HP Compaq nc6000 Maintenance And Service Manual

Main tenan ce and S er vice Guide HP C om paq Bu sines s Not ebook nc6 000 Doc ument P art Number : 3 3 516 7 -001 No v ember 200 3 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying note book features, components, and spare parts, troubleshooting n otebook problems, and performing notebook disassembly procedures.
© 2003 He wlett-Pack ard Dev elopment Compan y , L.P . Microsoft® and W indows® are U.S. r e gistered trademarks of Microsoft Corporation. Intel® and Pentium® are trad emarks or re gistered trademarks of Intel Corporation or its subsidiari es in the United States and other countries. SD Logo is a trademark of its pr oprietor . Bluetooth® is a trademark o wned by its p roprietor and used b y He wlett-P ackard Company under license. The information contained herein is s ubject to change without notice. The only warranties for HP produc ts and services are set forth in the express warranty stat ements accompa nying su ch products and services. Nothing herein should be construe d as constituting an addi tional warranty . HP shall not be liable for technica l or editorial errors or omissions contained herein. Mainte nance and Servi ce Guide HP Co mpaq Busines s Notebook nc60 00 F irst E dition No vember 200 3 Doc ument P ar t Number : 3 3 516 7 -001
Mainte nance and Serv ice Gui de 1 Cont en ts 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–10 1.3 Clearing a Password . . . . . . . . . . . . . . . . . . . . . . . . 1–12 1.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . 1–12 1.5 External Components . . . . . . . . . . . . . . . . . . . . . . . 1–13 1.6 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–25 2 Troubleshooting 2.1 Computer Setup and Diagnostics Utilities . . . . . . . . 2–1 Using Computer Setup . . . . . . . . . . . . . . . . . . . . . . . 2–2 Selecting from the File Menu . . . . . . . . . . . . . . . . . . 2–3 Selecting from the Security Menu . . . . . . . . . . . . . . 2–4 Selecting from the Advanced Menu . . . . . . . . . . . . . 2–5 2.2 Using Diagnostics for Windows . . . . . . . . . . . . . . . . 2–7 Obtaining, Savi ng, or Printing Configuration Information . . . . . . . . . . . . . . . . . . 2–7 Obtaining, Savi ng, or Printi ng Diagnosti c Test Information . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8 2.3 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . 2–10
2 Maintenance a nd Service Guide Cont en ts 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit Components . . . . . . . . . . 3–8 3.4 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . . . 3–9 3.5 Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–10 4 Removal and Replacement Prelim inaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2 Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.3 Preventing Damage to Remova ble Drives . . . . . . . . 4–3 4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4 4.5 Packaging and Transporting Precautions . . . . . . . . . 4–4 4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 4–5 4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–6 5 Removal and Repla cement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–2 5.3 Preparing the Notebook for Disassembly . . . . . . . . . 5–4 5.4 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10 5.5 Mini PCI Communications Board . . . . . . . . . . . . . . 5–10 5.6 MultiBay Device . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13 5.7 Bluetooth Wireless Communica tions Board . . . . . . 5–15 5.8 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17 5.9 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–20 5.10 Memory Expansion Board . . . . . . . . . . . . . . . . . . 5–21 5.11 Switch Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–23 5.12 Keyboard Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–25 5.13 Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–26 5.14 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29 5.15 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–32
Con ten ts Mainte nance and Serv ice Gui de 3 5.16 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–34 5.17 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–38 5.18 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–41 5.19 LED Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–43 5.20 Bottom Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–45 5.21 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–47 6 Specifications A Connector Pin Assignments B Power Cord Requirements 3-Conductor Power Cord . . . . . . . . . . . . . . . . . . . . . . . . . B–1 General Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1 Country-Specific Requirements . . . . . . . . . . . . . . . . . . . . B–2 C Screw Listing Index
Maintenance and S erv ice Gui de 1–1 1 Product D esc ription The HP Compaq Business Notebo ok nc6000 of fers advanc ed modularity , a Mobile Intel® Pen tium® 4 Processor-M with 64-bit architecture, an A TI MOBILITY RADEON 9600 graphics controller with 64 or 3 2 MB of discrete video memory , and e xtensi ve multimedia support. HP Co mpaq Busines s Notebook nc60 00
1–2 Maintenance a nd Service Guide Pr oduct Des cr i pti on 1.1 M o d e l s Notebook models are shown in T ables 1-1 and 1-2. T able 1-1 HP Compaq nc6000 Model Nam ing Con ventions Key C P 180 S4 60 Y Ci 10 P XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 1 Brand/Ser ies designator C = HP nc6000 2 Processor type P = Mobile Intel P entium 4 Processor-M 3 Processor speed 180 = 1.8-GHz 170 = 1.7-GHz 160 = 1.6-GHz 150 = 1.5-GHz 140 = 1.4-GHz 4 Displa y type/ size/resolution S = SXGA X = XGA 4 = 14.x-in 5 Hard dri v e size 80 = 80-GB 60 = 60-GB 40 = 40-GB 30 = 30-GB 6 Optical dr iv e designator C = CD-R OM drive Y = D VD R W/R and CD-R W combo drive W = D VD/CD-R W combo driv e 7 Integrated communication/ wireless device G = combination modem GB NIC N = no modem or NIC m = 802.11a/b/g Bluetooth® n = no wireless de vice 8 RAM 51= 512-MB 25 = 25-MB 9 Opera ting system P = Microsoft® Windows® XP Pro 2 = Windows 20 00 10 SKU#
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–3 T able 1-2 HP Compaq nc6000 Models All HP Compaq nc6000 models feature: ■ Dual Stick (T ouchP ad and pointing stick) pointing de vice ■ 8- or 6-cell lithium ion (Li-Ion) batter y pack ■ 3-year w arranty on par ts and labor Cnc6000 P 170 S4 60 Y Gm 51 P United States DQ882A ABA Cnc6000 P 170 S4 60 W Gp 5 1 P A ustralia DS804P ABG Cnc6000 P 170 S4 60 W Gp 5 1 2 A ustralia DS803P ABG Cnc6000 P 170 X4 60 D Gn 5 1 P Latin America DT486A ABM Cnc6000 P 160 S4 60 W G j 51 P Norwa y DJ299A ABN Cnc6000 P 160 X4 60 Y Gm 51 P F rench Canada DQ880A ABC United States DQ880A ABA Cnc6000 P 160 X4 60 W Gm 5 1 P F rench Canada DH915U ABC United States DH915U ABA Cnc6000 P 160 X4 60 W Gb 2 5 P K orea DT645P AB1 Cnc6000 P 160 X4 60 W Gg 5 1 P Brazil Latin Ameri ca DT483A AC4 DT483A ABM United States DT483A ABA Cnc6000 P 160 X4 40 W Gd 5 1 P The Netherl ands DJ311S ABH
1–4 Maintenance a nd Service Guide Pr oduct Des cr i pti on Cnc6000 P 160 X4 40 W G j 51 P Belgium Denm ark Europe Fr a n c e Ger many Greece Iceland Italy DJ256A UUG DJ256A ABY DJ256A ABB DJ256A ABF DJ256A ABD DJ256A AB7 DJ256A A2M DJ256A ABZ The Nether lands Norwa y P or t ugal Spain Sweden Switzerland United Kingdo m DJ256A ABH DJ256A ABN DJ256A AB9 DJ256A ABE DJ256A AK8 DJ256A UUZ DJ256A ABU Cnc6000 P 160 X4 40 W G j 51 2 Belgium Denm ark Europe Fr a n c e Ger many Greece Iceland Italy DJ257A UUG DJ257A ABY DJ257A ABB DJ257A ABF DJ257A ABD DJ257A AB7 DJ257A A2M DJ257A ABZ The Nether lands Norwa y P or t ugal Spain Sweden Switzerland United Kingdo m DJ257A ABH DJ257A ABN DJ257A AB9 DJ257A ABE DJ257A AK8 DJ257A UUZ DJ257A ABU T able 1-2 HP Compaq nc6000 Models (Continued)
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–5 Cnc6000 P 160 X4 40 W Gn 5 1 P Asia P acific A ustralia Belgium Brazil Czech Repub lic Denm ark Europe Inter national Fr a n c e F rench Canad a Ger many Greece Hong K ong Hungar y Iceland India Israel Italy Japan Japan - English DP894A UUF DP894A ABG and DS860P ABG DP894A UUG DP894A AC4 DP894A AKB DP894A ABY DP894A ABB DP894A ABF DP894A ABC and DH914U ABC DP894A ABD DP894A AB7 DP894A AB5 DP894A AKC DP894A A2M DP894A ACJ DP894A ABT DP894A ABZ DP894A ABJ DP894A ACF Ko r e a Latin Ameri ca The Nether lands Norwa y P eople’ s Republic of China P oland P or t ugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdo m United States DP894A AB1 DP894A ABM DP894A ABH DP894A ABN DP894A AB2 DP894A AKD DP894A AB9 DP894A ACB DP894A ABV DP894A AKN DP894A ABE DP894A AK8 DP894A UUZ DP894A AB0 DP894A AKL DP894A AB8 DP894A ABU DP894A ABA, DH915U ABA, and DH916U ABA T able 1-2 HP Compaq nc6000 Models (Continued)
1–6 Maintenance a nd Service Guide Pr oduct Des cr i pti on Cnc6000 P 160 X4 40 W Gn 5 1 2 Asia P acific A ustralia Belgium Brazil Czech Repub lic Denm ark Europe Inter national Fr a n c e F rench Canad a Ger many Greece Hong K ong Hungar y Iceland India Israel Italy Japan Japan - English DP895A UUF DP895A ABG and DS859P ABG DP895A UUG DP895A AC4 DP895A AKB DP895A ABY DP895A ABB DP895A ABF DP895A ABC DP895A ABD DP895A AB7 DP895A AB5 DP895A AKC DP895A A2M DP895A ACJ DP895A ABT DP895A ABZ DP895A ABJ DP895A ACF Ko r e a Latin Ameri ca The Nether lands Norwa y P eople’ s Republic of China P oland P or t ugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdo m United States DP895A AB1 DP895A ABM DP895A ABH DP895A ABN DP895A AB2 DP895A AKD DP895A AB9 DP895A ACB DP895A ABV DP895A AKN DP895A ABE DP895A AK8 DP895A UUZ DP895A AB0 DP895A AKL DP895A AB8 DP895A ABU DP895A ABA Cnc6000 P 160 X4 40 W Gn 2 5 P Hong K ong DS808P AB5 Cnc6000 P 160 X4 40 D Gd 5 1 P Ger many DJ330S ABD Cnc6000 P 150 X4 60 W Gb 2 5 P K orea DT644P AB1 Cnc6000 P 150 X4 60 W Gn 5 1 P Asia P acific DS805P UUF Cnc6000 P 150 X4 60 D Gb 2 5 P T a iwan DT812P AB0 T able 1-2 HP Compaq nc6000 Models (Continued)
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–7 Cnc6000 P 150 X4 40 W Gn 2 5 P Hong K ong DS807P AB5 Cnc6000 P 150 X4 30 W Gg 1 0 H Ger many DJ324S ABD Cnc6000 P 150 X4 30 D Gm 25 P Europe Inter national DQ881A ABB United States DQ881A ABA Cnc6000 P 140 X4 40 W Gm 2 5 P Japan DT641P ABJ Japan/English DT641P ACF Cnc6000 P 140 X4 40 W Gp 2 5 P A ustralia DS802P ABG Cnc6000 P 140 X4 40 W Gp 2 5 2 A ustralia DS801P ABG Cnc6000 P 140 X4 40 W Gb 2 5 P Asia P acific Ko r e a DT636P UUF DT643P AB1 T a iwan DT811P AB0 Cnc6000 P 140 X4 40 W Gn 2 5 H P eople’ s Repub lic of China DS796P AB2 Cnc6000 P 140 X4 40 D Gb 7 6 P United States DT611C ABA and DT610C ABA Cnc6000 P 140 X4 40 D Gb 2 5 P P eople’ s Repub lic of China DS795P AB2 T aiwan DT809P AB0 Cnc6000 P 140 X4 40 D Gn 2 5 H P eople’ s Repub lic of China DS794P AB2 T able 1-2 HP Compaq nc6000 Models (Continued)
1–8 Maintenance a nd Service Guide Pr oduct Des cr i pti on Cnc6000 P 140 X4 40 D Mn 51 P United States DT868A ABA Cnc6000 P 140 X4 40 C Gn 5 1 P Asia P acific DS652C UUF Cnc6000 P 140 X4 30 Y Gn 2 5 P United States DS825C ABA Cnc6000 P 140 X4 30 W Gi 25 P Belgium Denm ark Fr a n c e Ger many Greece Iceland Italy The Nether lands DJ333A UUG DJ333A ABY DJ333A ABF DJ333A ABG DJ333A AB7 DJ333A A2M DJ333A ABZ DJ333A ABH Norwa y P oland P or t ugal Spain Sweden Switzerland United Kingdo m DJ333A ABN DJ333A AKD DJ333A AB9 DJ333A ABE DJ333A AK8 DJ333A UUF DJ333A ABU Cnc6000 P 140 X4 30 W Gg 2 5 P Europe DJ323S ABB Cnc6000 P 140 X4 30 D Gb 2 5 P Asia P acific A ustralia F rench Canad a DT640P UUF DS800P ABG DH930U ABC Ta i w a n United States DT810P AB0 DH930U ABA Cnc6000 P 140 X4 30 D Gb 2 5 2 A ustralia Japan DS799P ABG DT642P ABJ Japan/English DT642P ACF T able 1-2 HP Compaq nc6000 Models (Continued)
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–9 Cnc6000 P 140 X4 30 D Gp 2 5 P Asia P acific Belgium Czech Repub lic Denm ark Europe Fr a n c e F rench Canad a Ger many Greece Hungar y Iceland Israel Italy Japan Japan/English Ko r e a DT412C UUF DJ254A UUG DJ254A AKB DJ254A ABY DJ254A ABB DJ254A ABF and DT412C ABF DT412C ABC DJ254A ABD, DT412C ABD, and DJ326S ABD DJ254A AB7 DJ254A AKC DJ254A A2M DT412C ABT DJ254A ABZ DT412C ABJ DT412C ACF DT412C AB1 The Nether lands Norwa y P eople’ s Republic of China P oland P or t ugal Russia Slov enia Spain Sweden Switzerland Ta i w a n Tu r k e y United Kingdo m United States DJ254A ABH and DT412C ABH DJ254A ABN DT412C AB2 DJ254A AKD DJ254A AB9 DJ254A ACB DJ254A AKN DJ254A ABE DJ254A AK8 and DT412C AK8 DJ254A UUZ DT412C AB0 DJ254A AB8 DJ254A ABU and DT412C ABU DT412C ABA Cnc6000 P 140 X4 30 D Gp 2 5 2 Belgium Czech Repub lic Denm ark Europe Fr a n c e Ger many Greece Hungar y Iceland Italy The Nether lands DJ255A UUG DJ255A AKB DJ255A ABY DJ255A ABB DJ255A ABF DJ255A ABD DJ255A AB7 DJ255A AKC DJ255A A2M DJ255A ABZ DJ255A ABH Norwa y P oland P or t ugal Russia Slov enia Spain Sweden Switzerland Tu r k e y United Kingdo m DJ255A ABN DJ255A AKD DJ255A AB9 DJ255A ACB DJ255A AKN DJ255A ABE DJ255A AK8 DJ255A UUZ DJ255A AB8 DJ255A ABU T able 1-2 HP Compaq nc6000 Models (Continued)
