HP Compaq nc8000 Maintenance And Service Manual

Main tenan ce and Ser vice Gu id e HP C ompaq nc8 000 Busine ss Notebook HP C ompaq n w8000 Mob ile W or kstati on D o cu m e nt P a r t N u m b e r: 33 3 9 54 - 0 05 October 2006 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying notebook features, components, and spare parts; troubleshooting notebook problems; and performing notebook disassembly procedures.
© Copyright 2003, 2004, 2006 He wlett-P ackard Dev elopment Company , L.P . Microsoft and W indows are U.S. re gistered trademarks of Microsoft Corporation. Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. SD Logo is a trademark of its proprietor . Bluetooth is a trademark o wned by its proprietor and used b y Hewlett-P ackard Company under license. The information contained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompan ying such products and services. Nothing herein should be construed as constituting an additional warranty . HP shall not be liable for technical or editorial errors or omissions contained herein. Maintenance and S ervi ce Guide HP Compaq nc8 000 Busines s Notebook HP Compaq n w8000 Mobile W orks tati on F ifth Editi on: October 2006 F irst E dition: September 200 3 Doc ument P art Number: 3 3 3 9 54 -00 5
Maintenance and Serv ice Gui de iii Cont ents 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–13 1.3 Clearing a Password . . . . . . . . . . . . . . . . . . . . . . . . 1–16 1.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . 1–17 1.5 External Components . . . . . . . . . . . . . . . . . . . . . . . 1–18 1.6 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–31 2T r o u b l e s h o o t i n g 2.1 Computer Setup and Diagnostics Utilities . . . . . . . . 2–2 2.2 Using Diagnostics for Windows . . . . . . . . . . . . . . . . 2–7 2.3 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . 2–10
i v Maintenance and Serv ice Guide Con ten ts 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit Components . . . . . . . . . . 3–9 3.4 Miscellaneous Cable Kit Components . . . . . . . . . . 3–10 3.5 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . . 3–11 3.6 Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13 3.7 Sequential Part Number Listing . . . . . . . . . . . . . . . 3–14 4 Removal and Replacement Preliminaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.3 Preventing Damage to Removable Drives . . . . . . . . 4–3 4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4 4.5 Packaging and Transporting Precautions . . . . . . . . . 4–5 4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 4–6 4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–7
Cont ent s Maintenance and Serv ice Gui de v 5 Removal and Replacement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Notebook for Di sassembly . . . . . . . . . 5–5 5.4 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11 5.5 MultiBay Device . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12 5.6 Bluetooth Board . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–13 5.7 Integrated Smart Card . . . . . . . . . . . . . . . . . . . . . . . 5–15 5.8 Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17 5.9 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–18 5.10 Memory Expansion Board . . . . . . . . . . . . . . . . . . 5–22 5.11 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–23 5.12 Mini PCI Communications Boar d . . . . . . . . . . . . . 5–24 5.13 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27 5.14 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29 5.15 LED Switch Cover . . . . . . . . . . . . . . . . . . . . . . . . 5–31 5.16 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–33 5.17 Security Module (TPM) . . . . . . . . . . . . . . . . . . . . 5–34 5.18 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–35 5.19 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–38 5.20 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–41 5.21 TouchPad. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–42 5.22 Fan Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–44 5.23 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–46
v i Maintenance and Serv ice Guide Con ten ts 6 Specifications A Connector Pin Assignments B Power Cord Requirements CS c r e w L i s t i n g Index
Maintenance and Serv ice Gui de 1–1 1 Pr oduct Descript ion The HP Compaq nc8000 Business Notebook and HP Compaq nw8000 Mobile W orkstation offer adv anced modularity , an Intel® Pentium® M processor with 64-bit architecture, an A TI MOBILITY RADEON 9600 Pro graphics controller with 128 or 64 MB of discrete video memory , and extensi ve multimedia support. HP Compaq nc8 000 Busines s Notebook and HP Compaq n w8000 Mobile W orks tati on
1–2 Maintenance and Serv ice Gui de Pr oduct Desc ri ption 1 . 1 Models Notebook model information is sho wn in T ables 1-1 through 1-3. Conf iguration code L Y2Z applies to all models of the HP Compaq nc8000 Business Notebook. Conf iguration code MDBZ applies to all models of the HP Compaq nw8000 Mobile W orkstation. Ta b l e 1 - 1 HP Compaq nc8000 Business Notebook and HP Compaq nw8000 Mobile W orkstation Model Naming Con ventions Key Cnc P 170 U5 80 Y Gg 10 P XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 1 Brand/Series designator C = HP Compaq nc = nc8000 nw = nw8000 2 Processor type P = Intel P entium M 3 Processor speed 170 = 1.70 GHz 160 = 1.60 GHz 150 = 1.50 GHz 140 = 1.40 GHz 4D i s p l a y t y p e / size/resolution U = UXGA S = SXGA X = XGA 5 = 15.X-inch 5 Hard drive size 80 = 80 GB 60 = 60 GB 40 = 40 GB 6 Optical drive designator D = D VD-ROM Y = D VD RW/R and CD-R W Combo Drive W = D VD/CD-RW Combo Drive
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–3 Key Cnc P 170 U5 80 Y Gg 10 P XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 7 Integrated communication/ wireless de vice G = Combination modem GB NIC N = None b = 802.11b d = 802.11a/b/g g = 802.11a/b Bluetooth® i = 802.11b Bluetooth j = 802.11g Bluetooth k = 802.11a/b Bluetooth m = 802.11a/b/g Bluetooth p = Bluetooth 8 RAM 10 = 1.0-GB 25 = 256-MB 51 = 512-MB 9 Operating system P = Microsoft® Windows® XP Prof essional 2 = Microsoft Windows 2000 10 SKU# Ta b l e 1 - 1 HP Compaq nc8000 Business Notebook and HP Compaq nw8000 Mobile W orkstation Model Naming Con ventions (Continued)
1–4 Maintenance and Serv ice Gui de Pr oduct Desc ri ption Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models These HP Compaq nc8000 Business Not ebook models f eature the f ollowing: ■ Dual point (pointing stick an d T ouchP ad) pointing device ■ 128-MB discrete video memor y ■ 8-cell, lithium ion (Li-Ion) batter y pack ■ 3-year w arranty on par ts and labor Cnc8000 P 170 U5 60 Y Gm 51 P Asia P acific Belgium Denmark Fr a n c e Ger many Greece Italy DQ617A UUF DQ617A UUG DQ617A ABY DQ617A ABF DQ617A ABD DQ617A AB7 DQ617A ABZ Jap a n The Netherlands Norwa y P or tugal Sweden/Finland United Kingdom United States DQ617A ABJ DQ617A ABH DQ617A ABN DQ617A AB9 DQ617A AK8 DQ617A AB U DQ617A ABA Cnc8000 P 160 S5 40 D Gm 51 P Ger many Italy Jap a n DQ618A ABD DQ618A ABZ DQ618A ABJ United Kingdom United States DQ618A AB U DQ618A ABA
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–5 These HP Compaq Business Notebook nc 8000 models f eature the f ollowing: ■ Dual point (pointing stick an d T ouchP ad) pointing device ■ 64-MB discrete video memor y ■ 8-cell, Li-Ion batter y pack ■ 3-year w arranty on par ts and labor Cnc8000 P 170 X5 60 W Gm 51 P F rench Canada DH918U ABC United States DH918U ABA Cnc8000 P 160 S5 40 W Gj 51 2 Belgium Denmark Europe Fr a n c e Ger many Greece Iceland Italy DJ242A UUG DJ242A AB Y DJ242A ABB DJ242A ABF DJ242A ABD DJ242A AB7 DJ242A A2M DJ242A ABZ The Netherlands Norwa y P or tugal Spain Sweden/Finland Switzerland United Kingdom DJ242A ABH DJ242A ABN DJ242A AB9 DJ242A ABE DJ242A AK8 DJ242A UUZ DJ242A ABU Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models (Continued)
1–6 Maintenance and Serv ice Gui de Pr oduct Desc ri ption Cnc8000 P 160 S5 40 D Gn 51 P Asia P acific A ustralia Belgium Brazil Czech Repub l ic Denmark Europe Fr a n c e F rench Canada Ger many Greece Hong K ong Hungar y Iceland India Israel Italy Jap a n Ja pan English Ko r e a DN889A UUF DN889A ABG DN889A UUG DN889A AC4 DN889A AKB DN889A ABY DN889A ABB DN889A ABF DN889A ABC DN889A ABD DN889A AB7 DN889A AB5 DN889A AKC DN889A A2M DN889A ACJ DN889A ABT DN889A ABZ DN889A ABJ DN889A ACF DN889A AB1 Latin America The Netherlands Norwa y Pe o p l e ’s Republic of China Po l a n d P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States DN889A ABM DN889A ABH DN889A ABN DN889A AB2 DN889A AKD DN889A AB9 DN889A ACB DN889A ABV DN889A AKN DN889A ABE DN889A AK8 DN889A UUZ DN889A AB0 DN889A AKL DN889A AB8 DN889A ABU DN889A ABA Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models (Continued)
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–7 Cnc8000 P 160 S5 40 D Gn 51 2 Asia P acific A ustralia Belgium Brazil Czech Repub l ic Denmark Europe Fr a n c e F rench Canada Ger many Greece Hong K ong Hungar y Iceland India Israel Italy Jap a n Ja pan English Ko r e a DN890A UUF DN890A ABG DN890A UUG DN890A AC4 DN890A AKB DN890A ABY DN890A ABB DN890A ABF DN890A ABC DN890A ABD DN890A AB7 DN890A AB5 DN890A AKC DN890A A2M DN890A ACJ DN890A ABT DN890A ABZ DN890A ABJ DN890A ACF DN890A AB1 Latin America The Netherlands Norwa y Pe o p l e ’s Republic of China Po l a n d P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States DN890A ABM DN890A ABH DN890A ABN DN890A AB2 DN890A AKD DN890A AB9 DN890A ACB DN890A ABV DN890A AKN DN890A ABE DN890A AK8 DN890A UUZ DN890A AB0 DN890A AKL DN890A AB8 DN890A ABU DN890A ABA Cnc8000 P 160 S5 40 W Gj 51 P Belgium Denmark Europe Fr a n c e Ger many Greece Iceland Italy DJ241A UUG DJ241A AB Y DJ241A ABB DJ241A ABF DJ241A ABD DJ241A AB7 DJ241A A2M DJ241A ABZ The Netherlands Norwa y P or tugal Spain Sweden/Finland Switzerland United Kingdom DJ241A ABH DJ241A ABN DJ241A AB9 DJ241A ABE DJ241A AK8 DJ241A UUZ DJ241A ABU Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models (Continued)
1–8 Maintenance and Serv ice Gui de Pr oduct Desc ri ption Cnc8000 RP 150 U5 60 W Gj 51 P Europe DU250S#ABB Cnc8000 RP 150 X5 40 D Gi 25 P P eople’ s Republic of China DT818P#AB2 Cnc8000 RP 150 X5 40 D Gp 25 2 Belgium Czech Repub l ic Denmark Europe Fr a n c e Ger many Greece Hungar y Iceland Israel Italy The Netherlands DJ244A#UUG DJ244A#AKB DJ244A#ABY DJ244A#ABB DJ244A#ABF DJ244A#ABD DJ244A#AB7 DJ244A#AKC DJ244A#A2M DJ244A#ABT DJ244A#ABZ DJ244A#ABH Norwa y Po l a n d P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Tu r k e y United Kingdom DJ244A#ABN DJ244A#AKD DJ244A#AB9 DJ244A#A CB DJ244A#ABV DJ244A#AKN DJ244A#ABE DJ244A#AK8 DJ244A#UUZ DJ244A#AB8 DJ244A#ABU Cnc8000 RP 150 X5 40 D Gp 25 P Belgium Czech Repub l ic Denmark Europe Fr a n c e Ger many Greece Hungar y Iceland Israel Italy The Netherlands DJ243A#UUG DJ243A#AKB DJ243A#ABY DJ243A#ABB DJ243A#ABF DJ243A#ABD DJ243A#AB7 DJ243A#AKC DJ243A#A2M DJ243A#ABT DJ243A#ABZ DJ243A#ABH Norwa y Po l a n d P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Tu r k e y United Kingdom DJ243A#ABN DJ243A#AKD DJ243A#AB9 DJ243A#A CB DJ243A#ABV DJ243A#AKN DJ243A#ABE DJ243A#AK8 DJ243A#UUZ DJ243A#AB8 DJ243A#ABU Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models (Continued)
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–9 Cnc8000 RP 150 X5 40 W Gi 25 P P eople’ s Republic of China DT819P#AB2 Cnc8000 RP 150 X5 60 W Gb 25 P T aiwan DT815P#AB0 Cnc8000 RP 150 Y5 40 D Gb 25 P P eople’ s Republic of China DS814P#AB2 Cnc8000 RP 150 Y5 40 W Gi 51 P P eople’ s Republic of China DT817P#AB2 Cnc8000 RP 150 Y5 60 W Gi 51 P United States DH936U#ABA F rench Canada DH936U#ABC Cnc8000 RP 150 Y5 60 W GN 51 H Europe DU256S#ABB Cnc8000 RP 150 Y5 60 W Gb 51 P K orea DT807P#AB1 Cnc8000 P 140 X5 40 D Gi 25 P Asia P acific Belgium Denmark Fr a n c e Ger many Greece Italy Jap a n DQ616A UUF DQ616A UUG DQ616A ABY DQ616A ABF DQ616A ABD DQ616A AB7 DQ616A ABZ DQ616A ABJ The Netherlands Norwa y P or tugal Spain Sweden/Finland Switzerland United Kingdom United States DQ616A ABH DQ616A ABN DQ616A AB9 DQ616A ABE DQ616A AK8 DQ616A UUZ DQ616A AB U DQ616A ABA Cnc8000 P 140 X5 40 D Gn 25 P F rench Canada DH917U ABC United States DH917U ABA Ta b l e 1 - 2 HP Compaq nc8000 Business Notebook Models (Continued)
1–10 Maintenance and Serv ice Gui de Pr oduct Desc ri ption Ta b l e 1 - 3 HP Compaq nw8000 Mobile W orkstation Models These HP Compaq nw8000 Mobile W orkst ation models f eature the f ollowing: ■ Dual point (pointing stick an d T ouchP ad) pointing device ■ 128-MB discrete video memor y ■ TPM security card ■ 8-cell, Li-Ion batter y pack ■ 3-year w arranty on par ts and labor Cnw8000 P 170 U5 60 Y Gd 10 P Asia P acific A ustralia Hong K ong Jap a n Ko r e a DU536P UUF DU536P ABG DU536P AB5 DU536P ABJ DU536P AB1 Pe o p l e ’s Republic of China Ta i w a n DU536P AB2 DU536P AB0 Cnw8000 P 170 U5 60 W Gk 10 P United States DQ857A ABA Cnw8000 P 160 X5 60 W Gp 51 P A ustralia DS864P ABG Cnw8000 P 160 X5 60 W Gp 51 2 A ustralia DS865P ABG
