HP COMPAQ NC4200 Maintenance And Service Manual

Main tenan ce and Ser vice Gu id e HP C ompaq nc4 200 Notebook P C Doc ument P art Number: 444 6 2 4 -00 2 Apr il 200 7 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying notebook features, components, and spare parts; troubleshooting notebook problems; and performing notebook disassembly procedures.
© Copyright 2006, 2007 He wlett-P ackard Dev elopment Company , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Bluetooth is a trademark o wned by its proprietor and used by He wlett-Packard Company under licen se. SD Logo is a trademark of its proprietor . The information contained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompan ying such products and services. Nothing herein should be construed as constituting an additional warranty . HP shall not be liable for technical or editorial errors or omissions contained herein. Maintenance and S ervi ce Gui de HP Compaq nc4 200 Notebook P C Second E dition: A pr il 200 7 F irst E diti on: December 2006 Doc ument P ar t Number : 444 6 2 4 -00 2
Saf e t y w ar ning not ice Å WA R N I N G : T o reduce the po ssibility of heat-r elated inj uri es or of o ve rheating the comput er , do not plac e the computer dir ectly on y our lap or obstru ct the computer air ve nt s. Use the com puter only on a har d , flat surface . Do not allow ano ther ha r d surface , such as an adjo ining optional pr inter , or a soft surface , su ch as p illow s or rugs or clothing, to block airflo w . Also , do not allo w the A C adapter to cont act the skin or a soft surface , such as p illo w s or rugs or c lothing , dur ing oper ation . T he computer and the A C adapter compli es w ith the us er -acces sible surface tempe r atur e limits def ined by the In ter national S tandar d f or Saf ety of Infor mation T echnology E quipment (I E C 60 9 50).
Maintenance and S ervi ce Guide v Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.5 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20 2T r o u b l e s h o o t i n g 2.1 Computer Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1 Accessing Computer Setup . . . . . . . . . . . . . . . . . . . . 2–2 Computer Setup Defaults . . . . . . . . . . . . . . . . . . . . . 2–2 Selecting from the File Menu . . . . . . . . . . . . . . . . . . 2–3 Selecting from the Security Menu . . . . . . . . . . . . . . 2–4 Selecting from the Tools Menu . . . . . . . . . . . . . . . . . 2–5 Selecting from the Advanced Menu . . . . . . . . . . . . . 2–6 2.2 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . . 2–7
v i Maintenance and S ervi ce Guide Cont en ts 3 Software Update and Recovery Downloading a BIOS Update . . . . . . . . . . . . . . . . . . 3–3 Installing a BIOS Update . . . . . . . . . . . . . . . . . . . . . 3–4 Recovering the BIOS . . . . . . . . . . . . . . . . . . . . . . . . 3–5 4 Illustrated Parts Catalog 4.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 4–2 4.3 Miscellaneous Plastics/ Hardware Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–10 4.4 Miscellaneous Cable Kit . . . . . . . . . . . . . . . . . . . . . 4–11 4.5 Miscellaneous (Not Illustrated) . . . . . . . . . . . . . . . . 4–12 4.6 Sequential Part Number Listing . . . . . . . . . . . . . . . 4–14 5 Removal and Replacement Preliminaries 5.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1 5.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 5–2 Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.3 Preventing Damage to Removable Drives . . . . . . . . 5–3 5.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 5–4 5.5 Packaging and Transporting Precautions . . . . . . . . . 5–5 5.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 5–6 5.7 Grounding Equipment and Methods . . . . . . . . . . . . . 5–7
Cont en ts Maintenance and S ervi ce Guide v ii 6 Removal and Replacement Procedures 6.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2 6.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 6–3 6.3 Preparing the Notebook for Di sassembly . . . . . . . . . 6–5 6.4 Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6 6.5 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–9 6.6 Bluetooth Module . . . . . . . . . . . . . . . . . . . . . . . . . . 6–10 6.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 6–12 6.8 TPM Security Card . . . . . . . . . . . . . . . . . . . . . . . . . 6–15 6.9 Keyboard Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–16 6.10 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–18 6.11 Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22 6.12 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–23 6.13 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–26 6.14 Internal Memory Module . . . . . . . . . . . . . . . . . . . 6–28 6.15 Mini PCI Communications Card . . . . . . . . . . . . . . 6–30 6.16 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 6–32 6.17 Button Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38 6.18 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–42 6.19 TouchPad. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–46 6.20 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–50 6.21 Infrared Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–52 6.22 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–54 6.23 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–57 6.24 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–59
v iii Maintenance and S ervi ce Guide Cont en ts 7 Specifications A Connector Pin Assignments B Power Cord Set Requirements C S c r e w L i s t i n g Index
Maintenance and S ervi ce Guide 1–1 1 Pr oduct Descript ion The HP Compaq nc4200 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support. HP Compaq nc4 200 Notebook P C
1–2 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1. 1 F e a t u r e s ■ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, or 1.60-GHz processors, or Intel Celeron M 1.50-GHz processor , varying by notebook model ■ 12.1-inch, XGA, TFT (1024 × 768) display with ov er 16.8 million colors ■ 80-, 60-, or 40-GB high-capacity hard dri v e, v arying by notebook model ■ 256-MB DDR2 synchronous DRAM (SDRAM) at 400 MHz and 533MHz, expandable to 2.0 GB ■ Microsoft® W indows® XP Home Edition or W indo ws XP Professional, v arying b y notebook model ■ Full-size W indows k eyboard with embedded numeric k eypad ■ T ouchPad and pointing stick pointing de vices, including a dedicated vertical scroll re gion ■ Integrated 10Base-T/100Base-T/1000Base-T Ethernet local area network (LAN) netw ork interface card (NIC) with RJ-45 jack ■ Integrated high-speed 56K modem with RJ-11 jack ■ Integrated wireless support for Mini PCI IEEE 802.11b/g and 802.11a/b/g WLAN de vice ■ Support for one T ype I or T ype II PC Card slot, with support for both 32-bit (CardBus) and 16-bit PC Cards
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–3 ■ External 65-watt A C adapter with 3-wire po wer cord ■ 6-cell Li-Ion battery pack, v arying by notebook model ■ Audio speaker ■ V olume up, v olume mute, and v olume do wn b uttons ■ Connectors: ❏ Infrared ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v . 2.0 (3 ports, 1 powered) ❏ Po wer ❏ External monitor ❏ RJ-45 (network) ❏ RJ-11 (modem) ❏ S-V ideo-out ❏ PC Card ❏ SD Card ❏ Primary battery ❏ T ravel battery ❏ Docking connector
1–4 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .2 Reset ting t h e Notebook If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 4.3, “Miscellaneous Plastics/ Hardware Kit, ” for more information). 2. Remov e the real-time clock (R TC) battery (refer to Section 6.24, “R TC Battery , ” for more information on removing and replacing the R TC battery). 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert an y battery packs at this time. 6. T urn on the notebook. All passwords and all CMOS settings ha v e been cleared.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–5 1. 3 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e po wer . The notebook supports the follo wing po wer management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys for setting the le ve l of performance ■ Battery calibration ■ Lid switch standby/resume ■ Po wer/standby b u tton ■ Adv anced Conf iguration and Po wer Management (A CPM) compliance
1–6 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1. F r ont Component s Ta b l e 1 - 1 Fr ont Components Item Component Function 1 Wireless light On: One or more optional internal wireless de vices, such as a WLAN de vice and/or Bluetooth® de vice, are turned on. 2 P ower/standb y light ■ Green: The notebook is on. ■ Blinking green: The notebook is in standb y mode.
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–7 3B a t t e r y l i g h t ■ Amber : A batter y pack is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pack that is the only a vailab le po wer source has reached a low-battery condition. When the batter y reaches a critical lo w-batter y condition, the batter y light begins blinking more quickly . ■ Off: If the notebook is connected to an e xternal power source, the light is tur ned off when all batteries in the notebook are fully charged. If the notebook is not connected to an e xter nal pow er source, the light is turned off until the batter y reaches a low-battery condition, when the li ght begins b linking amber . 4 Integra ted Dr iv e Electronics (IDE) drive light On: A drive in the hard drive ba y is being accessed. 5 F ast IrD A (select models only) Links the notebook to an optional remote control. 6 Bluetooth module Sends and receiv es Bluetooth de vice signals. 7 Displa y release b utton Opens the notebook. Ta b l e 1 - 1 Fr ont Components (Continued) Item Component Function
1–8 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the right side of the notebook are sho wn belo w and described in T able 1-2. R ight-Side C omponents
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects an optional headphone or pow ered stereo speakers . Also connects the audio function of an audio/video de vice , such as a tele vision or VCR. 2 A udio-in (microphone) jack Connects an optional monaural (single sound channel) or stereo (dual sound channel) microphone. 3 P owered USB por t Connects US B 1.1- or 2.0-compliant de vices to the notebook using a standard USB cable , or connects an optional e xternal MultiBa y or e xternal MultiBay II to the notebook. This USB por t is a powered por t that can be used without e xter nal pow er . 4 PC Card slot eject bu tt o n Ejects PC Cards from the PC Card slot. 5 PC Card slot Suppor ts optional T ype I, T ype II, 32-bit (CardBus), or 16-bit PC Cards. 6 SD Card slot Accepts SD (Secure Digital) Memor y Cards or MultiMediaCards.
1–1 0 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Lef t -S ide Com po ne nt s Ta b l e 1 - 3 Left-Side Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. ✎ The purpose of security solutions is to act as deterrents. These deterrents may not prevent a product from being mishandled or stolen. 2 V ent Enables airflo w to cool internal components. Ä T o pre v ent ov erheating, do not obstruct vents . Using the notebook on a soft surf ace, such as a pillo w , blank et, rug, or thick clothing, ma y blo ck a ir f low .
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 1 3 Wireless button (select models only) T urns the wireless functionality of the WLAN or Bluetooth de vice on or off , b ut does not establish a connection. ✎ To establish a wireless connection, a wireless network must already be set up. 4 USB por t Connects a USB 1.1- and 2.0-compliant de vice to the notebook using a standard USB cable . 5 Inf o Center b utton Enables y ou to view a list of commonly used software solutions . 6 P ower s witch When the notebook is ■ Off , slide tow ard the front of the notebook and release to tur n on the notebook. ■ In standby , slide tow a rd the front of the notebook and release to e xit standb y . ■ In hiber nation, slide tow ard the front of the notebook and release to e xit hiber nation. If the notebook has stopped responding and Microsoft Windows shutdo wn procedures cannot be used, slide tow ard the front of the notebook and hold f or 4 seconds to tur n off the notebook. 7 Speaker Enables y ou to li sten to music and hear audio aler ts and signals from programs . Ta b l e 1 - 3 Left-Side Components (Continued) Item Component Function
1–1 2 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4. R ear P anel Components
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 3 Ta b l e 1 - 4 Rear P anel Components Item Component Function 1 USB por t Connects USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . 2 RJ-11 (modem) jack Connects a modem cab le. Enab led with 56K connectivity . 3 RJ-45 (network) jack Connects a network cable . Enabled with 10/100/1000BaseT connectivity . 4 P ower connector Connects an A C adapter , an optional A C adapter , or an optional power cab le. 5 Exter nal monitor por t Connects an optional V GA external monitor or projector . 6 S-Video-out jack Is a 7-pin, dual-pur pose jack. It connects an optional S-Video de vice, such as a tele vision, VCR, camcorder , ov erhead projector , or video capture card, with an optional, standard (4-pin) S-Video cab le. The e xtra 3 pins also enab le an optional S-Video-to-composite adapter to be used with the notebook.
1–1 4 Maintenance and S ervi ce Guide Pr oduct Desc r iption The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5. St andard K ey boar d C omponents
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 5 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 Function ke ys (12) P erform system and application tasks. When combined with the fn key , th e function ke ys f3 , f4 , and f8 through f11 perf or m additional tasks as hotk eys . 2 caps lock ke y Enables caps loc k and turns on the caps loc k light. 3 fn ke y Ex ecutes frequently used system functions when pressed in combination with a function ke y or the esc key . 4 Windows logo k e y Displa ys the Microsoft Windows Star t menu. 5W i n d o w s applications ke y Displa ys a shor tcut menu f or items beneath the pointer . 6 Arrow k e ys Mov es the cursor around the screen. 7 Embedded numeric keyp a d Can be used like an e xter nal numeric ke ypad. 8 num lock ke y Enables n umeric lock, tur ns on the embedded numeric ke ypad, and turns on the num loc k light.