1–10 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on 1. 2 F e a t u r e s ■ Mobile Intel Pentium 4 1.8-GHz Processor -M, with 2.0-MB L2 cache, v arying by no tebook model. ■ Mobile Intel Pentium M 1 .7-, 1.6-, 1.5-, and 1.4-GHz processors, al l with 1.0-MB L2 cache, v arying b y notebook model. ■ 14.1-inch SXGA (140 0 × 1050) or XGA (10 24 × 768) TFT displays with ov er 16.7 million colors, v arying by notebook model ■ A TI MOBILITY RADEON 9600 gra phics controller with 64 or 32 MB of vi deo memory , v arying b y noteb ook model ■ 60-, 40-, or 30-GB high-capacity hard dri ve, v arying by notebook model ■ 256-MB DDR synchronous DRAM (SDRAM) at 333 MHz, expandable to 2.0 GB ■ Microsoft® W indo ws® 2000 or W indo ws XP Pro, varyin g by notebook model ■ Full-size W indo ws 98 k eybo ard with inte grated numeric keypa d ■ Dual pointing de vices (T ouchPad and pointing stick) ■ Integrated Secure Digital (SD) Memory Card flash media slot ■ Support for MultiBay de vice Cnc6000 P 140 X4 30 D Gn 2 5 P A ustralia F rench Canad a Hong K ong DS798P ABG DH913U ABC DS806P AB5 United States DH913U ABA and DS847C ABA Cnc6000 P 140 X4 30 D Gn 2 5 2 A ustralia DS797P ABG T able 1-2 HP Compaq nc6000 Models (Continued)
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–11 ■ Integrated 10/100/1000B ASE-T Ethernet local area network (LAN) NIC with RJ-45 connector ■ Integrated wireless support for Bluetooth ® LAN and Mini PCI 802.11a/b/g LAN de vices ■ Support for two T ype II or one T ype III PC Card slots with support for both 32-bit (CardBus) and 16-bit PC Cards ■ External 65-watt A C adapter with po wer cord ■ 8- or 6-cell Li-Io n battery pack ■ Stereo speakers ■ Support for the follo wing devices in the MultiBay: ❏ 24X Max CD-R OM dri ve ❏ 24X Max D VD/CD-R W combo driv e ❏ 8X Max D VD-R OM driv e ❏ D VD R W/R and CD-R W combo dri ve ❏ 8-cell Prismatic battery pack ■ Connectors for: ❏ SD Memory Card ❏ Infrared ❏ One T ype III PC Card slot ❏ T wo T ype II PC Card slots ❏ RJ-11 (modem) ❏ RJ-45 network int erface card (NIC) ❏ Uni v ersal Serial Bus (USB) v . 2.0 ❏ S-V ideo ❏ Pa rallel ❏ External monitor ❏ DC po w er ❏ Docking ❏ Microphone ❏ Stereo speaker/headphone
1–12 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on 1 .3 C learin g a P assw ord If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the no tebook for disa ssembly (refer to Section 5.3, “Preparing the Notebook fo r Disassembly , ” for more information). 2. Remov e the real time clock (R TC) battery (refer to Section 5.18, “R TC Battery”). 3. W ait approximately f i v e minutes. 4. Replace the R TC ba ttery a nd reassemble the notebook. 5. Connect A C po wer to the notebook . Do not reinsert any battery packs at this time. 6. T urn on the notebook . All passw ords and a ll CMOS settings ha ve been cleared. 1. 4 P o w e r M a n a g e m e n t The notebook comes with po wer management features that e xtend battery operating time an d conserv e po wer . The notebook supports the follo wing power man agement features: ■ Standby ■ Hibernation ■ Customization of settings b y the user ■ Hotke ys for setting le vel of performance ■ Lid switch Standb y/resume ■ Po wer/Standby b u tton ■ Adv anced Conf iguration and Po wer Management (A CPM) compli ance
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–13 1. 5 E x t e r n a l C o m p o n e n t s The external components on th e front and lef t side of the notebook are sh o wn belo w and described in T able 1-3. F r ont and Le ft -Si de Componen ts
1–14 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on T able 1-3 Fr ont and Left-Side Compone nts Item Component Function 1 A udio line-out jack Produces syst em sound when connected to optional powered stereo speak ers, headphones, headset, or television audio . 2 Microphone j ac k Connects an op tional monaural micropho ne. 3 Hard dr iv e ba y Holds the pri mar y hard drive . 4 MultiBa y de vice slot Holds a MultiBa y de vice . 5 Infrared por t Provides wireless communication between the notebook a nd an opti onal IrD A-compl iant de vice . 6 Mute b utton On: Mutes the system v olume. A light comes on when the button is pushed in and the sound is muted. 7 V olume control but to ns Increase and decrease system v olume. Press the volume up b utton to increase sound. Press the v olume down b utton to decrease sound. 8 Stereo speakers (2) Produce stereo soun d. 9 Display release latch Opens the noteboo k.
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–15 The notebo ok rear panel and right-side components are sho wn belo w and describ ed in T ab le 1-4. R ear P anel and R i ght Side C omponents T able 1-4 Rear P anel and Right-Side Components Item Component Function 1 Batter y slot Holds the pri mar y batter y . 2 PC Card eject b uttons Release PC Card de vices from the PC Card slots. 3 PC Card slots (2) Suppor t optional T ype I, T ype II, or T ype III 32-bit (CardBus) or 16-bit PC Cards. 4 Secure Digital (SD) Memor y Card slot Accepts SD Cards and MultiMedia Cards. 5 RJ-11 telephone jack Connects a modem cab le.
1–16 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on 6 V ents (3) Allow airflo w to cool inter nal compone nts . Ä T o prev ent ov erheating, do not obstruct vents. Using the notebook on a soft surf ace, such as a pillo w , blank et, rug, or thick clothing, may bl ock airflo w . 7 Bluetooth compar tmen t Holds a Bluetooth wirele ss de vice. 8 Secur ity cab le slot Attaches an optional secur ity cab le to the notebook. ✎ The purpose of security solutions is to act as a de terrent. These solutions do not pr event the product from being mishandle d or stolen. 9 A C power connector Connects an A C adapter or an optional A utomobile P ower Adapter/Charger , or Aircraft P ow er Adapter . 10 Ser ial connector Conn ects an optiona l serial de vice . 11 P arallel connector Connects an op tional parallel d e vi ce, such as an e xter nal diskette dr iv e ba y or a prin ter . 12 S-Video connector Connects an optiona l S-Video de vice , such as a tele vision, VCR, camcorder , ov erhead projector , or video ca pture card. 13 Exter nal monitor connector Connects an op tional external moni tor or ov erhead projector . 14 RJ-45 network jack Connects a network cable. 15 USB connectors (2) Connect USB 1.1- and 2.0-compliant de vices to the notebook, using a standard US B c abl e. T able 1-4 Rear P anel and Right-Side Components (Continued) Item Component Function
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–17 The noteb ook k eyboard components are sho wn be lo w and described in T able 1-5. Ke y b o a r d C o m p o n e n t s
1–18 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on T able 1-5 Ke yboar d Components Item Component Function 1 fn k e y Ex ecutes frequently used system fu nctions when pressed in combin ation with another key . 2 caps lock ke y Enables caps loc k and tur ns on the caps lock light. 3 f1 through f12 func tion keys P erf or m system and application tasks. When combined with the fn key , the functi on k eys f1 and f3 through f12 perform additional tasks as hotke y s . 4 num lock k ey Enables n umer ic loc k and the inter nal k eypad. 5 Embedded numer ic keyp a d Standard numeric ke ypad. 6 Cursor contro l k eys Mov e the cursor around the screen. 7 Applications k ey Displa ys a shor tcut menu f or items beneath the poin ter . 8 Windows logo ke y Displa y the Windows Star t menu.
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–19 The notebook top components are sho wn below and described in T able 1-6. To p C o m p o n e n t s T able 1-6 T op Components Item Component Function 1 Num lock light On: Num lock is on or the embedded numeric ke ypad is enabled. 2 Caps lock light On: Caps lock is on. 3 Scroll lock light On: Scroll lock is on.
1–20 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on 4 Displa y lid s witch* ■ If the notebook is closed while on, tur ns off the display . ■ If the noteboo k is opened while o n, tur ns on the displa y . 5 P ower button* When the notebook is: ■ Off , press and release to tur n on the notebook. ■ In Standby , pre ss and release to exit Standby . ■ In Hiber nation, pre ss and release to exit Hiber nation. If the system has stopped responding and Windows shutdown procedures cannot be used, press and hold f or 5 seconds to tur n off the notebook. 6 QuickLock b u tton Disab les the k eyboard and pointing de vice and clears the displa y . 7 Wireless On/Off button Enables and disables the integrated wireless de vice(s) on the notebook. ✎ When using the Wireless On/Off button to enable integrated WLAN or Bluetooth, first ensure that WLAN or Bluetooth has been enabled in the software and that the wireless on /off light is on before attempting to make a connection. *This table describes default settings. F or informa tion about changing the functions of the displa y lid s witch a nd power b utton and about using Standby and Hiber nation, refer to the “P ower” chapter in the Softwa re Guide on the Documentation Librar y CD . T able 1-6 T op Components (Continued) Item Component Function
Pr oduc t De sc r ipti on Mainte nance and Serv ice Gui de 1–21 T op Components (C ontinued)
1–2 2 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on T able 1-6 T op Components (Continued) Item Component Function 8 Presentation Mode but to n Alter nates between presentation modes. 9 P ointin g stic k Mov es the pointer and selects or activ ates items on the screen. 10 Left and ri ght pointing stick b uttons Function like the left and right mouse bu ttons on an external mouse. 11 T ouchP ad Mov es the pointer and selects or activ ates items on the screen. 12 Left and ri ght T ouchP ad b uttons Function like the left and r ight b uttons on an e xter nal mouse. 13 Mult iBa y light On : A de vice in the Mu ltiBa y is being accessed. 14 Hard dr iv e li ght On: Ha rd driv e in t he hard driv e ba y is being accessed. 15 Battery light On: A batte r y pac k is chargin g. Blinking: A batter y pac k that is the only av ailable power source has reached a low-battery condition. Whe n the batter y reaches a cr itical low- batter y condition, the batter y light begins blinking more quickly . 16 P ower/Standb y light On: P ower is turned o n. Blinking: Notebook is in Standby . The powe r/Standby light also blinks when a batter y pack that is the only a vailab le pow er source reaches a critical low-batter y condition. The light goes off wh en the system enters Hiber nation or shuts down. 17 Wireless on/off light On: An integrated wireless de vice has been enabled.
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–2 3 The external components on th e bottom of the notebo ok are sho wn belo w and described in T able 1-7. Bottom Componen ts T able 1-7 Bottom Components Item Compon ent Functi on 1 Batter y ba y Holds the pr imar y batter y pa c k. 2 Batter y release latch Releases a batter y pack from the batter y ba y .
1–2 4 Maintenance and Ser v ice Guide Pr oduct Des cr i pti on 3 Mini PCI compar tment Hol ds an optional wirel ess LAN or ISDN de vice. ✎ The FCC does not allow unauthorized Mini PCI devices to be used in the notebook. Installing an unauthorized Mini PCI device can prevent th e notebook from operating properly and might result in a warning messag e. To resume proper notebook operation, remove the unauthorized device. Contact the H P Customer Care Center if a warning message about th e Mini PCI device displays in error. 4 Intake v ent Allows airflow to cool inter nal components. Ä T o pre v ent o ve rheati ng, do not obstr uct vents . Using the notebook on a soft surf ace , such as a pillow , blank et, rug, or thick clothing, ma y b lock airflow . 5 Doc king connector Connects the notebook to an optional HP P or t Replicator . 6 Hard drive ba y Holds the inter nal hard dr iv e. 7 Hard drive security screw Secures the hard dr iv e. 8 MultiBa y release latch Releases the MultiBa y de vice. 9 MultiBa y Holds the MultiBay de vice . T able 1-7 Bottom Components (Continued) Item Compon ent Functi on
Pr oduc t De sc r ipti on Maintenance and S erv ice Gui de 1–2 5 1. 6 D e s i g n O v e r v i e w This section presents a des ign o vervie w of ke y parts and features of the notebook. Refer to Chapte r 3, “Illustrated P arts Catalog, ” to identify replacement parts, and Chapter 5, “Remov al a nd Replacement Procedures, ” for disassembly steps. The system board p rovides the fo llo wing de vice connections: ■ Memory ex pansion board ■ Mini PCI communicatio ns de vice ■ Hard dri v e ■ Display ■ K e yboard and T ouchPad ■ Audio ■ Mobile Intel Pentium 4 Processor -M ■ Fan ■ PC Card Ä CAUT ION: T o proper ly v entilate the notebook , allow at leas t a 7 .6 -cm (3-inch) c learance on all sides of the no tebook . The notebook uses an electric f an for ventilation. The f an is controlled b y a temperature sensor and is designed to come on automatically when hi gh temperature conditions exist. These conditions can be caused by high e xternal temperatures, heavy system power consumption, certa in po wer management/battery conserv ation conf igurations, batte ry f ast charging, and some software applications. Exhaust air is displaced through the ventilation grill located on the notebook rear panel.
Maintenance and S erv ice Gui de 2–1 2 Tr o u b l e s h o o t i n g Å W ARNI NG: Only auth or i z ed techni c ians tr ained by HP should r epair this equipment. All tr oubleshooti ng and r epair procedur es ar e detailed to allow only subassembly/ module -lev el repair . Because of the comple xi ty of the indi v idual boar ds and su bass embli es , do not att empt to mak e r epairs at the component le v el or modif icati ons to an y printed w ir ing board . Impr oper repairs can cr eate a safety haz ard . Any indicati on of compo nent r eplac ement or printed w ir ing board modifi cation ma y voi d an y w arr anty or e xc hange allow ances . 2. 1 C omp uter Setu p and Di agnos tics Utiliti es The notebook features tw o system management utilities: ■ Computer Setup —A system informatio n and customization utility that can be used e v en wh en your operating system is not working or will not load. T his utility includes settings that are not a v ailable in Microsoft W indows.