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–11 These HP Compaq nw8000 Mobile W orkst ation models f eature the f ollowing: ■ Dual point (pointing stick an d T ouchP ad) pointing device ■ 128-MB discrete video memor y ■ 8-cell, Li-Ion batter y pack ■ 3-year w arranty on par ts and labor Cnw8000 P 170 U5 60 Y Gd 10 P A ustralia Hong K ong Jap a n Ko r e a DU535P ABG DU535P AB5 DU535P ABJ DU535P AB1 Pe o p l e ’s Republic of China Ta i w a n DU535P AB2 DU535P AB0 Cnw8000 P 170 U5 60 Y Gn 51 P Asia P acific A ustralia Belgium Europe Fr a n c e F rench Canada Ger many Italy Jap a n Ko r e a Hong K ong DN912A UUF DN912A ABG DN912A UUG DN912A ABB DN912A ABF DN912A ABC DN912A ABD DN912A ABZ DN912A ABJ DN912A AB1 DN912A AB5 Latin America Pe o p l e ’s Republic of China Spain Sweden/Finland Switzerland Ta i w a n United Kingdom United States DN912A ABM DN912A AB2 DN912A ABE DN912A AK8 DN912A UUZ DN912A AB0 DN912A ABU DN912A ABA Cnw8000 P 170 U5 60 Y Gn 51 2 Asia P acific A ustralia Belgium Europe Fr a n c e F rench Canada Ger many Italy Jap a n Ko r e a Hong K ong DN913A UUF DN913A ABG DN913A UUG DN913A ABB DN913A ABF DN913A ABC DN913A ABD DN913A ABZ DN913A ABJ DN913A AB1 DN913A AB5 Latin America Pe o p l e ’s Republic of China Spain Sweden/Finland Switzerland Ta i w a n United Kingdom United States DN913A ABM DN913A AB2 DN913A ABE DN913A AK8 DN913A UUZ DN913A AB0 DN913A ABU DN913A ABA Ta b l e 1 - 3 HP Compaq nw8000 Mobile W orkstation Models (Continued)
1–12 Maintenance and Serv ice Gui de Pr oduct Desc ri ption Cnw8000 P 170 U5 60 W Gm 51 P Asia P acific DU534P UUF Cnw8000 P 170 U5 60 W Gd 10 P Asia P acific DU535P UUF Japan DU529P ABJ Cnw8000 P 170 U5 60 W Gd 10 2 Japan DU530P ABJ Cnw8000 P 170 U5 60 W Gd 51 P Japan DU531P ABJ Cnw8000 P 170 S5 60 W Gk 51 P Europe Fr a n c e Ger many Italy DQ556A ABB DQ556A ABF DQ556A ABD DQ556A ABZ Jap a n United Kingdom United States DQ556A ABJ DQ556A AB U DQ556A ABA Cnw8000 P 170 X5 60 W Gm 51 P Asia P acific DU532P UUF Cnw8000 P 160 X5 60 W Gi 51 P P eople’ s Republic of China DT821P AB2 Cnw8000 P 150 X5 60 W Gm 51 P Asia P acific DU533P UUF Cnw8000 P 150 X5 60 W Gi 51 P P eople’ s Republic of China DT820P AB2 Cnw8000 P 170 U5 60 W Gm 10 P F rench Canada DH919U ABC United States DH919U ABA Ta b l e 1 - 3 HP Compaq nw8000 Mobile W orkstation Models (Continued)
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–13 1. 2 F e a t u r e s ■ Intel Pentium M 1.7-, 1.6-, 1.5-, and 1.4-GHz processors, all with 1024-KB L2 cache and 400-MHz processor side bus, v arying b y notebook model ■ 15.1-inch UXGA (1600×1200), SXGA (1400×1050), or XGA (1024×768) TFT display with ov er 16.7 million colors, v arying b y notebook model ■ A TI MOBILITY RADEON 9600 Pro graphics controller with 128 or 64 MB of video memory , v arying by notebook model ■ 80-, 60-, or 40-GB high-capacity hard dri v e, v arying by notebook model ■ 256-MB DDR Synchronous DRAM (SDRAM) at 333 MHz, expandable to 2.0 GB ■ Microsoft® W indo ws® 2000 or W indows XP Professional, v arying b y notebook model ■ Full-size W indo ws 98 ke yboard with integrated numeric keyp a d ■ Dual point (T ouchPad and pointing stick) pointing de vice, with T ouchPad on/of f button and light Cnw8000 P 170 U5 60 W Gg 51 P Belgium Europe Fr a n c e Ger many Italy DJ294A UUG DJ294A ABB DJ294A ABF DJ294A ABD DJ294A ABZ Spain Sweden Switzerland United Kingdom DJ294A ABE DJ294A AK8 DJ294A UUZ DJ294A ABU Cnw8000 P 160 S5 40 W Gn 51 P F rench Canada DH920U ABC United States DH920U ABA Ta b l e 1 - 3 HP Compaq nw8000 Mobile W orkstation Models (Continued)
1–14 Maintenance and Serv ice Gui de Pr oduct Desc ri ption ■ Integrated Secure Digital (SD) Memory Card flash media slot ■ Integrated 10/100/1000 B A SE-T Ethernet local area network (LAN) NIC with RJ-45 connector ■ Integrated wireless support for Bluetooth® LAN and Mini PCI 802.11a/b/g LAN de vices ■ Support for f ixed optical dri ve and MultiBay de vice ■ Support for two T ype II/T ype III PC Card slots (one integrated) with support for both 32-bit (CardBus) and 16-bit PC Cards ■ External 65-W A C adapter with po wer cord ■ 8-cell Li-Ion battery pack ■ HP PremierSound audio ■ Support for the follo wing optical dri v es: ❏ 24X Max D VD/CD-R W Combo Dri v e ❏ 24X Max D VD R W/R and CD-R W Combo Driv e ❏ 8X Max D VD-R OM Driv e ❏ 24X Max CD-R OM Dri ve
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–15 ■ Connectors: ❏ SD Card ❏ Infrared ❏ T wo T ype II PC Card slots ❏ RJ-11 (modem) ❏ RJ-45 (NIC) ❏ T wo Uni versal Serial Bus (USB) 2.0 ❏ S-V ideo ❏ Parallel ❏ Serial ❏ External monitor ❏ DC po wer ❏ Docking ❏ IEEE 1394 digital ❏ Microphone ❏ Stereo speaker/headphone
1–16 Maintenance and Serv ice Gui de Pr oduct Desc ri ption 1. 3 C l e a r i n g a P a s s w o r d If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear the CMOS memory: 1. Prepare the notebook for disassembly (refer to Section “5.3 Preparing the Notebook for Disassembly” for more information). 2. Remov e the real time clock (R TC) battery (refer to Section “5.16 R TC Battery” ). 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C po wer to the notebook. Do not reinsert any battery packs at this time. 6. T urn on the notebook. All passwords and all CMOS settings are cleared.
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–17 1. 4 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e power . The notebook supports the follo wing po wer management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys for setting the le ve l of performance ■ Lid switch standby/resume ■ Po wer/standby b utton ■ Adv anced Conf iguration and Po wer Management (A CPM) compliance
1–18 Maintenance and Serv ice Gui de Pr oduct Desc ri ption 1 .5 External C ompon ents The external components on the front and right side of the notebook are sho wn belo w and described in T able 1-4. F ront and R ight -Side C omponents
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–19 Ta b l e 1 - 4 Fr ont and Right-Side Components Item Component Function 1 Stereo speakers (2) Produce stereo sound. 2 Displa y release latch Opens the notebook. 3 Mute button Mutes the system v olume. The b utton lights up when v olume is muted. 4 V olume control bu tt o n s Increase and decrease system v olume. Press the v olume up bu tton (on right) to increase sound. Press the v olume down button (on left) to decrease sound. 5 PC Card eject b uttons Eject an op tional PC Card or smart card (if a smar t card reader is installed) from the top or bottom PC Card slot. 6 A udio line-out jack Connects optional powered stereo speake rs, headphones , headset, or tele vision audio . 7 Microphone jac k Connects an optional monaural microphone. 8 PC Card slots Suppor t optional T ype I, T ype II, or T ype III 32-bit (CardBus) or 16-bit PC Cards. ✎ In select notebooks, one PC Card slot can be replaced with a factory-installed smart card reader. 9 Secure Digital (SD) slot Accepts SD Memor y Card and MultiMedia Cards. 10 MultiBa y Suppor ts an option al MultiBay de vice, such as a drive or batter y pac k. 11 Infrared por t Provides wireless comm unication between the notebook and an optional IrD A-compliant device . 12 RJ-11 jack Connects a modem cab le.
1–20 Maintenance and Serv ice Gui de Pr oduct Desc ri ption The external components on the rear and left side are sho wn belo w and described in T able 1-5. R ear and Left-Side C omponents
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–21 Ta b l e 1 - 5 Rear and Left-Side Components Item Component Function 1 USB connectors (2) Connect US B 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable . The bottom connector is a self-pow ered USB connector . It can be used to connect USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cable , and connect an optional Exter nal MultiBa y to the notebook us ing the External MultiBa y-pow ered USB cable . 2 1394 connector Connects a de vice that requires high bandwidth, such as a digital camera or other video or audio de vice.
1–2 2 Maintenance and Serv ice Guide Pr oduct Desc ri ption 3 P ower connector Connects an A C adapter or an optional A utomobile P ower Adapter/Charger or Aircraft P ow er Adapter . 4 Serial connector Connects an optional serial device . 5 P arallel connector Connects an optional parallel de vice, such as an e xtern al disk ette drive or a printer . 6 S-Video out jac k Connects an optional S-Video de vice , such as a tele vision, VCR, camcorder , ov erhead projector , or video capture card. 7 Exter nal monitor connector Connects an optional e xter nal monitor or ov erhead projector . 8 RJ-45 jack Connects a network cable . 9 Intak e v ents (2) Enab le airflow to cool internal components. Ä T o prev ent overheating, do not obstruct vents . Using the notebook on a soft surf ace, such as a pillo w , blank et, r ug, or thick clothing, can blo ck a ir f low . 10 Security cable slot Attaches an optional security cable to the notebook. ✎ The purpose of security solutions is to act as a deterrent. These solutions do not prevent the product from being mishandled or stolen. 11 Optical disk drive Reads and records CD and D VD media. 12 Batter y ba y Holds the primar y batter y pack. The battery pac k ships outside the notebook. Ta b l e 1 - 5 Rear and Left-Side Components (Continued) Item Component Function
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–2 3 The notebook ke yboard components are sho wn belo w and described in T able 1-6. Ke y b o a r d C o m p o n e n t s
1–2 4 Maintenance and Serv ice Guide Pr oduct Desc ri ption Ta b l e 1 - 6 Ke yboard Components Item Component Function 1 Windows logo k e y Displa ys the Windows Star t menu. 2 fn ke y Ex ecutes frequently used system functions when pressed in combination with a function ke y or the esc key . 3 caps lock ke y Enables capital alphabetic char acter lock. 4 f1 through f12 function keys Ex ecute indicated system functions when pressed in combination with the fn key . 5 num lock ke y Enables numeric lock and the internal ke ypad. 6 Inter nal k eypad Can be used li k e the k eys on an e xter nal numeric ke ypad. 7 Cursor control k eys Mov e th e cursor around the screen. 8 Application ke y Displa ys shor tcut menu f or items beneath the pointer .
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–2 5 The notebook top components are sho wn belo w and described in T able 1-7. To p C o m p o n e n t s
1–2 6 Maintenance and Serv ice Guide Pr oduct Desc ri ption Ta b l e 1 - 7 T op Components Item Component Function 1 Intak e v ents (2) Enab le airflow to cool internal components. Ä T o prev ent overheating, do not obstruct vents . Using the notebook on a soft surf ace, such as a pillo w , blank et, r ug, or thick clothing, can blo ck a ir f low . 2 P ower b utton When the notebook is: ■ Off , press and release to turn on the notebook. ■ In Standby , press and release to exit Standby . ■ In Hiber nation, press and release to e xit Hiber nation. If the system has stopp ed responding and Windows shutdo wn procedures cannot be used, press and hold f or fiv e seconds to tur n off the notebook. 3 Quick Launch b uttons (3) Enable y ou to access common functions with a single ke ystroke. 4 Num loc k light On: Num lock is on or the embedded numeric ke ypad is enab led. 5 Caps lock light On: Caps lock is on. 6 Scroll lock light On: Scroll lock is on. 7 Displa y lid switch ■ If the notebook is cl osed while on, tur ns off the displa y . ■ If the notebook is opened while in Standby , tur ns on the notebook (resumes from Standby). 8 P ointing stick Mov es the poin ter and selects or activ ates items on the screen. 9 Microphone Allows f or audio input.
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–2 7 T op Components (C ontinued)
1–2 8 Maintenance and Serv ice Guide Pr oduct Desc ri ption Ta b l e 1 - 7 T op Components (Continued) Item Component Function 10 MultiBa y light On: A drive in the MultiBa y is being accessed. 11 Drive light On: One of the f ollowing integ rated drives is being accessed: ■ Hard drive ■ Fix ed optical drive 12 Batter y light On: A batter y pack is charging. Blinking: A batter y pack that is the only av ailable pow er sour ce has reached a low-battery condition. When the batter y reaches a critical low-batter y condition, the batter y light begins blinking more quic kly . 13 P ower/Standb y light On: P ower is turned on. Blinking: Notebook is in standby . ✎ The power/standby light also blinks when a battery pack that is the only available power source reaches a critical low-battery condition. The light turns off when the system enters hibernation or shuts down. 14 Wireless on/off light On: An in tegrated wireless de vice has been enabled. 15 Left and right T ouchP ad b uttons Function like the left and right b uttons on an e xter nal mouse. 16 T ouchP ad Mov es the pointer and selects or activa tes items on the screen. Can be set to perf or m other mouse functions, such as scrolling and double-clic king. 17 Left and right pointing stick b uttons Function like the left and right b uttons on an e xter nal mouse.
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–2 9 The external components on the bottom of the notebook are sho wn belo w and described in T able 1-8. Bottom Components
1–30 Maintenance and Serv ice Guide Pr oduct Desc ri ption Ta b l e 1 - 8 Bottom Components Item Component Function 1 MultiBa y Suppor ts an optional MultiBay de vice, such as a driv e or batter y pack. 2 MultiBa y release latch Allows remo v al of the MultiBa y drive . 3 Bluetooth compar tment Holds a Bluetooth de vice. ✎ Bluetooth is not available in all countries. 4 Docking connector Connects the notebook to an optional por t replicator . 5 Optical disk drive Reads and records CD and D VD media. 6 Ser ial number Identifies the notebook. Y ou need this number when calling customer suppor t. 7 Batter y pack release latch Releases the primar y battery pac k from the batter y ba y . 8 Batter y bay Holds the primar y batter y pack. Batter y pac k ships outside the notebook. 9 Hard drive co ver latch Releases the cov er on the hard drive ba y . 10 Hard drive Holds the primar y hard dr ive .