1–1 6 Maintenance and S ervi ce Guide Pr oduct Desc r iption The notebook top components are sho wn belo w and described in T able 1-6. To p C o m p o n e n t s
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 7 T able 1-6 T op Components Item Component Function 1 Left and right T ouchP ad bu tt o n s (2 ) Function lik e the left and ri ght b uttons on an e xternal mouse. 2 T ouchP ad Mov es the pointer . Can be set to perf or m other mouse functions, such as scrolling, selecting, and double-clic king. 3 Left and right pointing stick b uttons (2) Function lik e the left and ri ght b uttons on an e xternal mouse. 4 P ointing stick Mov es the pointer . 5 V ent Enables airflo w to cool inter nal components. 6 Presentation Mode bu tt o n T urns on Presentation mode. 7 V olume mute bu tton Mute s or restores v olume. 8 V olume down b utton Decreases notebook sound. 9 V olume up button Increases notebook sound. 10 T ouchP ad scroll zone Scrolls upward or do wnwa rd.
1–1 8 Maintenance and S ervi ce Guide Pr oduct Desc r iption The external components on the bottom of the notebook are sho wn belo w and described in T able 1-7. Bot tom Component s
Pr oduc t Desc r ipti on Maintenance and S ervi ce Guide 1–1 9 Ta b l e 1 - 7 Bottom Components Item Component Function 1 Base enclosure cov er Cov ers the display cab le and connector . 2 Doc king connector Connects the notebook to an optional doc king de vice. 3 T r av el battery connector Connects an optional trav el battery . 4 V ents (3) Enable airflo w to cool internal components. 5 Primar y batter y bay Holds the primar y batter y pack. 6 Primar y batter y release latch Releases the primar y batter y pack from the batter y ba y . 7 Hard drive co v er Holds the primar y hard dr iv e. 8 Expansion memor y module compar tment Contains one e xpansion memor y module slot.
1–20 Maintenance and S ervi ce Guide Pr oduct Desc r iption 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of k ey parts and features of the notebook. Refer to Chapter 4, “Illustrated P arts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps. The system board provides the follo wing device connections: ■ Audio ■ Display ■ Hard dri v e ■ Intel Pentium M and Celeron M processors ■ K e yboard ■ Memory module ■ Mini PCI communications de vices ■ PC Card ■ Pointing stick ■ To u c h P a d ■ T rusted platform module (TPM) security module Ä CAUT ION: T o pr operl y v entilate the not ebook, allo w at least a 7 .6 -cm (3-inc h) clear ance on the left and ri ght side s of the noteboo k. The notebook uses an electric fan for v entilation. The fan is controlled by a temperature sensor and is designed to be turned on automatically when high temperature conditions exist. These conditions are af fected b y high external temperatures, system po wer consumption, po wer management/battery conserv ation conf igurations, battery fast char ging, and software applications. Exhaust air is displaced through the ventilation grill located on the left side of the notebook.
Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å WA R N I N G : Only au thori z ed tec hnic ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e det ailed to allo w onl y subass embl y-/module -lev el r epair . Because of the comple x ity of the indi v idual boar ds and subas sembli es, do not attem pt to mak e r epair s at the component le v el or modif icati ons to an y pr inted w ir ing boar d. Im pr oper r epairs can c r eate a saf ety haz ar d. A n y indicati on of component r eplacement or prin ted w ir ing board modif icati on may v o id an y w ar ran ty or ex c hange allo w ances . 2. 1 Com pu ter Setup Computer Setup is a preinstalled, R OM-based utility that can be used e ven when the operating system is not w orking or will not load. If the operating system is working, the notebook restarts the operating system after you exit Computer Setup. ✎ Pointing de vices are not supporte d in Computer Setup; you must use the ke yboard to na vigate and make selections. The menu tables later in this chapter provide an o v ervie w of Computer Setup options.
2–2 Maintenance and Serv ice Gui de T roubleshooting Acce ssing Computer Se tup The information and settings in Computer Setup are accessed from the File , Security , To o l s , and Advanced menus. 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner of the screen. ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . ❏ T o return to the Computer Setup menu, press esc . 2. Select the File , Security , T ools , or Advanced menu. 3. T o exit Computer Setup, choose one of the follo wing: ❏ T o exit without sa ving any changes, use the arro w keys to select File > Ignor e changes and exit , and then follo w the instructions on the screen. ❏ T o exit and sa ve all the settings you ha ve entered, use the arro w ke ys to select File > Sa ve changes and exit , and then follo w the instructions on the screen. Y our preferences are set when you exit Computer Setup and tak e ef fect when the notebook restarts. Com pu ter Setup Defaults T o return all settings in Computer Setup to the values that were set at the factory: 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner of the screen. ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . 2. Use the arro w ke ys to select File > Restor e defaults . 3. Select the Restore Defaults check box.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you ha v e entered is sa ved. Sele cting f r om the F ile Me nu Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ Vie w identification inf or mation about the notebook and any battery packs in the system. ■ Vie w specification inf or mation about the processor , memor y and cache size, video re vision, ke yboard controller version, and system ROM. Sav e to floppy Sav e system configuration settings to a diskette . Restore from flopp y Restore system configuration settings from a diskette . Restore def aults Replace configurat ion settings in Computer Setup with f actor y def ault se ttings. (Identification inf or mation is retained.) Ignore changes and e xit Cancel ch anges entered during the current session. Then e xit an d restar t the notebook. Sav e changes and exit Sav e changes entered dur ing the current session. Then e xit and restar t the notebook. The changes you sa v e are in eff ect when the notebook restar ts.
2–4 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass w ord Enter , change , or delete an HP Administrator pass word. P ower-on pass w ord Enter , change, or delete a power-on pass word. P ass w ord options ■ Enable/Disab le stringent secur ity . ■ Enable/Disab le required pass word on restar t. DriveLoc k pass words Enable/disab le Driv eLock; change a Driv eLock user or master pass word. ✎ DriveLock Settings are accessible only when you enter Comput er Setup by turning on (not restarting) the notebook. Smar t Card Secur ity Enable/disab le po wer-on suppor t f or smar t cards. ✎ This f eature is suppor ted by select smar t card readers only . Embedded Security ■ Enable/Disab le the embedded security chip . ■ Restore embedded security chip to factory settings. ■ Enable/Disab le po wer-on authentication suppor t. ■ Enable/Disab le automatic DriveLoc k. ■ Reset pow er-on authen tication credential ✎ Embedded Security settings are accessible only if the notebook is equipped with an embedded security chip. De vice security Enable/Disab le de vices in the system. Enable NIC f or inclusion in MultiBoot. System IDs Enter user-defin ed identification v alues.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–5 Selec ting from th e T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on an y hard drive in the system. Batter y Inf or mation Vie w inf or matio n about any battery packs in the notebook. Memor y Check ■ Run a self-test on memor y modules in the notebook. ■ Vie w inf or mation about memor y modules installed in the notebook.
2–6 Maintenance and Serv ice Gui de T roubleshooting Selec ting from th e Ad v anced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disab le MultiBoot, which sets a star tup sequence that can include most bootable de vices and media in the system. ■ Set the boot order . De vice options ■ Swap the functions of the fn k e y and left ctrl key . ■ Enable/Disab le multiple pointing de vices at star tup . (T o set the notebook to suppor t only a single, usually nonstandard, pointing de vice at star tup , select Disable .) ■ Enable/Disab le USB legacy suppor t f or a USB ke yboard, mouse , and hu b . When USB legacy suppor t is enabled ❐ A USB k eyboard, mouse , and hub work e v en when a Windows operating system is not loaded. ❐ The notebook star ts fr om a bootable hard drive , diskette driv e disk ette, or CD , CD-R W , or D VD inser ted into a drive connected b y a USB connector to the notebook or to an op tional doc king de vice. ■ Select a parallel por t mode: EPP (Enhanced P ar allel P o r t), standard, bidirectional, or ECP (Enhanced Capabilities P or t). ■ Enable/Disab le all settings in the SpeedStep window . (When Disable is selected, the notebook runs in Batter y Optimized mode.)
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc h arts Ta b l e 2 - 5 T roubleshooting Flo wc har ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.2—No P ower , P ar t 1” 2.3 “Flowchar t 2.3—No P ower , P ar t 2” 2.4 “Flowchar t 2.4—No P ower , P ar t 3” 2.5 “Flowchar t 2.5—No P ower , P ar t 4” 2.6 “Flowchar t 2.6—No Video , P ar t 1” 2.7 “Flowchar t 2.7—No Video , P ar t 2” 2.8 “Flowchar t 2.8—Nonfunctioning Doc king De vice (if applicab le)” 2.9 “Flowchar t 2.9—No Operating System (OS) Loading” 2.10 “Flowchar t 2.10—No OS Loading, Hard Drive, P ar t 1” 2.11 “Flowchar t 2.11—No OS Loading, Hard Drive, P ar t 2” 2.12 “Flowchar t 2.12—No OS Loading, Hard Drive, P ar t 3” 2.13 “Flowchar t 2.13—No OS Loading, Diskette Driv e”
2–8 Maintenance and Serv ice Gui de T roubleshooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning De vice” 2.18 “Flowchar t 2.18—Nonfunctioning K e yboard” 2.19 “Flowchar t 2.19—Nonfunctioning P ointing Device” 2.20 “Flowchar t 2.20—No Network/Modem Connection” Ta b l e 2 - 5 T roub leshooting Flowc har ts Overview (Continued)
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initial T roubleshootin g Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.17—Nonfunc- tioning De vice. ” Go to “Flowchar t 2.2—No P ower , Pa r t 1 . ” Go to “Flowchar t 2.6—No Video , Pa r t 1 . ” All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to “Flowchar t 2.9—No Operating System (OS) Loading. ” Go to “Flowchar t 2.15—No A udio , Pa r t 1 . ” Go to “Flowchart 2.18—Nonfunc- tioning K e yboard” or “Flowchart 2.19—Nonfunc- tioning P ointing De vice. ” Check LED board, speaker connections. Go to “Flowchar t 2.20—No Net- work/Modem Con- nection. ”
2–1 0 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.2—No P o w er , P art 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking device (if applicable). Po we r up on batter y power? Po we r up on AC power? Power up in docking device? Po we r u p on batter y power? Po we r up in docking device? Done Reset power .* Reset power .* Po we r up on AC power? N Y Y N N Y N N Y Y YN 1. On select models, there is a separate reset button. 2. On select models, the notebook can be reset using the standby switch and either the lid switch or the main power switch. *NOTES Go to “Flowchart 2.4—No P ower , Pa r t 3 . ” Go to “Flowchar t 2.3—No P ower , Pa r t 2 . ” Go to “Flowchar t 2.8—Nonfunction- ing Docking De vice (if applica- No power (power LED is off).
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 1 Flo w c har t 2.3—No P o w er , P art 2 Continued from “Flowchar t 2.2—No P ower , Pa r t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r on ? Check batter y by recharging it, moving it to another notebook, or replacing it. Po we r on ? Done Y Replace power supply (if applicable). N Po we r on ? Done Y N Go to “Flowchart 2.4—No P ower , Pa r t 3 . ”
2–1 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.4—No P o w er , P art 3 Continued from “Flowchart 2.3—No P ower , Pa r t 2 . ” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r on ? Po we r on ? Po we r on ? Plug directly into AC outlet. Po we r LE D on? Po we r ou t le t active? T r y different outlet. Replace external AC adapter . Replace power cord. Y N Y Y Y Y N N N N External Internal Go to “Flowchar t 2.5—No P ower , Pa r t 4 . ”
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 3 Flowc h ar t 2. 5—N o P o w er , P ar t 4 Y N Continued from “Flowchar t 2.4—No P ower , Pa r t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Po we r o n? Done N Replace the following items (if ap plicable). Check notebook operation after each replacement: 1. Internal DC-DC converter* 2. Internal AC adapter 3. Processor board* 4. System board* *NOTE: Replace these items as a set to prevent shorting out among components.