2–2 Maintenance a nd Service Guide T r oubleshooting ■ Diagnostics f or Windows —A sy stem informati on and diagnostic utility that is used within the W indows operating system. Use this utility whene ver possible to: ❏ Display system information. ❏ T est system components. ❏ T roubleshoot a de vice conf iguration problem in W indo ws XP Professional or W indo ws XP Home. ✎ It is not necessary to conf ig ure a de vice connected to a USB connector on the notebook or to an optional HP Port Replicator . Using C om puter S etup Information and settings in Co mputer Setup are accessed from the File, Security , or Adv anced menus: 1. T urn on or restart th e notebook. P ress F10 while the F10 = R OM-Based Setup message is displayed in the lo wer left corner of the screen. ❏ T o change the language , press F2. ❏ T o vie w na vigation informatio n, press F1. ❏ T o return to the Comp uter Setup menu, press esc. 2. Select the File, Security , or Adva nced menu. 3. T o close Computer Setup an d restart the notebook : ❏ Select File > Sa ve Changes and Exit and press enter . -or- ❏ Select File > Ignore Changes and Exit and press ente r . 4. When you are p rompted to conf irm your action, press F10.
T r ouble shooting Maintenance and S erv ice Gui de 2–3 Selecti ng fr om the F i le Menu Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ View identificati on inf orm ation about the notebook, a P o r t Replicator , and an y batter y packs in the system. ■ View specification inf or mation about the processor , memor y and cache size, and system ROM. Sa ve to Floppy Sav e system configuration settings to a diskette . Restore from Flopp y Restore system configuration settings from a diskette . Restore Def aults Replace co nfiguration settings in Comp uter Setup with f actor y default settings. Identificat ion inf or mation is retained. Ignore Changes and Exit Cancel changes entered dur ing the current session, then exit and restar t the noteboo k. Sav e Change s and Exit Sav e changes entered during the current session, then exit and restar t the noteboo k.
2–4 Maintenance a nd Service Guide T r oubleshooting Selecting fr om th e Securi t y Me nu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P assword Enter , change , or delete a Setup passw ord. The Setup pass word is called an administrator pass word in Computer Security , a program accessed f rom the W indo ws Contro l P anel. P ower-on P assw ord Enter , change, or delete a power-on pass word. DriveLock P ass words Enab le/disable Driv eLock; change a DriveLoc k User or Master pass word. ✎ DriveLock Settings are accessib le only when you en ter Computer Setu p by turning on (not restarting) the notebo ok. P assw ord Options (P ass word optio ns can be selected only when a pow er-on pass word has been set.) Enable/disab le: ■ QuickLoc k ■ QuickLoc k on Standby ■ QuickBlank ✎ To enable QuickLock on Standby or QuickBlank, you must first enable QuickLock. De vice Security Enable/disab le: ■ P or ts or disk ette drives* ■ Disk ette w rite* ■ CD-ROM or diskette star tup ✎ Settings for a DVD-ROM can be entered in the CD-ROM field. System IDs Enter identificatio n numbers f or the notebook, a P or t Replicator , and all batter y packs in the system. *Not applicable to SuperDisk LS-120 drives .
T r ouble shooting Maintenance and S erv ice Gui de 2–5 Sel ec ting from t he Adv a nced M enu Ta b l e 2 - 3 Adv anced Menu Select T o Do This Language Change th e Computer Setup language. Boot Op tions Enab le/disab le: ■ QuickBoot, which star ts the notebook more quickly b y eliminating some star tup te sts. (If you suspect a memor y failure and w ant to test memor y automati cally duri ng star tup , disab le Qu ic kBoot.) ■ MultiBoot, which sets a star tup sequence that can include most b ootab le devices and media in the system. De vice Options ■ Enable/disab le the embedd ed numeric ke ypad at star tup. ■ Enable/disab le multiple standard pointing de vices at star tup . (T o set the notebook to suppor t only a sing le , usually nonstandard , pointing de vice at st ar tup , select Disable.) ■ Enable/disab le USB legacy suppor t f or a USB ke yboard. (When USB legacy suppor t is enabled, the k e yboard works e v en when a Windows oper ating system is not loaded.) ■ Set an optional e xternal moni tor or ov erhead projector connected to a vide o card in a P or t Replicator as the primar y device . (When the notebook display is set as secondar y , the notebook must be shut down bef ore it is undock ed from a P or t Repl icator .)
2–6 Maintenance a nd Service Guide T r oubleshooting De vice Options (continued) ■ Change th e parallel por t mode from Enhanced P arallel P or t (EPP , the def ault setting) to standard, bi-directiona l EPP , or Enhanced Capa bilities P or t (ECP). ■ Set video-out mode to NTSC (default), P AL, NTSC-J , or P AL-M.* ■ Enable/disab le all settings in the Inte l SpeedStep window . (When Disable is selected, the notebook r uns in Batter y Optimized mode .) ■ Specify how the noteboo k recognizes multiple identica l P or t Replic ators that are identically equippe d. Select Disab le to recognize the P or t Rep licators as a single P or t Replicator ; select Enable to recognize the P or t Replicators individually , b y ser ial numb er . ■ Enable/disab le the repor ting of the processor serial number by the processor to the software . HDD Self T est Optio ns Run a quick comprehensiv e self test on hard drives in the system t hat suppor t the test f eatures. *Video modes vary ev en within regions. Ho we v er , NTSC is common in Nor th America; P AL, in Europe, Africa, and the Midd le East; NTSC-J , in Japan; and P AL-M, in Brazil. Other South and Central American regions can use NTSC, P A L, or P AL-M. Ta b l e 2 - 3 Adv anced Menu (Continued) Select T o Do This
T r ouble shooting Maintenance and S erv ice Gui de 2–7 2.2 Using Dia gnosti cs for W indo ws When you access Diagnostics for W indows, a scan of all system components is displayed on the screen before the di agnostics windo w opens. Y ou can display more or less in formation from an ywhere within Diagnostics for W indows b y sel ecting Le vel on the menu bar . Diagnostics for W indo ws is designed to test HP components. If other components are tested, the results might be inconclusi ve. Obtaining , Savi ng , or Printing Configura tion Inf orma tion 1. Access Diagnostics for W indo ws b y selecting Start > Settings > Control P anel > Diagnostics for W indows. 2. Select Categories, then select a category from the drop-down list. ❏ T o sa ve the information, select File > Sa ve As. ❏ T o print the information, select File > Print. 3. T o close Diagnostics for W indo ws, select File > Exit.
2–8 Maintenance a nd Service Guide T r oubleshooting Obtaining , Savi ng , or Printing Dia gnostic Te s t I n f o r m a t i o n 1. Access Diagnostics for W indo ws b y selecting Start > Settings > Control P anel > Diagnostics for W indows. 2. Select the T est tab . 3. In the scroll box, select the category or de vice you w ant to test. 4. Select a test type: ❏ Quick T est —Runs a quick, general test on each de vice in a selected category . ❏ Complete T est —Performs maximum testing on each de vice in a selected category . ❏ Custom T est —Performs maximum tes ting on a select ed de vice. ◆ T o run all tests for yo ur se lected de vice, select the Check All button. ◆ T o run only the tests you select, select the Uncheck All b utton, then select the check box for eac h test you want to run. 5. Select a test mode: ❏ Interactiv e Mode —Provides maximum control ov e r the testing process. Y ou determ ine whether the test w as passed or fai led. Y ou might be prompted to insert or remo ve de vices. ❏ Unattended Mode —Does not display prompts. If errors are found, they are displaye d when testing is complete.
T r ouble shooting Maintenance and S erv ice Gui de 2–9 6. Select the Begin T esting button. 7. Select a tab to vie w a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session. ❏ Log tab —Lists tests run on the system, the number of times each test has run, the number of errors found on each test, and the total run time of each test. ❏ Error tab —Lists all errors found in the notebook, along with the corresponding error codes. 8. Select a tab to sav e the report: ❏ Log tab —Select the Sav e b u tton. ❏ Error tab —Select the Sa v e b utton. 9. Select a tab to print the report: ❏ Log tab —Select File > Sa v e As, then print the f ile from your folder .
2–10 Maintenance and Ser v ice Guide T r oubleshooting 2. 3 T roubl eshooting Flo wc har ts T able 2-4 T r oubleshoot ing Flow charts Overview Flo wchart Descripti on 2.1 Initial troubleshooting 2.2 N o pow er , par t 1 2.3 N o pow er , par t 2 2.4 N o pow er , par t 3 2.5 N o pow er , par t 4 2.6 No video , par t 1 2.7 No video , par t 2 2.8 Nonfunctioning P or t Replicator 2.9 No oper ating syst em (OS) loading 2.10 No OS loadi ng from hard dr ive , par t 1 2.11 No OS loadi ng from hard dr ive , par t 2 2.12 No OS loadi ng from hard dr ive , par t 3 2.13 No OS loadi ng from diskette dri v e 2.14 No OS loading from CD- or D VD-ROM driv e 2.15 No audio , par t 1 2.16 No audio , par t 2 2.17 Nonfunctioning device 2.18 Nonfunctioning ke yboard 2.19 Nonfunctioning po inting de vice 2.20 No networ k or modem connection
T r ouble shooting Mainte nance and Serv ice Gui de 2–11 Flo wch art 2. 1—Initi al T roub leshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to Flowchart 2.17, Nonfunctioning Device. Go to Flowchart 2.2, No Power . Go to Flowchart 2.6, No Video. All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to Flowchart 2.9, No OS Loading. Go to Flowchart 2.15, No Audio. Go to Flowchart 2.18, Nonfunctioning Keyboard or Flowchart 2.19, Nonfunctioning Pointing Device. Check LED board, speake r connections. Go to Flowchart 2.20, No Network or Modem.
2–12 Maintenance and Ser v ice Guide T r oubleshooting F l o wch a rt 2 . 2 —N o P o w er , P art 1 1. Reseat the power cables in the Port Replicator and at the AC outlet. 2. Ensure that the AC pow er sour ce is active . 3. Ensure that the power strip is working. Done Remove from Port Replicator (if appl icable). Power up on battery power? Power up on AC power? Power up in Port Replicator? Power up on battery power? Power up in Port Replicator? Done *Reset power . *Reset power . Power up on AC power? N Y Y N N Y N N Y Y YN 1. On some models, there is a se parate reset button. 2. On some models, the notebook can be reset using the Standby switch and either the lid switch or the main power switch. *NOTES: Go to Flowchart 2.4, No Power , Part 3. Go to Flowchart 2.3, No Power , Part 2. Go to Flowchart 2.8, Nonfunctioning Port Replicator . No power (power LED is off).
T r ouble shooting Mainte nance and Serv ice Gui de 2–13 Flo wc h art 2.3—No P o wer , P ar t 2 Continued from Flowchart 2.2, No Power , Pa rt 1. Visually check for debris in battery socket a nd clean if necessar y . Done N Y Power on? Check batter y by recharging it, moving it to another notebook, or replacing it. Power on? Done Y Replace power supply (if applicable). N Power on? Done Y N Go to Flowchart 2.4, No Power , Part 3.
2–14 Maintenance and Ser v ice Guide T r oubleshooting F l o wch a rt 2 . 4 —N o P o w er , P art 3 Continued from Flowchart 2.3, No Power , Part 2. Reseat AC ada pter in notebook and at power sour ce. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet. Power LED on? Power outlet active ? T r y different outlet. Replace ext ernal AC adapter . Replace power cord. Y N Y Y Y Y N N N N Exter nal Internal Go to Flowchart 2.5, No Power , Part 4.
T r ouble shooting Mainte nance and Serv ice Gui de 2–15 Flo wc h art 2.5—No P ow er , P art 4 Y N Continued from Flowchart 2.4, No Power , Part 3. Reseat loos e components and boards and replace damaged items. Open notebook. Loose or damaged parts ? Y Close notebook and retest. Power on? Done N Replace the following it ems (if applicable) in the order given. Check notebook operation after each of the following two replacement steps: 1. Internal DC-DC converter , processor , and system board* 2. Internal AC adapte r * NOTE: Replace these items as a set to prevent shorting out among components.
2–16 Maintenance and Ser v ice Guide T r oubleshooting Flowch art 2.6—No Vide o, P ar t 1 A N Stand-alone or Port Repl icator? No video. Replace the following one at a t ime. T est after each replacement. 1. Cable between notebook and no tebook display (if applicable) 2. Inverter board (if applicable) 3. Display 4. System board Internal or external display*? Adjust brightness. Video OK? Done Port Replicator Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid switch to ensure operation. Video OK? Done Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N * NOTE: T o change from inte rnal to external display , use the hotkey combination. Y Go to Flowchart 2.7, No Video, Part 2.
T r ouble shooting Mainte nance and Serv ice Gui de 2–17 Flowch art 2.7—No Vide o, P ar t 2 Y N Continued from Flowchart 2.6, No Video, Part 1. Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done V erify that noteb ook i s prop erly seated in Port Replicator , and check for bent pins on cable and for secure monitor connection. Go to “A” in Flowchart 2.6, No Video, Part 1. Check brightness of external monitor . T r y another external monitor . Internal and external video OK? Go to Flowchart 2.8, Nonfunctioning Port Replicator . Y Y Y N N N Remove notebook from Port Replicator , if connected.
2–18 Maintenance and Ser v ice Guide T r oubleshooting Flo wc h art 2.8—Nonfun ctioning P o rt Repli cator (if applic able) Y N Reseat po wer cord in Port Replicator and power outlet. N Replace the following Port Replicator components one at a time. Check notebook operation after each replacement. 1. Power supply 2. I/O board 3. Backplane board 4. Switch box 5. Port Replicator motor mechanism Check voltage setting on Port Replicator . Reseat monit or cable connector at Port Replicator . Reinstall notebook into Port Replicator . Port Repl icator operating? Port Replicator operating? Remove notebook, reseat all internal parts, and replace any damaged items in Port Replicator . Done Done Y Nonfunctioning Port Replicator .
T r ouble shooting Mainte nance and Serv ice Gui de 2–19 Flo wc har t 2.9—No Operating S y stem (OS) Loading No OS loading from hard drive, go to Flow chart 2.10, No OS Loading, Hard Drive, Part 1. Reseat power cord in Port Replicator and power outlet. No OS loading.* * NOTE: Before beginning to troublesho ot, always check ca ble connections, cable ends, and drives for bent or damaged pins. No OS loading from diskette drive, go to Flowchart 2.13, No OS Loading, Diskette Drive. No OS loading from CD- or DVD-ROM drive, go to Flow chart 2.14, No OS Loading, CD- or DVD-ROM Drive. No OS loading from network, go to Flowchart 2.20, No Network/Modem Connection.
2–20 Maintenance and Ser v ice Guide T r oubleshooting Flo wch art 2. 1 0—N o OS Loadin g, H ard Driv e, P ar t 1 Go to Flowchart 2.17, Nonfunctioning Device. Y Done N OS not loading from hard drive. Nonsystem disk message? Go to Flowchart 2.11, No OS Loading from Hard Drive, Part 2. Reseat external hard drive. OS loading? Done Boot from CD? Go to Flowchart 2.13, No OS Loading from Diskette D rive. Boot from hard drive? Boot from diskette? Change boot priority through the Setup utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order .