Pr oduct De sc ripti on Maintenance and Serv ice Gui de 1–31 1. 6 D e s i g n O v e r v i e w This section presents a design ov erview of k ey parts and features of the notebook. Refer to Chapter 3, “Illustrated P arts Catalog” to identify replacement parts, and Chapter 5, “Remo v al and Replacement Procedures” for disassembly steps. The system board provides the follo wing device connections: ■ Memory expansion board ■ Mini PCI communications de vices ■ Hard dri v e ■ Display ■ K e yboard, T ouchPad, and pointing stick ■ Audio ■ Intel Pentium M processor ■ Fan ■ PC Card ■ MCD modem ■ Bluetooth wireless LAN Ä CAUT ION: T o proper ly v entilate the notebook, allo w at least a 7 .6 -cm (3-inc h) clear ance on the left and right si des of the notebook . The notebook uses an electrical fan for v entilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are af fected b y high external temperatures, system po wer consumption, po wer management/battery conserv a tion conf igurations, battery fast char ging, and software applications. Exhaust air is displaced through the ventilation grill located on the left side of the notebook.
Maintenance and Serv ice Gui de 2–1 2 Tr o u b l e s h o o t i n g Å W ARNIN G: Onl y author iz ed techni c ians tr ained by HP should r epair this equipment . All tr oubleshooting and r epair pr ocedures ar e detailed to allo w only su basse mbly/module-lev el r epair . Becaus e of the comple x ity of the indi vi dual boar ds and subasse mblies , do not attempt to mak e r epairs at the com ponent le vel or modif ications to an y printed w ir ing boar d. Im pr oper r epairs can c r eate a safety ha z ard . Any indicati on of component r eplacement or printed w i r ing board modifi cation ma y voi d an y war r anty or ex change allo wances .
2–2 Maintenance and Serv ice Gui de T r oubleshooting 2. 1 Com pu ter Setup an d Dia gnosti c s Utiliti es The notebook features two system management utilities: ■ Computer Setup —A system information and customization utility that can be used e ven when your operating system is not working or does not load. This utility includes settings that are not a v ailable in Microsoft W indo ws. ■ Diagnostics f or W indows —A system information and diagnostic utility that is used within the W indo ws operating system. Use this utility whene ver possible to: ❏ Display system information. ❏ T est system components. ❏ T roubleshoot a device conf iguration problem in W indo ws XP Professional or W indows XP Home. ✎ It is not necessary to conf ig ure a de vice connected to a USB connector on the notebook or to an optional HP Port Replicator . Using C ompu ter Setup Information and settings in Computer Setup are accessed from the File, Security , or Adv anced menus: 1. T urn on or restart the notebook. Press F10 while the F10 = R OM-Based Setup message is displayed in the lo wer left corner of the screen. ❏ T o change the language, press F2 . ❏ T o view na vigation information, press F1 . ❏ T o return to the Computer Setup menu, press esc . 2. Select the File , Security , or Advanced menu.
T r oubleshooting Maintenance and Serv ice Gui de 2–3 3. T o close Computer Setup and restart the notebook: ❏ Select File > Sa ve Changes and Exit and press enter . – or – ❏ Select File > Ignor e Changes and Exit and press enter . 4. When you are prompted to conf irm your action, press F10 . Sele cting f r om the F ile Me nu Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ View identification inf or mation about the notebook, a P or t Replicator , and any battery packs in the system. ■ View specification inf or mation about the processor , memor y and cache size, and system R OM. Sa ve to Flopp y Sa ve system config uration settings to a disk ette. Restore from Flopp y Restore syste m configuration settings from ad i s k e t t e . Restore Def aults Replace configur ation settings in Computer Setup with f actor y def ault settings. Identification inf or mation is retained. Ignore Changes and Exit Cancel ch anges entered during the current session, then e xit and restar t the notebook. Sa ve Changes and Exit Sav e cha nges entered dur ing the current session, then e xit and restar t the notebook.
2–4 Maintenance and Serv ice Gui de T r oubleshooting Selec ting from t he Sec urity Menu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P assw ord Enter , change, or delete a Setup pass word. The Setup pass word is called an administr ator pass word in Computer Security , a program accessed from the Windows Control P anel. P ower-on P asswo rd Enter , change, or delete a po wer-on pass word. DriveLoc k P assw ords Enab le/disable DriveLoc k; change a Dr iveLoc k User or Master pass word. ✎ DriveLock Settings ar e accessible only when you enter Computer Setup by turning on (not restarting) the notebook. P assw ord Options (P assw ord options can be selected only when a pow er-on pass word has been set.) Enab le/disable: ■ QuickLoc k ■ QuickLoc k on Standby ■ QuickBlank ✎ To enable QuickLo ck on Standby or QuickBlank, you must first enable QuickLock. De vice Security Enab le/disable: ■ P or ts or diskette drives* ■ Disk ette write* ■ CD-ROM or disk ette star tup ✎ Settings for a DVD-ROM can be entered in the CD-ROM field. System IDs Enter identification numbers f or the notebook, a P or t Replicator , and al l batter y packs in the system. *Not applicab le to SuperDisk LS-120 drives.
T r oubleshooting Maintenance and Serv ice Gui de 2–5 Selec tin g from th e Adv an ced Men u Ta b l e 2 - 3 Adv anced Menu Select T o Do This Language Change the Comp uter Setup language. Boot Options Enab le/disable: ■ QuickBoot, which star ts the notebook more quic kly by eliminating some star tup tests. If you suspect a memory f ailure and want to test memor y automatically during star tup , disable Quic kBoot. ■ MultiBoot, which sets a star tup sequence that can include most bootab le de vices and media in the system. De vice Options ■ Enable/disab le the embedded numer ic ke ypad at star tup . ■ Enable/disab le multiple standard pointing de vices at star tup . T o set the notebook to suppor t only a single, usually nonstandard, pointing de vice at star tup , select Disable . ■ Enable/disab le USB legacy suppor t f or a USB ke yboard. When USB legacy suppor t is enabled, the k e yboard works e v en when a Windows oper ating system is not loaded. ■ Set an optional e xternal monitor or overhead projector connected to a video card in a P or t Replicator as the primar y device . When the notebook displa y is set as secondary , the notebook must be shut do wn bef ore it is undock ed from a P or t Replicator .
2–6 Maintenance and Serv ice Gui de T r oubleshooting De vice Options (continued) ■ Change the parallel por t mode from Enhanced P arallel P or t (EPP , the def ault setting) to standard, bidirectional EPP , or Enhanced Capabilities P or t (ECP). ■ Set video-out mode to NTSC (def ault), P AL, NTSC-J , or P AL-M.* ■ Enable/disab le all settings in the Intel SpeedStep window . When Disable is selected, the notebook runs in Batter y Optimized mode . ■ Specify how the notebook recogniz es multiple identical P or t Replicators that are identically equipped. Select Disable to recognize the P o r t Replicators as a single P or t Replicator ; select Enable to recogniz e the P or t Replicators individually , by serial numb er . ■ Enable/disab le the repor ting of the processor serial number by the processor to the software . HDD Self T est Options Run a quick comprehensiv e self test on hard drives in the system th at suppor t the test f eatures. *Video modes v ar y e v en within regions. Ho we ver , NTSC is common in Nor th America; P AL, in Europe, Africa, and th e Middle East; NTSC-J , in Japan; and P AL-M, in Brazil. Other South and Ce ntral American regions can use NTSC, P AL, or P AL-M. Ta b l e 2 - 3 Adv anced Menu (Continued) Select T o Do This
T r oubleshooting Maintenance and Serv ice Gui de 2–7 2.2 Using Dia gnostic s f or Windo w s When you access Diagnostics for W indo ws, a scan of all system components is displayed on the screen before the diagnostics windo w opens. Y ou can display more or less information from anywhere within Diagnostics for W indo ws by selecting Le vel on the menu bar . Diagnostics for W indo ws is designed to test HP components. If HP components are tested, the results might be inconclusi ve. Obtainin g , Saving , or Printin g Confi gura tion Informa tion 1. Access Diagnostics for W indo ws by selecting Start > Settings > Contr ol Panel > Diagnostics f or Windows . 2. Select Categories , then select a cate gory from the drop-do wn list. ❏ T o sav e the information, select File > Sa ve As . ❏ T o print the information, select File > Print . 3. T o close Diagnostics for W indows, select File > Exit .
2–8 Maintenance and Serv ice Gui de T r oubleshooting Obtainin g , Saving , or Printin g Dia gnos tic Te s t I n f o r m a t i o n 1. Access Diagnostics for W indo ws by selecting Start > Settings > Contr ol Panel > Diagnostics f or Windows . 2. Select the Te s t tab . 3. In the scroll box, select the category or de vice you want to test. 4. Select a test type: ❏ Quick T est —Runs a quick, general test on each de vice in a selected cate gory . ❏ Complete T est —Performs maximum testing on each de vice in a selected cate gory . ❏ Custom T est —Performs maximum testing on a selected de vice. ◆ T o run all tests for your selected device, select the Check All bu tt o n . ◆ T o run only the tests you select, select the Uncheck All b utton, then select the check box for each test you want to run. 5. Select a test mode: ❏ Interactiv e Mode —Provides maximum control o ver the testing process. Y ou determine whether the test was passed or failed. Y ou might be prompted to insert or remov e de vices. ❏ Unattended Mode —Does not display prompts. If errors are found, they are displayed when testing is complete.
T r oubleshooting Maintenance and Serv ice Gui de 2–9 6. Select the Begin T esting b utton. 7. Select a tab to vie w a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session. ❏ Log tab —Lists tests run on the system, the number of times each test has run, th e number of errors found on each test, and the total run time of each test. ❏ Err or tab —Lists all errors found in the notebook, along with the corresponding error codes. 8. Select a tab to sa ve the report: ❏ Log tab —Select the Sa ve b utton. ❏ Err or tab —Select the Sav e button. 9. Select a tab to print the report: ❏ Log tab —Select File > Sa ve As, and then print the f ile from your folder .
2–10 Maintenance and Serv ice Gui de T r oubleshooting 2.3 T roubleshootin g Flo wc har ts Ta b l e 2 - 4 T roubl eshooting Flowc har ts Overview Flowc har t Description 2.1 “Flo wchar t 2.1—Initial T roubleshooting” 2.2 “Flo wchar t 2.2—No P ower , P ar t 1” 2.3 “Flo wchar t 2.3—No P ower , P ar t 2” 2.4 “Flo wchar t 2.4—No P ower , P ar t 3” 2.5 “Flo wchar t 2.5—No P ower , P ar t 4” 2.6 “Flo wchar t 2.6—No Video , P ar t 1” 2.7 “Flo wchar t 2.7—No Video , P ar t 2” 2.8 “Flo wchar t 2.8—Nonfunctioning P o r t Replicator” 2.9 “Flo wchar t 2.9—No OS Loading” 2.10 “Flowchar t 2.10—No OS Loading, Hard Dr ive , P ar t 1” 2.11 “Flowchar t 2.11—No OS Loading, Hard Dr ive , P ar t 2” 2.12 “Flowchar t 2.12—No OS Loading, Hard Dr ive , P ar t 3” 2.13 “Flowchar t 2.13—No OS Loading, Diskette Drive” 2.14 “Flowchar t 2.14—No OS Loading, CD- or D VD-ROM Driv e” 2.15 “Flowchar t 2.15—No Audio , P ar t 1” 2.16 “Flowchar t 2.16—No Audio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning Device” 2.18 “Flowchar t 2.18—Nonfunctioning Ke yboard” 2.19 “Flowchar t 2.19—Nonfunctio ning P ointing Device” 2.20 “Flowchar t 2.20—No Networ k/Modem Connection”
T r oubleshooting Maintenance and Serv ice Gui de 2–11 Flo wc h ar t 2. 1—Initi al T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to “Flowchart 2.17—Nonfunc- tioning Device” Go to “Flowchart 2.2—No Power , Part 1” . Go to “Flowchart 2.6—No Video, Part 1” All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to “Flowchart 2.9—No OS Loading” Go to “Flowchart 2.15—No Audio, Part 1” Go to “Flowchart 2.18—Nonfunc- tioning Key- board” or “Flowchart 2.19—Nonfunc- tioning Pointing Check LED board, speaker connections. Go to “Flowchart 2.20—No Network/Modem Connection”
2–12 Maintenance and Serv ice Gui de T r oubleshooting Flowch ar t 2.2— No P o wer , P ar t 1 1. Reseat the power cables in the Port Replicator and at the AC outlet. 2. Ensure that the AC power source is active. 3. Ensure that the po wer strip i s working. Done Remove from Port Replicator (if applicable). Power up on battery power? Power up on AC power? Power up in Port Replicator? Power up on battery power? Power up in Port Replicator? Done *Reset power . *Reset power . Power up on AC power? N Y Y N N Y N N Y Y YN 1. On some models, ther e is a separate reset button. 2. On some models, the notebook can be reset using the Standby switch and either the lid switch or th e main power switch. *NOTES: Go to “Flowchart 2.4—No Power , Part 3” Go to “Flowchart 2.3—No Power , Part 2” Go to “Flowchart 2.8—Nonfunctioning Port Replicator” No power (power LED is off).
T r oubleshooting Maintenance and Serv ice Gui de 2–13 Flowch ar t 2.3 —No P o w er , P ar t 2 Continued from “Flowchart 2.2—No Power , Part 1” Visually check for debris in battery socket and clean if necessary . Done N Y Power on? Check battery by recharging it, moving it to another notebook, or replacing it. Power on? Done Y Replace power supply (if applicable). N Power on? Done Y N Go to “Flowchart 2.4—No Power , Part 3”
2–14 Maintenance and Serv ice Gui de T r oubleshooting Flowch ar t 2.4— No P o wer , P ar t 3 Continued from “Flowchart 2.3—No Power , Part 2” Reseat AC adapter in notebook and at power source. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet. Power LED on? Power outlet active? T r y different outlet. Replace external AC adapter . Replace power cord. Y N Y Y Y Y N N N N External Internal Go to “Flowchart 2.5—No Power , Part 4”
T r oubleshooting Maintenance and Serv ice Gui de 2–15 Flowch ar t 2.5— No P o wer , P ar t 4 Y N Continued from “Flowchart 2.4—No Power , Part 3” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Power on? Done N Replace the following items (if applicable) in the order given. Check noteb ook operation after each of the following two replacement steps: 1. Internal DC to DC converter , processor , and system board* 2. Internal AC adapter * NOTE: Replace these items as a set to prevent shorting out among components.
2–16 Maintenance and Serv ice Gui de T r oubleshooting Flo wc h art 2.6—N o Vid eo, P ar t 1 A N Stand-alone or Port Replicator? No video. Replace the following one at a ti me. T est after each replacement. 1. Cable between notebook and no tebook display (if applicable) 2. Inverter board (if applicable) 3. Display 4. System board Internal or external display*? Adjust brightness. Video OK? Done Port Replicator Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid switch to ensure operation. Video OK? Done Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N * NOTE: T o change from internal to external display , use the hotkey combination. Y Go to “Flowchart 2.7—No Video, Part 2”
T r oubleshooting Maintenance and Serv ice Gui de 2–17 Flo wc h art 2.7—N o Vid eo, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Verify that notebook is properly seated in Port Replicator , and check for bent pins on cable and for secure monitor connection. Go to “A” in “Flowchart 2.6—No Video, Part 1” Check brightness of external monitor . T r y another external monitor . Internal and external video OK? Go to “Flowchart 2.8—Nonfunctioning Port Replicator” Y Y Y N N N Remove notebook from Port Replicator , if connected.