2–1 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2.6—No Video, P art 1 A N Stand-alone or docking device? No video. Replace the following one at a time . T est after each replacement. 1. Cable between notebook and not ebook display (if applicable) 2. Display 3. System board Internal or external display*? Adjust brightness. Video OK? Done Docking Device Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid swi tc h to en su re operation. Video OK? Done Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N *NOTE: T o change from internal to external display , use the hotkey combi- nation. Y Go to “Flowchar t 2.7—No Video , Pa r t 2 . ”
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 5 Flo wc h ar t 2.7—No Video, P art 2 Y N Continued from “Flowchart 2.6—No Video , Pa r t 1 . ” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in docking device, for bent pins on cable, and for monitor connection. Go to “A ” in “Flowchart 2.6—No Video , Pa r t 1 . ” Check brightness of external monitor . T r y another external monitor . Internal and external video OK? Go to “Flowchar t 2.8—Nonfunction- ing Docking De vice (if applica- Y Y Y N N N Remove notebook from dock- ing device, if connected.
2–1 6 Maintenance and S ervi ce Guide T roubleshooting F l o wch a rt 2 . 8 — No nf u n ct i on in g D ock i n g De v ice (if a pp licab le) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device. Reinstall notebook into dock- ing device. Docking device operating? Docking device operating? Done Done Y Nonfunctioning docking device. Remove notebook, replace docking device. T est replacement docking device with new notebook.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 7 Flo wc h ar t 2.9—No O peratin g S y s tem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive , P ar t 1. ” Reseat power cord in docking device and power outlet. No OS loading.* *NOTE: Before beginning troubleshooting, always check cable connections, cable ends, and drives for bent or damaged pins. No OS loading from diskette drive, go to “Flowchar t 2.13—No OS Loading, Dis- k ette Drive . ” No OS loading from optical drive, go to “Flowchar t 2.14—No OS Loading, Optical Drive . ” No OS loading from network, go to “Flowchar t 2.20—No Network/Modem Connection. ”
2–1 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 0—N o OS Loadin g , Hard Driv e, Pa r t 1 Go to “Flowchart 2.17—Nonfunction- ing De vice. ” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchar t 2.11—No OS Load- ing, Hard Drive , Pa r t 2 . ” Reseat external hard drive. OS loading? Done Boot from CD? Go to “Flowchar t 2.13—No OS Loading, Dis- kette Driv e. ” Boot from hard drive? Boot from diskette? Change boot priority through the Setup utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order .
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–1 9 Flo wc h ar t 2. 1 1—No OS Loa ding , H ard Driv e, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchar t 2.10—No OS Loading, Hard Drive, P ar t 1. ” Reseat hard drive. Done Disc or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to “Flowchar t 2.13—No OS Loading, Dis- kette Driv e . ” Format hard drive and bring to ab o o t a b l e C:\ prompt. Create partition, and then format hard drive to boot- able C:\ prompt. Boot from diskette drive? Remove disc or diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible? Y N Hard drive accessible? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Notebook booted? Done Y N Go to “Flowchart 2.12—No OS Load- ing, Hard Drive , Pa r t 3 . ” Go to “Flowchar t 2.12—No OS Load- ing, Hard Drive, Pa r t 3 . ”
2–20 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 2—No OS Loa ding , H ard Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchar t 2.11—No OS Load- ing, Hard Drive, Pa r t 2 . ” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on disc or diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix ba d sectors. Boot from hard drive? Replace hard drive. Done
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 1 Flo wc h ar t 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive ■ System board Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system files. Tr y d i f f e r e n t diskette. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot notebook. Is diskette drive boot order cor- rect? Change boot priority using the Setup utility . Go to “Flowchar t 2.17—Nonfunc- tioning De vice. ” Diskette drive enabled in the Setup utility? Go to “Flowchart 2.17—Nonfunction- ing De vice. ” Reset the notebook. Refer to Section 1.2, “Resetting the Notebook, ” for instructions.
2–2 2 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2. 1 4—No OS Loa ding , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchar t 2.17—Nonfunction- ing De vice. ” Go to “Flowchar t 2.17—Nonfunctioning De vice. ” Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T r y another bootable disc. Booting from another device? Booting order correct? Correct boot order using the Setup utility . Done Reseat drive. Y Y Y Y Y N N N N N Reset the notebook. Refer to Section 1.2, “Resetting the Notebook, ” for instructions.
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5 —No Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchar t 2.16—No A udio , Pa r t 2 . ” Go to “Flowchar t 2.17—Nonfunctioning De vice. ” Replace the following docking device compo- nents one at a time, as applicable. Check audio status after each change. 1. Reseat docking device audio cable. 2. Replace audio cable. 3. Replace speaker . 4. Replace docking device audio board. 5. Replace backplane board. 6. Replace I/O board. Y Y Y Y N N N Go to “Flowchar t 2.16—No A udio , Pa r t 2 . ”
2–2 4 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 6—N o Audio, P ar t 2 YN Continued from “Flowchart 2.15—No A udio , Pa r t 1 . ” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio board and speaker connections in notebook (if applicable). Replace the following components individually , retesting after each replacement: ■ Internal speakers. ■ Audio board (if applicable).
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—Nonfunc tionin g De v ice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix o r replace broken item. Nonfunctioning device. Reattach device. Close notebook, plug in power , and reboot. Device boots properly? Go to “Flowchart 2.9—No Operat- ing System (OS) Loading. ” Device boots properly? Replace hard drive. Replace diskette drive. Replace NIC. If integrated NIC, replace system board. Y N Y N
2–2 6 Maintenance and S ervi ce Guide T roubleshooting Flo wc h ar t 2. 1 8—N onfunc tionin g K e yboard Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board. Reseat internal key- board connector (if applicable). Replace internal keyboard or cable. Y N Y N Done Done Keyboard operating properly?
Tr o u b l e s h o o t i n g Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—N onfunc tioning P ointin g De vice Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace internal pointing device or cable. Y N Y N Done Done Pointing device operating properly? Pointing device operating properly?
2–2 8 Maintenance and S ervi ce Guide T roubleshooting Flo wc h art 2.20—N o Net w ork/Modem Conn ectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers and recon- figure. Reseat NIC/modem (if applicable). Replace NIC/modem (if applicable). Replace system board. Done N N N N Y Y Y Y Network or modem connec- tion working? Network or modem connec- tion working?
Maintenance and S ervi ce Guide 3–1 3 Soft w ar e Upd a te an d Rec o ver y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a v ailable. T o update HP software: 1. Identify your computer model, product category , and series or family . Prepare for a system BIOS update by identifying the BIOS version currently installed on the computer . Ä CAUT ION: If y our comput er is connect ed to a netw ork , it is r ecommended that y ou consult w ith your netw or k administr ator bef or e installing an y softwar e u pdates , espec ially s yste m BIO S updates . ✎ The computer system BIOS is stored on the system R OM. The BIOS initializes the operating system, determines ho w the computer will interact with the hardware de vices, and pro vides for data transfer among hardware de vices, including the time and date. 2. Access the updates through the HP W eb site ( http://www .hp.com ) or the Support Softwar e disc (purchased separately). 3. Install the updates.
3–2 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel. ■ Model information is provided on the serial number label on the bottom of the computer . T o determine whether av ailable BIOS updates contain later BIOS versions than those currently installed on the computer , you need to kno w the v ersion of the system BIOS currently installed. BIOS version information (also kno wn as R OM date and System BIOS) can be displayed by pressing fn esc (if you are already in Microsoft W indows) or b y opening Computer Setup. T o use Computer Setup for displaying BIOS information: 1. Open Computer Setup by turning on or restarting the computer , and then pressing f10 while the “F10 = R OM Based Setup” message is displayed in the lo wer -left corner of the screen. 2. Use the arro w ke ys to select File > System Inf ormation , and then press enter . BIOS date information is displayed. 3. T o exit Computer Setup, use the arro w k eys to select File > Ignor e changes and exit . Then follo w the instructions on the screen.
Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–3 Obtainin g t h e Suppor t Sof t w are Disc The Support Softwar e disc provides HP softw are updates and installation instructions. The disc includes de vice dri vers, BIOS updates, and utilities. T o purchase the current Support Softwar e disc or a subscription that provides both the current v ers ion and future v ersions of the disc, visit the HP W eb site at http://www .hp.com . Soft w are Upda tes an d t he HP W eb Site Most software on the HP W eb site is packaged in a compressed f ile called a SoftP aq . Some BIOS updates may be packaged in a compressed f ile called a RO M P a q . Most do wnload packages contain a f ile named Readme.txt. A Readme.txt f ile contains information regarding installing and troubleshooting the f ile. The Readme.txt f iles included with R OMPaqs are provided in English only . Do wnloa ding a B IOS U pda te Ä CAUT ION: T o pr ev en t damage to the computer or an unsucce ssf ul installati on , do w nload and install a BIO S update onl y w hen the comput er is connected to r eliable external po w er u sing the A C adapt er . Do not do w nload or install a BIO S update w hile the computer is ru nning on battery pow er , doc k ed in an optional doc king de v ice , or connected to an optional po wer so ur ce . Dur ing the do wnload and ins tallation: ■ Do not disc onnect po w er f r om th e comput er by un plugging the po w er cor d f r om the A C outlet . ■ Do not shut do wn the compu ter or initiate s tandb y or hibernati on . ■ Do not inse rt, r emov e , connect , or disconnect an y de v ice , cable, or cord .
3–4 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery T o download a BIOS update: 1. Access the page on the HP W eb site that provides software for your computer: ❏ Select Start > Help and Support , and then click a software update link. – or – ❏ V isit the HP W eb site at http://www .hp.com/support . 2. Follo w the instructions on the screen to identify your computer and access the BIOS update you want to do wnload. 3. At the do wnload area: a. Identify the BIOS update that is later than the BIOS version currently installed on your computer . Make a note of the date, name, or other identif ier . Y ou may need this information to locate the update later , after it has been do wnloaded to your hard dri v e. b . F ollo w the instructions on the screen to do wnload your selection to the hard dri ve. ✎ Make a note of the path to the location on your hard dri v e where the BIOS update will be do wnloaded. Y ou will need to access this path when you are ready to install the update. Installin g a B IOS U pda te Ä CAUT ION: If y our comput er is connect ed to a netw ork , it is r ecommended that y ou consult w ith your netw or k administr ator bef or e installing an y softwar e u pdates , espec ially s yste m BIO S updates .
Softwar e Update and Reco v ery Maintenance and S ervi ce Guide 3–5 BIOS installation procedures v a ry . Follo w any instructions that are displayed on the screen after the do wnload is complete. If no instructions are displayed: 1. Open W indows Explorer b y selecting Start > All Pr ograms > Accessories > Windo ws Explor er . 2. In the left pane of the W indows Explorer windo w: a. Click My Computer and then your hard dri v e designation. The hard dri ve designation is typically Local Disk (C:). b . Using the hard dri v e path you recorded earlier , open the folder on your hard dri v e that contains the update. 3. Double-click the f ile with an .ex e e xtension (for example, f ilename.ex e). The BIOS installation begins. 4. Complete the installation by follo wing the instructions on the screen. ✎ After a message on the screen repor ts a successful installation, you may delete the do wnloaded f ile from your hard dri v e. Rec o v er in g t h e B I O S ✎ The BIOS recov ery procedure requires a USB disk ette dri ve and a formatted diskette. The BIOS can be recov ered if the flash memory is corrupted. Flash memory corruption can occur if the notebook po wers do wn while the BIOS is being updated. When the notebook is turned on, the boot block portion of the flash memory performs an integrity check on the rest of the BIOS image and enters recov ery mode if the image is corrupt.
3–6 Maintenance and Serv ice Gui de So ftwar e Update and R eco v ery BIOS recov ery can be forced on a non-functioning notebook b y turning on the notebook while pressing and holding the W indows logo ke y B on the nonfunctioning notebook ke yboard until the caps lock light blinks. T o recov er the BIOS: 1. If the nonfunctioning notebook is docked in an optional docking de vice, undock the notebook. 2. Attach the USB diskette dri v e directly to a USB port on the nonfunctioning notebook. (USB hubs are not supported for BIOS recov ery). 3. Insert the correct R OMPaq diskette for the product being updated. The BIOS image f ile must be located in the root directory of the diskette and must be in contiguous sectors. The easiest way to ensure this is to visit http://www .hp.com , do wnload the Softpaq, and let the Softpaq create the R OMPaq diskette. 4. Press and hold the W indows logo k ey B on the notebook ke yboard (do not use an e xternal keyboard) and turn on the notebook and wait for the caps lock light to start blinking. 5. Release the W indows logo k ey B . The BIOS recov ery procedure takes approximately one minute to read the image from the diskette, and then an additional 15 seconds to pr ogram the image into flash memory . The notebook restarts when the BIOS recov ery procedure is complete. Do not attempt to turn of f the notebook after starting a recov ery . If the BIOS recov ery procedure stalls, the caps lock light will begin blinking. This situation can arise if the disk ette is corrupt or the incorrect R OMPaq is used. If the notebook does not restart after approximately 3 minutes, press and hold the po wer b utton, or slide and hold the po wer switch, for at least 5 seconds to force the notebook to turn itself of f. Then repeat the BIOS recov ery procedure.
Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a tal og This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seri al Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook. Serial Numb er Loca tion
4–2 Maintenance and Serv ice Gui de Illustrated P a rts Catalog 4.2 Notebook Major C om ponents Noteboo k Major C omponents
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 12.1-inch, XGA, TFT display assemb ly (includes wireless antenna boards and cables) 383548-001 Display Hinge Kit (not illustrated) 383530-001 LCD rubber pad kit, with screws (not illustr ated) 383546-001 2 Keyboar d co ver 383519-001 3 Keyboar ds , with pointing stick Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Ger many Hungar y Iceland Israel Italy Ja pa n Ko r e a Latin America The Netherlands Norwa y 383458-181 383458-201 383458-221 383458-081 383458-021 383458-051 383458-121 383458-041 383458-211 383458-DD1 383458-BB1 383458-061 383458-291 383458-AD1 383458-161 383458-331 383458-091 P eople’ s Repub lic of China Po l a n d P or tugal Russia Saudi Arabia South Africa Spain Slov akia Sweden Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 383458-AA1 383458-241 383458-131 383458-251 383458-171 383458-AR1 383458-071 383458-231 383458-101 383458-111 383458-AB1 383458-281 383458-141 383458-031 383458-001
4–4 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 4 Rear keyboard co ver 383522-001 5 Button board (includes button board cab le) 383511-001 6 T op cover 383560-001 7 Fa n 383528-001 8 T ouchP ad 383562-001 T ouchP ad cable (not illustr ated, included in the Cable Kit, spare par t number 383516-001) 9 Memor y modules PC24200 1024 MB 512 MB 256 MB 383536-001 383542-001 383538-001 PC23200 1024 MB 512 MB 256 MB 383535-001 383541-001 383537-001 10 Mini PCI comm unications cards 802.11g Silv er ton wirele ss local access network (WLAN) card, f or use in most of the world 802.11g Silv er ton WLAN card, f or use in the rest of the wor ld 381302-001 381303-001 802.11a/b/g FRLN WLAN card, f or use in Europe 802.11a/b/g FRLN WLAN card, f or use in Japan 802.11a/b/g FRLN WLAN card , f or use in most of the wor ld 802.11a/b/g FRLN WLAN card, f or use in RO W 377792-001 373888-291 373888-001 373889-001
4–6 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 10 Mini PCI comm unications cards (Continued) 802.11a/b/g DynaStar WLAN card, f or use in Ja pan 802.11a/b/g DynaStar WLAN card, f or use in most of the world 802.11a/b/g DynaStar WLAN ca rd, f or use in the rest of the world 337407-291 337407-001 337407-002 802.11a/b/g A TMC WLAN card, for use in J apan 802.11a/b/g A TMC WLAN card, for use in MO W 802.11a/b/g A TMC WLAN card , for use in the rest of the world 377408-291 377408-001 377408-002 11 Heat sink (includes ther mal paste) 383559-001 12 Processor s (include ther mal paste) Intel P entium M 2.13-GHz Intel P entium M 2.00-GHz Intel P entium M 1.86-GHz Intel P entium M 1.73-GHz Intel P entium M 1.60-GHz 383555-001 383554-001 383553-001 383552-001 383551-001 Intel Celeron M 1.50-GHz 383550-001 13 System board 383515-001
4–8 Maintenance and Serv ice Gui de Illustrated P a rts Catalog Noteboo k Major C omponents
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–9 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics/Hard ware Kit , includes: 383549-001 14a 14b 14c 14d PC Card slot spacer Bluetooth board cov er Hard drive cov er Memor y module compar tment cove r Not illustrated: Notebook f eet 15 Speaker 383557-001 16 Modem board (high-speed 56K, includes modem cab le) 383534-001 17 RTC battery 383625-001 18 Base enclosure co ver 383520-001 19 Infrared boar d (includes cable) 383512-001 20 Base enclosure 383509-001 21 6-cell battery pack 383510-001 22 Hard drives (all 5400 rpm; include cov er , frame, and connector) 80-GB 80-GB 60-GB 40-GB 405839-001 383527-001 383526-001 383525-001 23 TPM security module 383545-001 24 Bluetooth wireless module (includes Bluetooth module cab le) 370429-001 25 Hard drive co ver 383529-001 LCD board (not illustr ated) 417947-001
4–1 0 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.3 Miscell an eous P la sti c s/ Har dw ar e Ki t T able 4-2 Spare P art Number 383549-001 Item Description 1 Hard drive co v er 2 Bluetooth cov er 3 PC Card slot space sav er 4 Memor y module compar tment cov er (includes 2 captive scre ws) 5 Notebook f eet (5)
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 1 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Spare P art Number 383516-001 Item Description 1 LED board cable 2 RJ-11 cable 3 T ouchP ad cab le 4 Bluetooth cable
4–1 2 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.5 Miscell an eous (Not I llus trated) Ta b l e 4 - 4 Miscellaneous Spare P art Information Description Spare P art Number Label Kit 383533-001 Adjustable notebook stand 372420-001 Adv anced Doc king Station 374804-001 Docking Station 374803-001 Docking Station Miscellaneous Plastics Kit 380045-001 P o wer supply , 65 watt 338136-001 Ke yboard point stic k cap, blue 404150-001 Rubber domes 383524-001 In verter 383532-001 Micr ophone 383543-001 Smart card reader 411337-001 LCD center hinge cap 383518-001 Po w e r c o r d s Fo r u s e i n : Belgium, Europe, Greece , Norwa y , and P or tugal 350188-021 Brazil 350188-201 Canada, F rench Canada, Latin Amer ica, T aiwan, Thailand, and the United States 350188-001 Denmark 350188-081 F rance 350188-051 Ger many 350188-041
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 3 Po w e r c o r d s (continued) Fo r u s e i n : Hong K ong and the United Kingdom 350188-031 Israel 350188-BB1 Italy 350188-061 Japan 350188-291 The Netherlands 350188-331 P eople’ s Repub lic of China 350188-AA1 Saudi Arabia 350188-171 Spain 350188-071 Sweden/Finland 350188-B71 Screw Kit (includes the f o llow ing screws; ref er to Appendix C , “Screw Listing, ” for more inf ormation on specifications and usage) 383556-001 ■ Phillips PM2.5×13.0 spring-loaded scre w ■ Phillips PM3.0×4.0 screw ■ Phillips PM2.5×7.0 screw ■ Phillips PM2.0×5.0 screw ■ Phillips PM2.0×4.0 screw ■ Phillips PM1.5×3.5 screw ■ T orx 8 M2.0×18.0 screw ■ T orx 8 M2.0×9.0 screw ■ T orx 8 M2.0×7.5 screw ■ T orx 8 M2.0×5.0 screw Ta b l e 4 - 4 Miscellaneous Spare P art Information (Continued) Description Spare P art Number
4–1 4 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 4.6 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 5 Sequential P art Number Listing Spare P art Number Description 337407-001 802.11a/b/g DynaStar WLAN Mini PCI comm unications card, f or use in most of the world 337407-002 802.11a/b/g DynaStar WLAN Mini PCI comm unications card, f or use in the rest of the world 337407-291 802.11a/b/g DynaStar WLAN Mini PCI comm unications card, f or use in J apan 338136-001 65-w att pow er supply 350188-001 P ower cord f or use in Can ada, F rench Canada, Latin Amer ica, T aiwan, Thailand, and the United States 350188-021 P ower cord f or use in Be lgium, Europe , Greece, Norw a y , and P or tugal 350188-031 P ower cord f or use in Hong K ong and the United Kingdom 350188-041 P ower cord f or use in Germany 350188-051 P ower cord f or use in F rance 350188-061 P ower cord f or use in Italy 350188-071 P ower cord f or use in Spain 350188-081 P ower cord f or use in Denmark 350188-171 P ower cord f or use in Saudi Arabia 350188-201 P ower cord f or use in Brazil 350188-291 P ower cord f or use in J apan 350188-331 P ower cord f or use in the Netherlands
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 5 350188-AA1 P ower cord f or use in P eople’ s Republic of China 350188-B71 P ow er cord f or use in Sweden/Finland 350188-BB1 P ower cord f or use in Isra el 370429-001 Bluetooth wireless module (includes Bluetooth module cab le) 373888-001 802.11a/b/g FRLN WLAN Mini PCI comm unications card, f or use in most of the world 373888-291 802.11a/b/g FRLN WLAN Mini PCI comm unications card, f or use in Japan 373889-001 802.11a/b/g FRLN WLAN Mini PCI comm unications card, f or use in the rest of the world 372420-001 Adjustab le notebook stand 374803-001 Doc king Station 374804-001 Adv anced Doc king Station 377408-001 802.11a/b/g A TMC WLAN Mini PCI communications card, f or use in most of the world 377408-002 802.11a/b/g A TMC WLAN Mini PCI communications card, f or use in the rest of the world 377408-291 802.11a/b/g A TMC WLAN Mini PCI communications card, f or use in Japan 377792-001 802.11a/b/g FRLN WLAN Mini PCI comm unications card, fo r u s e i n E u r o p e 380045-001 Doc king Station Mi scellaneous Plastics Kit Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
4–1 6 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 381302-001 802.11g Silv er ton WLAN Mini PCI communications card, f or use in most of the world 381303-001 802.11g Silv er ton WLAN ca rd Mini PCI communications card, f or use in the rest of the world 383458-001 K eyboard with pointing st ic k f or use in the United States 383458-021 K eyboard with pointi ng stic k f or use in Europe 383458-031 K eyboard with pointing st ic k f or use in the United Kingdom 383458-041 K eyboard with pointi ng stic k f or use in Germany 383458-051 K eyboard with pointi ng stic k f or use in F rance 383458-061 K eyboard with poin ting stic k f or use in Italy 383458-071 K eyboard with pointi ng stic k f or use in Spain 383458-081 K eyboard with pointi ng stic k f or use in Denmark 383458-091 K eyboard with pointi ng stic k f or use in Norw a y 383458-101 K eyboard with pointi ng stic k f or use in Sweden 383458-111 K eyboard with pointing stic k f or use in Switze r land 383458-121 K eyboard with pointing stic k f or use in F rench Canada 383458-131 K eyboard with pointi ng stic k f or use in P or tugal 383458-141 K eyboard with pointi ng stic k f or use in T urke y 383458-171 K eyboard with pointing stic k f or use in Saudi Arabia 383458-181 K eyboard with pointi ng stic k f or use in Belgium 383458-201 K eyboard with pointi ng stic k f or use in Brazil Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 7 383458-211 K eyboard with pointi ng stic k f or use in Hungary 383458-221 K eyboard with pointing stic k f or use in Czech Repub lic 383458-231 K eyboard with pointi ng stic k f or use in Slo v akia 383458-241 K eyboard with pointi ng stic k f or use in P o land 383458-251 K eyboard with pointi ng stic k f or use in Russia 383458-281 K eyboard with pointi ng stic k f or use in Thailand 383458-291 K eyboard with pointi ng stic k f or use in J apan 383458-AA1 K eyboard with pointing st ic k f or use in P eople’ s Republic of China 383458-AB1 K eyboard with pointi ng stic k f o r use in T aiwan 383458-AD1 K e yboard with pointi ng stick f or use in K orea 383458-AR1 K e yboard with pointing stick f or use in South Afr ica 383458-BB1 K eyboard with pointi ng stic k f or use in Israel 383458-DD1 K eyboard with pointi ng stic k f or use in Iceland 383509-001 Base enclosure 383510-001 6-cell battery pack 383511-001 Button board (inc ludes b utton board cab le) 383512-001 Infr ared board (includes cable) 383515-001 System board 383516-001 Miscellaneous Cab le Kit Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
4–1 8 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 383518-001 LCD center hinge cap 383519-001 K eyboard co v er 383520-001 Base enclosure co v er 383522-001 Rear k e yboard cov er 383524-001 Rub ber domes 383525-001 40-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 383526-001 60-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 383527-001 80-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 383528-001 F an 383529-001 Hard drive co v er 383530-001 Displa y Hinge Kit 383532-001 In v er ter 383534-001 Modem board (high-spee d 56K, includes modem cab le) 383535-001 PC23200 1024-MB memory module 383536-001 PC24200 1024-MB memory module 383537-001 PC23200 256-MB memory module 383538-001 PC24200 256-MB memory module 383541-001 PC23200 512-MB memory module Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
Illustrated P ar ts Catal og Maintenance and S ervi ce Guide 4–1 9 383542-001 PC24200 512-MB memory module 383543-001 Microphone 383545-001 TPM security module 383546-001 LCD rubber pad kit with scre ws 383548-001 12.1-inch, XGA, TFT disp la y assemb ly (includes wireless antenna boards and cables) 383549-001 Miscellaneous Plastics/Hardw are Kit 383550-001 Intel Celeron M 1.50-GHz processor (includes thermal paste) 383551-001 Intel P e ntium M 1.60-GHz processor (includes ther mal paste) 383552-001 Intel P e ntium M 1.73-GHz processor (includes ther mal paste) 383553-001 Intel P e ntium M 1.86-GHz processor (includes ther mal paste) 383554-001 Intel P e ntium M 2.00-GHz processor (includes ther mal paste) 383555-001 Intel P e ntium M 2.13-GHz processor (includes ther mal paste) 383557-001 Speak er 383559-001 Heat sink 383560-001 T op cov er 383562-001 T ouchP ad 383625-001 R TC batter y 383533-001 Label Kit 383556-001 Scre w Kit Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
4–20 Maintenance and S ervi ce Guide Illustrated P a rts Catalog 405839-001 80-GB hard driv e (5400 r pm; includes cov er , frame, and connector) 411337-001 Smar t card reader 417947-001 LCD board 440150-001 K eyboard point stic k cap , blue Ta b l e 4 - 5 Sequential P art Number Listing (Continued) Spare P art Number Description
Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 5 . 1 T ools Required Y ou will need the follo wing tools to complete the remov al and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 scre wdri v er ■ T orx T8 screwdri ver ■ Flat-bladed scre wdri v er ■ T ool kit—includes connector remov al tool, loopback plugs, and case utility tool
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassembly from the notebook, place the subassembly (and all accompanying scre ws) away from the work area to pre vent damage. Pl a s t i c Pa r t s Using excessi ve force during disassembly and reassembly can damage plastic parts. Use care when handling the plastic parts. Apply pressure only at the points designated in the maintenance instructions. C abl es and C onn ec tors Ä CAUT ION: When serv ic ing the notebook, ensur e that cable s are placed in their pr oper locations dur ing the r eass embl y pr oces s. Impr oper ca ble placement can damage the noteboo k. Cables must be handled with extreme care to a void damage. Apply only the tension required to unseat or seat the cables during remov al and insertion. Handle cables by the connector whene ver possible. In all cases, a void bending, twisting, or tearing cables. Ensure that cables are routed in such a way that they cannot be caught or snagged b y parts being remo ved or replaced. Handle flex cables w ith e xtreme care; these cables tear easily .
