Warning Battery Low Ring Indicator Keystroke Mouse movement Schedule Alarm STR Suspend Time out STR hot key pressed Suspend button Battery Low Power Button Ring Indicator Keystroke (Int. KB) Schedule Alarm STD Suspend Time out STD hot key pressed Hibernate Battery Low Power Button Schedule Alarm Soft Off Power button Execute Windows shutdown command Power Button Schedule Alarm
Hard w are Technical Specification 5-33 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action LCD STR/STD LCD OFF No action Full on No a ction No action Stand by No action No action CRT STR/STD No action No action Full on LCD OFF/CRT ON No action Stand by No action No action SIMUL STR/STD No action No action LCD display will be shut down while closing LCD. 6.3.2 Power button Power button function depend s on the d efinition in Windows power setting or you can force of f by pressing power button for 4 se conds . To reset the system, you need to pre ss the reset button. 6.4 Device Power management Power state of local devices table Power State Component Doze Stand By STR STD/SOff CPU Quick Start Stop Clock Power Off Power Off North Bridge ON Stop Clo ck Power Off Power Off South Bridge ON ON Power Off (except 3VA, RTCVCC ) Power Off (except 3VA, RTCVCC) DDR ON Self Refresh Self Refresh Power Off Onboard FLASH ON Power down Power Off Power Off KBC ON ON Power down Power Off VGA ON Power down Power Off Power Off Audio CODEC ON ON Power Off Power Off Audio Amplifier ON Power down Power Off Power Off LCD Backlight ON Power Off Power Off Power Off LAN ON Power down Power down Power do wn
Hard w are Technical Specification 5-34 Modem ON Power down Power Off Power Off WLAN ON Power down Power Off Power Off 6.4.1 Device PM control during Stand By mode Device Power Controlled by Description CPU Hardware PCMCIA Controller Software Enter PCI PM D3Hot s tate EC Chip Working Keyboard Controller Working KB3310 support power down command USB Working Onboard FLASH Software support power down com mand Audio AMP Hardware Controlled by Jack in detect Modem Software Enter PCI PM D3Hot state LAN Software Enter PCI PM D3Hot state LCD Panel Back light Hardware Clock Synthesizer Hardware WLAN Software 6.4.2 Device PM control during STR mode Device Po wer Do wn Contro lled by Description EC Chip Hardware Power Do wn Onboard FLASH Hardware Power Off Modem Software Power Off LAN Software Power Down USB Hardware Power Down Audio CODEC Software Power Off Audio AMP Hardware Power Off WLAN Software Power Off LCD Panel Ha rdware Power Off LCD Back light Ha rd ware Power Off Clock Synthesizer Hardware Power Off Keyboard Controller Software Controlled by KB3310 power down com mand
Hard w are Technical Specification 5-35 6.4.3 Device PM control during STD mode Device Po wer Do wn Controlled by Description Core Logic Hardwar e Power off (ex cept R es ume Well) EC Chip Hardware Power off VGA Chip Ha rdware Power off Onboard FLASH Hardware Power off PCMCIA Controller Hard war e Power off Modem Hardware Power off LAN Hardware Power off USB Hardware Power off Audio Chip Hard war e Power off Audio AMP Hardware Power off WLAN Hardware Power off LCD Panel Hardware Power off Back light Hardware Power off Clock Synthesizer Hardware Power off Keyboard Controller Hardware Power off
Hard w are Technical Specification 5-36 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the follo w ing PCB assembly and modules. 7.1.1 Board assembly Processor Upgradeable CPU (FCBGA 479) Main Board Main System board Inverter Board LCD Module Back-lig ht TOUCH PAD&AUDIO DJ BOARD 4 LED Indicators, 2 Touch Pad Button, 5 Audio DJ button SO-DIMM Module Memory Expansion Modem Board MDC 7.2 Processor Feature: Celeron M CPU with on-die L2 ca ch e. FCBGA 479 [CPU Cooling System] Function: Dothan Core FAN is controlled by a thermal sensor and BIOS/ACPI OS.