2–18 Maintenance and Serv ice Gui de T r oubleshooting Flo wc h ar t 2.8—Nonfunc tionin g P ort Repli cator Y N Reseat power cord in Port Replicator and power outlet. N Replace the following Port Replicator components one at a time. Check notebook operation after each replacement. 1. Power supply 2. I/O board 3. Backplane board 4. Switch box 5. Port Replicator motor mechanism Check voltage setting on Port Replicator . Reseat monitor cable connector at Port Replicator . Reinstall notebook into Port Replicator . Port Replicator operating? Port Replicator operating? Remove notebook, reseat all internal parts, and replace any damaged items in Port Replicator . Done Done Y Nonfunctioning Port Replicator .
T r oubleshooting Maintenance and Serv ice Gui de 2–19 Flo wc h ar t 2.9—N o OS Lo adi ng No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat power cord in Port Replicator and power outlet. No OS loading.* * NOTE: Before beginning to troubleshoot, always check cable connections, cable ends, and drives for bent or damaged pins. No OS loading from diskette drive, go to “Flowchart 2.13—No OS Loading, Diskette Drive” No OS loading from CD- or DVD-ROM drive, go to “Flowchart 2.14—No OS Loading, CD- or DVD-ROM Drive” . No OS loading from network, go to “Flowchart 2.20—No Network/Modem Connection”
2–20 Maintenance and Serv ice Gui de T r oubleshooting Flo wc h ar t 2. 1 0—No OS Loa ding , H ard Dri v e, P ar t 1 Go to “Flowchart 2.17—Nonfunction ing Device” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.11—No OS Loading, Hard Drive, Part 2” Reseat external hard drive. OS loading? Done Boot from CD? Go to “Flowchart 2.13—No OS Loading, Diskette Drive” Boot from hard drive? Boot from diskette? Change boot priority through the Setup utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order .
T r oubleshooting Maintenance and Serv ice Gui de 2–21 Flo wc h ar t 2. 1 1—No OS Loa ding , H ard Driv e, P art 2 Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1” Reseat hard drive. Done CD or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to “Flowchart 2.13—No OS Loading, Diskette Drive” Load OS using System Restore CD (if applicable). Format hard drive and bring to a bootable C:\ prompt. Create partition, then format hard drive to bootable C:\ prompt. Boot from diskette drive? Remove diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible? Y N Hard drive accessible? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Notebook booted? Done Y N Go to “Flowchart 2.12—No OS Loading, Hard Drive, Part 3” Go to “Flowchart 2.12—No OS Loading, Hard Drive, Part 3”
2–2 2 Maintenance and Serv ice Guide T r oubleshooting Flo wc h ar t 2. 1 2—No OS Loa ding , H ard Dri v e, P ar t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix bad sectors. Boot from hard drive? Replace hard drive. Done
T r oubleshooting Maintenance and Serv ice Gui de 2–2 3 Flo wc h ar t 2. 1 3—No OS Loa ding , Disk et te Driv e Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system files. T r y different diskette. 1. Replace diskette drive. 2. Replace system board. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot notebook. Is diskette drive boot order correct? Change boot priority using the Setup utility . Go to “Flowchart 2.17—Nonfunc- tioning Device” Diskette drive enabled in the Setup utility? Go to “Flowchart 2.17—Nonfunc- tioning Device” Clear CMOS. Refer to “Section 1.3 Clearing a Password” for instructions.
2–2 4 Maintenance and Serv ice Guide T r oubleshooting Flo wc har t 2. 1 4—No OS Loa ding , CD- or DV D - R O M D r i ve Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.17—Nonfunc- tioning Device” Go to “Flowchart 2.17—Nonfunc- tioning Device” Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T r y another bootable disc. Booting from another device? Booting order correct? Correct boot order using the Setup utility . Done Reseat drive. Y Y Y Y Y N N N N N Clear CMOS. Refer to “Section 1.3 Clearing a Password” for instructions.
T r oubleshooting Maintenance and Serv ice Gui de 2–2 5 Flo wc h art 2. 1 5—No Au dio, P ar t 1 No audio. N Notebook in Port Replicator (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.16—No Audio, Part 2” Go to “Flowchart 2.16—No Audio, Part 2” Go to “Flowchart 2.17—Nonfunction ing Device” Replace the following Port Replicator components one at a time, as applicable. Check audio status after each change. 1. Port Replicator audio cable 2. Audio cable 3. Speaker 4. Port Replicator audio board 5. Backplane board 6. I/O Board Y Y Y Y N N N
2–2 6 Maintenance and Serv ice Guide T r oubleshooting Flo wc har t 2. 1 6—No Audio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio board and speaker connections in notebook (if applicable). 1. Replace internal speakers. 2. Replace audio board (if applicable). 3. Replace system board.
T r oubleshooting Maintenance and Serv ice Gui de 2–2 7 Flo wc h ar t 2. 1 7—Nonfun c tioning De vice Done Any physical device detected? Y N Unplug the nonfunctioning de vice from the notebook, and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix or replace broken item. Nonfunctioning device. Reattach device. Close notebook, plug in power , and reboot. Device boots properly? Go to “Flowchart 2.9—No OS Loading” Device boots properly? Replace hard drive. Replace diskette drive. Replace NIC. If integrated NIC, replace system board. Y N Y N
2–2 8 Maintenance and Serv ice Guide T r oubleshooting Flo wc h ar t 2. 1 8—N onfunc tioning K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard. Reseat internal keyboard connector (if applicable). Replace internal keyboard or cable. OK? Y N Y N Done Done
T r oubleshooting Maintenance and Serv ice Gui de 2–2 9 Flo wc h ar t 2. 1 9 —Nonfunc tionin g P ointing D e vice Y N OK? Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace internal pointing device or cable. OK? Y N Y N Done Done
2–30 Maintenance and Serv ice Guide T r oubleshooting Flo wc h ar t 2.20—No N et w ork/Modem C onnec tion Y Disconnect all power from the notebook and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers and reconfigure. Reseat NIC/modem (if applicable). Replace NIC/modem (if applicable). Replace system board. OK? OK? Done N N N N Y Y Y Y
Maintenance and Serv ice Gui de 3–1 3 I llus trated P ar ts C a tal og This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers and option part numbers. 3. 1 S erial N umber Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook. Ser ial Numb er L ocation
3–2 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 3.2 Notebook Major C omp onents Notebook Major C omponents
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P art Number 1 Display assemb lies 15.0-inch, UXGA , TFT 15.0-inch, SXGA , TFT 15.0-inch, XGA, TFT 345060-001 345059-001 345058-001 Miscellaneous Plastics Kit , includes: 345066-001 2a 2b 2c 2d 2e 2f Left and right display hinges R TC batter y Mini PCI communications board shield Bluetooth cov er Batter y bezel Hard drive cov er Not illustrated: Notebook f eet (4) 3 LED switc h cover 345063-001 4 Ke yboar ds (include pointing stick) Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Ger many Greece Greece - Blk Hungar y Iceland Inter national Israel Italy 341520-201 341520-221 341520-081 341520-A41 341520-051 341520-121 341520-041 378539-151 373646-151 341520-211 341520-DD1 341520-B31 341520-BB1 341520-061 Jap a n Ko r e a Latin America Norwa y P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 341520-291 341520-AD1 341520-161 341520-091 341520-131 341520-251 341520-171 341520-BA1 341520-071 341520-B71 341520-BG1 341520-AB1 341520-281 341520-141 341520-031 341520-001 5 T op cover (includes T ouchP ad and speaker) 345061-001
3–4 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog Notebook Major C omponents (C ontinued)
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–5 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Cable Kit , includes: 345056-001 6a 6b Modem cable Bluetooth cable 7 Modem board 325521-001 8 Fa n assembly 345065-001 9 Heat sink (includes grease) 345067-001 10 Memory expansion boar ds, 333-MHz 1024-MB (1.0-GB) 512-MB 256-MB 336579-001 336578-001 336577-001 11 Pr ocessors (include ther mal grease) Intel P entium M (Banias) processor , 1.7 GHz Intel P entium M (Banias) processor , 1.6 GHz Intel P entium M (Banias) processor , 1.5 GHz Intel P entium M (Banias) processor , 1.4 GHz Intel P entium M (Dothan) processor , 1.5 GHz Intel P entium M (Dothan) processor , 1.6 GHz Intel P entium M (Dothan) processor , 1.7 GHz Intel P entium M (Dothan) processor , 1.8 GHz Intel P entium M (Dothan) processor , 2.0 GHz 340165-001 319777-001 319776-001 319775-001 359636-001 356596-001 356597-001 345857-001 353395-001 12 System boar ds (include ther mal grease) With 128 MB of video memor y With 64 MB of video memor y 349206-001 345064-001 13 T rusted Platform Module (TPM) 345856-001 * Integrated smart card 379336-001 *Not illustrated.
3–6 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog Notebook Major C omponents (C ontinued)
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–7 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components (Continued) Item Description Spare P art Number 14 Mini PCI comm unications boards 802.11a/b/g LAN NIC 802.11b/g LAN NIC 802.11b W500 modem boar d (f or use in Japan) 802.11b wireless LAN (MO W) 802.11b wireless LAN (RO W) 802.11b/g wirele ss modem (MO W) 802.11b/g wirele ss modem (RO W) 325525-001 325526-001 339742-291 345641-001 345640-001 368247-001 368248-001 15 Optical drives 24X Max D VD RW/R and CD-R W Combo Dr ive 8X Max D VD-ROM Drive 24X Max D VD/CD-RW Combo Driv e 24X Max CD-ROM Driv e 349242-001 349241-001 349243-001 349240-001 16 MultiBa y devices 1.44-MB diskette driv e 24X Max CD-ROM Driv e 8X Max Slim D VD RW/R and CD-R W Combo Drive 4X Max Reg D VD RW/R and CD-R W Combo Drive 241995-001 228746-001 251292-001 344256-001 17 Base enc losure (includes optical dr iv e shield, hard drive shield, and f our notebook feet) 345062-001 18 Bluetooth boar d (includes Bluetooth cable , item 6b) 348277-001 19 Har d drives (includes hard dr ive bez el and frame) 80-GB 60-GB 40-GB 60-GB 5400-r pm 5400-r pm 5400-r pm 7200-r pm (all models) (all models) (all models) (nw8000 only) 345632-001 345631-001 345630-001 345855-001 20 Battery pack, 8-cell, 4.4 Wh, Li-Ion 338669-001 * Battery pack, 8-cell, 4.8AHR 360663-001
3–8 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog *Not illustrated. Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P art Number
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–9 3. 3 M iscellan eous P l a sti c s Kit Com ponen ts Miscellaneou s P lastics K it Compo nents T able 3-2 Miscellaneous Plastics Kit Components Spare P ar t Number 345066-001 Item Description 1 Left and right display hinges 2 R TC batter y 3 Mini PCI communications board shield 4 Bluetooth cov er 5 Batter y bezel 6 Hard drive co v er 7 Notebook f eet (4) * Integ rated smar t card bezel *Not illustrated.