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5. 3 P r eve n t i n g D a m a g e t o R emo v able Dr i v es Remov able driv es are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able driv e, or loss of information, observe the follo wing precautions: ■ Before removing or inserting a hard dri ve, shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the notebook on, and then shut it do wn through the operating system. ■ Before removing a disk ette dri v e or optical dri ve, ensure that a diskette or disc is not in the dri ve and ensure that the optical dri ve tray is closed. ■ Before handling a dri ve, ensure that you are dischar ged of static electricity . While handling a driv e, a v oid touching the connector . ■ Handle dri ves on surf aces co vered with at least one inch of shock-proof foam. ■ A v oid dropping dri ves from an y height onto an y surface. ■ After removing a hard dri ve, an optical dri v e, or a diskette dri ve, place it in a static-proof bag. ■ A v oid exposing a hard dri ve to products that ha ve magnetic f ields, such as monitors or speakers. ■ A v oid exposing a dri ve to temperature extremes or liquids. ■ If a dri ve must be mailed, place the dri ve in a b ubble pack mailer or other suitable form of protecti ve packaging and label the package “FRA GILE: Handle W ith Care. ”
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pr e v enting Elec trosta tic D ama g e Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks built into many inte grated circuits provide some protection, b ut in many cases, the discharg e contains enough po wer to alter de vice parameters or melt silicon junctions. A sudden dischar ge of static electricity from a finger or other conductor can destroy static-sensiti ve de vices or microcircuitry . Often the spark is neither felt nor heard, b ut damage occurs. An electronic de vice e xposed to electrostatic dischar ge may not be af fected at all and can work perfectly throughout a normal cycle. Or the de vice may function normally for a while, then degrade in the internal layers, reducing its life e xpectanc y .
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k a ging an d T rans por ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrostatic-sensiti ve parts and assemblies with conducti ve or appro v ed containers or packaging. ■ K eep electrostatic-sensiti ve parts in their containers until the parts arri ve at static-free w orkstations. ■ Place items on a grounded surface before remo ving items from their containers. ■ Alw ays be properly grounded when touching a sensiti ve component or assembly . ■ Store reusable electrostatic-sensiti ve parts from assemblies in protecti ve packaging or nonconducti ve foam. ■ Use transporters and con veyors made of antistatic belts and roller b ushings. Ensure that mechanized equipment used for moving materials is wired to ground and that proper materials are selected to a v oid static charging. When grounding is not possible, use an ionizer to dissipate electric charges.y
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ). ■ Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and equipment. ■ Use conducti ve f ield service tools such as cutters, driv ers, and v acuums. ■ When f ixtures must directly contact dissipati ve surf aces, use f ixtures made only of static-safe materials. ■ K eep the work area free of nonconducti ve materials such as ordinary plastic assembly aids and Styrofoam. ■ Handle electrostatic-sensiti ve components, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A v oid contact with pins, leads, or circuitry . ■ T urn off po wer and input signals before inserting or removing connectors or test equipment.
Re mo val and R eplaceme nt Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 5 .7 G rounding E quip men t and Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o provide proper ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips to connect a wrist strap. ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots. On conducti ve floors or dissipati ve floor mats, use foot straps on both feet with a minimum of one megohm resistance between the operator and ground. T o be effecti ve, the conducti ve strips must be w orn in contact with the skin. Other grounding equipment recommended for use in pre venting electrostatic damage includes: ■ Antistatic tape ■ Antistatic smocks, aprons, and slee ve protectors ■ Conducti ve bins and other assembly or soldering aids ■ Nonconducti ve foam ■ Conducti ve tabletop w orkstations with ground cords of one megohm resistance ■ Static-dissipati ve tables or floor mats with hard ties to the ground ■ Field service kits ■ Static aw areness labels ■ Material-handling packages ■ Nonconducti ve plastic bags, tubes, or box es ■ Metal tote boxes ■ Electrostatic v oltage le vels and protecti ve materials
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif f erent acti vities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats. Ta b l e 5 - 1 T ypical Electrostatic V oltage Levels Relative Humidity Event 10% 40% 55% W alking across carpet 35,000 V 15,000 V 7,500 V W alking across vin yl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 14,500 V 5,000 V 3,500 V Removing b ubb le pac k from PCB 26,500 V 20,000 V 7,000 V P ac king PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 V. Ta b l e 5 - 2 Static-Shielding Materials Material Use V oltage Pr otection Level Antistatic plastic Bags 1,500 V Carbon-loaded plastic F loor mats 7,500 V Metallized laminate Floor mats 5,000 V
Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cemen t Pr ocedure s This chapter provides remo v al and replacement procedures. There are 56 scre ws, in 10 dif feren t sizes, that may ha v e to be remov ed, replaced, or loosened when servicing the notebook. Make special note of each scre w and scre w lock size and location during remov al and replacement. Refer to Appendix C, “Scre w Listing, ” for detailed information on scre w and scre w lock sizes, locations, and usage.
6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Seri al Number Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Serial Numb er Loca tion
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 6 .2 Di sassembl y Seque nce Chart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Remo ved 6.3 Preparing the notebook for disassemb ly Batter y pack 0 6.4 Hard drive 2 loosened to remov e the hard drive co ver 1 loosened to remov e the hard drive 4 to disassemble the hard drive 6.5 Notebook f eet 0 6.6 Bluetooth module 2 loosened to remov e the Bluetooth cov er 6.7 Exter nal memor y module 2 to remov e the memor y module compar tment cov er 6.8 TPM security card 1 6.9 K eyboard cov er 2 6.10 K e yboard 4 6.11 Fa n 3 6.12 Heat sink 4
6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es Section Description # of Screws Remo ved 6.13 Processor 1 loosened 6.14 Inter nal memor y module 0 6.15 Mini PCI communications card 0 Å T o prev ent an unresponsive system, replace the wireless module only with a wireless module authorized f or use in the computer by the go v er nme ntal agency that regulates wireless de vices in your coun try or region. If you replace the module and then receiv e a warning message, remov e the module to restore comput er functionality , and then contact technical suppor t through Help and Suppor t. 6.16 Displa y assembly 6 6.17 Button board 2 on rear ke yboard cov er 1 on button board 6.18 To p c o v e r 8 6.19 T ouchP ad 4 6.20 Speaker 2 6.21 Infrared board 1 6.22 System board 5 6.23 Modem board 2 6.24 R TC batter y 0 Disassembl y Sequence Char t (Continued)
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 6. 3 Preparin g th e Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1. Shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the computer on, and then shut it do wn through the operating system. 2. Disconnect all external de vices connected to the notebook. 3. Disconnect the po wer cord. 4. Remov e the battery pack b y follo wing these steps: a. T urn the notebook upside do wn with the rear panel to ward you. b . Slide the battery release latch 1 to ward you. (The left side of the battery pack disengages from the notebook.) c. Lift the left side of the battery pack and swing it to the right 2 to remov e it. R emo v ing the Battery P ack Re verse the abo v e procedure to install the battery pack. Battery P ack Spare P ar t Number Information 6-cell batter y pack 383510-001
6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the two PM2.0×5.0 scre ws 1 that secure the hard dri v e cov er to the notebook. 3. Lift the right side of the hard dri ve co v er and swing it to the left 2 to remov e it. ✎ The hard dri ve co v er is included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001. R emo v ing the Har d Dr i v e C o v er Har d Drive Spare P art Number Information Hard drives (all 5400 rpm; incl ude cove r , frame, and connector) 80-GB 80-GB 60-GB 40-GB 405839-001 383527-001 383526-001 383525-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–7 4. Loosen the PM2.5×13.0 hard dri v e retention scre w 1 . 5. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the left 3 to disconnect it from the system board. 6. Remov e the hard dri v e 4 . R emo v ing the Har d Dr i v e
6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Remov e the four PM3.0×4.0 scre ws 1 that secure the hard dri v e frame to the hard dri ve. 8. Lift the frame straight up 2 to remov e if from the hard dri v e. 9. Remov e the hard dri v e connector 3 . R emo v ing the Har d Dr i v e F rame Re verse the abo v e procedure to reassemble and install the hard dri ve.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001. R eplac ing the Notebook F eet
6–1 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the hard dri v e ( Section 6.4 ). 3. Position the notebook with the front to ward you. 4. Loosen the two PM2.0×5.0 scre ws 1 that secure the Bluetooth cov er to the notebook. 5. Remov e the Bluetooth co ver 2 . ✎ The Bluetooth cov er is included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001. R emo v ing the Blueto oth Co v er Bluetooth Module Spare P art Number Information Bluetooth wireless module (includes Bluetooth module cable) 370429-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 1 6. Slide the Bluetooth module out of the notebook 1 . 7. Disconnect the Bluetooth module cable 2 from the board. R emo v ing the Bluet ooth Module Re verse the abo v e procedure to install the Bluetooth module.