T r ouble shooting Mainte nance and Serv ice Gui de 2–21 Flo wch art 2. 1 1—No OS Loadin g , Hard Driv e, P ar t 2 Continued from Flowchart 2.10, No OS Loading from Hard Drive, Part 1. Reseat hard drive. Done CD or disket te in drive? 1. Replace hard drive. 2. Replace system board. Go to Flowchart 2.13, No OS Loading from Disk ette Drive. Load OS using System R estore CD (if applicable). Format hard drive and bring to a boo tabl e C:\ prompt. Create partition, then forma t hard drive to bootable C:\ prompt. Boot from diskette drive? Remove diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible ? Y N Hard drive accessible ? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Notebook booted? Done Y N Go to Flowchart 2.12, No OS Loading from Hard Drive, Part 3. Go to Flowchart 2.12, No OS Loading from Hard Drive, Part 3.
2–2 2 Maintenance and Ser v ice Guide T r oubleshooting Flo wch art 2. 1 2—N o OS Loadin g, H ard Driv e, P a rt 3 Y System files on hard drive? Continued from Flowchart 2.11, No OS Loading from Hard Drive, Part 2. Clean virus. Done N Instal l OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix bad sectors. Boot from hard drive? Replace hard drive. Done
T r ouble shooting Maintenance and S erv ice Gui de 2–2 3 Flo wc har t 2. 1 3—No OS Loading , Disk et te Dri v e Done Y N Reseat disket te drive . OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette a nd reboot notebook. Check diskette for system files. T r y differ ent diskette . 1. Replace diskette drive. 2. Replace s ystem board. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot notebook. Is diskette drive boot order correct? Change boot priority using the Setup utility . Go to Flowchart 2.17, Nonfunctioning Device. Disket te drive enabled in the Setup utility? Go to Flowchart 2.17, Nonfunctioning Device. Clear CMOS. Refer to Section 1.2, “Clearing a Password,” for instructions.
2–2 4 Maintenance and Ser v ice Guide T r oubleshooting Flo wc har t 2. 1 4—No OS Loa ding, CD-R OM or D VD-ROM Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Dri ve. Install bootable disc and reboot notebook. Go to Flowchart 2.17, Nonfunctioning Device . Go to Flowchart 2.17, Nonfunctioning Device. Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T r y another bootable disc. Booting from another device? Booting order correct? Correct b oot order using the Setup utility . Done Reseat drive. Y Y Y Y Y N N N N N Clear CMOS. Refer to Section 1.2, “Clear ing a Password,” f or instructions.
T r ouble shooting Maintenance and S erv ice Gui de 2–2 5 Flo wch art 2. 1 5—No Au dio, P ar t 1 No audio. N Notebook in Port Replicator (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to Flowchart 2.16, No Audio, Part 2. Go to Flowchart 2.16, No Audio, Part 2. Go to Flowchart 2.17, Nonfunctioning Device . Replace the following Port Rep licator components one at a time, as applicable. Check audio status after each change. 1. Port Replic ator audio cable 2. Audio cable 3. Speaker 4. Port Replicator audio board 5. Backplane board 6. I/O board Y Y Y Y N N N
2–2 6 Maintenance and Ser v ice Guide T r oubleshooting Flo wch art 2. 1 6—N o Audio, P art 2 YN Continued from Flowchart 2.15, No Audio, Part 1. Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speake r . Load drivers and set configuration in OS. Audio? Done Replace audio board and speake r connections in notebook (if applicable). 1. Replace internal speakers . 2. Replace audio board (if applicable). 3. Replace system board.
T r ouble shooting Maintenance and S erv ice Gui de 2–2 7 Flo wch art 2. 1 7—Nonfun c tioning De vice Done Any physica l device dete cted? Y N Unplug the nonfuncti oning device from the notebook, and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix or replace broken ite m. Nonfunctioning device. Reattach dev ice. Close notebook, plug in power , and reboot. Device boots properly? Go to Flowchart 2.9, No OS Loading. Device boots properly? Replace hard drive. Replac e diskette drive . Replace NI C. If integrated NI C, replace syst em boar d. Y N Y N
2–2 8 Maintenance and Ser v ice Guide T r oubleshooting Flo wch art 2. 1 8—Nonfunc tionin g K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard. Reseat i nternal keyboard connector (if applicable). Replace internal keyboard or cable. OK? Y N Y N Done Done
T r ouble shooting Maintenance and S erv ice Gui de 2–2 9 Flo wch art 2. 1 9—N onfunc tioning P oin ting De vice Y N OK? Pointing device not operating properly . External device works? Replace system boar d. Replace system board. Connect noteb ook to good external pointing device. Reseat int ernal pointing device connector (if applicable). Replace intern al pointing device or cable. OK? Y N Y N Done Done
2–30 Maintenance and Ser v ice Guide T r oubleshooting Flo wch art 2.20—N o Net w ork/Modem Con nec tion Y Disconnect all power from the notebook and open. No net work or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activate d. Connect to nondigital line. NIC/modem configured in O S? Reload drivers and reconfigure. Reseat NIC/modem (if applicable). Replac e NIC/modem (if applicable). Replace system board. OK? OK? Done N N N N Y Y Y Y
Maintenance and S erv ice Gui de 3–1 3 I llustrated P arts C a talog This chapter provides an illu strated parts breakdo wn and a reference for spare part numbers and option part numbers. 3 . 1 Se ria l Num be r L o cat io n When ordering parts o r reques ting information, pro vide the notebook serial nu mber and model number located on the bottom of the notebook. Seri al Num ber Location
3–2 Maintenance a nd Service Guide Illus tr ated P arts Catalog 3.2 Notebook M ajor Com pon ents Noteboo k Major C omponents
Illustr ated P arts Catalog Maintenance and S erv ice Gui de 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Descrip tion Spare P ar t Number 1 Display assemb lies 14.1-inch, TFT , SXGA 14.1-inch, TFT , XGA 344397-001 344396-001 Miscellaneous Plastics Kit (i ncludes the f ollowing components) 344411-001 2a 2b 2c 2d 2e 2f 2g Left and r ight display hinge cov e rs R TC batter y K e yboard plate Memor y shield Bluetooth cov er Batter y bezel Mini PCI compar tment cov er not illustrated: Notebook feet (4) PC Card slot space sa v ers (2) 3 Switch co ver 344400-001 4 Keyb oa rds (incl ude pointing stic k) Brazil Czech Republic Denmar k European F rance F rench Canada Ger many Hungar y Iceland India Inter nati onal Israel Italy Japan 344391-201 344391-221 344391-081 344391-A41 344391-051 344391-121 344391-041 344391-211 344391-DD1 344391-D61 344391-B31 344391-BB1 344391-061 344391-291 Ko r e a Latin Am erica Norwa y P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 344391-AD1 344391-161 344391-091 344391-131 344391-251 344391-171 344391-BA1 344391-071 344391-101 344391-111 344391-AB1 344391-281 344391-141 344391-031 344391-001
3–4 Maintenance a nd Service Guide Illus tr ated P arts Catalog Noteboo k Major C omponents
Illustr ated P arts Catalog Maintenance and S erv ice Gui de 3–5 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Descrip tion Spare P ar t Number 5 T op cover (includes T ouchPad) 344398-001 6 F an assembly 345065-001 7 Heat sink 344410-001 8 Har d drives 80-GB (5400-r pm) 60-GB (5400-r pm) 40-GB (5400-r pm) 30-GB (4200-r pm) 344407-001 344406-001 344405-001 344404-001 9 Modem board (includes ca b le) 344409-001 10 Bottom boar d 346883-001 11 Memory e xpansion boar ds, 333-MHz 1024-MB DDR 512-MB DDR 256-MB DDR 336579-001 336578-001 336577-001 12 Pr ocessors Mobile Intel P entium 4 Processor-M, 1.8-GHz Mobile Intel P entium 4 Processor-M, 1.7-GHz Mobile Intel P entium 4 Processor-M, 1.6-GHz Mobile Intel P entium 4 Processor-M, 1.5-GHz Mobile Intel P entium 4 Processor-M, 1.4-GHz 345857-001 340165-001 319777-001 347253-001 319775-001
3–6 Maintenance a nd Service Guide Illus tr ated P arts Catalog Noteboo k Major C omponents
Illustr ated P arts Catalog Maintenance and S erv ice Gui de 3–7 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Descrip tion Spare P ar t Number 13 Mult iBay de vices 24X Max CD-R OM drive 24X Max D VD/CD-RW combo drive 4X Max D VD R W/R and CD-R W combo dr iv e Diskette drive MultiBay batter y pack 100044-001 346789-001 344256-001 241995-001 267747-001 14 System boar ds Includes 64 -MB discrete video memor y Includes 32 -MB discrete video memor y 346885-001 344401-001 15 LED boar d (includes cable) 346884-001 16 Bluetooth wireless comm unications boar d 333605-001 17 Battery pac ks Primar y batter y pack, Li-Ion, 6-cell, 3.6-Ah, 48-Wh Optional high-capacity batter y pack, Li-Ion, 8-cell, 4.4-Ah, 63-Wh 338669-001 344408-001 18 Base enclosure (includes speakers) 344399-001 19 Mini PCI comm unications boards 802.11a/b/g LAN board 802.11b/g LAN board 802.11b W500 mo dem board (f o r use in J apan) 325525-001 325526-001 339742-291 Wireless local area network (LAN) cards 802.11b (MOW) 802.11b (RO W) 345641-001 345640-001
3–8 Maintenance a nd Service Guide Illus tr ated P arts Catalog 3. 3 M iscellaneous Plas tics Kit Com ponents Miscellaneou s P lasti cs K i t Co mponents T able 3-2 Miscellaneous Plastics Kit Compo nents Spare P ar t Number 344411-001 Item Description 1 L eft and right display hinge co v ers 2R T C b a t t e r y 3 Min i PCI compar tment cov er 4 Bl uetooth cov er 5 Batter y bez el 6 Memor y shield 7 Ke yboard plate 8 No tebook feet (4) 9 PC Card slot space sav ers (2)
Illustr ated P arts Catalog Maintenance and S erv ice Gui de 3–9 3 .4 Mass St or age De v ice s T ab le 3-3 Mass Storage Devices Spare P ar t Number Inf ormation Item Description Spare P art Number 1 Ha r d drives (include hard drive be ze l and fram e) 80-GB (5400-r pm) 60-GB (5400-r pm) 40-GB (5400-r pm) 60-GB (4200-r pm) 344407-001 344406-001 344405-001 344404-001 2 MultiBay devices 24X Max CD-ROM drive 24X Max D VD/CD-R W combo dr iv e 4X Max D VD R W/R and CD-R W combo dr ive Diskette drive MultiBa y batter y pack 100044-001 346789-001 344256-001 241995-001 267747-001
3–10 Maintenance and Ser v ice Guide Illus tr ated P arts Catalog 3.5 M iscell an eous T abl e 3-4 Miscellaneous (not illustrated) Spare P ar t Information Description Spare P art Number 3-wire power cor ds A ustralia Brazil Denm ark Europe/ Middle East/ Africa Israel 246959-011 246959-201 246959-081 246959-021 246959-BB1 Italy Jap a n Ko r e a Switzerland United Kingdom United States 246959-061 246959-291 246959-AD1 246959-AG1 246959-031 246959-001 65-watt A C adapter 239704-001
Illustr ated P arts Catalog Mainte nance and Serv ice Gui de 3–11 Carrying cas es Leather , top load, Samsung Leather , top load, SG Nylon, top load, Samsung Nylon, top load, SG Nylon, entr y lev el 325817-001 325817-002 325815-001 325815-002 325814-001 Po r t R e p l i c a t o rs Adv anced P o r t Replicator Simple P or t Replicator 339096-001 339097-001 Security card 345856-001 Screw Kit (includes the f ollowing scre ws; ref er to Appendix C , “Screw Listing, ” for more information on screw specifications and usage.) 344412-001 ■ Phillips PM3.0×4.0 screw ■ Phillips PM3.0×3.5 screw ■ Phillips PM2.5×11.0 screw ■ Phillips PM2.5×9.0 screw ■ Phillips PM2.5×7.0 screw ■ Phillips PM2.5×3.5 screw ■ Phillips PM2.0×5.0 screw ■ Phillips PM2.0×3.0 screw ■ Phillips PM1.5×3.0 screw ■ T orx T8M2.5×5.5 scre w ■ T orx T8M2.5×5.0 scre w ■ T orx T8M2.5×3.5 flat-head screw ■ T orx T5M3.0×4.0 scre w ■ He x M2.5×9.0 scre w ■ He x M2.0×10 .0 alignmen t pin USB mouse, carbon 164999-001 T abl e 3-4 Miscellaneous (not illustrated) Spare P ar t Information Description Spare P art Number
Maintenance and S erv ice Gui de 4–1 4 Remo v al an d Repl a cemen t Pr eliminaries This chapter provides essential informati on for proper and safe remo v al and replacement service. 4. 1 T ools Required Y ou will need the follo wing tool s to complete the remov al and replacement procedures: ■ Magnetic scre wdri v er ■ Phillips P0 scre wdri ve r ■ 5.0-mm socket for system board standof fs ■ Flat-bladed scre wdri v er ■ T ool kit (includes connec tor re mo v a l tool, loopback plugs, and case utility tool)
4–2 Maintenance a nd Service Guide Remo val and Replacement Preliminari es 4.2 S er vice C onsid erations The follo wing sections include so me of the considerations that you sho uld keep in mind during disassem bly and assemb ly procedures. ✎ As you remo ve each subassembly from the noteboo k, place the subassembly (and all accompanying scre ws) aw ay from the work area to prev ent damage. Pl a s t i c Pa r ts Using excessi ve force during di sassembly and reasse mbly can damage plastic parts. Use care when handling th e plastic parts. Apply pressure on ly at the points designated in the maintena nce instructions. Ca bles and C onnectors Ä CAUT ION: When ser vicing th e notebook, ensure that cables are placed in their proper locations dur ing the reassembly process. Improper cable placement can damage the notebook. Cables must be handled with e xtreme care to a v oid d amage. Apply only the tension required to unseat or seat the cables during remov al and insertion. Ha ndle cables b y the connector whene ver possible. In all cases, a v oid bending, twisting, or tearing cables. Ensure that ca bles are routed in such a way that they cannot be caught or snagge d b y parts being removed or replaced. Handle flex cables with e xtreme care; these cables tear easily .