3–10 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 3.4 Miscell an eous Ca bl e Kit Comp one nt s Miscellaneou s Cable K it Com ponents Ta b l e 3 - 3 Miscellaneous Cable Kit Components Spare P art Number 345056-001 Item Description 1 Bluetooth cable 2 Modem cable
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–11 3.5 M a s s S to ra g e D e vi ces Mass S tor age De v ices T able 3-4 Mass Storage De vices Spare P ar t Number Information Item Description Spare P art Number 1 Har d drives (includes hard drive bez el and frame) 80-GB 5400-r pm 60-GB 5400-r pm 40-GB 5400-r pm (all models) (all models) (all models) 345632-001 345631-001 345630-001 60-GB 7200-r pm (nw8000 only) 345855-001
3–12 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 2 Optical drives 24X Max D VD RW/R and CD-R W Combo Dr iv e 8X Max D VD-ROM Drive 24X Max D VD/CD-RW Combo Driv e 24X Max CD-ROM Driv e 349242-001 349241-001 349243-001 349240-001 3 MultiBay de vices 1.44-MB diskette driv e 24X Max CD-ROM Driv e 8X Max Slim D VD/R W and CD-R W Combo Drive 4X Max Regular D VD/R W and CD-RW Combo Drive 135233-001 228746-001 251292-001 344256-001 T able 3-4 Mass Storage De vices Spare P art Number Information (Continued) Item Description Spare P art Number
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–13 3.6 Miscell an eous Ta b l e 3 - 5 Spare P ar ts: Miscellaneous (not illustrated) Description Spare P art Number AC a d a p t e r s 90-W , PFC 65-W 239705-001 239704-001 Carrying cases Leather top load, Samsung Leather top load, SG Nylon top load, Samsung Nylon top load, SG Nylon entr y le v el 325817-001 325817-002 325815-001 325815-002 325814-001 P or t replicators Adv anced P or t Replicator Common P or t Replicator 339096-001 339097-001 Po w e r c o r d s A ustralia Brazil Denmark Europe/Middle East/Africa Israel 246959-011 246959-201 246959-081 246959-021 246959-BB1 Italy Jap a n Ko r e a Switzerland United Kingdom United States 246959-061 246959-291 246959-AD1 246959-A G1 246959-031 246959-001 Screw Kit (includes the f ollowing screws; ref er to Appendix C , “Screw Listing” f or more information on scre w specifications and usage.) 345057-001 ■ T orx T8M2.0×6.0 screw ■ T orx T8M2.0×4.0 screw ■ T orx T5M2.5×4.0 screw ■ T orx T8M2.0×3.5 screw ■ Phillips PM3.0×3.5 scre w ■ Phillips PM1.5×4.0 scre w ■ Phillips PM1.5×3.0 scre w ■ M2.0×10.0 alignment pin
3–14 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 3.7 Sequenti al P ar t N umber Lis ting Ta b l e 3 - 6 Spare P ar ts: Sequential P ar t Number Listing Spare P art Number Description 228746-001 24X Max CD-ROM drive 239704-001 65-watt A C adapter 239705-001 90-watt, PFC , A C adapter 241995-001 Diskette driv e 246959-001 3-wire power cord - United States 246959-011 3-wire power cord - A ustralia 246959-021 3-wire power cord - Europe , Middle East, Africa 246959-031 3-wire power cord - United Kingdom 246959-061 3-wire power cord - Italy 246959-081 3-wire power cord - Denmark 246959-201 3-wire power cord - Br azil 246959-291 3-wire power cord - J apan 246959-AD1 3-wire pow er cord - K o rea 246959-A G1 3-wire pow er cord - Switzerland 246959-BB1 3-wire pow er cord - Israel 251292-001 8X Max Slim D VD R W/R and CD-R W combo drive 319775-001 Intel P entium M (Banias) processor , 1.4-GHz 319776-001 Intel P entium M (Banias) processor , 1.5-GHz 319777-001 Intel P entium M (Banias) processor , 1.6-GHz 325521-001 Modem board (includes cable) 325525-001 802.11a/b/g LAN board mini PCI communications board
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–15 325526-001 802.11b/g LAN board mi ni PCI communications board 325814-001 Nylon, entr y lev el 325815-001 Nylon, top load, Samsung 325815-002 Nylon, top load, SG 325817-001 Leather , top load, Samsung 325817-002 Leather , top load, SG 336577-001 Memor y expansion b oard, 333 MHz, 256-MB DDR 336578-001 Memor y expansion b oard, 333 MHz, 512-MB DDR 336579-001 Memor y expansion b oard, 333 MHz, 1024-MB DDR 338669-001 Batter y pack, 8-cell, 4.4 Wh, Li-ion 339096-001 Advanced P or t Replicator 339097-001 Simple P or t Replicator 339742-291 802.11b W500 modem boar d (f or use in J apan) mini PCI communications board 340165-001 Intel P entium M (Banias) processor , 1.7-GHz 341520-001 K eyboard (including po inting stic k) - United States 341520-031 K eyboard (including po inting stic k) - United Kingdom 341520-041 K e yboard (including pointing stick) - Germany 341520-051 K e yboard (including pointing stick) - F rance 341520-061 K e yboard (including pointing stick) - Italy 341520-071 K e yboard (including pointing stick) - Spain 341520-081 K e yboard (including pointing stick) - Denmark 341520-091 K e yboard (including pointing stick) - Norw a y Ta b l e 3 - 6 Spare P arts: Sequential Part Number Listing (Continued) Spare P art Number Description
3–16 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 341520-121 K eyboard (including po inting stic k) - F rench Canada 341520-131 K e yboard (including pointing stick) - P o r tugal 341520-141 K e yboard (including pointing stick) - T urke y 341520-161 K e yboard (including pointing stick) - Latin America 341520-171 K e yboard (including pointing stick) - Saudi Ar abia 341520-201 K e yboard (including pointing stick) - Br azil 341520-211 K e yboard (including pointing stick) - Hungary 341520-221 K eyboard (including po inting stic k) - Czech Republic 341520-251 K e yboard (including pointing stick) - Russia 341520-281 K e yboard (including pointing stick) - Thailand 341520-291 K e yboard (including pointing stick) - J apan 341520-A41 K eyboard (including pointing stic k) - European 341520-AB1 K eyboard (including pointing stic k) - T aiwan 341520-AD1 K eyboard (including pointing stic k) - K o rea 341520-B31 K eyboard (including po inting stick) - International 341520-B71 K eyboard (including po inting stick) - Sw eden/Finland 341520-BA1 K eyboard (including pointing stic k) - Slov enia 341520-BB1 K eyboard (including pointing stic k) - Israel 341520-BG1 K eyboard (including pointing stic k) - Switzerland 341520-DD1 K eyboard (including pointing stic k) - Iceland 344256-001 4X Max Reg D VD R W/R and CD-R W combo drive 345056-001 Miscellaneous Cable Kit 345057-001 Misc Screw Kit Ta b l e 3 - 6 Spare P arts: Sequential Part Number Listing (Continued) Spare P art Number Description
Illustr ated P ar ts Catalog Maintenance and Serv ice Gui de 3–17 345058-001 Display assemb ly , 15.0-inch, XGA, TFT 345059-001 Display assemb ly , 15.0-inch, SXGA , TFT 345060-001 Display assemb ly , 15.0-inch, UXGA , TFT 345061-001 T op cov er (includes T ouchP ad and speak er) 345062-001 Base enclosure (includes optical dr iv e shield, hard drive shield, and f our notebook f eet) 345063-001 LED switch co v er 345064-001 System board (include s 64-MB discrete video memor y) 345065-001 F an assembly 345066-001 Misc Plastics Kit 345067-001 Heat sink 345630-001 40-GB (5400-r pm) hard dr iv e 345631-001 60-GB (5400-r pm) hard dr iv e 345632-001 80-GB (5400-r pm) hard dr iv e 345640-001 802.11b wireless LA N (RO W) Wireless LAN card 345641-001 802.11b wireless LAN (MOW) Wireless LAN card 345855-001 60-GB (7200-r pm) hard dr ive (nw8000 only) 345856-001 T rusted Platform Module (TPM) 345857-001 Intel P e ntium M (D othan) processor , 1.8 GHz 348277-001 Bluetooth wirele ss communications board 349206-001 System board (includes 128-MB discrete video memor y) 349240-001 24X Max CD-ROM Drive 349241-001 8X Max D VD-R OM drive Ta b l e 3 - 6 Spare P arts: Sequential Part Number Listing (Continued) Spare P art Number Description
3–18 Maintenance and Serv ice Gui de Illustrated P ar ts Catalog 349242-001 24X Max D VD R W/R and CD-R W combo drive 349243-001 24X Max D VD/CD-R W combo drive 353395-001 Intel P e ntium M (D othan) processor , 2.0 GHz 356596-001 Intel P e ntium M (D othan) processor , 1.6 GHz 356597-001 Intel P e ntium M (D othan) processor , 1.7 GHz 359636-001 Intel P e ntium M (D othan) processor , 1.5 GHz 360663-001 Batter y pack, 8-cell, 4.8AHR 365438-001 60-GB (7200-r pm) hard dr ive (includes bez el and frame) 368247-001 802.11b/g modem board (MOW) mini PCI comm unications board 368248-001 802.11b/g modem board (RO W) mini PCI communications board 373646-151 K e yboard (including pointing stick) - Greece Bk 378539-151 K e yboard (including pointing stick) - Greece 379336-001 Integrated smar t card Ta b l e 3 - 6 Spare P arts: Sequential Part Number Listing (Continued) Spare P art Number Description
Maintenance and Serv ice Gui de 4–1 4 Remo v al an d Repl acement Preliminari es This chapter provides essential information for proper and safe remov al and replacement service. 4. 1 T ools Required Y ou need the follo wing tools to complete the remo v al and replacement procedures: ■ Magnetic scre w dri v er ■ Phillips P0 scre w dri v er ■ T orx8 screw dri ver ■ T orx7 pin bit screw dri ver ✎ Some computer models ha ve tw o T orx7 with pin security screws (M2.0×4.0) securing the Mini PCI communications board to the computer . A T7 pin bit screw dri ver is required to remo ve the Mini PCI communications board on these computer models. Refer to Section 5.12, “Mini PCI Communications Board, ” for more information on removing Mini PCI communications boards. ■ 5.0-mm socket for system board standof fs ■ Flat-bladed scre wdri ver
4–2 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminari es 4.2 Ser vice Consi derations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassem bly from the notebook, place the subassembly (and all accompanying scre ws) aw ay from the work area to pre vent damage. Pl a s t i c P a r t s Using excessi ve force during disassembly and reassembly can damage plastic parts. Use care when handling the plastic parts. Apply pressure only at the points designated in the maintenance instructions. Ca bl es and C onnec tors Ä CA UTION: When ser vicing the notebook , ensure that cables are placed in their proper locations during the reassembly process . Improper cable placement can damage the notebook. Cables must be handled with extreme care to a void damage. Apply only the tension required to unseat or seat the cables during remov al and insertion. Handle cables by the connector whene ver possible. In all cases, a void bending, twisting, or tearing cables. Ensure that cables are routed in such a way that they cannot be caught or snagged b y parts being removed or replaced. Handle flex cables w ith e xtreme care; these cables tear easily .
Re mov al and Replacement Pr eliminaries Maintenance and Serv ice Gui de 4–3 4.3 Pre v entin g D ama g e to R emo v able D ri v es Remov able dri ves are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able dri ve, or loss of information, observ e the follo wing precautions: ■ Before removing or inserting a hard dri ve, shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the notebook on, then shut it do wn. ■ Before removing a disk ette dri ve or optical dri ve, ensure that a diskette or disc is not in the dri ve. Ensure that the optical dri v e tray is closed. ■ Before handling a dri v e, ensure that you are discharged of static electricity . While handling a dri ve, a void touching the connector . ■ Handle dri v es on surfaces that ha ve at least one inch of shock-proof foam. ■ A void dropping dri ves from any height onto an y surface. ■ After removing a hard dri ve, an optical dri ve, or a diskette dri v e, place it in a static-proof bag. ■ A void e xposing a hard dri ve to products that ha ve magnetic f ields, such as monitors or speakers. ■ A void e xposing a dri ve to temperature e xtremes or liquids. ■ If a dri v e must be mailed, place the dri ve in a b ubble pack mailer or other suitable form of protecti v e packaging and label the package “FRA GILE: Handle W ith Care. ”
4–4 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminari es 4.4 Pre v entin g Elec trosta tic D ama g e Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks b uilt into man y integrated circuits provide some protection, b ut in many cases the dischar ge contains enough po wer to alter de vi ce parameters or melt silicon junctions. A sudden dischar ge of static electricity from a finger or other conductor can destroy static-sensiti ve de vices or microcircuitry . Often the spark is neither felt nor heard, b ut damage occurs. An electronic de vice e xposed to electrostatic discharge might not be af fected at all and can work perfectly throughout a normal life cycle. Or the de vice might function normally for a while, then degrade in the internal layers, reducing its life e xpectancy .
Re mov al and Replacement Pr eliminaries Maintenance and Serv ice Gui de 4–5 4.5 P ac k a ging an d T ranspor tin g Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrostatic-sensiti ve parts and assemblies with conducti ve or appro ved containers or packaging. ■ K eep electrostatic-sensiti v e parts in their containers until the parts arri ve at static-free w orkstations. ■ Place items on a grounded surface before remo ving them from their containers. ■ Alw ays be properly grounded when touching a sensiti ve component or assembly . ■ Store reusable electrostatic-sensiti v e parts from assemblies in protecti v e packaging or nonconducti ve foam. ■ Use transporters and con ve yors made of antistatic belts and roller b ushings. Ensure that mechanized equipment used for moving materials is wired to ground and that proper materials are selected to a void static char ging. When grounding is not possible, use an ionizer to dissipate electric char ges.
4–6 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminari es 4.6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with approv ed static-shielding material (refer to T able 4-2 ). ■ Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and equipment. ■ Use conducti ve f ield service tools, such as cutters, scre wdri vers, and v acuums. ■ When using f ixtures that must directly contact dissipati ve surfaces, use only f ixtures made of static-safe materials. ■ K eep the work area free of nonconducti ve materials, such as ordinary plastic assembly aids and Styrofoam. ■ Handle electrostatic-sensiti v e components, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A void contact with pins, leads, or circuitry . ■ T urn of f po wer and input signals before inserting or removing connectors or test equipment.
Re mov al and Replacement Pr eliminaries Maintenance and Serv ice Gui de 4–7 4.7 G rounding E quip men t and Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o provide proper ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug connectors, connect a wrist strap with alligator clips. ■ When standing, use foot stra ps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots. On conducti v e floors or dissipati ve floor mats, use foot straps on both feet with a minimum of one-megohm resistance between the operator and ground. T o be effecti ve, the conducti ve strips must be w orn in contact with the skin. Other grounding equipment recommended for use in pre venting electrostatic damage includes ■ Antistatic tape. ■ Antistatic smocks, aprons, and slee ve protectors. ■ Conducti v e bins and other assembly or soldering aids. ■ Nonconducti v e foam. ■ Conducti v e tabletop workstations with ground cords of one-megohm resistance. ■ Static-dissipati ve tables or floor mats with hard ties to the ground. ■ Field service kits. ■ Static aw areness labels. ■ Material-handling packages. ■ Nonconducti v e plastic bags, tubes, or boxes. ■ Metal tote boxes. ■ Electrostatic v oltage le vels and protecti ve materials.
4–8 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminari es T able 4-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif ferent activities. T able 4-2 lists the shielding protection provided b y antistatic bags and floor mats. Ta b l e 4 - 1 T ypical Electrostatic V oltage Levels Relative Humidity Event 10% 40% 55% W alking across car pet 35,000 V 15,000 V 7,500 V W alking across vinyl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 14,500 V 5,000 V 3,500 V Removing b ubb le pack from PCB 26,500 V 20,000 V 7,000 V P acking PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 V. Ta b l e 4 - 2 Static-Shielding Materials Material Use V oltage Pr otection Level Antistatic plastic Bags 1,500 V Carbon-loaded plastic Floor mats 7,500 V Metallized laminate Floor mats 5,000 V
Maintenance and Serv ice Gui de 5–1 5 Remo v al an d Repl acement Pr ocedures This chapter provides remo val and replacement procedures. There are 62 scre ws in eight dif ferent sizes that must be remo ved, replaced, and loosened when servicing the notebook. Make note of each scre w size and location during remo v al and replacement. Refer to Appendix C, “Scre w Listing” for detailed information on scre w sizes, locations, and usage.
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 1 S e r i a l N u m b e r Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Numb er L ocation
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 5 .2 D isassembl y Se quence C hart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Chart Section Description # of Screws Remo ved 5.3 Preparing the notebook for disassemb ly Batter y pack Hard drive 0 1 to remov e 4 screws and 2 alignment pins to disassemble 5.4 Notebook f eet 0 5.5 MultiBa y de vice 0 5.6 Bluetooth board 3 5.7 Integrated smart card 0 5.8 Optical drive 1 5.9 K eyboard 1 5.10 Memor y e xpansion board 0 5.11 Modem board 2 5.12 Mini PCI communications board 2 5.13 Heat sink 5 5.14 Processor 0 5.15 LED s witch cov er 1 5.16 R TC batter y 0 5.17 Security Module (TPM) 1 5.18 Displa y assembly 4 5.19 T op cov er 18
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s Section Description # of Screws Remo ved 5.20 Speaker 6 5.21 T ouchP ad 3 5.22 F an assembly 4 5.23 System board 4 Disassembl y Sequence Chart (Continued)
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–5 5 .3 Preparing t h e Notebook for Di sassem bly Before you begin an y remov al or installation procedures: 1. Sa ve your w ork, exit all applications, and shut do wn the notebook. If you are not sure whet her the notebook is of f or in hibernation, briefly press the po wer b utton. If your work returns to the screen, sa ve your w ork, exit all applications, and then shut do wn the notebook. 2. Disconnect all external de vices connected to the notebook. 3. Disconnect the po wer cord.
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 4. Remov e the battery pack by follo wing these steps: a. T urn the notebook upside do wn with the front facing you. b . Slide and hold the battery release latch 1 tow ard the back of the notebook. c. Use the notch in the battery pack to slide the battery pack to the right 2 . d. Remov e the battery pack. R emo v ing the Battery P ack Spare P ar t Number Information Batter y pack, 8-cell, 4.4 Wh, Li-Ion Batter y pack, 8-cell, 4.8AHR 338669-001 360663-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–7 5. Remov e the battery bezel by sliding it do wn and of f of the battery pack. ✎ The battery bezel is included in the Miscellaneous Plastics Kit, spare part number 345066-001. R emo v ing the Battery Bez el Re verse the abo ve procedure to install the battery pack and battery bezel.