6–1 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.7 Exter nal Me mor y Module 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. Memory Module Spare P ar t Number Inf ormation PC24200 1024 MB 512 MB 256 MB 383536-001 383542-001 383538-001 PC23200 1024 MB 512 MB 256 MB 383535-001 383541-001 383537-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 3 3. Remov e the two PM2.0×5.0 scre ws 1 that secure the memory module compartment cov er to the notebook. 4. Lift the left side of the cov er and swing it to the right 2 to remov e the memory module compartment co ver . ✎ The memory module compartment cov er is included in the Miscellaneous Plastics/Hardware Kit, spare part number 383549-001. R emo v ing the Memory Module Compartment C o v er
6–1 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the module opposite the socket rises a way from the notebook.) 6. Slide the module aw ay from the socket at an angle 2 . 7. Remov e the memory module. ✎ Memory modules are slotted 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Memory Module Re verse the abo v e procedure to install an external memory module.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 5 6.8 TP M S ec u ri t y C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module compartment co ver ( Section 6.7 ). 3. Remov e the PM1.5×3.5 scre w 1 that secures the TPM security card to the notebook. 4. Lift up on the rear edge of the TPM security card 2 to disconnect it from the system board. 5. Remov e the TPM security card. R emo v ing a TP M Sec ur ity Car d Re verse the abo v e procedure to install the TPM security card. TPM Security Car d Spare P art Number Inf ormation TPM security module 383545-001
6–1 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.9 K e yboar d C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Remov e the two T8M2.0×18.0 scre ws that secure the ke yboard co ver to the notebook. R emo v ing the K e y boar d Co ver S c r e w s Ke yboar d Co ver Spare P art Number Information K e yboard cov er 383519-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 7 4. T urn the notebook right-side up with the front to ward you. 5. Open the notebook as far as possible. 6. Lift the front edge of the ke yboard cov er until it detaches from the notebook. Rel e as i n g t h e Keybo a rd C over 7. Lift the ke yboard co ver straight up and remo v e it. R emo v ing the K e y boar d Co ver Re verse the abo v e procedure to install the ke yboard co ver .
6–1 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e yb oa rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. T urn the notebook upside do wn with the front to ward you. Ke yboar d Spare P art Number Information K e yboards, with pointing stic k Belgium Brazil Czech Repub lic Denmark Europe F rance F rench Canada Ger many Hungar y Iceland Israel Italy Ja pan Ko r e a Latin America The Netherlands Norwa y 383458-181 383458-201 383458-221 383458-081 383458-021 383458-051 383458-121 383458-041 383458-211 383458-DD1 383458-BB1 383458-061 383458-291 383458-AD1 383458-161 383458-331 383458-091 P eople’ s Repub lic of China Po l a n d P or tugal Russia Saudi Arabia South Africa Spain Slov akia Sweden Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 383458-AA1 383458-241 383458-131 383458-251 383458-171 383458-AR1 383458-071 383458-231 383458-101 383458-111 383458-AB1 383458-281 383458-141 383458-031 383458-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–1 9 4. Remov e the follo wing: 1 Three T8M2.0×9.0 scre ws 2 One T8M2.0×5.0 scre w R emo v ing the K e y boar d Sc r e w s
6–20 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. T urn the notebook right-side up with the front to ward you. 6. Open the notebook as far as possible. 7. Slide the ke yboard back 1 until the pointing stick cable is accessible. 8. Release the zero insertion force (ZIF) connector to which the pointing stick cable is connected and disconnect the pointing stick cable 2 from the system board. Disconnec ting the P ointing S tic k Cable
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 1 9. Lift the rear edge of the ke yboard 1 until it disengages from the notebook. 10. Slide the ke yboard forward 2 until it rests on the palm rest. 11. Release the ZIF connector to which the ke yboard cable is connected and disconnect the ke yboard cable 3 from the system board. 12. Remov e the ke yboard. R emo v ing the K e y boar d Re verse the abo v e procedure to install the ke yboard.
6–2 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 1 Fan 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Disconnect the fan cable 1 from the system board. 5. Remov e the three T8M2.0×7.5 scre ws 2 that secure the fan to the notebook. 6. Remov e the f an 3 . R emo v ing the F an Re verse the abo v e procedure to install the fan. F an Spare P art Number Information F an 383528-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 3 6. 1 2 H ea t S in k 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Remov e the f an ( Section 6.11 ). 5. Remov e the four PM2.5×7.0 scre ws that secure the heat sink to the notebook. R emo v ing the Heat Sink Sc r e w s Heat Sink Spare P art Number Information Heat sink (includes ther mal paste) 383559-001
6–2 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. Lift the right side of the heat sink 1 to disengage it from the processor . 7. Slide the heat sink up and to the right 2 to remov e it. ✎ Due to the adhesi v e quality of the thermal paste located between the heat sink and processor , it may be necessary to mov e the heat sink from side to side to detach the heat sink from the processor . R emo v ing the Heat Sink
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 5 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste is included with all heat sink and processor spare part kits. T hermal P aste L ocations Re verse the abo v e procedure to install the heat sink.
6–2 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 3 P roces s or ✎ All processor spare part kits include thermal paste. 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). 4. Remov e the f an ( Section 6.11 ). 5. Remov e the heat sink ( Section 6.12 ). Pr ocessor Spare P art Number Information Intel P entium M 2.13-GHz Intel P entium M 2.00-GHz Intel P entium M 1.86-GHz Intel P entium M 1.73-GHz Intel P entium M 1.60-GHz 383555-001 383554-001 383553-001 383552-001 383551-001 Intel Celeron M 1.50-GHz 383550-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–2 7 6. Use a flat-blade scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear a click. 7. Lift the processor straight up and remov e it 2 . ✎ The gold triangle 3 on the processor should be aligned in the rear right corner when you install the processor. Remo ving the Processor Re verse the abo v e procedure to install the processor .
6–2 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 4 Internal M emor y Module 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). Memory Module Spare P ar t Number Inf ormation PC24200 1024 MB 512 MB 256 MB 383536-001 383542-001 383538-001 PC23200 1024 MB 512 MB 256 MB 383535-001 383541-001 383537-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –2 9 4. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The side of the memory module opposite the socket rises a way from the notebook.) 5. Slide the memory module aw ay from the socket at an angle 2 . 6. Remov e the memory module. ✎ Memory modules are slotted 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Int ernal Me mory Module Re verse the abo v e procedure to install a memory module.
6–30 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 5 M i ni PCI C o mm u n ic a t io ns C a rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Release the ke yboard ( Section 6.10 ). Mini PCI Communications Car d Spare P art Number Information 802.11g Silv er ton wireless loca l access network (WLAN) card, f or use in most of the world 802.11g Silv er ton WLAN card, for use in the rest of the w orld 381302-001 381303-001 802.11a/b/g FRLN WLAN card, f or use in Europe 802.11a/b/g FRLN WLAN card, f or use in Ja pan 802.11a/b/g FRLN WLAN card, f or use in most of the world 802.11a/b/g FRLN WLAN card, f or use in the rest of the world 377792-001 373888-291 373888-001 373889-001 802.11a/b/g DynaStar WLAN card, f or use in Japan 802.11a/b/g DynaStar WLAN card, f or use in most of the world 802.11a/b/g DynaStar WLAN card , f or use in the rest of the wor l d 337407-291 337407-001 337407-002 802.11a/b/g A TMC WLAN card, for use in J apan 802.11a/b/g A TMC WLAN card, fo r use in most of the w orld 802.11a/b/g A TMC WLAN card, for use in the rest of the world 377408-291 377408-001 377408-002
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 1 ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. 5. Spread the two retaining tabs 2 on each side of the Mini PCI socket to release the Mini PCI communications card. (The edge of the card opposite the socket rises a way from the notebook.) 6. Remov e the Mini PCI communications card b y pulling the card aw ay from the socket at a 45-de gree angle 3 . ✎ The Mini PCI communications card is slotted 4 to pre vent incorrect installation. R emo v ing a Mini P CI Communi cati ons Car d Re verse the abo v e procedure to install a Mini PCI communications card.
6–3 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6 . 1 6 Displa y Assembl y 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard co ver ( Section 6.9 ). 3. Remov e the ke yboard ( Section 6.10 ). 4. Close the notebook. 5. T urn the notebook upside do wn with the rear panel to ward you. Displa y Assembl y Spare P art Number Information 12.1-inch, XGA, TFT displa y assemb ly (includes wireless antenna boards and cab les) 383548-001 Displa y Hinge Kit 383530-001 LCD rubber pad kit, with screws 383546-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –3 3 6. Remov e the two T8M2.0×18.0 scre ws 1 that secure the display cable cov er to the notebook. 7. Remov e the two T8M2.0×9.0 scre ws 2 that secure the display assembly to the notebook. R emo v ing the Displa y Assembl y Sc r e w s
6–3 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the base enclosure co ver . R emo v ing the Bas e Enclo sur e C o v er 9. Disconnect the display cable from the system board. Disconnec ting the Displa y Cable
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–35 10. Route the display cable through the opening between the base enclosure and the top cov er . R eleasing the Dis play C able
6–3 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 11. T urn the notebook right-side up with the front to ward you. 12. Open the notebook as far as possible. 13. Disconnect the wireless antenna cables from the Mini PCI communications card 1 . 14. Disconnect the microphone cable 2 from the system board. 15. Remov e the wireless antenna cables and the microphone cable from the routing channel 3 and clips 4 through which the cables are routed. Disconnec ting the Displa y Cable s
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 7 16. Route the display cable through the opening in the notebook 1 . 17. Remov e the two PM2.0×18.0 scre ws 2 that secure the display assembly to the notebook. 18. Remov e the display assembly 3 . R emo v ing the Displa y Assembl y Re verse the abo v e procedure to install the display assembly .
6–3 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6 . 1 7 But to n Boa r d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. K eyboard co v er ( Section 6.9 ) b . K e yboard ( Section 6.10 ) c. Display assembly ( Section 6.16 ) Button Boar d Spare P art Number Information Rear k eyboard co v er 383522-001 Button board (includes b utt on board cable) 383511-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–3 9 2. Remov e the two T8M2.0×18.0 scre ws 1 that secure the rear ke yboard co ver to the notebook. 3. Remov e the rear k eyboard co v er 2 . R emo v ing the R ear K e yboar d Co v er
6–40 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. Disconnect the b utton board cable 1 from the system board. 5. Remov e the silv er PM2.0×4.0 scre w 2 that secures the b utton board to the top cov er . R emo v ing the Button Boar d Sc r e w
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 1 6. Lift the left side of the b utton board 1 . 7. Slide the b utton board to the left 2 and remov e it. R emo v ing the Button Boar d Re verse the abo v e procedure to install the b utton board.
6–4 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 8 T o p C ov e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board ( Section 6.17 ) T op Cover Spare P ar t Number Information T op cover 383560-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–43 2. T urn the notebook upside do wn with the front to ward you. 3. Remov e the se v en T8M2.0×9.0 scre ws that secure the top cov er to the notebook. R emo v ing the T op Co v er Sc r ew s, P ar t 1
6–44 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the silv er PM2.0×4.0 scre w that secures the top cov er to the notebook. R emo v ing the T op Co v er S cr ew , P art 2
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6 –4 5 6. Disconnect the T ouchPad cable from the system board 1 . 7. Lift the rear edge of the top cov er 2 until it disengages from the base enclosure. 8. Lift the top cov er straight up 3 and remo ve it. R emo v ing the T op Co v er Re verse the abo v e procedure to install the top cov er .
6–4 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T o uc h P a d 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board ( Section 6.17 ) f. T op cov er ( Section 6.18 ) 2. T urn the top cov er upside do wn with the front to ward you. T ouchP ad Spare P ar t Number Information T ouchP ad 383562-001 T ouchP ad cable (included in the Cab l e Kit, spare par t number 383516-001)
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 7 3. Remov e the four PM2.0×4.0 scre ws that secure the T ouchPad bracket to the top co ver . R emo v ing the T ouchP ad Br ac k et Sc r e ws
6–4 8 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Lift the right side of the T ouchPad bracket 1 until it rests at an angle. 5. Slide the T ouchPad bracket to the right 2 and remo v e it. R emo v ing the T ouchP ad Br ac k et
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–4 9 6. Lift the right side of the T ouchPad 1 until it rests at an angle. 7. Slide the T ouchPad to the right and remov e it 2 . R emo v ing the T ouchP ad Re verse the abo v e procedure to install the T ouchPad.
6–5 0 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 Sp ea k e r 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board ( Section 6.17 ) f. T op cov er ( Section 6.18 ) Speaker Spare P art Number Information Speak er 383557-00
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 1 2. Disconnect the speaker cable 1 from the system board and route the cable under the infrared board cable 2 . 3. Remov e the two T8M2.0×5.0 scre ws 3 that secure the speaker to the notebook. 4. Remov e the speak er 4 . R emo v ing the S peak er Re verse the abo v e procedure to install the speaker .