Hard w are Technical Specification 5-37 7.3 Main board 7.3.1 Main system module spec Feature: CPU Celeron M, NB 910GML, SB ICH6M, Clock generator, SO-DIMM PC/AT compatible syst em (RTC, DMA, INT, Timer, ⦠etc) IDE controller with PIO Mode 4 & Ultra-33/66/100, PCMCIA /Cardbus controll er & their sockets Audio CODEC, Audio amplifier, CPU thermal se nsor, I/O connectors, Power management control circuit, Internal Graphic/Display controll er, Keyboard Controller, Audio analog signal, Power control, DC/DC, Battery power Regulated power SM bus for Battery Indication Charger LE D Indication Power LED Indication WLAN LED Indication FLASN Access LED â¦etc
Hard w are Technical Specification 5-38 7.3.2 DC/DC module spec Controller: ISL6262CRZ, TPS51020, ISL622 7CAZ, Input voltage: 8-20V Output voltage/current: Voltage Current Regulation 3VA 60mA -5% 3VSB 1.74A -5% 5VSB 1.38A -5% 1.5V 1.88A -5% 5V 1.09A -5% 3V 566Ma -5% 2.5V 100mA -5% 1.8V_DUAL 4.5A -5% VTT_DDR 121mA -5% VCCP 2.07A -5% VCORE 2.96A -5% Support OVP Support OCP 7.3.3 Charger Charger spec Controller: MAX8724ETI Input voltage: 9.5~12V Charger Method: CV.CC Li-Ion Battery: Full charger sense I min.: 250mA Max. charge voltage : 4.2V/cell Charger Voltage: 8.36 Charger current: Input: Adapter Contain Min Typ. Max
Hard w are Technical Specification 5-39 Charge c urrent (4S2P) 2.4A 2.46A 2.6A Charge current (4S1P) 1.3A 1.4A 1.5A Ripple & Noise 100mV Efficiency 94% 7.4 Inverter Board Inverter spec Input Voltage: 9~11V Output Current: 160mA(max) Start Voltage: 12V(min) Efficiency: 86%(max) Brightness control duty: Brightness adjust by input voltage: 0~3V Support output short protection Frequency: 25~35KHz Pin no I/O Description 1 Input/ Output Return 2 Input/ Output High voltage Brightness control duty: 0-100% 7.5 Adapter spec 7.5.1 Input Input voltage: 100~240VAC,Full range Input frequency: 50~60Hz Input current: 680Ma(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/2 40VA C Efficiency: 85%(min) 7.5.2 Output 22W power output Output Voltage/Current: 9.5V/2.315A Ripple: 500mV
Hard w are Technical Specification 5-40 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.6 Main Battery spec Battery pack capacity : Vendor Cells Volta g eC a p acit y Watts Li-Ion æ°ï¦ç 4 7.4V 2600m A h Battery warning and low percentage (Li-Ion): Battery low = 7% Battery low low= 0% Gauge controller (BQ2060H) setting: Charging voltage:8.36V Charging efficiency: 95% Low temperature capacit y : 70% 7.7 LAN Spec Controller: Atheros L2 Interface: PCIE Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LAN duri ng S3,S4 Integrated IEEE 802.3x 10BASE-T and 100 BASE-TX com patible PHY and transceiver in one chip Full duplex and half duplex support at both 10 and 1 00Mbps Low power 3.3V device 64-Pin LQFP package
Hard w are Technical Specification 5-41 7.8 Modem spec Part Number: ASUS RD01-D480 Controller: Conexant software modem Interface: AC-link Support Caller ID Support Ring wake up function ITU-T V.90 Data Mode with auto-fall back to K56flex and V.34 V.80 Video ready Modem Data speed: 56Kbps FAX transfer speed: 14.4Kbps Modem modulation format: V.90 PCM
Hard w are Technical Specification 5-42 8 MISCELLANEOUS 8.1 Indicators Power LED Feature: Type: Color: Show System power status LED Yellow Indication: On: System in ON Mode Flash: System in SUSPEND Mode Off: System in OFF Mode Location: MB/TP BRD Charging LED Feature: Type: Color: Show Battery status LED Red Indication: On: Battery in Charging Flash: Battery Low Off: Battery is fully charged or absent Location: TP BRD WLAN Feature: Type: Color: Show Receive mail status LED Blue Indication: On: WLAN on Off: No status Location: TP BRD FLASH Access LED Feature: Type: Color: Location: On: While FLASH Read/Write access LED Yellow MB
Hard w are Technical Specification 5-43 8.2 Power cord list TBD Where Description Vendor US UK Japan Europe Austria South Asia 8.3 Safety/ EMI Appliance : Agency Approv al EMC CE Mark (Europe) BSMI (Taiwan) EMI FCC Class B Certified (USA & Canada ), VCCI (Japan) MIC, IDA Safety UL, CSA or CUL, NEMKO-CB (Norwa y), TUV, CE Mark (Europe) Telecomm. FCC Part 68 (USA), DOC (Canada), JATE (Japan ), AUSTEL (Australia), TELE PERWIT (New Zealand), C TR- 21 (EU) Other Requirements Industry Standards Compliance SPA Energy Star Complianc e Designed for Windows 95/98 and Windows NT Logo (Complia nce with Microsoft PC98)
S o f t w a r e S p e c i f i c a t i o n 6-1 Softw ar e Specifica tions Get to know more about the Eee PC 4G (701) No tebook with a detailed look at the software specifications. he information contained in the chapter can be quit e useful when you are troubleshooting the systemâs har dware. Each item has its individual usage for you to Understand the soft ware side of the notebookâs a rchitecture. Chapter 6 T
S o f t w a r e S p e c i f i c a t i o n 6-2 1. General Description The specification is a guideline for BIOS de velopment on 701 platform s. Anyone who needed the system BIOS information can check this docum e nt for reference. The general device specification, hardware block diagram , SMBUS, GPIO definition and so on are subjected to be depicted in this document. Hotkeys implem entation a nd other BIOS features are also included in the document.