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 6. Remov e the hard driv e by follo wing these steps: a. T urn the notebook upside do wn with the front facing you. b . Remov e the T8M2.0×6.0 hard dri ve co ver scre w 1 . c. Slide and hold the tab on the hard dri v e cov er to the left 2. d. Swing the right edge of the hard dri v e cov er up and to the left 3 . ✎ The hard dri ve co v er is included in the Miscellaneous Plastics Kit, spare part number 345066-001. R emo v ing the Har d Dr i ve C ov er Spare P ar t Number Information Hard drives (includes hard driv e bezel and frame) 80-GB 5400-r pm 60-GB 5400-r pm 40-GB 5400-r pm 60-GB 7200-r pm (all models) (all models) (all models) (nw8000 only) 345632-001 345631-001 345630-001 345855-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–9 e. Use the Mylar tab 1 to slide the hard dri v e to the right 2 to disconnect it from the system board. f. Lift the hard dri ve straight up to remo ve it 3 . R emo v ing the Har d Dr i ve
5–10 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s g. Remo ve the two T5M2.5×4.0 scre ws 1 and the two PM3.0×3.5 scre ws 2 that secure the hard driv e to the hard dri ve frame. h. Use a 4.0-mm socket to remo ve the tw o M2.0×10.0 alignment pins 3 that secure the hard dri ve to the hard dri v e frame. i. Remo v e the hard dri ve 4 from the hard dri ve frame. j. Remo v e the hard dri ve connector 5 from the hard dri ve. Disas sembling the Har d Dr i ve Re verse the abo ve procedure to assemble and install the hard dri ve.
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–11 5 .4 N otebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 345066-001. The feet attach to the base enclosure as illustrated belo w . Notebook F eet Locations
5–12 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 5 M u l t i B a y D ev i c e 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the left side facing you. 3. Slide and hold the MultiBay release latch to ward you 1 . 4. Use the notch in the MultiBay de vice to slide the de vice out of the MultiBay 2 . 5. Remov e the MultiBay device. R emo v ing a MultiBa y De v ice Re verse the abo ve procedure to install a MultiBay de vice. Spare P ar t Number Information 1.44-MB diskette driv e 24X Max CD-ROM Driv e 8X Max D VD RW/R and CD-R W Combo Drive 24X Max D VD RW/R and CD-R W Combo Dr iv e 135233-001 228746-001 251292-001 344256-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–13 5 .6 Bluetoot h B oard 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the left side facing you. 3. Remov e the T8M2.0×6.0 screw 1 that secures the Bluetooth cov er to the notebook. 4. Lift the cov er straight up to remo ve it 2 . ✎ The Bluetooth cov er is included in the Miscellaneous Plastics Kit, spare part number 345066-001. R emo v ing the Bluetooth Co ver Spare P ar t Number Information Bluetooth board (inc ludes cab le) 348277-001
5–14 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. Disconnect the Bluetooth cable from the Bluetooth board 1 and the system board 2 . ✎ The Bluetooth cable is included with the Bluetooth board and is also included in the Miscellaneous Cables Kit, spare part number 345056-001. 6. Remov e the two PM1.5×3.0 screws 3 that secure the Bluetooth board to the Bluetooth cov er . 7. Remov e the board from the cover 4 . R emo v ing the Bluetooth Boar d Re verse the abo ve procedure to install the Bluetooth board.
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–15 5 .7 In tegrated Sm art C ard ✎ The integrated smart card is located in the bottom PC Card slot. 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e any PC Card or spacer from the top PC Card slot. 3. Using a flat-bladed tool, pry the smart card bezel of f of the notebook 1 . The bezel releases from the notebook with a small amount of force. 4. Remov e the bezel from the notebook 2 . R emo v ing the Smart Car d Bez el Spare P ar t Number Information Integrated smart card 379336-001
5–16 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s ✎ The integrated smart card bezel is included in the Miscellaneous Plastics Kit, spare part number 345066-001. 5. Eject the smart card from the notebook using a flat-bladed tool to press the small metal eject tab 1 to the left of the smart card. 6. Remov e the card from the slot 2 . R emo v ing the Smart Car d Re verse the abo ve procedure to install the integrated smart card.
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–17 5 .8 O pti cal Driv e 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the right side facing you. 3. Remov e the T8M2.0×6.0 screw 1 that secures the optical dri v e to the notebook. 4. Insert a paper clip or similar tool into the optical dri ve release hole to open the optical dri v e tray 2 . 5. Use the optical dri ve tray to remo v e the optical dri ve 3 . R emo v ing the Optical Dr iv e Re verse the abo ve procedure to install the optical dri ve. Spare P ar t Number Information 24X Max D VD RW/R and CD-R W Combo Dr iv e 8X Max D VD-ROM Drive 24X Max D VD/CD-RW Combo Driv e 24X Max CD-RO M Drive 349242-001 349241-001 349243-001 349240-001
5–18 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 9 K eyb o a r d 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the front facing you. Spare P ar t Number Information K eyboards (include pointing stic k) Brazil Czech Repub l ic Denmark Europe Fr a n c e F rench Canada Ger many Greece Greece - Blk Hungar y Iceland Inter national Israel Italy Jap a n 341520-201 341520-221 341520-081 341520-A41 341520-051 341520-121 341520-041 378539-151 373646-151 341520-211 341520-DD1 341520-B31 341520-BB1 341520-061 341520-291 Ko r e a Latin America Norwa y P or tugal Russia Saudi Arabia Slov enia Spain Sweden/Finland Switzerland Ta i w a n Thailand Tu r k e y United Kingdom United States 341520-AD1 341520-161 341520-091 341520-131 341520-251 341520-171 341520-BA1 341520-071 341520-B71 341520-BG1 341520-AB1 341520-281 341520-141 341520-031 341520-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–19 3. Remov e the T8M2.×6.0 screw that secures the ke yboard to the notebook. R emo v ing the K e yboar d Scr e w
5–20 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 4. T urn the notebook right-side up with the front facing you. 5. Open the notebook. 6. Slide the four tabs 1 on the top edge of the ke yboard to ward you. 7. Lift the rear edge of the ke yboard up and swing it to ward you 2 until it rests on the palm rest. Re l ea s i n g t h e K eyb o a rd
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–21 8. Release the zero insertion force (ZIF) connector 1 to which the pointing stick cable is attached and disconnect the cable 2 . 9. Release the ZIF connector 3 to which the ke yboard cable is attached and disconnect the cable 4 . Disconnecting the K ey board C ables 10. Remov e the keyboard. Re verse the abo ve procedure to install the ke yboard.
5–2 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5 . 1 0 Memor y Expansion B oard 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Spread the retaining tabs 1 that secure the memory expansion board to the sock et. The free end of the board rises. 4. Pull the board aw ay from the socket at a 45-de gree angle 2 . R emo v ing a Memory Expansion Boar d Re verse the abo ve procedure to install a memory expansion board. Spare P ar t Number Information 1024 MB (1.0 GB), 333 MHz 512 MB, 333 MHz 256 MB, 333 MHz 336579-001 336578-001 336577-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 3 5 . 1 1 Modem B oard 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the two T8M2.0×4.0 scre ws 1 that secure the modem board to the notebook. 4. Lift up on the right side of the modem board 2 to disconnect the board from the system board. R emo v ing the Modem Boar d Scr ew s Spare P ar t Number Information Modem board 325521-001
5–2 4 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. T urn the modem board upside do wn 1 . 6. Disconnect the modem cable 2 from the modem. Disconnecting the Modem Boar d Cable 7. Remov e the modem board. Re verse the abo ve procedure to install the modem board. 5 . 1 2 Mi ni P CI Co mmun icati on s Boa r d 1. Prepare the notebook for disassembly (refer to Section 5.3). 2. Release the ke yboard (refer to Section 5.9). Spare P ar t Number Information 802.11a/b/g LAN NIC 802.11b/g LAN NIC 802.11b W500 modem boar d (f or use in Japan) 802.11b wireless LAN (MO W) 802.11b wireless LAN (R O W) 802.11b/g wireless modem (MO W) 802.11b/g wireless modem (RO W) 325525-001 325526-001 339742-291 345641-001 345640-001 368247-001 368248-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 5 ✎ Some computer models ha ve tw o T orx7 with pin security screws (M2.0×4.0) securing the Mini PCI communications board to the computer . A T7 pin bit screw dri ver is required to remo ve the Mini PCI communications board on these computer models. 3. Remov e the two T8M2.0×4.0 scre ws 1 that secure the Mini PCI communications board shield to the notebook. 4. Lift up on the left side of the shield 2 and slide it to the left 3 to remov e it. ✎ The Mini PCI communications board shield is included in the Miscellaneous Plastics Kit, spare part number 345066-001. R emo v ing the Mini P C I Co mmuni cations Boar d Shield
5–2 6 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. Disconnect the two antenna cables 1 from the board. Make note of which cable connects to which terminal. 6. Spread the retaining tabs 2 that secure the Mini PCI communications board to the socket. The free end of the board rises. 7. Pull the board aw ay from the socket at a 45-de gree angle 3 . R emo v ing the Mini P CI Communi cations Boar d 8. Remov e the Mini PCI communications board. Re verse the abo ve procedure to install the Mini PCI communications board.
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 7 5. 1 3 H e a t S i n k 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the fi ve T8M2.0×4.0 scre ws 1 that secure the heat sink to the notebook. 4. Lift the front edge of the heat sink 2 to unseat the adhesi ve grip of the thermal grease on the processor . 5. Swing the heat sink in a counterclockwise motion 3 until the back of the heat sink 4 clears the notebook. R emo v ing the Heat Sink 6. Remov e the heat sink. Spare P ar t Number Information Heat sink (includes grease) 345067-001
5–2 8 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s ✎ Carefully clean any thermal grease residue from the heat sink 1 and processor surfaces 2 each time you remo ve the heat sink. Apply ne w thermal grease to both surfaces. R emo v ing the Ther mal Gr ease F r om the Heat Sink and Pr ocess or Re verse the abo ve procedure to install the heat sink.
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 9 5. 1 4 P r o c e s s o r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Release the ke yboard (refer to Section 5.9 ). 3. Remov e the heat sink (refer to Section 5.13 ). Spare P ar t Number Information Processors (include grease) Intel P entium M (Banias) processor , 1.7 GHz Intel P entium M (Banias) processor , 1.6 GHz Intel P entium M (Banias) processor , 1.5 GHz Intel P entium M (Banias) processor , 1.4 GHz Intel P entium M (Dothan) processor , 1.5 GHz Intel P entium M (Dothan) processor , 1.6 GHz Intel P entium M (Dothan) processor , 1.7 GHz Intel P entium M (Dothan) processor , 1.8 GHz Intel P entium M (Dothan) processor , 2.0 GHz 340165-001 319777-001 319776-001 319775-001 359636-001 356596-001 356597-001 345857-001 353395-001
5–30 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 4. Use a flat-bladed scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 . 5. Remov e the processor from the system board socket 2 . ✎ Note that the gold triangle 3 on the processor should be aligned in the front left corner when you install the processor . R emo v ing the Pr ocess or Re verse the abo ve procedure to install the processor .
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–31 5. 1 5 L E D Sw i t c h C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. T urn the notebook upside do wn with the rear facing you. 3. Remov e the T8M2.0×6.0 screw that secures the LED switch cov er to the notebook. R emo v ing the LED S witc h Co ver S cr ew Spare P ar t Number Information LED s witch cov er 345063-001
5–3 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 4. T urn the notebook right-side up with the front facing you. 5. Open the notebook. 6. Lift the left 1 and right 2 sides of the LED switch co ver to disengage the cov er from the notebook. 7. Remov e the LED switch cover . R emo v ing the LED S witc h Cov er Re verse the abo ve procedure to install the LED switch co ver .
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 3 5. 1 6 R TC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 345066-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the LED switch cover (refer to Section 5.15 ). 3. Disconnect the R TC battery cable 1 from the system board. 4. Slide the R TC battery out of the clips in the top cove r 2 and re m ove t he b at te r y . R emo v ing the R T C Battery Re verse the abo ve procedure to install the R TC battery .
5–34 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5 . 1 7 Securit y Module ( TP M) 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the LED switch cover (refer to Section 5.15 ). 3. Remov e the PM3.5×3.0 screw 1 that secures the security card to the system board. 4. Lift the security module straight up 2 to disconnect it from the system board. R emo v ing the TP M Sec ur ity Module Re verse the abo ve procedure to install the security card. Spare P ar t Number Information Security Module (TPM) 345856-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 5 5 . 1 8 Di sp la y Asse mbl y 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Disconnect the wireless antenna cables from the Mini PCI wireless communications board (refer to Section 5.12 ). 4. Remov e the LED switch cover (refer to Section 5.15 ). 5. Disconnect the display cable 1 from the system board. 6. Remov e the wireless antenna cables from the opening 2 and the clips 3 in the top cov er . Disconnecting the Dis pla y Cables Spare P ar t Number Information 15.0-inch, UXGA, TFT 15.0-inch, SXGA , TFT 15.0-inch, XGA, TFT 345060-001 345059-001 345058-001
5–3 6 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 7. Position the notebook with the rear facing to ward you. 8. Remov e the two T8M2.0×6.0 scre ws 1 that secure the display hinge cov ers to the notebook. 9. Remov e the two T8M2.0×6.0 scre ws 2 that secure the display assembly to the notebook. R emo v ing the Displa y Sc r e w s
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 7 10. Lift the display assembly straight up 1 to remov e it from the notebook. 11. If necessary , remov e the display hinge co vers 2 from the display assembly . ✎ The display hinge cov ers are included in the Miscellaneous Plastics Kit, spare part number 345066-001. R emo v ing the Displa y Assembl y Re verse the abo ve procedure to install the display assembly .
5–3 8 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 1 9 T o p C ove r 1. Prepare the notebook for disassembly (refer to Section 5.3 ). 2. Remov e the keyboard (refer to Section 5.9 ). 3. Remov e the LED switch cover (refer to Section 5.15 ). 4. Remov e the display assembly (refer to Section 5.18 ). 5. T urn the notebook upside do wn with the front facing you. 6. Remov e the 17 T8M2.0×6.0 screws that secure the top co ver to the notebook. R emo v ing the T op Co v er Sc re ws Spare P ar t Number Information T op cov er (includes T ouchP ad and speak er) 345061-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 9 7. T urn the notebook right-side up with the front facing you. 8. Remov e the TM2.0×4.0 screw 1 near the fan that secures the top cov er to the notebook. 9. Lift the front edge of the top cov e r 2 until the speaker cable 3 , T ouchPad cable 4 , and microphone cable 5 are accessible. R eleasing the T op Co v er
5–40 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 10. Disconnect the speaker 1 and microphone cables 2 . 11. Release the ZIF connector 3 to which the T ouchPad cable is attached and disconnect the T ouchPad cable 4 from the system board. Disconnecting the T op Co ver C ables 12. Remov e the top cover . Re verse the abo ve procedure to install the top cov er .
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–41 5 .20 S peak er ✎ The speaker is included with the top co v er , spare part number 345061-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K e yboard (refer to Section 5.9 ) ❏ LED switch co ver (refer to Section 5.15 ) ❏ Display assembly (refer to Section 5.18 ) ❏ T op cov er (refer to Section 5.19 ) 2. T urn the top cov e r upside do wn with the rear facing you. 3. Remov e the fi v e T8M2.0×4.0 scre ws 1 and one T8M2.0×6.0 scre w 2 that secure the speaker to the top co v er . 4. Remov e the speaker 3 from the top cov er . R emo v ing the Speak er Re verse the abo ve procedure to install the speaker .