6–5 2 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 1 Infrared Board 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . K e yboard cov er ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Display assembly ( Section 6.16 ) e. Button board ( Section 6.17 ) f. T op cov er ( Section 6.18 ) g. Speaker ( Section 6.20 ) Infrared Boar d Spare P art Number Information Infrared board (includes cab le) 383512-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 3 2. Release the ZIF connector to which the infrared board cable is connected and disconnect the cable 1 from the system board. 3. Remov e the T8M2.0×5.0 scre w 2 that secures the infrared board to the system board. 4. Remov e the infrared board 3 . R emo v ing the Infr ared Boar d Re verse the abo v e procedure to install the infrared board .
6–5 4 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.22 S y s t em B oa rd ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti v e system board and installed on the replacement system board: ■ Memory modules ( Section 6.7 and Section 6.14 ) ■ TPM security card ( Section 6.8 ) ■ Processor ( Section 6.13 ) ■ Mini PCI communications card ( Section 6.15 ) ■ Modem board ( Section 6.23 ) ■ R TC battery ( Section 6.24) 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.6 ) c. K eyboard co v er ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Fan ( Section 6.11 ) f. Heat sink ( Section 6.12 ) g. Display assembly ( Section 6.16 ) h. Button board ( Section 6.17 ) i. T op cov er ( Section 6.18 ) j. Speaker ( Section 6.20 ) k. Infrared board ( Section 6.21 ) System Boar d Spare P art Number Information System board 383515-001
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 5 2. Remov e the four T8M2.0×5.0 scre ws 1 that secure the system board to the notebook. 3. Remov e the T8M2.0×7.5 scre w 2 that secures the system board spacer to the notebook. 4. Remov e the system board spacer 3 . R emo v ing the S ys tem Boar d Sc r ew s
6–5 6 Maint enance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 5. Lift the left side of the system board 1 until the hard dri v e connector 2 is clear of the base enclosure. 6. Slide the system board to the left 3 to remov e it. R emo v ing the S ys tem Boar d Re verse the abo v e procedure to install the system board.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 7 6.2 3 Mod em B oard 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.6 ) c. K eyboard co v er ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Fan ( Section 6.11 ) f. Heat sink ( Section 6.12 ) g. Display assembly ( Section 6.16 ) h. Button board ( Section 6.17 ) i. T op cov er ( Section 6.18 ) j. Speaker ( Section 6.20 ) k. Infrared board ( Section 6.21 ) l. System board ( Section 6.22 ) 2. T urn the system board upside do wn with the front to ward you. Modem Boar d Spare P art Number Information Modem board (high-speed 56K, in cludes modem cable) 383534-001
6–5 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the modem cable from the two connectors 1 on the system board. 4. Remov e the two PM2.0×4.0 scre ws 2 that secure the modem board to the system board. 5. Lift the right side of the modem board 3 to disconnect it from the system board. 6. Remov e the modem board. R emo v ing the Modem Boar d Re verse the abo v e procedure to install the modem board.
R emo v al and Replace ment Pr ocedures Maintenance and S ervi ce Guide 6–5 9 6.24 RT C B a t t er y 1. Prepare the notebook for disassembly ( Section 6.3 ) and remo ve the follo wing components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth module ( Section 6.6 ) c. K eyboard co v er ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Fan ( Section 6.11 ) f. Heat sink ( Section 6.12 ) g. Display assembly ( Section 6.16 ) h. Button board ( Section 6.17 ) i. T op cov er ( Section 6.18 ) j. Speaker ( Section 6.20 ) k. Infrared board ( Section 6.21 ) l. System board ( Section 6.22 ) 2. T urn the system board upside do wn with the left side to ward you. R TC Battery Spare Part Number Information R TC batter y 383625-001
6–60 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 3. Remov e the R TC battery from the system board socket. R emo v ing the R T C Bat tery Re verse the abo v e procedure to install the R TC battery .
Maintenance and S ervi ce Guide 7–1 7 Spec ifi ca tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height (front to back) Width Depth 30.2 to 31.5 mm 285 mm 235 mm 1.19 to 1.24 in 11.22 in 9 in W eight 1.81 kg 3.99 lbs Input P ower Operating v oltage Operating current 18.5 V dc @ 3.5 A - 65 W 3.5 A T emperature Operating (not writing to optical disc) Operating (writing to optical disc) Nonoperating 0°C to 35°C 5°C to 35°C -20°C to 60°C 32°F to 95°F 41°F to 95°F -4°F to 140°F
7–2 Maintenance and Serv ice Gui de Spe cifica tio ns Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95% Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.75 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min s weep r ate 1.50 g zero-to-peak, 10 Hz to 500 Hz, 0.5 oct/min s weep r ate ✎ Applicable product safety standards specify thermal limits for plastic surfaces. The notebook operates well within this range of temperatures. Ta b l e 7 - 1 Notebook (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 12.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.300 × 0.300 mm 1024 × 768 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 3.5 W Viewing angle /-65° horizontal, /-50° v er tical typical
7–4 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 3 Har d Drives 80-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 102 g 9.5 mm 70 mm 99 g Interface type ATA - 5 ATA - 5 ATA - 5 T ransfer rate Synchronous (maximum) Security 100 MB/sec A T A security 100 MB/sec ATA s e c u r i t y 100 MB/sec A T A security Seek times (typical read, including setting) Single trac k Ave r a g e Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms Logical bloc ks † 156,301,488 117,210,240 78,140,160 Disk rotational speed 5400 r pm 5400 r pm 5400 r pm Operating temperature 5°C to 55°C (41°F to 131°F) ✎ Certain restrictions and exclusi ons apply. Consult Customer Care for details. *1 GB = 1 billion b ytes when ref erring to hard dr iv e storage capacity . Actual accessible capacity is less . † Actual drive specificatio ns ma y differ slightly .
Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 Primary 6-cell, Li-Ion Batter y P ac k Dimensions Height Width Depth We i g h t 2.00 cm 9.40 cm 13.40 cm 0.34 kg 0.79 in 3.70 in 5.28 in 0.75 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.8 V 4.8 Ah 52 Wh T emperature Operating Nonoperating 5°C to 45°C 0°C to 60°C 41°F to 113°F 32°F to 140°F
7–6 Maintenance and Serv ice Gui de Spe cifica tio ns Ta b l e 7 - 5 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 Not applicable DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K e y or Microsoft Natural K eyboard IRQ2 Cascaded IRQ3 Intel 82801DB/DBM USB2 Enhanced Host Controller—24CD IRQ4 COM1 IRQ5* Cone xant A C—Link A udio Intel 82801DB/DBM SMBus Controller—24C3 Data F ax Modem with Smar tCP IRQ6 Diskette driv e IRQ7* P arallel port IRQ8 System CMOS/real-time clock IRQ9* Microsoft A CPI-compliant system IRQ10* Intel USB UHCI controller—24C2 Intel 82852/82855 GM/GME Graphic Controller Realtek R TL8139 F amily PCI f ast Ether net Controller
7–8 Maintenance and Serv ice Gui de Spe cifica tio ns IRQ11 Intel USB EHCI controller—24CD Intel USB UHCI controller—24C4 Intel USB UHCI controller—24C7 Intel Pro/Wireless 2200BG TI OHCI 1394 host controller TI PCI1410 CardBus controller IRQ12 Synaptics PS/2 T ouchPad IRQ13 Numer ic data processor IRQ14 Pri mar y IDE channel IRQ15 Secondar y IDE channel *Def ault configuration; audio possib le configurations are IRQ5, IRQ7, IRQ9, IRQ10, or none. ✎ PC Cards may assert IRQ3, IRQ4, IRQ5, IRQ7, IRQ9, IRQ10, IRQ11, or IRQ15. Either the infrared or the se rial port may assert IRQ3 or IRQ4. Ta b l e 7 - 6 System Interrupts (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 7 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interrupt controller no . 1 022 - 024 Opti chipset configuration registers 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration f or CPU 040 - 05F Counter/timer registers 044 - 05F Unused 060 K eyboard controller 061 P or t B 062 - 063 Unused 064 K eyboard controller 065 - 06F Unused 070 - 071 NMI enab le/R TC 072 - 07F Unused 080 - 08F DMA page registers 090 - 091 Unused 092 P or t A 093 - 09F Unused 0A0 - 0A1 Interrupt controller no . 2
7–1 0 Maintenance and S ervi ce Guide Spe cifica tio ns I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 Secondar y fix ed disk controller 178 - 1EF Unused 1F0 - 1F7 Pr imar y fix ed disk controller 1F8 - 200 Unused 201 Jo ystic k (decoded in ESS1688) 202 - 21F Unused 220 - 22F Enter tainment audio 230 - 26D Unused 26E - 26 Unused 278 - 27F Unused 280 - 2AB Unused 2A0 - 2A7 Unused 2A8 - 2E7 Unused 2E8 - 2EF Reser v ed seri al por t Ta b l e 7 - 7 System I/O Addresses (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–1 1 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette driv e controller 378 - 37F P arallel por t (LPT1/def ault) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Reser v ed (parallel por t/no EPP suppor t) 3C0 - 3DF V GA 3E0 - 3E1 PC Card controller in CPU 3E2 - 3E3 Unused 3E8 - 3EF Inter nal modem 3F0 - 3F7 “A” diskette controller 3F8 - 3FF Serial por t (COM1/def ault) CF8 - CFB PCI configuration inde x register (PCIDIV O-1) CFC - CFF PCI configuration data register (PCIDIV O-1) Ta b l e 7 - 7 System I/O Addresses (Continued)
7–1 2 Maintenance and S ervi ce Guide Spe cifica tio ns Ta b l e 7 - 8 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memor y 48 KB 000C0000-000CBFFF Video BIOS 160 KB 000C8000-000E7FFF Unused 64 KB 000E8000-000FFFFF System BIOS 15 MB 00100000-00FFFFFF Extended memor y 58 MB 01000000-047FFFFF Super extended memory 58 MB 04800000-07FFFFFF Unused 2 MB 08000000-080FFFFF Video memor y (direct access) 4 GB 08200000-FFFEFFFF Unused 64 KB FFFF0000-FFFFFFFF System BIOS
Maintenance and S ervi ce Guide A–1 A Co nnec tor P in A ssi gnm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel
A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 5 VDC 3 Data 2 Data – 4 Ground
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 External Monitor Pin Signal Pin Signal 1 Red analog 9 5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor izontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B cloc k 8 Ground analog
A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive 7 Unused 4 Unused 8 Unused
A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 S-Video-Out Pin Signal Pin Signal 1 S-VHS color (C) signal 5 TV -CD 2 Composite video signal 6 S-VHS intensity ground 3 S-VHS intensity (Y) signal 7 Composite video ground 4 S-VHS color ground
Maintenance and S ervi ce Guide B–1 B P o w er Cord Se t Requirements 3-Con duc tor P o w er C ord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 v olts A C. The po wer cord set included with the notebook meets the requirements for use in the country or region where the equipment is purchased. Po wer cord sets for use in other countries or regions must meet the requirements of the country or region where the notebook is used.
B–2 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries or regions. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft). ■ All po wer cord sets must be approv ed b y an acceptable accredited agency responsible for e valuation in the country or region where the po wer cord set will be used. ■ The po wer cord sets must ha ve a minimum current capacity of 10 amps and a nominal v oltage rating of 125 or 250 V A C, as required by each country’ s or region’ s po wer system. ■ The appliance coupler must meet the mechanical conf iguration of an EN 60 320/IEC 320 Standard Sheet C13 connector for mating with the ap pliance inlet on the back of the notebook.
P ow er Cor d Set Requir ements Maintenance and S ervi ce Guide B–3 Countr y/Region -Spec ific Requiremen ts 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Number A ustralia EANSW 1 Au s t r i a OVE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 F rance UTE 1 Ger many VDE 1 Italy IMQ 1 Jap a n ME TI 3 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f or e v aluation in the countr y or region where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equiv alent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flexib le cord, and wall plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration.
B–4 Maintenance and Se rvic e Guide P ow er Cor d Set R equirements The Netherlands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f or e v aluation in the countr y or region where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equiv alent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flexib le cord, and wall plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration. 3-Conductor P ower Cor d Set Requirements (Continued) Country/Region Accredited Agency Applicable Note Number
Maintenance and S ervi ce Guide C–1 C Sc r e w List ing This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 383556-001.