S o f t w a r e S p e c i f i c a t i o n 6-3 2. CPU, Chipsets & Main Devices Item V endor Specification Partâ s Name Revision CPU INTEL Dothan single core North Bridge INTEL 910GML South Bridge INTEL ICH6M VGA In ternal HD Controller Internal Audio Codec REAL TEK ALC66 2 USB INTEL Lan Athros L2 Flash memory DDR2 Clock Gen. ICS ICS9LR367 Thermal EC ENE KB3310 Wir eless Lan Atheros AR5006X Camera Azure W ave AZW A VE CardReader P ANASONIC ICS9LPR42 6AGLF-T modem Askey AFM6010NAM Table 2-1 Chipsets
S o f t w a r e S p e c i f i c a t i o n 6-4 Main component block diagram:
S o f t w a r e S p e c i f i c a t i o n 6-5 3. Device resources 3.1 Subsystem and Sub vendor ID of PCI Devices Device Bus/Dev/ Func Function V endor ID Device ID Sub-V endor ID Sub-System ID INTEL 0,0,0 Host Bridge 0x8086 0x2590 0x1043 0x1882 0.2.0 VGA 0x8086 0x2592 0x1043 0x1882 0.31.2 IDE controller 0x8086 0x2653 0x1043 0x8290 Realtek 0.27.0 Audio controller 0x8086 0x2668 0x1043 0x82A1 Athros 3.0.0 LAN 0x1969 0x2048 0x1969 0x2048 Table3-1 3.2 Devices I/O Base Table3.2 IO Base Address Devices Base Address ACPI Power Management 0x800
S o f t w a r e S p e c i f i c a t i o n 6-6 4. Specified Function Tables The Specified Functions are controlled via Gene ral Purpose Pins of Chipsets, following tables are the definition of The Functions which cont rolled via the GPIO pins of South-Bridge (ICH6M). Table 4-1. SB ICH6M GPIO Definition GPIO# Definition I/O Active Polarity Description 7 S _GPI7 Input EC THRO_CPU 8 KBC_SCI# Input Low Level SCI Event 12 S_GPI12 Input Detect LID level 13 EXTSMI# Input Low Level SMI event 19 WLAN_LED# Output High Level W ireless Lan LED 21 CAMERA_EN# Output High Level Camera Enable 23 SPEAKER_EN# Output Low Level Speaker Enable 24 MINICARD_EN # Output Low Level Minicard Enable 25 WLAN_ON# Output Low Level W ireless Lan Enable 26 S_GPI26 Input Detect PCB V ersion 27 CARD_READE R_EN# Output Low Level Card Read Enable 28 MODEM_EN# Output High Level Modem Enable 29 PCBVER0 Input Detect PCB V ersion 30 S_GPI30 Input Detect PCB V ersion 31 PCBVER1 Input Detect PCB V ersion
S o f t w a r e S p e c i f i c a t i o n 6-7 5. Setup Menu 701 system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST , the setup feature is categorized into 4 menus described as below . 5.1 Main Menu Main menu describes system overall inform ati on with some user ch angeable setting, it contains below items. 1. System Firmware: Current version for the system, EC and VGA BIOS. 2. Ty p e : Show the installed CPU Brand String. 3. Count: Show the CPU c ore number . 4. Installed Size: T otal system available memory . 5. System Time: Current time 6. System Date: Cur rent date .
S o f t w a r e S p e c i f i c a t i o n 6-8 5.2 Advanced Menu In advanced menu the users may configure ID E configuration, onboard devices and OS to install type settings may be changed as we ll. Detailed settings are describ ed below . 1. IDE configuration: See 5.2.1 2. Onboard Devices Configuration: See 5.2.2 3. OS to Install: select OS to Install Linux/W inXP/Normal
S o f t w a r e S p e c i f i c a t i o n 6-9 5.2.1 IDE Configuration 1. IDE Master: See details. 2. IDE Slave: See details.