5–4 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 2 1 T o u c h Pa d ✎ The T ouchPad and bracket are included with the top co ver , spare part number 345061-001. 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K e yboard (refer to Section 5.9 ) ❏ LED switch co ver (refer to Section 5.15 ) ❏ Display assembly (refer to Section 5.18 ) ❏ T op cov er (refer to Section 5.19 ) ❏ Speaker (refer to Section 5.20 ) 2. Remov e the three T orx T8M2.0×3.5 scre ws 1 that secure the T ouchPad and bracket to the top co ver . 3. Lift the left side of the bracket 2 , then slide the brack et to the left. R emo v ing the T ouchP ad Br ac k et
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Guide 5–43 4. Remov e the bracket. 5. Remov e the T ouchPad 1 from the top co ver . 6. Release the ZIF connector 2 to which the T ouchPad cable is attached and disconnect the cable 3 . R emo v ing the T ouchP ad Re verse the abo ve procedure to install the T ouchPad and bracket.
5–44 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .2 2 F an Asse mbl y 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K e yboard (refer to Section 5.9 ) ❏ Heat sink (refer to Section 5.13 ) ❏ LED switch co ver (refer to Section 5.15 ) ❏ Display assembly (refer to Section 5.18 ) ❏ T op cov er (refer to Section 5.19 ) Spare P ar t Number Information F an assembly 345065-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 5 2. Disconnect the fan cable 1 . 3. Remov e the T8M2.0×4.0 screw 2 that secures the fan assembly to the notebook. 4. Remov e the fan assembly 3 from the notebook. 5. Remov e the three PM1.5×4.0 screws 4 that secure the fan to the f an housing. 6. Remov e the fan 5 . R emo v ing the F an Re verse the abo ve procedure to install the fan.
5–46 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 2 3 Sys t e m B o a r d ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defectiv e system board and installed on the replacement system board: ■ Memory expansion boards (refer to Section 5.10 ) ■ Modem board (refer to Section 5.11 ) ■ Mini PCI communications board (refer to Section 5.12 ) ■ Heat sink (refer to Section 5.13 ) ■ Processor (refer to Section 5.14 ) ■ Real time clock battery (refer to Section 5.16 ) ■ Security card (refer to Section 5.17 ) 1. Prepare the notebook for disassembly (refer to Section 5.3 ) and remov e the following components: ❏ K e yboard (refer to Section 5.9 ) ❏ LED switch co ver (refer to Section 5.15 ) ❏ Display assembly (refer to Section 5.18 ) ❏ T op cov er (refer to Section 5.19 ) ❏ Fan (refer to Section 5.22 ) Spare P ar t Number Information System board with 128 MB of video memor y System board with 64 MB of video memor y ✎ Both system boards in clude thermal grease. 349206-001 345064-001
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 7 2. Remov e the four T8M2.0×4.0 screws that secure the system board to the notebook. R emo v ing the S ys tem Boar d Scr ew s
5–4 8 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 3. Flex and hold the front right corner of the base enclosure out 1 to allo w the system board to clear the base enclosure. 4. Lift the front edge of the system board 2 until the board clears the base enclosure. 5. Slide the system board to ward you 3 to remo v e it from the notebook. R emo v ing the S ys tem Boar d
Re mov al and Replacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 9 6. If necessary , disconnect the modem cable from the system board and remov e the cable. ✎ The modem cable is included in the Miscellaneous Cables Kit, spare part number 345056-001. R emo v ing the Modem Ca ble Re verse the abo ve procedure to install the modem cable and system board.
Maintenance and Serv ice Gui de 6–1 6 Spec ifi ca tions This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Notebook Dimensions Height Width Depth 4.1 cm 32.6 cm 27.5 cm 1.61 in 12.83 in 10.83 in W e ight (with main batter y pac k and MultiBa y weight sa v er) 2.95 kg 6.50 lb Stand-alone power requirements Nominal operating v oltage (Li-Ion) Maximum operating power P eak operating po wer 14.4 VDC 60.0 W 65.0 W Te m p e r a t u r e Operating (not writing optical drive) Nonoperating 10°C to 35°C -20°C to 60°C 50°F to 95°F -4°F to 140°F Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 90%, 38.7°C (101.6°F) maximum wet b ulb temperature
6–2 Maintenance and Serv ice Gui de Spe cificat ion s Altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) 0 to 3,048 m 0 to 9,144 m 0 to 10,000 ft 0 to 30,000 ft Shock Operating Nonoperating 40 g, 2 ms, half-sine 240 g, 2 ms, half-sine ✎ Applicable product safety standards specify thermal limits for plastic surfaces. The notebook operates well within this range of temperatures. Ta b l e 6 - 1 Notebook (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–3 Ta b l e 6 - 2 15.0-inch, UXGA, TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 140 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.191 × 0.191 mm 1680 × 1200 RGB v er tical str ipe Bac klight Edge lit Character displa y 80 × 25 T otal power consumption 6.5 W Viewing angle /- 85° horizontal, 15/-35° v er tical typical
6–4 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 6 - 3 15.1-inch, SXGA , TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.218 × 0.218 mm 1400 × 1050 RGB v er tical str ipe Bac klight Edge lit Character displa y 80 × 25 T otal power consumption 5.75 W Viewing angle /- 35° horizontal, 15/-35° v er tical typical
Spe cificat ion s Maintenance and Serv ice Gui de 6–5 Ta b l e 6 - 4 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 29.9 cm 22.8 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 150:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1280 × 800 RGB v er tical str ipe Bac klight Edge lit Character displa y 80 × 25 T otal power consumption 5.75 W Viewing angle /- 35° horizontal, 15/-35° v er tical typical
6–6 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-5 Har d Drives 80-GB 60-GB 40-GB User capacity per drive 1 80 GB 60 GB 40 GB Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g Interface type ATA - 5 ATA - 5 ATA - 5 T ransfer rate Synchronous (maximum) Security 100 MB/s ATA s e c u r i t y 100 MB/s A T A security 100 MB/s ATA s e c u r i t y Seek times (typical read, including setting) Single trac k A ver age Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms Logical blocks 2 156,280,320 117,210,240 78,140,160 Disk r otational speed 5400 r pm 5400 r pm 5400 rpm Operating temperature 5°C to 55°C (41°F to 131°F) 5°C to 55°C (41°F to 131°F) 5°C to 55°C (41°F to 131°F) 1 1 GB = 1,073,741,824 bytes . 2 Actual drive specifications ma y diff er slightly . Cer tain restr ictions and e xclusions app ly . Consult the HP Customer Suppor t Center f or details.
Spe cificat ion s Maintenance and Serv ice Gui de 6–7 Ta b l e 6 - 6 External A C Adapter W e ight A C adapter Po w e r c o r d 0.29 kg 0.13 kg 0.65 lb 0.29 lb P ower supply Operating v oltage Operating current Operating frequency range Maximum tr ansient 90 to 264 V A C RMS 1.6 A RMS 47 to 63 Hz A C 4/50 kV Ta b l e 6 - 7 6-cell, Li-Ion Battery Pa ck Dimensions Height Width Depth We i g h t 2.3 cm 6.3 cm 20.7 cm 0.39 kg 0.90 in 2.48 in 8.15 in 0.86 lb Energ y Vo l t a g e Amp-hour capacity W att-hour capacity 11.1 V 3.96 Ah 40 Wh Te m p e r a t u r e Operating Nonoperating 5°C to 45°C -20°C to 60°C 41°F to 113°F -4°F to 140°F Rechar ge time System in Standby mode System on (depending on system pow er consumption) 2 to 3 hours 2 to 5 hours
6–8 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-8 24X Max D VD R W/R and CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thickness 1.2 mm 0.047 in Tr a c k p i t c h 0.74 µm Access time Random Full stroke < 150 ms < 225 ms A udio output level Line-out, 0.7 Vr ms Cache b uffer 128 KB/s Data transfer rate CD-R (24X) CD-R W (10X) CD-ROM (24X) DV D ( 8 X ) Multiword DMA mode 2 3,600 KB/s (150 KB/s at 1X CD rate) 1,500 KB/s (150 KB/s at 1X CD rate) 3,600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate ) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds
Spe cificat ion s Maintenance and Serv ice Gui de 6–9 T able 6-9 24X Max D VD/CD-R W Combo Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thickness 1.2 mm 0.047 in Tr a c k p i t c h 0.74 µm Access time Random Full stroke < 150 ms < 225 ms A udio output level Line-out, 0.7 Vr ms Cache b uffer 128 KB/s Data transfer rate CD-R (24X) CD-R W (10X) CD-ROM (24X) DV D ( 8 X ) Multiword DMA mode 2 3,600 KB/s (150 KB/s at 1X CD rate) 1,500 KB/s (150 KB/s at 1X CD rate) 3,600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate ) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds
6–10 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-10 8X D VD-ROM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thickness 1.2 mm 0.047 in Tr a c k p i t c h 0.74 µm Access time Random D VD media Full stroke D VD media Random CD media Full stroke CD media < 150 ms < 225 ms < 110 ms < 200 ms A udio output level Line-out, 0.7 Vr ms Cache b uffer 512 KB/s Data transfer rate Max 24X CD Max 8X D VD Multiword DMA mode 2 3,600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate ) 16.6 MB/s Star tup time < 10 seconds Stop time < 3 seconds
Spe cificat ion s Maintenance and Serv ice Gui de 6–11 T able 6-11 24X CD-R OM Drive Applicable disc DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disc diameter Standard disc Mini disc 12 cm 8 cm 4.72 in 3.15 in Disc thickness 1.2 mm 0.047 in Tr a c k p i t c h 1.6 µm Access time Random Full stroke < 150 ms < 300 ms A udio output level Line-out, 0.7 Vr ms Cache b uffer 128 KB/s Data transfer rate Sustained (16X) Va r i a b l e Multiword DMA mode 2 2,400 KB/s 1,500 to 3,600 KB/s (10X to 24X) 16.6 MB/s Star tup time < 8 seconds Stop time < 4 seconds
6–12 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-12 System DMA Har dware DMA System Function DMA0 A vailab le f or audio DMA1* Enter tainment audio (def ault; alter nate = DMA0, DMA3, none) DMA2* Disk ette drive DMA3 ECP parallel por t LPT1 (def ault; alter nate = DMA0, none) DMA4 DMA controller cascading (not av ailable) DMA5* A v ailable f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
Spe cificat ion s Maintenance and Serv ice Gui de 6–13 T able 6-13 System Interrupts Har dware IRQ System Function IRQ0 System timer IRQ1 K eyboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 A udio (default)* IRQ6 Disk ette drive IRQ7 P arallel por t IRQ8 R TC IRQ9 Assigned b y operating system IRQ10 Assigned by oper ating system IRQ11 Assigned by oper ating system IRQ12 Inter nal point stick or e xter nal mouse IRQ13 Infrared IRQ14 Primar y IDE interf ace IRQ15 Secondar y IDE interface ✎ PC Cards ma y asser t IRQ3, IR Q4, IRQ5, IRQ7, IRQ9, IRQ10, IRQ11, or IRQ15. Either the in frared or the serial por t may asser t IRQ3 or IRQ4. *Def ault configuration; audio possib le configur ations are IRQ5, IRQ7, IRQ9, IRQ10, or none.
6–14 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-14 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller 1 010 - 01F Unused 020 - 021 Interrupt controller 1 022 - 024 Opti chipset configuration registers 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration f or CPU 040 - 05F Counter/t imer registers 044 - 05F Unused 060 K eyboard controller 061 P or t B 062 - 063 Unused 064 K eyboard controller 065 - 06F Unused 070 - 071 NMI enable/R TC 072 - 07F Unused 080 - 08F DMA page registers 090 - 091 Unused 092 P or t A 093 - 09F Unused 0A0 - 0A1 Interrupt controller 2
Spe cificat ion s Maintenance and Serv ice Gui de 6–15 I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 Secondar y fix ed disk controller 178 - 1EF Unused 1F0 - 1F7 Pr imar y fix ed disk controller 1F8 - 200 Unused 201 Jo ystick (decoded in ESS1688) 202 - 21F Unused 220 - 22F Enter tainment audio 230 - 26D Unused 26E - 26 Unused 278 - 27F Unused 280 - 2AB Unused 2A0 - 2A7 Un used 2A8 - 2E7 Un used 2E8 - 2EF Reser v ed seri al por t T able 6-14 System I/O Addresses (Continued)
6–16 Maintenance and Serv ice Gui de Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette drive controller 378 - 37F Par allel por t (LPT1/default) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Reser ved (parallel por t/no EPP suppor t) 3C0 - 3DF V GA 3E0 - 3E1 PC Card controller in CPU 3E2 - 3E3 Un used 3E8 - 3EF Inter nal modem 3F0 - 3F7 “A” diskette controller 3F8 - 3FF Serial por t (COM1/def ault) CF8 - CFB PCI configuration inde x register (PCIDIV O-1) CFC - CFF PCI configuration data register (PCIDIV O-1) T able 6-14 System I/O Addresses (Continued)
Maintenance and Serv ice Gui de A–1 A Conn ec tor P in As si gnmen ts Ta b l e A - 1 RJ-45 Netw ork Interface Pin Signal Pin Signal 1 T ransmit 5 Unused 2 T ransmit – 6 Receive – 3 Receiv e 7 Unused 4U n u s e d 8 U n u s e d
A–2 Maintenance and Serv ice Gui de Connec tor P in Assignmen ts Ta b l e A - 2 RJ-11 Modem Pin Signal Pin Signal 1 TX (ISDN modem) 4 Ring (modem) 2 TX- (ISDN modem) 5 RX (ISDN modem) 3 Tip (modem) 6 RX- (ISDN modem) Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 5 VDC 3 Data 2 Data – 4 Ground
Connec tor P in Assignments Maintenance and Serv ice Gui de A–3 Ta b l e A - 4 S-Video Pin Signal Pin Signal 1 Ground (Y) 3 Y -Luminance (Intensity) 2 Ground (C) 4 C-Chrominance (Color) Ta b l e A - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Hor izontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B cloc k 8 Ground analog 1 2 43
A–4 Maintenance and Serv ice Gui de Connec tor P in Assignmen ts Ta b l e A - 6 A udio Line-Out Pin Signal 1G r o u n d 2 Left audio out 3 Right audio out Ta b l e A - 7 Micr ophone Pin Signal Pin Signal 1 A udio in 2 Ground
Connec tor P in Assignments Maintenance and Serv ice Gui de A–5 Ta b l e A - 8 P arallel Pin Signal Pin Signal 1 Strobe 14 A uto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize paper 4 Data bit 2 17 Select in 5 Data bit 3 18 Ground 6 Data bit 4 19 Ground 7 Data bit 5 20 Ground 8 Data bit 6 21 5VS 9 Data bit 7 22 PTF 10 Ac knowledge 23 EXTFDD_VCC ( 5V) 11 Busy 24 Ground 12 P aper end 25 Ground 13 Select
A–6 Maintenance and Serv ice Gui de Connec tor P in Assignmen ts Ta b l e A - 9 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receiv e data 7 Ready to send 3 T ransmit data 8 Clear to send 4 Data terminal ready 9 Ring indicator 5G r o u n d
Maintenance and Serv ice Gui de B–1 B P o w er C ord Requiremen ts The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 V A C. The po wer cord included with the notebook meets the requirements for use in the country where the equipment is purchased. Po wer cords for use in other countries must meet the requirements of the country where the notebook is used. For more information on po wer cord requirements, contact an HP authorized reseller or service provider .