Remo val and Replacement P r eliminaries Maintenance and S erv ice Gui de 4–3 4. 3 Pr e v ent ing Damage to R emo v able Dr i v es Remov able dri ves are fragile co mponents that must be hand led with care. T o prev ent damage to the notebook, damage to a remov able driv e, or loss of in formation, observ e the follo wing precautions: ■ Before remo ving or inserting a hard dri ve, shut do wn the notebook. If you are unsure whether the no tebook is of f or in Hibernation, turn the noteb ook on, then shut i t do wn. ■ Before remo ving a disk ette dri ve or optical d ri ve, ensure that a diskette or disc is no t in th e dri ve. Ensure that the optical dri ve tray is closed. ■ Before handling a dri ve, ensure that yo u are discharg ed of static electricity . While handling a dri ve, a void touching the connector . ■ Handle dri v es on surfaces that ha ve at least one inch of shock-proof foam. ■ A v oid dropping dri ves from an y height onto an y surface. ■ After removing a hard dri ve, a CD-R OM dri ve, or a diskette dri v e, place it in a static-proof bag. ■ A v oid e xposing a hard dri v e to products that h a ve magn etic f ields, such as monito rs or speakers. ■ A v oid exposing a dri ve to temperature e xtremes or liquids. ■ If a dri ve must be mailed, place the driv e in a b ubble pack mailer or other suit able form of protecti ve packaging and label the package “Fragile: Handle W ith Care. ”
4–4 Maintenance a nd Service Guide Remo val and Replacement Preliminari es 4.4 Pre v entin g Elec trostati c D ama ge Many electronic components ar e sensiti ve to electrostatic dischar ge (ESD). Circu itry design and stru cture determine the degree of sensiti vity . Networks b uilt into many inte grated circuits provide some protection, but in man y cases the discharge contains enough po wer to alter de vice pa rameters or melt silicon junctions. A sudden dischar ge of static electricity from a f inger or other conductor can destroy static-sensitiv e de vices or microcircuitry . Often the spark is neither felt nor heard, bu t damage occurs. An electronic device exposed to electrosta tic discharge might not be af fected at all and can work pe rfectly throughout a normal life c ycle. Or the de vice might fu nc tion normally for a while, then degrade in the internal layers , reducing its life e xpectancy . 4.5 P a ck agin g and T ranspor tin g Precautions Use the follo wing grounding precautions when packagin g and transporting equipment: ■ T o av oid hand co ntact, transport products in stati c-safe containers, such as tubes, bags , or box es. ■ Protect all electrostatic-sensiti ve parts and assemblies with conductiv e or approv ed containers or packaging . ■ K eep electrostatic-sensiti v e parts in their containers until the parts arri v e at static-free workstations. ■ Place items on a grounded surface before removing them from their containers. ■ Alw ays be properly grounded when to uching a sensiti v e component or assembly .
Remo val and Replacement P r eliminaries Maintenance and S erv ice Gui de 4–5 ■ Store reusable electrostatic-sen siti v e parts from assemblies in protecti v e packag ing or noncon ducti v e foam. ■ Use transpo rters and con ve yors made of antistatic belts and roller b ushings. Ensure that mechanized equipment used for moving materials is wired to g round and that prop er materials are selected to av oid static charging. When grounding is not possible, use an ionizer to dissipate electric char ges. 4.6 W orkstation Precau tions Use the follo wing grounding pr ecautions at w orkstations: ■ Cov er the workstation with approv ed stati c-shielding material (refer to T able 4-2). ■ Use a wrist strap connected to a prop erly grounded work surface and use properly g rounded to ols and equipment. ■ Use conducti ve f ield servic e tools, such as cutters, scre wdri v ers, and v acuums. ■ When using f ixtures that must directly contact dissipati ve surfaces, use only f ixtures made of static-safe materials. ■ K eep the w ork area free of nonconducti ve materials, such as ordinary plastic ass embly aids and Styrofoam. ■ Handle electrostatic-sensi ti ve co mponents, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A v oid contact with pins, leads, or circuitry . ■ T urn off po wer an d input signals before insertin g or removing connectors or test equipment.
4–6 Maintenance a nd Service Guide Remo val and Replacement Preliminari es 4.7 G roundin g Eq uipm ent an d Met hods Grounding equipmen t must include either a wrist strap or a foot strap at a grounded w orkstation. ■ When seated, wear a wrist strap co nnected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o pro vide proper ground, wear a strap snugl y against the skin at all times. On grounded mats with banana-plug conn ectors, connect a wrist strap with alligator clips. ■ When standing, use fo ot straps and a grounded floor mat. Fo ot straps (heel, toe, or boot straps) can be used at standin g workstations and are compatible with most types of sh oes or boots. On con ducti v e floors or dissipati ve floor mats, use foot straps on bot h feet with a minimum of o ne-mego hm resistance between the operator and ground. T o be ef fecti ve, the conducti ve strips must be wo rn in contact with the skin. Other grounding equip ment recommended for use in pre v enting electrostatic damage includes: ■ Antistatic tape ■ Antistatic smocks, aprons, an d slee ve p rotectors ■ Conductiv e bins and other assembly or sold ering aids ■ Nonconducti ve foam ■ Conducti ve tablet op workstatio ns with ground cords of one-me gohm resistance ■ Static-dissipati v e tables or floor mats with hard ties to the ground ■ Field service kits ■ Static a wareness labels ■ Material-handling packages ■ Nonconducti ve plastic bags, tube s, or box es
Remo val and Replacement P r eliminaries Maintenance and S erv ice Gui de 4–7 ■ Metal tote boxes ■ Electrostatic v oltage le vels and protecti ve materials T able 4-1 shows ho w humidity af fects the electrostatic vo ltage le v els generated by dif ferent activ ities. T able 4-2 lists the shielding protec tion pro vided b y antistatic bags and floor mats . Ta b l e 4 - 1 T ypical Electrostatic V oltage Levels Relative Humidity Event 10% 40% 55% W al king across car pet 35,000 V 15 ,000 V 7,500 V W al king across vin yl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 14,500 V 5,000 V 3,500 V Removing b ubb le pack from PCB 2 6,500 V 20,0 00 V 7,000 V P acking PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 volts. T able 4-2 Static-Shielding Materia ls Material Use V oltage Pr otection Le vel Antistatic plastic Bags 1,500 V Carbon-loaded pl astic Floor mats 7,500 V Metallized laminate Floor mats 5,000 V
Maintenance and S erv ice Gui de 5–1 5 Remo v al an d Repl a cemen t Procedure s This chapter provides remov al and replaceme nt procedures. There are 56 scre ws and standof fs, in 14 dif ferent sizes, that must be remov ed, replaced, and/or loosened when servicing the notebook. Make special note of each scre w size and location during remov al and replacement. Refer to Appendix C, “Scre w Li sting, ” for detailed information on scre w sizes, locations, and usage.
5–2 Maintenance a nd Service Guide Remo val and Replacement P r ocedures 5. 1 S e r i a l N u m b e r Report the notebook serial number to HP when requesting information or ordering spare part s. The serial number is loc ated on the bottom of the notebook. Seri al Num ber Location 5 .2 Di sassem bl y Se quenc e Chart Use the chart belo w to determin e the section number to be referenced when remo ving noteb ook components. Disassemb ly Sequence Char t Section Description # of Screws Remo ved 5.3 Prepar ing the notebook for disassemb ly Batter y pack Hard drive 0 2 to remov e, 6 to disassemb le 5.4 Noteboo k f eet 0
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–3 Section Description # of Screws Remo ved 5.5 Mini PCI communications board 1 5.6 MultiBa y de vice 0 5.7 Bluetooth wire less communications board 3 5.8 K eyboard 2 5.9 Modem board 2 5.10 Memor y expansion board 0 5.11 Switch cov er 2 5.12 K eyboard plate 0 5.13 F an assembly 5 5.14 Heat sink 4 5.15 Processor 0 5.16 Displa y assemb ly 4 5.17 T op cover 16 5.18 R TC batter y 0 5.19 LED board 0 5.20 Bottom board 2 5.21 System board 5 screws , 2 standoffs Disassembl y Sequence Char t (Continued)
5–4 Maintenance a nd Service Guide Remo val and Replacement P r ocedures 5 .3 Preparing t he Notebook for Disa ssemb ly Before you be gin an y remov al or installation procedures: 1. Sa v e your wor k, e xit all applications, and shut do wn the notebook. If you are not sure whether the noteboo k is of f or in Hibernation, briefly press the po wer b utton. If your work returns to the screen, sa ve y our work, e xit all applications, and then shut down the notebook. 2. Disconnect all e xternal de vices connected to the not ebook. 3. Disconnect the po wer cord. 4. Remov e the battery pack b y follo wing these steps: a. T urn the notebook up side do wn, with the front panel fa cing you. Spare P ar t Number Information Battery packs Primar y ba tter y pack, Li-I on, 6-cell, 3.6-Ah, 48-Wh Optional h igh-capacity batter y pack, Li-Ion, 8-cell, 4.4-Ah, 63-Wh 338669-001 344408-001
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–5 b . Slide and hold the bat tery release latch 1 tow ard the back of the notebook. c. Use the notch in the battery pa ck to slide the battery pack to the left 2 . d. Remov e the battery pack. Re m ovin g t h e B a t te r y P a ck
5–6 Maintenance a nd Service Guide Remo val and Replacement P r ocedures 5. Remov e the battery bezel b y sliding it do wn and of f of the battery p ack. ✎ The battery bezel is in cluded in the Miscellaneous Plastics Kit, spare part number 34 4411-001. Re m ovin g t h e B a t te r y B e zel Re v erse the abov e procedure to install the battery pack and battery b ezel.
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–7 6. Remov e the hard dri ve b y follo wing these steps: a. T urn the notebook up side do wn, with the rear panel fa cing you. b . Remo v e the T8M2.5×5.0 scre w 1 that secures the hard dri ve door to the notebook. c. Remov e the PM3.0×4.0 h ard dri ve security screw 2 that secures the hard dri ve to the notebook. R emo ving the Har d Dri v e Sc r ew s Spare P ar t Number Information Hard d rives (include hard drive frame and connector) 80-GB (5400-r pm) 60-GB (5400-r pm) 40-GB (5400-r pm) 30-GB (4200-r pm) 344407-001 344406-001 344405-001 344404-001
5–8 Maintenance a nd Service Guide Remo val and Replacement P r ocedures d. Lift the hard driv e cov er up and swing it back 1 . e. Use the Mylar tab 2 to sli de the hard dri v e to the left 3 to disconnect it from the system board. f. Remo ve the hard dri ve. Re m ovi ng t h e H a rd Drive
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–9 Ä CAUT ION: The har d dri v e should be disasse mbled only if it is damaged and must be repair ed . Unnecessary di sas sembly of the har d dri ve can r esult in damage to the hard dr i v e and loss o f info rmati on . g. Remov e the tw o T5M3.0×4.0 scre ws 1 and the two PM3.0×3.5 sc re w s 2 that secure the hard dri v e to the hard dri v e frame. h. Use a 4.0 -mm socket to remo v e the tw o M2.0×10.0 alignment pins 3 that secure the hard dri ve to the hard dri v e frame. i. Remov e the hard dri ve from the hard dri ve frame 4 . j. Remov e the hard dri ve connector from the hard dri ve 5 . R emo v ing the Har d Dr i v e Br ac k et and Co nnect or Re v erse the abov e procedure to reassemble and insta ll the hard driv e.
5–10 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5 .4 Notebook F eet The notebook feet are a dhesi ve-backed rubber pads. The notebook feet are in cluded in the Miscellaneous Plastics Kit, spare part number 344411-001. The n otebook feet attach to t he base enclosure as illustrated belo w . R eplac ing the Note book F eet 5 .5 M ini P CI Communica tions Board Spare P art Number Information Mini PCI c ommunications boards 802.11a/b/g LAN board 802.11b/g LAN board 802.11b W500 mo dem board (f or use in J apan) 325525-001 325526-001 339742-291 Wireless LAN car ds 802.11b (MOW) 802.11b (RO W) 345641-001 345640-001
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–11 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. T urn the notebook up side do wn, with the fro nt facing yo u. 3. Remov e the PM2.5× 3.5 scre w 1 that secures the Mini PCI compartment cov er to the notebook. 4. Lift the right side of the co v er up and swing it to the left 2 . 5. Remov e the cov er . ✎ The Mini PCI compartment co ve r is included in the Miscellaneous Plasti cs Kit, spare part nu mber 344411-001 . R emo v ing the Mini P CI Com partment Co v er
5–12 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 6. If a wireless communications de vice is installed in this compartment, disconnect the two antenna cables from the Mini PCI communications bo ard. Note that the longer cable 1 connects to the rear antenn a terminal and the shorter antenna cable 2 connects to the front antenna terminal. 7. If a modem is installed in th is compartment, disconnect the modem cable from the modem 3 . Disconnec ting the Ca bles fr om the Mini P CI C ommuni cati ons Boar d
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–13 8. Spread the retaining tabs 1 that secure the Mini PCI communications board to the sock et. The b oard rises u p. 9. Pull the board aw ay from the socket at a 45-de gree angle 2 . R emov i ng the Mini P CI Communications Boar d Re v erse the abov e procedure to install a Mini PCI communications b oard. 5. 6 M u l t i B a y D evi c e 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. T urn the notebook up side do wn, with the rig ht side fa cing you . Spare P art Number Information MultiBay de vices 24X Max CD-RO M dri v e 24X Max D VD/CD-RW combo drive 4X Max D VD RW/R and CD-R W combo drive Diskette driv e MultiBa y batter y pack 100044-001 346789-001 344256-001 241995-001 267747-001
5–14 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 3. Slide and hold the MultiBay release latch to the right 1 . 4. Remov e the MultiBay de vice 2 . R emo v ing a MultiBa y Dev ice Re v erse the abov e procedure to install a MultiBay de vice.
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–15 5. 7 B l u e t o o t h W i re l e s s Com mun ic ati on s Boa r d 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. T urn the notebook up side do wn, with the rig ht side fa cing you . 3. Loosen the PM2.0×5.0 scre w 1 that secures the Bluetooth cov er to the notebook. 4. Remov e the co ve r from the note book as far as the cable will allo w 2 . 5. Disconnect the cable 3 from the Bluetooth board. Re m ovin g t h e B l ue t o ot h C over Spare P art Number Information Bluetooth wireless communications board 333605-001
5–16 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 6. Remov e the two PM1.5×3.0 scre ws 1 that secure the Bluetooth board to the Bluetooth co ver 2 . 7. Remov e the co ver from the board. ✎ The Bluetooth co ver is included in the Miscellaneous Plastics Kit, spare part number 34 4411-001. R emo v ing the Bluetooth Boar d Re v erse the abov e procedure to install a Bluetooth board.
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–17 5 .8 K e y board 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. T urn the notebook up side do wn, with the fro nt facing yo u. 3. Remov e the tw o T8M2.5×11.0 scre ws that secure the ke yboard to th e notebook. Re m ovi ng t h e Keyb o a rd S crews Spare P art Number Information Keyb oa rds (include pointing stic k) Brazil Czech Repub lic Denm ark European Fr a n c e F rench Canad a Ger many Hungar y Iceland India Inter nati onal Israel Italy Japan Ko r e a 344391-201 344391-221 344391-081 344391-A41 344391-051 344391-121 344391-041 344391-211 344391-DD1 344391-D61 344391-B31 344391-BB1 344391-061 344391-291 344391-AD1 Latin Am erica Norw a y P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 344391-161 344391-091 344391-131 344391-251 344391-171 344391-BA1 344391-071 344391-101 344391-111 344391-AB1 344391-281 344391-141 344391-031 344391-001
5–18 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 4. T urn the noteb ook right-side up, with the front facing you. 5. Open the notebook. 6. Slide the four tabs on the top edge of the ke yboard to ward you 1 . 7. Lift the rear edge of the ke yboard up and swi ng it forward 2 until it rests on the palm rest. R eleasin g the K e y boar d
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–19 8. Release the zero insertion force (ZIF) connector 1 to which the pointing stick cable is attached and disconnect the cable 2 . 9. Release the ZIF connector 3 to which the k eyboard cable is attached and disconnect the cable 4 . Disconnec ting the T ouchP ad and K e y boar d Ca bles Re v erse the abov e procedure to install the keyboard.