S o f t w a r e S p e c i f i c a t i o n 6-10 5.2.2 Onboard Devices Configuration: 1. USB Ports: USB Ports enabled/disabled 2. Onboard LAN: Onboard LAN e nabled/disabled 3. Onboard Audio: Onboard Aud io enabled/disabled 4. Onboard Wlan: Onboar d wireless LAN enabl ed/disabled 5. Onboard Camera: Onboard Ca mera enabled/disabled 6. Onboard Speaker: Onb oard Speaker enabled /disabled 7. Onboard Modem: Onboard Mod em enabled/disabled 8. Onboard Card Reader: Onboard Card Reader enabled/disabled
S o f t w a r e S p e c i f i c a t i o n 6-1 1 5.3 Security Menu 701 BIOS supports three kinds of password for se curity protection: 1. Supervisor Passw ord: Users may set, change or erase system password, the password dat a is saved in non-volatile device (CMOS), syste m password check is done durin g POST(Po wer On Self Test). The BIOS will prompt a dialog message to ask user fo r password check when: The system has password store d, and âPassword on bootâ setting in BIOS SETUP is enabled. If password verification fails for 3 times, the sy stem BIOS will halt the machine to inhibit users from operating. User can modify all setup item if user use Supervisor password to enter setup. 2. User Pass word: If your setting of BIOS have been modified by other, You can setting the function [Enable], and Key in your password an d confirm, Donât modify BIOS setting if no password. User is just able to modify some of setup it em if user use user password to enter setup
S o f t w a r e S p e c i f i c a t i o n 6-12 5.4 Boot Menu In this menu users can decide the boot sequen ce, as long as the de vice with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing â â,â-â or space key on the selected (highlighted) item . 3 bootable devices fare listed in this menu ( BIOS default boot sequence ). 1. Boot Device Priority : See 5.6.1 2. Boot Settings Configurat ion: See 5.6.2 3. Onboard LAN Boot ROM: Boot from LAN
S o f t w a r e S p e c i f i c a t i o n 6-13 5. 4 .1 Boot Device Priority In this menu specifies the boot sequence from the available devices. User can change boot devices priority .
S o f t w a r e S p e c i f i c a t i o n 6-14 5. 4 .2 Boot Settings Configuration 1. Quick Boot: [Enabled] decrease time when boot. 2 . Quiet Boot: [ D i s a b l e ] : D i s p l a y n o r m a l P O S T m e s s a g e s . [Enable]: Displays OEM Logo instead of POST m essages.
S o f t w a r e S p e c i f i c a t i o n 6-15 5.5 Exit Menu In Exit BIOS setup, users may m ake final decision if they want to save the change just made or load BIOS default setting. 1 Exit & Save Changes: Exit system setup afte r saving the changes. 2 Exit & Discard Changes: Exit system setup wit hout saving any changes. 3 Discard Changes: Discards changes done so far to any of the setup questions. 4 Load setup Defaults: Load Optimal Default values for all the setup questions.
S o f t w a r e S p e c i f i c a t i o n 6-16 6. Device resources 701 uses ICH6M chipset as its power management co re logic, the chipset supports most features the ACPI 2.0 interface specifies, for ACPI 2.0 co mpliant OS. The BIOS has below features implemented: (1). System sleep states : The system supports: (a). S0 state: The CPU and all dev ices are working. ( b ). S3 state: system is in low power state, with all setting saved into RAM. Most of the devices are power of f ( c ). S4 state: The system is powered o ff, with all settings saved into hard disk. (d). S5 states. Mechanical of f. 6.1 Wake Up Event APM/ Non ACPI ACPI P W M m o d e W ake up Events S1 S1 S3 S4 S5 Power Button V V V V LID switch PME# (Lan) V V Any key V R TC V V USB
S o f t w a r e S p e c i f i c a t i o n 6-17 7 Embedded Controller (EC) 7.1 Hot Key Table 8.1.0 Fn Hot-Key definition Fn key Description A vailable Fn F1 Suspend switch ACPI A SUS010 Fn F2 W ireless lan On/Off ACPI A SUS010 Fn F 3 Brightness Down ACPI A SUS010 Fn F 4 Brightness Up ACPI A SUS010 Fn F 5 Display Devices Switch ACPI A SUS010 Fn F 6 Task Manager ACPI A SUS010 Fn F 7 V olume On/Off (Mute) ACPI A SUS010 Fn F 8 V olume Down ACPI A SUS010 Fn F 9 Vo l u m e U p ACPI A SUS010 Fn F 11 Number lock on/of f ACPI A SUS010 Fn F 12 Scroll lock on/off ACPI A SUS010 Note: 9. The applications/actions would be invoked only while A SUS01 0 driver was installed in O/S. 7.2 Battery Interface Battery T ype: ASUS Battery Command Bus interface: ASUS
S o f t w a r e S p e c i f i c a t i o n 6-18 8. Thermal Policy There is only one CPU fan in this project. The c ontrolling m e thod is to plan several step thermal ranges then every range mapping to dif ferent fan speed. The following table is thermal policy tab le and Fan Curve.