C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw Color Qty . Length Thread Head Width Black 6 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the hard driv e cov er to the notebook (documented in Section 6.5 ) 2 T wo screws that secure the memory mo dule compar tment drive co v er to the notebook (documented in Section 6.7 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–3 Phillips M2 . 0×5 . 0 Sc r ew L ocations Ta b l e C - 1 Phillips PM2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 6 5.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the Bluetooth co v er to the notebook (scre ws are captured on the cov er b y C clips; documented in Section 6.6 ) mm
C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 .5×1 3 . 0 and Phillips M3 .0×4. 0 Scr ew L ocations Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty . Length Thread Head Width Black 1 13.0 mm 2.5 mm 5.5 mm Where used: 1 One scre w that secures the hard dr iv e frame to the hard drive (documented in Section 6.4 ) mm Ta b l e C - 3 Phillips PM3.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 3.0 mm 5.0 mm Where used: 2 F our scre ws that secure the hard driv e fr ame to the hard drive (documented in Section 6.4 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–5 Phillips M1 . 5×3 . 5 Sc re w L ocation Ta b l e C - 4 Phillips PM1.5×3.5 Screw Color Qty . Length Thread Head Width Silv er 1 3.5 mm 1.5 mm 4.5 mm Where used: One screw that secures the TPM security card to the notebook (documented in Section 6.8 ) mm
C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the k e yboard co v er to the notebook (documented in Section 6.9 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–7 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the bas e enclosure cov er to the notebook (documented in Section 6.16 ) mm
C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.16 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–9 T or x T8M2 .0×1 8.0 S cr ew L ocati ons Ta b l e C - 5 T orx T8M2.0×18.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 18.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the rear k e yboard cov e r to the notebook (documented in Section 6.17 ) mm
C–1 0 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 1 Three screws that secure the k e yb oard to the notebook (documented in Section 6.10 ) 2 T wo screws that secure the displa y assembly to the not ebook (documented in Section 6.16 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 1 T or x T8M2 .0×9 . 0 Sc r e w L ocations Ta b l e C - 6 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 12 9.0 mm 2.0 mm 4.5 mm Where used: 7 screws that secure the top co v e r to the notebook (documented in Section 6.18 ) mm
C–1 2 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati on Ta b l e C - 7 T orx T8M2.0×5.0 Screw Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: One screw that secures the k e yboa rd to the noteboo k (documented in Section 6.10 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 3 T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 1 T wo screws that secure the speak e r to the notebook (documented in Section 6.20 ) 2 One scre w that secures the infrared board to the notebook (documented in Section 6.21 ) mm
C–1 4 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×5 . 0 Scr ew L ocati ons Ta b l e C - 7 T orx T8M2.0×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 5.0 mm 2.0 mm 4.5 mm Where used: 4 screws that secure the system boar d to the notebook (documented in Section 6.22 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 5 T or x T8M2 .0×7 .5 Sc r ew L ocations Ta b l e C - 8 T orx T8M2.0×7.5 Screw Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: 3 screws that secure the f an to the notebook (documented in Section 6.11 ) mm
C–1 6 Maintenance and Serv ice Gui de Scr e w Listi ng T or x T8M2 .0×7 . 5 Sc r e w L ocation Ta b l e C - 8 T orx T8M2.0×7.5 Screw (Continued) Color Qty . Length Thread Head Width Silv er 4 7.5 mm 2.0 mm 4.5 mm Where used: One screw that secures the system boar d and system board spacer to the notebook (documented in Section 6.22 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 7 Phillips M2 .5×7 .0 S cr ew L ocati ons Ta b l e C - 9 Phillips PM2.5×7.0 Screw Color Qty . Length Thread Head Width Black 4 7.0 mm 2.5 mm 5.0 mm Where used: 4 screws that secure the heat sink to the notebook (documented in Section 6.12 ) mm
C–1 8 Maintenance and Serv ice Gui de Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 1 One scre w that secures the button b oard to the notebook (documented in Section 6.17 ) 2 One scre w that secures the top co v er to the notebook (documented in Section 6.18 ) mm
Scr e w Listi ng Maintenance and S ervi ce Guide C–1 9 Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 4 screws that secure the T ouchPad br a ck et to the top co v er (documented in Section 6.19 ) mm
C–20 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips M2 . 0×4. 0 Sc r e w L ocati ons T able C-10 Phillips PM2.0×4.0 Screw ( Continued) Color Qty . Length Thread Head Width Silv er 8 2.0 mm 4.0 mm 4.0 mm Where used: 2 screws that secure the modem board to the system board (documented in Section 6.23 ) mm
Maintenance and S ervi ce Guide Inde x–1 In de x A adjustable notebook stand, spare part number 4–12, 4–15 Advanced Docking Station, HP, spare part number 4–12 , 4–15 arrow keys 1–15 audio troubleshooting 2–23 audio-in jack location 1–9 pin assignments A–2 audio-out jack location 1–9 pin assignments A–1 B base enclosure cover location 1–19 spare part number 4–18 base enclosure, spare part number 4–9, 4–17 battery bay 1–19 battery light 1–7 battery pack removal 6–5 spare part number 4–9 , 4–17 , 6–5 specifications 7–5 battery release latch 1–19 Bluetooth cable 4–11 Bluetooth cover illustrated 4–10 removal 6–10 Bluetooth module location 1–7 removal 6–10 spare part number 4–9 , 4–15 , 6–10 bottom components 1–18 button board removal 6–38 spare part number 4–5 , 4–17 , 6–38 C cables, service considerations 5–2 caps lock key 1–15
Inde x–2 Maintenance and Serv ice Gui de Inde x components bottom 1–18 front 1–6 keyboard 1–14 left-side 1–10, 1–12 rear 1–10, 1–12 right-side 1–8 top 1–16 Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin assignments audio-in A–2 audio-out A–1 external monitor A–3 monitor A–3 RJ-11 A–4 RJ-45 A–5 S-Video-out A–6 Universal Serial Bus (USB) A–2 connectors, service considerations 5–2 D design overview 1–20 disassembly sequence chart 6–3 diskette drive OS loading problems 2–21 precautions 5–3 display assembly removal 6–32 spare part number 4–3 , 4–19 , 6–32 specifications 7–3 Display Hinge Kit, spare part number 4–3, 4–18 , 6–32 display release button 1–7 docking connector 1–19 docking device, troubleshooting 2–16 Docking Station, HP, spare part number 4–12, 4–15 drives, preventing damage 5–3 E electrostatic discharge 5–4, 5–8 external monitor port, pin assignments A–3 F fan removal 6–22 spare part number 4–5 , 4–18 , 6–22 features 1–2 feet illustrated 4–10 locations 6–9 flowcharts, troubleshooting no audio 2–23, 2–24 no network/modem connection 2–28 no OS loading 2–17 no OS loading from diskette drive 2–21
Inde x Maintenance and S ervi ce Guide Inde x–3 no OS loading from hard drive 2–18, 2–19, 2–20 no OS loading from optical drive 2–22 no power 2–10 , 2–12 , 2–13 no video 2–14, 2–15 nonfunctioning device 2–25 nonfunctioning docking device 2–16 nonfunctioning keyboard 2–26 nonfunctioning pointing device 2–27 fn key 1–15 front components 1–6 function keys 1–15 G grounding equipment and methods 5–7 H hard drive OS loading problems 2–18 precautions 5–3 removal 6–6 spare part numbers 4–9, 4–18 , 4–20 , 6–6 specifications 7–4 hard drive cover illustrated 4–10 location 1–19 removal 6–6 spare part number 4–9, 4–18 hard drive light 1–7 headphone jack, pin assignments A–1 heat sink removal 6–23 spare part number 4–7 , 4–19 , 6–23 HP Advanced Docking Station, spare part number 4–12 , 4–15 HP Docking Station, spare part number 4–12, 4–15 I I/O address specifications 7–9 Info Center button 1–11 infrared board removal 6–52 spare part number 4–17, 6–52 infrared lens 1–7 interrupt specifications 7–7 K keyboard removal 6–18 spare part numbers 4–3, 4–16 , 4–17 , 6–18 troubleshooting 2–26 keyboard components 1–14 keyboard cover removal 6–16 spare part number 4–3 , 4–18 , 6–16 keypad keys 1–15
Inde x–4 Maintenance and Serv ice Gui de Inde x L Label Kit, spare part number 4–12 , 4–19 LED board cable 4–11 left-side components 1–10, 1–12 M memory map specifications 7–12 memory module removal 6–12, 6–28 spare part numbers 4–5, 4–18 , 4–19 , 6–12 , 6–28 memory module compartment 1–19 memory module compartment cover illustrated 4–10 removal 6–13 microphone jack, pin assignments A–2 Mini PCI communications card removal 6–30 spare part numbers 4–5, 4–7 , 4–14 , 4–15 , 4–16 Miscellaneous Cable Kit components 4–11 spare part number 4–11, 4–17 Miscellaneous Plastics Kit (for use with Docking Station), spare part number 4–12, 4–15 Miscellaneous Plastics/Hardware Kit components 4–10 spare part number 4–9 , 4–10 , 4–19 modem board removal 6–57 spare part number 4–9 , 4–18 , 6–57 modem cable 4–11 modem jack, pin assignments A–4 modem, troubleshooting 2–28 monitor port location 1–13 pin assignments A–3 N network jack, pin assignments A–5 network, troubleshooting 2–28 nonfunctioning device, troubleshooting 2–16, 2–25 notebook feet illustrated 4–10 locations 6–9 notebook specifications 7–1 num lock key 1–15 O optical drive OS loading problems 2–22 precautions 5–3 P packing precautions 5–5 PC Card slot 1–9
Inde x Maintenance and S ervi ce Guide Inde x–5 PC Card slot eject button 1–9 PC Card slot space saver 4–10 plastic parts 5–2 pointing device, troubleshooting 2–27 pointing stick 1–17 pointing stick buttons 1–17 power connector 1–13 power cord set requirements B–2 spare part numbers 4–12, 4–13 , 4–14 , 4–15 power management features 1–5 power supply, spare part number 4–12, 4–14 power switch 1–11 power, troubleshooting 2–10 power/standby light 1–6 Presentation Mode button 1–17 primary battery release latch 1–19 processor removal 6–26 spare part numbers 4–7, 4–19 , 6–26 R rear components 1–10, 1–12 rear keyboard cover removal 6–38 spare part number 4–5, 4–18 , 6–38 removal/replacement preliminaries 5–1 procedures 6–1 right-side components 1–8 RJ-11 cable 4–11 RJ-11 jack location 1–13 pin assignments A–4 RJ-45 jack location 1–13 pin assignments A–5 RTC battery removal 6–59 spare part number 4–9 , 4–19 , 6–59 S Screw Kit contents C–1 spare part number 4–13, 4–19 , C–1 screw listing C–1 SD Card slot 1–9 security cable slot 1–10 serial number 4–1, 6–2 service considerations 5–2 speaker location 1–11 removal 6–50 spare part number 4–9 , 4–19 , 6–50 specifications battery pack 7–5 display 7–3 hard drive 7–4 I/O addresses 7–9 interrupts 7–7 memory map 7–12
Inde x–6 Maintenance and Serv ice Gui de Inde x notebook 7–1 system DMA 7–6 static shielding materials 5–8 S-Video-out jack location 1–13 pin assignments A–6 system board removal 6–54 spare part number 4–7, 4–17 , 6–54 system DMA 7–6 system memory map 7–12 T tools required 5–1 top components 1–16 top cover removal 6–42 spare part number 4–5, 4–19 , 6–42 TouchPad location 1–17 removal 6–46 spare part number 4–5, 4–19 , 6–46 TouchPad buttons 1–17 TouchPad cable 4–11 TouchPad scroll zone 1–17 TPM security module removal 6–15 spare part number 4–9, 4–19 , 6–15 transporting precautions 5–5 travel battery connector 1–19 troubleshooting audio 2–23 Computer Setup 2–2 docking device 2–16 flowcharts 2–7 keyboard 2–26 modem 2–28 network 2–28 nonfunctioning device 2–16 , 2–25 OS loading 2–17 overview 2–1 pointing device 2–27 power 2–10 video 2–14 U Universal Serial Bus (USB) port location 1–9, 1–11, 1–13 pin assignments A–2 V vents 1–10, 1–17 , 1–19 video troubleshooting 2–14 volume buttons 1–17 W Windows applications key 1–15 Windows logo key 1–15 wireless button 1–11 wireless light 1–6 workstation precautions 5–6