5–20 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5. 9 M o d e m B o a r d 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Release the ke yboard (Sect ion 5.8). 3. Disconnect the modem cable 1 from the modem bo ard. 4. Remov e the two PM2.5×3.5 screws 2 that secure the modem board to the notebook. 5. Lift the rear edge of the modem board 3 to disconnect it from the syst em board. 6. Remov e the modem board. R emo v ing the Modem Boar d Re v erse the abov e procedure to install th e modem board. Spare P art Number Information Modem board (includes cable) 344409-001
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–21 5 . 1 0 Memor y Expansion B oard 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Remov e the ke yboard (Section 5.8) . 3. Lift the left side of the memo ry shield and swing it up and to the right 1 until it rests at a 45-de gree angle. 4. Slide the shield to the left 2 to remo ve it . ✎ The memory shield is included in the Miscellaneous Plastics Kit, spare part number 34 4411-001. R emo v ing the Memory Shield Spare P art Number Information Memory expa nsion boards , 333-MHz 1024-MB DDR 512-MB DDR 256-MB DDR 336579-001 336578-001 336577-001
5–2 2 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5. Spread the retaining tabs 1 that secure the memory e xpansion board to the socket. The board rises up . 6. Pull the board aw ay from the socket at a 45-de gree angle 2 . R emo v ing a Memory Expansion Boar d Re v erse the abov e procedure to install a memory expansion board.
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–2 3 5. 1 1 Sw i t c h C ove r 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Remov e the ke yboard (Section 5.8) . 3. Close the note book. 4. T urn the notebook upsi de do wn, with the rear panel fa cing you . 5. Remov e the two TM2.5×9.0 sc re ws that secure the switch cov er to the notebook. Rem ovi n g t h e Switch Cove r Sc rew s Spare P art Number Information Switch cov er 344400-001
5–2 4 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 6. T urn the noteb ook right-side up, with the front facing you. 7. Open the notebook. 8. Lift up on the middle of the switch cov er 1 to disengage it from the notebook. 9. Swing the rear edge of the switch co v er up and forward 2 . 10. Remov e the switch co ve r . Rem ovi n g t h e Switch Cove r Re v erse the abov e procedure to install the switch co ver .
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–2 5 5. 1 2 K eyb o a r d Pl a t e ✎ The ke yboard pla te is included in the Miscellaneous Plastics Kit, spare part number 34 4411-001. 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Remov e the ke yboard (Section 5.8) . 3. Remov e the switch co ver (Section 5.11). 4. Slide the k eyboard plate to ward the back of the notebook 1 to disengage the plate tabs from the slots in the top cov er , and then lift the plate straight up 2 to remo v e it. Re m ovi ng t h e Keybo a rd Pl a te Re v erse the abov e procedure to install the keyboard plate.
5–2 6 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5. 1 3 F a n A s s e m b ly 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Remov e the ke yboard (Section 5.8) . 3. Remov e the switch co ver (Section 5.11). 4. Remov e the keyb oard plate (Section 5.12). 5. Disconnect the f an cable 1 from the system board. 6. Remov e the T8M2.5×7.0 2 and T8M2.5 ×5.0 scre ws 3 that secure the fan assembly to the notebook. R emo v ing the F an Ass embl y Sc r e ws Spare P art Number Information F an assembly 345065-001
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–2 7 7. Lift the left side of the f an assembly 1 until it rests at an angle. 8. Slide the fan assembly up and to the left 2 to remov e it from the notebook. R emo ving the F an Ass embl y
5–2 8 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 9. Remov e the three PM2.0× 3.0 scre ws 1 that secure the fan to the fan housing. 10. Remov e the fan 2 . R emo v ing the F an fr om the Fan As sembl y Re v erse the abov e procedure to install the fan assembly .
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–2 9 5. 1 4 H e a t S i n k 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) 2. Remov e the four T8M2.5×5.0 scre ws that secure the heat sink bracket to the system board. Re m ovin g t h e H e a t S i nk Spare P art Number Information Heat sink 344410-001
5–30 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 3. Lift the left side of the heat sink up 1 until the thermal grease bond between the heat sink and the processor disengages. 4. Slide the hea t sink forward 2 until the cooling f ins 3 clear the top cov er . 5. Lift the heat sink straight up to remo ve it. Re m ovin g t h e H e a t S i nk
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–31 ✎ Carefully clean an y thermal grease residue from the underside of the heat sink 1 and processor surfaces 2 each time you remove the heat sink. Then apply ne w thermal grease to both surfaces. R emo v ing the T her mal Gr ease F r om the Heat Sink and Pr ocess or Re v erse the abov e procedure to install the heat sink.
5–3 2 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5. 1 5 P ro c e s s o r 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) Spare P art Number Information Processors (include ther mal grease) Mobile Intel P entium 4 Processor-M, 1.8-GHz Mobile Intel P entium 4 Processor-M, 1.7-GHz Mobile Intel P entium 4 Processor-M, 1.6-GHz Mobile Intel P entium 4 Processor-M, 1.5-GHz Mobile Intel P entium 4 Processor-M, 1.4-GHz 345857-001 340165-001 319777-001 347253-001 319775-001
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–3 3 2. Use a flat-bladed scre wdri v er to turn the processor lock scre w one-quarter turn counterclockwise 1 to release the processor from the socket. 3. Lift the processor straig ht up 2 to remo ve it. ✎ Note that the gold triangle 3 on the processor should be aligne d in the lo wer right corner wh en you install the processor . Re m ovin g t h e P roc e ss o r Re v erse the abov e procedure to install the processor .
5–34 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 5. 1 6 D i s p l ay A s s e m b l y 1. Prepare the noteb ook for disassembly (Section 5. 3). 2. Disconnect the wireless antenna cables from the Mini PCI communications b oard (Section 5.5). 3. Remov e the follo wing components: ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) Spare P art Number Information Display assemblies 14.1-inch, TFT , SXGA 14.1-inch, TFT , XGA 344397-001 344396-001
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–3 5 4. Disconnect the disp lay cable 1 and microphone cab le 2 from the system board. 5. Remov e the left and right wireless antenna cables 3 from the three clips in the top co ver . 6. Remov e the left and right wi reless antenna cables from the hole 4 in the system board. Disco nnecting the Displa y Cables
5–3 6 Maintenance and Service Guide Remo val and Replacement P r ocedures 7. Close the note book. 8. T urn the notebook upsi de do wn, with the rear panel fa cing you . 9. Remov e the follo wing scre ws: 1 T wo T8M2.5×9.0 scre ws from the rear panel 2 T wo T8M2.5×9.0 scre ws from the bottom of the notebook Re m ovi ng t h e D i s p l ay Sc rews
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–3 7 10. T urn the notebook right-side up, with the front facing you. 11. Open the notebook until the display assembly is in an upright position. 12. Lift the display assembly straight up 1 to remov e it. 13. If necessary , remov e the left 2 and right 2 display hinge cov ers from the displ ay assembly . ✎ The display hinge cov ers are included in the Miscellaneous Plastics Kit, spare part number 3444 11-001. Remo ving th e Di splay Assem bly Re v erse the abov e procedure to install the display assembly .
5–3 8 Maintenance and Service Guide Remo val and Replacement P r ocedures 5. 1 7 T o p C ove r 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) ❏ Display assembly (Section 5.16) 2. T urn the notebook upsi de do wn, with the rear panel fa cing you . Spare P art Number Information T o p cov er (includes T ouchPad) 344398-001
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–3 9 3. Remov e the follo wing scre ws: 1 Nine T8M2.5×9.0 scre ws fr om the bottom of the notebook 2 Three PM2.5×3.5 scre ws from the MultiBay 3 T wo PM2 .5×3.5 scre ws from the hard d ri ve bay 4 T wo T8M2.5×5.5 scre ws from the rear panel Re movi n g t h e Top Cove r Sc rews
5–40 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 4. T urn the noteb ook right-side up, with the front facing you. 5. Disconnect the R TC battery cable 1 from the system board. 6. Release the ZIF connector 2 to which the T ouchPad cable is attached and disconnect the T ouchPad cable 3 . 7. Lift the right side of the top co v er 4 until it rests at a 45-degree angle. 8. Slide the top co v er to the left 5 to disengage the audio connectors 6 from the top co v er . 9. Remov e the top co v er . Re movi n g t he Top Cove r Re v erse the abov e procedure to install the top co ver .
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–41 5. 1 8 R TC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 34 4411-001. 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) ❏ Display assembly (Section 5.16) ❏ T o p co ver (Section 5.17) 2. T urn the top cover upside do wn, with the front facing you.
5–4 2 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 3. Lift the R TC battery out of the top cov er clip. Re m ovin g t h e RT C B a t te r y Re v erse the abov e procedure to install the R TC battery .
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–4 3 5. 1 9 L E D B o a r d 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) ❏ Display assembly (Section 5.16) ❏ T o p co ver (Section 5.17) 2. T urn the top cover upside do wn, with the front facing you. Spare P art Number Information LED board (includ es cab le) 346884-001
5–44 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 3. Release the ZIF connector 1 on the system board to which the LED board cable is attach ed, and then disconnect the cable 2 . 4. Lift the board straight up to remo v e it 3 . 5. Release the ZIF connector 4 on the LED board to which the LED board cable is a ttached and disconnect the cable 5 . 6. Remov e the LED board actuator 6 from the notebook. Re m ovin g t h e L E D Bo a rd Re v erse the abov e procedure to install the LED board.
Rem ova l a n d Re p la c em en t Pro ce d ures Maintenance and S erv ice Gui de 5–4 5 5 . 20 Bo tto m Bo ar d 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) ❏ Display assembly (Section 5.16) ❏ T o p co ver (Section 5.17) 2. T urn the top cover upside do wn, with the front facing you. Spare P art Number Information Bottom board 346883-001
5–46 Maintenance and Ser v ice Guide Remo val and Replacement P r ocedures 3. Remov e the two PM2.5×5.0 screws 1 that secure the bottom board to the notebook. 4. Lift the front and rear edges of the bottom board to disconnect it from the sys tem board 2 . 5. Remov e the bottom board. R emo ving the Bo ttom Bo ar d Re v erse the abov e procedure to install the bottom board.
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–4 7 5. 2 1 Sys t e m B o a r d ✎ When repla cing the sy stem boa r d, ensure that the follo wing components are remo ved from the defecti v e system board and installed on the replacement system board: ■ Mini PCI communicatio ns board ( Section 5.5) ■ Bluetooth wireless co mmunications board (Section 5 .7) ■ Modem board (Section 5. 9) ■ Memory ex pansion boards (Section 5.10) ■ Processor (Section 5.15) ■ R T C battery (Section 5.18) ■ Bottom board (Section 5.2 0) 1. Prepare the noteb ook for disassembly (Section 5. 3) and remo ve the follo wing components: ❏ MultiBay de vice (Section 5.6) ❏ K e yboard (Section 5.8) ❏ Memory shield (Section 5.10) ❏ Switch co ver (Section 5.11) ❏ K e yboard plate (Section 5.12) ❏ Fan assembly (Section 5.13) ❏ Heat sink (Section 5.14) ❏ Display assembly (Section 5.16) ❏ T o p co ver (Section 5.17) ❏ LED board (Section 5.19) ❏ Bottom board (Section 5.2 0) Spare P art Number Information System boards Includes 64-MB disc rete video memor y Includes 32-MB disc rete video memor y 346885-001 344401-001
5–4 8 Maintenance and Service Guide Remo val and Replacement P r ocedures 2. Disconnect the speaker cable 1 . 3. Remov e the f i v e T8M2.5×5.0 screws 2 that secure the system board to the notebook. 4. Use a 5.0-mm sock et to remo v e the two HM2.5×9 .0 standof fs 3 that secure the system board to the notebook. R emo v ing the S y stem Boar d Scr ew s and St andoff s
Rem ova l a n d Re p la c em en t Pro ce d ures Mainte nance and Serv ice Gui de 5–4 9 5. Lift the front edge of the system board 1 until it rests at an angle. 6. Slide the system board forward at an angle, and then lift it straight up to remov e it 2 . Re m ovin g t h e Syste m B o a rd Re v erse the abov e procedure to install the system board.
Maintenance and S erv ice Gui de 6–1 6 Specification s This chapter provides physical and perform ance specifications. T abl e 6-1 Notebook Dimensions Height Width Depth 3.40 cm 31.78 cm 26.19 cm 1.34 in 12.51 in 10.31 in We i g h t With 6-cell batter y pack and MultiBa y weight sa v er With 6-cell batter y pack and MultiBa y DV D - R O M d r i v e 2.25 kg 2.46 kg 4.96 lb 5.42 lb Stand-alone power requirements Nominal operating vo lt a g e Maximum operating power P eak o perating power 14.4 VDC 40 W 50 W Te m p e r a t u r e Operating (not wr iting optical) Operating (writing optical) Nonoperating 0°C to 35°C 5°C to 35°C -20°C to 60°C 32°F to 95°F 41°F to 95°F -4°F to 140°F
6–2 Maintenance a nd Service Guide Spe cifica tio ns Relative humidity (nonco ndensing) Operating Nonoperating 10% to 90% 5% to 95%, 38.7°C (101.6°F) maximum w et bulb temperature Altitude (unpressur ize d) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 to 3,048 m -15 to 12,192 m -50 to 10,000 ft -50 to 40,000 ft Shoc k Operating Nonoperating 10 g, 11 ms, half-sine 175 g, 2 ms, half-sine ✎ Applicable product saf ety standar ds specify ther ma l limits f or plastic surfaces . The n otebook operates well within this range of temperatures. T abl e 6-1 Notebook (Continued)
Spe cifica tio ns Maintenance and S erv ice Gui de 6–3 T abl e 6-2 14.1-inch, SXGA , TF T Displa y Dimensions Height Width Diagonal 28.6 cm 21.4 cm 35.7 cm 11.2 in 8.4 in 14.1 in Number of colors up to 16.8 million Contrast ratio 250 :1 Refresh rate 60 Hz Brightness 180 nits typical Pixel reso lution Pitch Fo r ma t Configuration 0.204 × 0.204 mm 1400 × 1050 RGB stripe Backlight CCFT Character display 80 × 25 T otal power consumption 4 W Vie wing angle /-40° horizontal, 20/-40° ver tical typical
6–4 Maintenance a nd Service Guide Spe cifica tio ns T abl e 6-3 14.1-inch, XGA, TFT Displ ay Dimensions Height Width Diagonal 28.6 cm 21.4 cm 35.7 cm 11.2 in 8.4 in 14.1 in Number of colors up to 16.8 million Contrast ratio 250 :1 Refresh rate 60 Hz Brightness 180 nits typical Pixel reso lution Pitch Fo r ma t Configuration 0.279 × 0.279 mm 1024 × 768 RGB stripe Backlight CCFT Character display 80 × 25 T otal power consumption 4 W Vie wing angle /-40° horizontal, 20/-40° ver tical typical
Spe cifica tio ns Maintenance and S erv ice Gui de 6–5 T ab le 6-4 Har d Drives 60-GB 40-GB 30 -GB User capa city per driv e 1 60 GB 40 GB 30 GB Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99g Interface type ATA - 5 ATA - 5 ATA - 5 T rans fer rate Synchronous (maximum) Securi ty 100 MB/ sec A T A secur ity 100 MB/ sec A T A secur ity 100 MB/ sec A T A secur ity Seek times (typical read, including setti ng) Single track A v erage Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 2.5 ms 12 ms 23 ms Logical blocks 2 117,210,240 78,140,160 58,605,120 Disk rotational speed 5400 r pm 5400 r pm 4200 r pm Operatin g temperature 5° to 55° C (41° to 131° F) 5° to 55° C (41° to 131° F) 5° to 55° C (41° to 131° F) 1 1 GB = 1,0 73,741,824 bytes. 2 Actual drive specifications ma y diff er slightly . Cer tain restr ictions and e xclusions apply . Consult the HP Customer Care Center f or details.
6–6 Maintenance a nd Service Guide Spe cifica tio ns Ta b l e 6 - 5 External A C Adapter We i g h t .29 kg 0.65 lb Po w e r s u p p l y Operating voltage Operating current Operating frequency range Maximum transient 90 to 264 V A C RMS 1.6 A RMS 47 to 63 Hz A C 4/50 kV Ta b l e 6 - 6 Primary 6-Cell, Li-Ion Battery P ac k Dimensions Height Width Depth We i g h t 1.90 c m 7.60 c m 14.70 cm .34 kg .75 in 3.00 in 5.80 in .75 lb Energy V oltage Amp-hour ca pacity W att-hour capacity 11.1 V 3.6 Ah 48 Wh Te m p e r a t u r e Operating Nonoperating 5°C to 45°C 0°C to 60°C 41°F to 113°F 32°F to 140°F Recharge time System in off mode or Standby System on (depending on system po wer consumption) 2 to 3 hours 3 to 5 hours
Spe cifica tio ns Maintenance and S erv ice Gui de 6–7 Ta b l e 6 - 7 Optional High-Capacity 8-Cell, Li-Ion Battery P ac k Dimensions Height Width Depth We i g h t 1.90 c m 7.60 c m 14.70 cm .43 kg .75 in 3.00 in 5.80 in .94 lb Energy V oltage Amp-hour ca pacity W att-hour capacity 14.1 V 4.4 Ah 63 Wh Te m p e r a t u r e Operating Nonoperating 5°C to 45°C 0°C to 60°C 41°F to 113°F 32°F to 140°F Recharge time System in off mode or Standby System on (depending on system po wer consumption) 2 to 3 hours 3 to 5 hours
6–8 Maintenance a nd Service Guide Spe cifica tio ns Ta b l e 6 - 8 Optional MultiBa y 8-Cell, Li-Ion Battery P ack Dimensions Height Width Depth We i g h t 1.30 c m 13.20 cm 13.90 cm .39 kg .50 in 5.20 in 5.45 in .86 lb Energy V oltage Amp-hour ca pacity W att-hour capacity 14.8 V 3.6 Ah 52 Wh Te m p e r a t u r e Operating Nonoperating 5°C to 45°C 0°C to 60°C 41°F to 113°F 32°F to 140°F Recharge time System in off mode or Standby System on (depending on system po wer consumption) 2 to 3 hours 3 to 5 hours
Spe cifica tio ns Maintenance and S erv ice Gui de 6–9 T ab le 6-9 24X D VD/CD-R W Combo Drive and 24X CD-R OM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thic kness 1.2 mm 0.047 in T rack pitch 0.74 µm Access time Random Full stroke < 150 ms < 225 ms A udio outpu t level Line-ou t, 0.7 Vrms Cache buffer 128 KB/s Data transfer rate CD-R (24X) CD-R W (10X) CD-ROM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rat e) 16.6 MB/s Startup time < 15 seconds Stop time < 6 seconds
6–10 Maintenance and Ser v ice Guide Spe cifica tio ns T abl e 6-10 8X D VD-ROM Drive and D VD R W /R and CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thic kness 1.2 mm 0.047 in T rack pitch 0.74 µm Access time Random D VD media Full stroke D VD me dia Random CD media Full stroke CD media < 150 ms < 225 ms < 110 ms < 200 ms A udio outpu t level Line-ou t, 0.7 Vrms Cache buffer 512 KB/s Data transfer rate Max 24X CD Max 8X D VD Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rat e) 16.6 MB/s Startup time < 10 seconds Stop time < 3 seconds
Spe cifica tio ns Mainte nance and Serv ice Gui de 6–11 T able 6-11 System DMA Har dware DMA System Function DMA0 A vailable f or audi o DMA1* Enter tainment audio (def ault; alter nate = DMA0, DMA3, none) DMA2* Disk ette drive DMA3 ECP parallel por t LPT1 (def ault; alter nate = DMA0, none) DMA4 DMA controller cascading (not a v ailable) DMA5* A vaila ble f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller can use DMA 1, 2, or 5.
6–12 Maintenance and Ser v ice Guide Spe cifica tio ns T abl e 6-12 System Interrupts Har dware IRQ System Function IRQ0 System ti mer IRQ1 K eyboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 Audio (def ault)* IRQ6 Diskette dr iv e IRQ7 P arallel por t IRQ8 Real time clock (R TC) IRQ9 In frared IRQ10 System use IRQ11 System use IRQ12 In tern al point stick or e xter nal mouse IRQ13 Copro cessor (not av ailab le to any per ipheral) IRQ14 IDE interface (hard drive and optical dr iv e) IRQ15 System use ✎ PC Cards ma y asser t IRQ 3, IRQ4, IRQ5, I RQ7, IRQ9, IR Q10, IRQ11, or IRQ15. Either the infrared or the ser ial por t ma y asser t IRQ3 or IRQ4. *Def ault configuration; audio possible configurations are IRQ5, IRQ7, IR Q9, IRQ10, or none.
Spe cifica tio ns Mainte nance and Serv ice Gui de 6–13 T able 6-13 System I/O Addresses I/O Address (he x) System Funct ion (shipping config uration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Inte rrupt controller no. 1 022 - 024 Opti chipset confi guration registers 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration for CPU 040 - 05F Counter/timer registers 044 - 05F Unused 060 K e yboard controller 061 P or t B 062 - 063 Unused 064 K e yboard controller 065 - 06F Unused 070 - 071 NMI enable/real time cloc k (R TC) 072 - 07F Unused 080 - 08F DMA page registers 090 - 091 Unused 092 P or t A 093 - 09F Unused 0A0 - 0A1 Interr upt controller no . 2
6–14 Maintenance and Ser v ice Guide Spe cifica tio ns I/O Address (he x) System Funct ion (shipping config uration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 Second ar y fix ed disk controlle r 178 - 1EF Unused 1F0 - 1F7 Primar y fixed disk controller 1F8 - 200 Unused 201 Jo ystic k (decoded in ESS1688) 202 - 21F Unused 220 - 22F Enter tainmen t audio 230 - 26D Unused 26E - 26 Unused 278 - 27F Unused 280 - 2AB Unused 2A0 - 2A7 Unused 2A8 - 2E7 Unused 2E8 - 2EF Reser ved serial por t T able 6-13 System I/O Ad dresses (Continued)
Spe cifica tio ns Mainte nance and Serv ice Gui de 6–15 I/O Address (he x) System Funct ion (shipping config uration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette drive controller 378 - 37F P arallel por t (LPT1/default) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Reser v ed (parallel port/no EPP suppor t) 3C0 - 3DF VGA 3E0 - 3E1 PC Card controller in CPU 3E2 - 3E3 Unused 3E8 - 3EF Internal modem 3F0 - 3F7 “A” diskette controller 3F8 - 3FF Seria l por t (COM1/def ault) CF8 - CFB PCI configuration inde x register (PCIDIV O-1) CFC - CFF PCI con figuration data register (PCIDIV O-1) T able 6-13 System I/O Ad dresses (Continued)
Maintenance and S erv ice Gui de A–1 A Con n e c t or P in Ass ign me nts Ta b l e A - 1 RJ-45 Netw ork Interface Pin Signal P in Signal 1 T ransmi t 5 Unused 2 T ransmit – 6 Receive – 3 Receive 7 Unused 4 Unused 8 Unused
A–2 M aintenance and Ser vi ce Guide Co nnector P in As signments Ta b l e A - 2 RJ-11 Modem Pin Signal P in Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused Ta b l e A - 3 Univer sal Serial Bus Pin Signal P in Signal 1 5 VDC 3 Data 2 Data – 4 Ground
Co nnector P in Assi gnments Maintenance and S erv ice Gui de A–3 Ta b l e A - 4 S-Video Pin Signal P in Signal 1 Ground (Y) 3 Y -Lu minance (Intensity) 2 Ground (C) 4 C-Chromina nce (Color) Ta b l e A - 5 External Monitor Pin Signal P in Signal 1 Red analog 9 5 VDC 2 Green a nalog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor izontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B clock 8 Ground ana log
A–4 M aintenance and Ser vi ce Guide Co nnector P in As signments Ta b l e A - 6 A udio Line-Out Pin Signal P in Signal 1 Audio out 2 Ground Ta b l e A - 7 Micr ophone Pin Signal P in Signal 1 Audio in 2 Groun d
Co nnector P in Assi gnments Maintenance and S erv ice Gui de A–5 Ta b l e A - 8 Pa r a l l e l Pin Signal P in Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize paper 4 Data bit 2 17 Se lect in 5 Data bit 3 18 Ground 6 Data bit 4 19 Ground 7 Data bit 5 20 Ground 8 Data bit 6 21 5VS 9 Data bit 7 22 PTF 10 Ac knowledge 23 EXTFDD_VCC ( 5V) 11 Busy 24 Ground 12 P aper end 25 Groun d 13 Select
A–6 M aintenance and Ser vi ce Guide Co nnector P in As signments Ta b l e A - 9 Serial Pin Signal P in Signal 1 Carr ier detect 6 Data set read y 2 Receive data 7 Ready to send 3 T ransmit data 8 Clear to send 4 Data ter minal ready 9 Ri ng indicator 5 Ground
Maintenance and S erv ice Gui de B–1 B P o w er C ord R equiremen ts 3-Con duc tor P o w er Cord The wide range in put feature of the notebook permi ts it to operate from any line voltage from 100 to 120 or 2 20 to 240 v olts A C. The po wer cord included w ith the notebook meets the requirements for use in the co untry where the equipme nt is purchased. Po wer cords for use in other countries must meet the requirements of the country wh ere the notebook is used. For more information on po wer cord requirements, contact an HP authorized reseller or service provider . Gen eral Requirem ents The requirements listed belo w ar e applicable to all countries: ■ The length of the po we r cord must be at least 1.5 meters (5.00 feet) and a maximum of 2.0 meters (6.50 feet). ■ All po wer cords must be appro ved b y an ac ceptable accredited agency responsible for ev a luation in the country where the po wer cord will be used. ■ The po wer cord must h a v e a minimum current c apacity of 10 amps and a nominal voltage rati ng of 125 or 250 v olts A C, as required b y each country’ s po wer system. ■ The appliance coupler must meet the mechanical conf iguration of an EN 60 320/IEC 3 20 Standard Sheet C1 3 connector for mating with the ap pliance inlet on the back of the notebook.
B–2 Maintenance a nd Service Guide P o w er Cor d R equirements Co untr y- Spec ific R equ iremen ts 3-Conductor P ower Cor d Requirements Country Accredited Agency Applicable Note Number A ustralia EANSW 1 A ustria O VE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 Fr a n c e U T E 1 Ger many V DE 1 Italy IMQ 1 Japan METI 3 The Nether lands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1
P ow er Cor d R equirements Maintenance and S erv ice Gui de B–3 United Kingdom BSI 1 United States UL 2 Notes 1. The flexible cord m ust be <HAR> T y pe HO5VV -F , 3-conductor , 1.0 mm 2 conductor size. P ow er cord fittings (app liance coupler and wall plug) must bear the cer tification mar k of the agency responsible f or e valuation in the countr y where it will be used . 2. The flexib le cord must be T ype SPT -3 or equivalent, No . 18 A WG, 3-conductor . The w all plug must be a two-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appl iance coupler , fle xible cord, and w all plug must bear a “T” mark and registration number in a ccordance with the Japanese Dentor i Law . The fle xible cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm 2 conductor size. The wall plug must be a two-pole grounding type with a Japanese Industrial Standard C8303 (7 A, 125 V) configuration. 3-Conductor P ower Cor d Requirements Country Accredited Agency Applicable Note Number
Maintenance and S erv ice Gui de C–1 C Sc r e w List ing This appendix provides specif i cation and reference information for the scre ws used in the notebo ok. All scre ws listed in this appendix are a v ailable in the Mis cellaneous Screw Kit, spare part number 344412-00 1.
C–2 Maintenance and Ser v ice Guide Scre w List ing Ta b l e C - 1 T orx T5M3.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 2 4.0 mm 3.0 mm 5.0 mm Where used: 1 T wo scre ws that secure the hard dr iv e frame to the hard dr iv e (documented in Section 5.3) mm Ta b l e C - 2 Phillips PM3.0×3.5 Scre w Color Qty . Length Thread Head Width Silv er 2 3.5 mm 3.0 mm 5.0 mm Where used: 2 T wo scre ws that secure the hard dr iv e frame to the hard dr iv e (documented in Section 5.3) mm Ta b l e C - 3 Hex M2.0×1 0.0 Alignment Pin Color Qty . Length Thread Head Width Silv er 2 10.0 mm 2.0 mm 4.0 mm Where used: 3 T wo alig nment pins that secure the h ard driv e frame an d connector to the hard drive (documented in Section 5.3) mm
S crew Lis t i n g Maintenance and S erv ice Gui de C–3 T orx T5M3 . 0×4. 0 Sc r ew , Phillips P M3 . 0×3 . 5 Sc re w , and Hex M2 . 0×10. 0 Ali gnment P in Locati ons
C–4 Maintenance and Ser v ice Guide Scre w List ing Phillip s P M3 . 0×4. 0 Sc r e w Locati on Ta b l e C - 4 Phillips PM3.0×4.0 Scre w Color Qty . Length Thread Head Width Black 1 4.0 mm 3.0 mm 4.0 mm Where used: One screw that secures the hard drive to the notebook (documented in Section 5.3) mm
S crew Lis t i n g Maintenance and S erv ice Gui de C–5 To r x T 8 M 2. 5 × 5 . 0 S c r e w L o c a t i o n Ta b l e C - 5 T orx T8M2.5×5.0 Screw Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: One screw that secures the hard drive co v er to the notebook (documented in Section 5.3) mm
C–6 Maintenance and Ser v ice Guide Scre w List ing To r x T 8 M 2. 5 × 5 . 0 S c r e w L o c a t i o n Ta b l e C - 5 T o rx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: One screw that secures the f an assembly to the notebook (documented in Section 5.13) mm
S crew Lis t i n g Maintenance and S erv ice Gui de C–7 To r x T 8 M 2. 5 × 5 . 0 S c r e w L o c a t i o n s Ta b l e C - 5 T o rx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: F our scre ws that secure the heat sink to the notebook (documented in Section 5.14) mm
C–8 Maintenance and Ser v ice Guide Scre w List ing To r x T 8 M 2. 5 × 5 . 0 S c r e w L o c a t i o n s Ta b l e C - 5 T o rx T8M2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 13 5.0 mm 2.5 mm 4.0 mm Where used: 1 T wo scre ws that secure the bottom board to the notebook (documented in Section 5.20) 2 Fiv e screws that secure the system board to the notebook (documented in Section 5.21) mm
S crew Lis t i n g Maintenance and S erv ice Gui de C–9 Phillips M2 . 5×3 . 5 Scr e w Locati on Ta b l e C - 6 Phillips PM2.5×3.5 Scre w Color Qty . Length Thread Head Width Black 3 3.5 mm 2.5 mm 4.0 mm Where used: One screw that secures the Mini PCI compar tment cov er to the notebook (documented in Section 5.5) mm
C–10 Maintenance an d Servi ce Guide Scre w List ing Phillips P M2 . 5×3 .5 Sc re w Locati ons Ta b l e C - 6 Phillips PM2.5×3.5 Screw (Continued) Color Qty . Length Thread Head Width Black 3 3.5 mm 2.5 mm 4.0 mm Where used: T wo screws that secure the modem board to the notebook (documented in Section 5.9) mm
S crew Lis t i n g Mainte nance and Serv ice Gui de C–11 Phillips P M2 . 0×5 .0 Sc re w Locations Ta b l e C - 7 Phillips PM2.0×5.0 Scre w Color Qty . Length Thread Head Width Black 1 5.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the Bluetooth co ver to the notebook (documented in Section 5.7) mm
C–12 Maintenance an d Servi ce Guide Scre w List ing Phillips P M1.5×3 . 0 Scr e w L ocations Ta b l e C - 8 Phillips PM1.5×3.0 Scre w Color Qty . Length Thread Head Width Black 5 3.0 mm 1.5 mm 3.5 mm Where used: T wo screws that secure the Bluetooth board to the Bluetooth cov er (documented in Section 5.7) mm
S crew Lis t i n g Mainte nance and Serv ice Gui de C–13 Phillips P M1.5×3 . 0 Scr e w L ocations Ta b l e C - 8 Phillips PM1.5×3.0 Screw (Continued) Color Qty . Length Thread Head Width Black 5 3.0 mm 1.5 mm 3.5 mm Where used: Three screws that secure the f an to the f an housing (documented in Section 5.13) mm
C–14 Maintenance an d Servi ce Guide Scre w List ing T orx T8M2 . 5×11. 0 Scr e w L ocati ons Ta b l e C - 9 T orx T8M2.5×11.0 Screw Color Qty . Length Thread Head Width Silv er 2 11.0 mm 2.5 mm 5.0 mm Where used: T wo screws that secure the k eyboard to the notebook (documented in Section 5.8) mm
S crew Lis t i n g Mainte nance and Serv ice Gui de C–15 T o r x T 8 M 2.5× 9 .0 S crew Lo c a t i on s T able C-10 T orx T8M2.5×9.0 Screw Color Qty . Length Thread Head Width Black 15 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo scre ws that secure the s witch cov er to the notebook (documented in Section 5.11) 2 F our scre ws that sec ure the di spla y assembly to the notebook (documented in Section 5.16) mm
C–16 Maintenance an d Servi ce Guide Scre w List ing T o r x T 8 M 2.5× 9 .0 S crew Lo c a t i on s T able C-10 T o rx T8M2.5×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 15 9.0 mm 2.5 mm 5.0 mm Where used: Nine scre ws that secure th e top co ver to the notebook (documented in Section 5.17) mm
S crew Lis t i n g Mainte nance and Serv ice Gui de C–17 T orx T8M2 .5×7 . 0 Sc r e w L ocatio ns T able C-11 T orx T8M2.5×7.0 Screw Color Qty . Length Thread Head Width Black 1 7.0 mm 2.5 mm 5.0 mm Where used: One screw that secures the f an assembly to the notebook (documented in Section 5.13) mm
C–18 Maintenance an d Servi ce Guide Scre w List ing Phillips M2 .0×3 .5 S cr ew L ocations T able C-12 Phillips M2.0×3.5 Scre w Color Qty . Length Thread Head Width Black 5 3.5 mm 2.5 mm 4.0 mm Where used: Five scre ws that secure the top co ver to the notebook (th ree in the MultiBa y , two in the hard d rive ba y; documented in Secti on 5.17) mm
S crew Lis t i n g Mainte nance and Serv ice Gui de C–19 T o r x T 8 M 2 .5 × 5.5 S crew Lo c a t io n s T able C-13 T orx T8M2.5×5.5 Screw Color Qty . Length Thread Head Width Black 2 5.5 mm 2.5 mm 5.0 mm Where used: T wo screws that secure the top co ver to the notebook (documented in Section 5.17) mm
C–20 Maintenance an d Servi ce Guide Scre w List ing He x M2 . 5×9 . 0 S tandoff L ocations T able C-14 Hex M2.5×9.0 Standoffs Color Qty . Length Thread Head Width Silv er 2 9.0 mm 2.5 mm Where used: T wo standoffs that secure t he system board to the notebook (documented in Section 5.21) mm
Maintenance and S erv ice Gui de Inde x–1 Ind e x A AC adapter spare part number 3–10 specifications 6–6 AC power connector, location 1–16 applications key, l ocation 1–18 audio line-out jack location 1–14 pin assignments A–4 audio troubleshooting 2–25 B base enclosure illustrated 3–6 spare part number 3–7 battery bay, location 1–23 battery b ezel illustrated 3–2, 3–8 removal 5–6 battery light, location 1–22 battery p ack illustrated 3–6 removal 5–4 spare part numbers 3–7 specifications 6–6, 6–7, 6–8 See also MultiBay battery pack, spare part number battery release latch, location 1–23 battery slot, location 1–15 Bluetooth compartment, location 1–16 Bluetooth cover illustrated 3–2, 3–8 removal 5–15 Bluetooth wireless communications board illustrated 3–6 removal 5–15 spare part number 3–7, 5–15 bottom board illustrated 3–4 removal 5–45 spare part number 3–5, 5–45
Inde x–2 Mainten ance and Service Guide Inde x C cables, service considerations 4–2 caps lock key, location 1–18 caps lock light, location 1–19 carrying case, spare part numbers 3–11 CD-ROM drive spare part number 3–7, 3–9 specifications 6–9 components bottom 1–23 front 1–13 keyboard 1–17 left-side 1–13 rear panel 1–15 right-side 1–15 top 1–19 Computer Setup Advanced Menu 2–5 File Menu 2–3 overview 2–1 Security Menu 2–4 connector pin assignmen ts audio line-out jack A–4 external monitor connector A–3 microphone jack A–4 modem jack A–2 monitor connector A–3 network jack A–1 parallel connector A–5 RJ-11 telephone jack A–2 RJ-45 network jack A–1 serial connec tor A–6 S-Video connec tor A–3 Universal Serial Bus connector A–2 connectors, service considerations 4–2 cursor control keys, location 1–18 D design overv iew 1–25 diagnostics configuration information 2–7 test information 2–8 Diagnostics for Windows 2–1 , 2–7 disassembly sequence chart 5–2 diskette drive spare part number 3–7, 3–9 OS loading problems 2–23 display assembly illustrated 3–2 removal 5–34 spare part numbers 3–3, 5–34 specifications 6–3, 6–4 display h inge cover illustrated 3–2, 3–8 removal 5–37 display lid switch, location 1–20 display release latch, location 1–14
Inde x Maintenance and S erv ice Gui de Inde x–3 docking connector, location 1–24 drives, preventing d amage 4–3 DVD RW/R and CD-RW combo drive pecifications 6–10 DVD RW/R and CD-RW combo drive spare part number 3–7, 3–9 DVD/CD-RW combo drive spare part number 3–7, 3–9 specifications 6–9 DVD-ROM drive specifications 6–10 E electrostatic discharge 4–4, 4–7 embedded numeric keypad, location 1–18 external monitor connector location 1–16 pin assignments A–3 F f1 through f12 function keys, location 1–18 fan assembly disassembly 5–28 illustrated 3–4 removal 5–26 spare part number 3–5, 5–26 features 1–10 feet illustrated 3–8 locations 5–10 fn key, location 1–18 front components 1–13 G grounding eq uipment and methods 4–6 H hard drive disassembly 5–9 illustrated 3–4 OS loading problems 2–20 removal 5–7 spare part numbers 3–5, 3–9 , 5–7 specifications 6–5 hard drive bay, location 1–14, 1–24 hard drive cover, removal 5–7 hard drive light, location 1–22 hard drive security screw, location 1–24 heat sink illustrated 3–4 removal 5–29 spare part number 3–5, 5–29 I I/O address specifications 6–13 infrared port, location 1–14 interrupt specifications 6–12
Inde x–4 Mainten ance and Service Guide Inde x K keyboard components 1–17 illustrated 3–2 removal 5–17 spare part numbers 3–3, 5–17 troubleshooting 2–28 keyboard pla te illustrated 3–2, 3–8 removal 5–25 L LED board illustrated 3–6 removal 5–43 spare part number 3–7, 5–43 left-side components 1–13 M mass storage devices, spare part numbe rs 3–9 memory expa nsion board illustrated 3–4 removal 5–21 spare part numbers 3–5, 5–21 memory shield illustrated 3–2, 3–8 removal 5–21 microphone jack location 1–14 pin assignments A–4 Mini PCI communications board illustrated 3–6 removal 5–10 spare part numbers 3–7, 5–10 Mini PCI compartment cover illustrated 3–2, 3–8 removal 5–10 Mini PCI compartment, location 1–24 Miscellaneous Plastics Kit components 3–8 spare part number 3–3, 3–8 model number 3–1 models 1–2 modem board illustrated 3–4 removal 5–20 spare part number 3–5, 5–20 modem jack, pin assign ments A–2 modem, trouble shooting 2–30 monitor connector location 1–16 pin assignments A–3 mouse, spare part numbe r 3–11 MultiBay battery pack spare part number 3–7, 3–9 MultiBay device illustrated 3–6 spare part numbers 3–9 MultiBay light, location 1–22
Inde x Maintenance and S erv ice Gui de Inde x–5 MultiBay release latch, location 1–24 MultiBay, location 1–14 , 1–24 mute button, location 1–14 N network jack, pin assignments A–1 network, trouble shooting 2–30 nonfunction ing device, troubleshooting 2–18, 2–27 notebook feet illustrated 3–8 locations 5–10 notebook specifications 6–1 num lock key, location 1–18 num lock light, location 1–19 numeric keypad, location 1–18 O operating system loading, troubleshooting 2–19 optical drive spare part numbers 3–7 P packing precautions 4–4 parallel connector location 1–16 pin assignments A–5 password, clearing 1–12 PC Card eject buttons, location 1–15 PC Card slot space saver, illustrated 3–8 PC Card slots, location 1–15 plastic parts 4–2 pointing device, troubleshooting 2–29 pointing stick buttons, location 1–22 pointing stick, location 1–22 Port Replicator spare part numbers 3–11 troubleshooting 2–18 power button, location 1–20 power cord, spare part numbers 3–10 power manage ment features 1–12 power, troubleshootin g 2–12 power/Standby light, location 1–22 Presentation Mode button, location 1–22 processor illustrated 3–4 removal 5–32 spare part numbers 5–32 Q QuickLock button, location 1–20 R real time clock battery illustrated 3–2, 3–8 removal 5–41 rear panel components 1–15 removal preliminaries 4–1 procedures 5–1
Inde x–6 Mainten ance and Service Guide Inde x replacement preliminaries 4–1 procedures 5–1 right-side compo nents 1–15 RJ-11 telephone jack location 1–15 pin assignments A–2 RJ-45 network jack location 1–16 pin assignments A–1 RTC battery illustrated 3–2, 3–8 removal 5–41 S Screw Kit, spare part number 3–11 scroll lock light, location 1–19 Secure Digital (SD) Card slot, location 1–15 security cable slot, location 1–16 security card, spare part number 3–11 serial co nnector location 1–16 pin assignments A–6 serial nu mber 3–1, 5–2 service considerations 4–2 specifications AC adapter 6–6 battery p ack 6–6, 6–7, 6–8 CD-ROM drive 6–9 display 6–3, 6–4 DMA 6–11 DVD RW/R and CD-RW combo drive 6–10 DVD/CD-RW combo drive 6–9 DVD-ROM drive 6–10 hard drive 6–5 I/O addresses 6–13 interrupts 6–12 notebook 6–1 static shielding materials 4–7 stereo speakers, location 1–14 S-Video connec tor location 1–16 pin assignments A–3 switch cover illustrated 3–2 removal 5–23 spare part number 3–3, 5–23 system board illustrated 3–6 removal 5–47 spare part numbers 3–7, 5–47 T thermal grease, replaceme nt 5–31 tools required 4–1 top components 1–19, 1–21 top cover illustrated 3–4 removal 5–38 spare part number 3–5, 5–38
Inde x Maintenance and S erv ice Gui de Inde x–7 TouchPad bu tto ns, location 1–22 TouchPad, location 1–22 transporting precautions 4–4 troubleshooting audio 2–25 Computer Setup 2–2 Diagnostics for Windows 2–7 flowchart s 2–10 keyboard 2–28 modem 2–30 network 2–30 nonfunctioni ng device 2–18 , 2–27 operating system loading 2–19 overview 2–1 pointing device 2–29 Port Replicator 2–18 power 2–12 video 2–16 U Universal Serial Bus connector location 1–16 pin assignments A–2 Universal Serial Bus mouse, spare part number 3–11 V vent, location 1–16, 1–24 video troub leshooting 2–16 volume control butto ns, location 1–14 W Windows logo ke y, location 1–18 wireless LAN card illustrated 3–6 removal 5–10 spare part numbers 3–7, 5–10 Wireless On/Off button, location 1–20 wireless on/off light, location 1–22 workstation precaution s 4–5