B–2 Maintenance and Se rvice Gui de P ow er Cor d Requirements Gen eral Requiremen ts The requirements listed belo w are applicable to all countries: ■ The length of the po wer cord must be at least 1.5 m (5.00 ft) and a maximum of 2.0 m (6.50 ft). ■ All po wer cords must be appro ved b y an acceptable accredited agency responsible for e v aluation in the country where the po wer cord will be used. ■ The po wer cord must ha ve a minimum current capacity of 10 amps and a nominal v oltage rating of 125 or 250 V A C, as required by each country’ s po wer system. ■ The appliance coupler must meet the mechanical conf iguration of an EN 60 320/IEC 320 Standard Sheet C13 connector for mating with the ap pliance inlet on the back of the notebook.
P ow er Cor d Requir ements Maintenance and Serv ice Gui de B–3 Countr y- Spec ifi c Requir ements 3-Conductor P ower Cor d Requirements Country Accredited Agency Applicable Note Number A ustralia EANSW 1 A ustria O VE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 Fr a n c e U T E 1 Ger many VDE 1 Italy IMQ 1 Jap a n ME T I 3 The Netherlands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1
B–4 Maintenance and Se rvice Gui de P ow er Cor d Requirements United Kingdom BSI 1 United States UL 2 Notes 1. The fle xib le cord must be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm 2 conductor size . P ow er cord fittings (a ppliance coupler and wall plug) m ust bear the cer tification mar k of the ag ency responsib le f or e v aluation in the countr y where it will be used. 2. The fle xib le cord must be T ype SPT -3 or equiv alent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , fle xible cord , and wall plug m ust bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VC T or VCTF , 3-conductor , 1.00 mm 2 conductor size . The wall plug m ust be a two-pole g rounding type with a Japanese Industrial Standard C8303 (7 A, 125 V) configuration. 3-Conductor P ower Cor d Requirements (Continued) Country Accredited Agency Applicable Note Number
Maintenance and Serv ice Gui de C–1 C Sc r e w List ing This appendix provides specif ication and reference information for the scre ws used in the notebook. All scre ws listed in this appendix are a v ailable in the Miscellaneous Scre w Kit, spare part number 345057-001.
C–2 Maint enance and Servi ce Guide Scr e w Listing Ta b l e C - 1 T orx T5M2.5×4.0 Screw Color Qty . Length Thread Head Width Silv er 2 4.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screws that secure the hard drive to the hard driv e frame (documented in Section 5.3 ) mm Ta b l e C - 2 Phillips PM3.0×3.5 Screw Color Qty . Length Thread Head Width Silv er 2 3.5 mm 3.0 mm 4.5 mm Where used: 2 T wo screws that secure the hard drive to the hard driv e frame (documented in Section 5.3 ) mm Ta b l e C - 3 M2.0×10.0 Alignment Pin Color Qty . Length Thread Head Width Silv er 2 10.0 mm 2.0 mm 4.0 mm Where used: 3 T wo alignment pins that secure the hard drive to the hard drive fr ame (documented in Section 5.3 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–3 T orx T5M2 . 5×4. 0 Sc r e w , Phillips P M3. 0×3 . 5 Sc re w , and M2 .0×10. 0 Alignment P in Locati ons
C–4 Maint enance and Servi ce Guide Scr e w Listing T orx T8M2 . 0×6 . 0 Sc r e w Locatio ns Ta b l e C - 4 T orx T8M2.0×6.0 Screw Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: 1 One screw that secures the har d drive cov er to the notebook (documented in Section 5.3 ) 2 One screw that secures the Bl uetooth co ver to the notebook (documented in Section 5.6 ) 3 One screw that secures the optical drive to the notebook (documented in Section 5.8 ) 4 One screw that secures th e ke yboard to the notebook (documented in Section 5.9 ) 5 One screw that secures the LE D s witch cov er to the notebook (documented in Section 5.15 ) 6 F our screws that secure the displa y assembly and hinge co v ers to the notebook (documented in Section 5.18 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–5 T orx T8M2 . 0×6 . 0 Sc r e w Locatio ns Ta b l e C - 4 T orx T8M2.0×6.0 Screw (Continued) Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: Se v enteen screw s that secure the top cov e r to the notebook (documented in Section 5.19 ) mm
C–6 Maint enance and Servi ce Guide Scr e w Listing T orx T8M2 . 0×6 . 0 Sc r e w Locatio n Ta b l e C - 4 T orx T8M2.0×6.0 Screw (Continued) Color Qty . Length Thread Head Width Black 27 6.0 mm 2.0 mm 5.0 mm Where used: One scre w that secures the speaker to the top cov er (documented in Section 5.20 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–7 Phillips P M1. 5×3 .0 Sc re w Locations Ta b l e C - 5 Phillips PM1.5×3.0 Screw Color Qty . Length Thread Head Width Black 3 3.0 mm 1.5 mm 3.0 mm Where used: T wo screws that secure the Bluetooth board to the Bluetooth co v er (documented in Section 5.6 ) mm
C–8 Maint enance and Servi ce Guide Scr e w Listing P h i l l i p s PM 3.5 × 3. 0 S cr ew Lo c a t io n Ta b l e C - 6 Phillips PM3.5×3.0 Screw Color Qty . Length Thread Head Width Black 3 3.0 mm 1.5 mm 3.5 mm Where used: One scre w that secures the secu r ity card to the system board (documented in Section 5.17 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–9 T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: 1 T wo screws that secure the mo dem board to the system board (documented in Section 5.11 ) 2 T wo screws that secure the Mini PC I communications board and shield to the system board (documented in Section 5.12 ) 3 Fiv e screws that secure the he at sink to the system board (documented in Section 5.13 ) 4 One screw that secures th e top cov er to the notebook (documented in Section 5.19 ) mm
C–10 Maintenance and Serv ice Gui de Scr e w Listing T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: Fiv e screws that secure the speak er to the top cover (documented in Section 5.20 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–11 T orx T8M2 . 0×4. 0 Sc r e w L ocation Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: One scre w that secures the f an assembly to the notebook (documented in Section 5.22 ) mm
C–12 Maintenance and Serv ice Gui de Scr e w Listing T orx T8M2 . 0×4. 0 Sc r e w L ocations Ta b l e C - 7 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width P ewter 20 4.0 mm 2.0 mm 5.0 mm Where used: F our scre ws that secure the system board to the notebook (documented in Section 5.23 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de C–13 T orx T8M2 . 0×3 .5 Sc r e w L ocations Ta b l e C - 8 T orx T8M2.0×3.5 Screw Color Qty . Length Thread Head Width Silv er 3 3.5 mm 2.0 mm 5.0 mm Where used: Three screws that secure the T ouc hP ad and brack et to the top cov er (documented in Section 5.21 ) mm
C–14 Maintenance and Serv ice Gui de Scr e w Listing Phillips P M1. 5×4. 0 Scr ew L ocations Ta b l e C - 9 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.0 mm 1.5 mm 3.0 mm Where used: Three screws that secure the f an to the f an housing (documented in Section 5.22 ) mm
Maintenance and Serv ice Gui de Inde x–1 Ind e x 1394 connector 1–21 A AC adapter spare part number 3–13, 3–14 specifications 6–7 application key 1–24 audio line-out jack location 1–19 pin assignments A–4 audio troubleshooting 2–25 B base enclosure, spare part number 3–7 battery bay 1–22, 1–30 battery bezel removal 5–7 battery light 1–28 battery pack release latch 1–30 removal 5–6 spare part number 3–7 , 5–6 specifications 6–7 Bluetooth board removal 5–13 spare part number 3–7, 5–13 Bluetooth cable illustrated 3–10 removal 5–14 Bluetooth compartment 1–30 Bluetooth cover removal 5–13 bottom components 1–29 C cables, service considerations 4–2 caps lock key 1–24 caps lock light 1–26 carrying case, spare part numbers 3–13 CD-ROM Drive illustrated 3–11 spare part number 3–7 , 3–12 specifications 6–11 components bottom 1–29 front 1–18 keyboard 1–23 left-side 1–20 rear 1–20 right-side 1–18 top 1–25 , 1–27
Inde x–2 Maintenance and Serv ice Guide Inde x Computer Setup Advanced Menu 2–5 File Menu 2–3 overview 2–2 Security Menu 2–4 connector pin assignments audio line-out jack A–4 external monitor connector A–3 microphone jack A–4 modem jack A–2 monitor connector A–3 network jack A–1 parallel connector A–5 RJ-11 telephone jack A–2 RJ-45 network jack A–1 serial connector A–6 S-Video connector A–3 Universal Serial Bus (USB) connector A–2 connectors, service considerations 4–2 cursor control keys 1–24 D design overview 1–31 diagnostics configuration information 2–7 test information 2–8 Diagnostics for Windows 2–2 , 2–7 disassembly sequence chart 5–3 diskette drive OS loading problems 2–23 spare part number 3–7 , 5–12 display assembly illustrated 3–2 removal 5–35 spare part numbers 3–3, 5–35 specifications 6–3, 6–4, 6–5 display lid switch 1–26 display release latch 1–19 DMA specifications 6–12 docking connector 1–30 drive light 1–28 drives, preventing damage 4–3 DVD RW/R and CD-RW Combo Drive illustrated 3–11 spare part number 3–7 , 3–12 specifications 6–8 DVD/CD-RW Combo Drive illustrated 3–11 spare part number 3–7 , 3–12 specifications 6–9 DVD-ROM Drive illustrated 3–11 spare part number 3–7 , 3–12 specifications 6–10
Inde x Maintenance and Serv ice Gui de Inde x–3 E electrostatic discharge 4–4, 4–8 external monitor connector location 1–22 pin assignments A–3 F f1 through f12 function keys 1–24 fan assembly illustrated 3–4, 3–6 removal 5–44 spare part number 3–5, 5–44 features 1–13 feet, locations 5–11 fn key 1–24 front components 1–18 G grounding equipment and methods 4–7 H hard drive connector 5–10 cover latch 1–30 disassembly 5–10 illustrated 3–11 location 1–30 OS loading problems 2–20 removal 5–8 spare part numbers 3–7, 3–11 , 5–8 specifications 6–6 hard drive cover removal 5–8 heat sink removal 5–27 spare part number 3–5 , 5–27 hinge cover removal 5–37 I I/O address specifications 6–14 infrared port 1–19 integrated smart card removal 5–15 spare part number 3–5 , 5–15 internal keypad 1–24 interrupt specifications 6–13 K keyboard components 1–23 illustrated 3–2 removal 5–18 spare part numbers 3–3, 5–18 troubleshooting 2–28 L LED switch cover illustrated 3–2 removal 5–31 spare part number 3–3 , 3–17 , 5–31 left-side components 1–20 light 1–28
Inde x–4 Maintenance and Serv ice Guide Inde x M mass storage devices, spare part numbers 3–11 memory expansion board illustrated 3–4, 3–6 removal 5–22 spare part numbers 3–5, 5–22 microphone 1–26 microphone jack location 1–19 pin assignments A–4 Mini PCI communications board illustrated 3–4, 3–6 removal 5–24 shield removal 5–25 spare part numbers 3–7, 5–24 Miscellaneous Cables Kit components 3–5, 3–10 spare part number 3–5, 3–10 Miscellaneous Plastics Kit components 3–3, 3–9 spare part number 3–3 , 3–9 models 1–2 modem board illustrated 3–4, 3–6 removal 5–23 spare part number 3–5, 5–23 modem cable illustrated 3–10 removal 5–49 modem jack location 1–19 pin assignments A–2 modem, troubleshooting 2–30 monitor connector location 1–22 pin assignments A–3 MultiBay 1–19, 1–28, 1–30 MultiBay devices illustrated 3–12 removal 5–12 spare part numbers 3–7, 3–12 , 5–12 mute button 1–19 N network jack, pin assignments A–1 network, troubleshooting 2–30 nonfunctioning device, troubleshooting 2–18, 2–27 notebook feet, locations 5–11 notebook specifications 6–1 num lock key 1–24 num lock light 1–26 O operating system loading, troubleshooting 2–19 optical drive location 1–22, 1–30 removal 5–12, 5–17 spare part numbers 3–7, 3–12 , 5–12 , 5–17
Inde x Maintenance and Serv ice Gui de Inde x–5 P packing precautions 4–5 parallel connector location 1–22 pin assignments A–5 password, clearing 1–16 PC Card eject buttons 1–19 PC Card slots 1–19 plastic parts 4–2 pointing device, troubleshooting 2–29 pointing stick 1–26 pointing stick buttons 1–28 port replicator spare part numbers 3–13 troubleshooting 2–18 power button 1–26 power connector 1–22 power cord, spare part numbers 3–13 power management features 1–17 power, troubleshooting 2–12 power/Standby light 1–28 processor illustrated 3–4, 3–6 removal 5–29 spare part numbers 3–5, 5–29 Q Quick Launch buttons 1–26 R real time clock battery illustrated 3–9 removal 5–33 rear components 1–20 release latch 1–30 removal preliminaries 4–1 procedures 5–1 replacement preliminaries 4–1 procedures 5–1 right-side components 1–18 RJ-11 telephone jack location 1–19 pin assignments A–2 RJ-45 network jack location 1–22 pin assignments A–1 S Screw Kit contents 3–13 spare part number 3–13, 3–16 scroll lock light 1–26 Secure Digital (SD) slot 1–19 security cable slot 1–22 security card, illustrated 3–4, 3–6 security module removal 5–34 spare part number 3–5 , 3–17 , 5–34 serial connector location 1–22 pin assignments A–6 serial number 1–30, 3–1, 5–2 service considerations 4–2
Inde x–6 Maintenance and Serv ice Guide Inde x smart card removal 5–15 spare part number 3–5, 5–15 speaker, removal 5–41 specifications AC adapter 6–7 battery pack 6–7 CD-ROM Drive 6–11 display 6–3, 6–4, 6–5 DMA 6–12 DVD RW/R and CD-RW Combo Drive 6–8 DVD/CD-RW Combo Drive 6–9 DVD-ROM Drive 6–10 hard drive 6–6 I/O addresses 6–14 interrupts 6–13 notebook 6–1 static shielding materials 4–8 stereo speakers 1–19 S-Video connector location 1–22 pin assignments A–3 system board illustrated 3–4, 3–6 removal 5–46 spare part numbers 3–5, 5–46 T tools required 4–1 top components 1–25, 1–27 top cover illustrated 3–2 removal 5–38 spare part number 3–3 , 5–38 TouchPad buttons 1–28 location 1–28 removal 5–42 TPM removal 5–34 spare part number 3–5 , 3–17 , 5–34 transporting precautions 4–5 troubleshooting audio 2–25 Computer Setup 2–2 Diagnostics for Windows 2–7 flowcharts 2–10 keyboard 2–28 modem 2–30 network 2–30 nonfunctioning device 2–18 , 2–27 operating system loading 2–19 overview 2–1 pointing device 2–29 port replicator 2–18 power 2–12 video 2–16
Inde x Maintenance and Serv ice Gui de Inde x–7 U Universal Serial Bus (USB) connector location 1–21 pin assignments A–2 V vent 1–22 , 1–26 video troubleshooting 2–16 volume control buttons 1–19 W Windows logo key, location 1–24 wireless LAN, spare part numbers 3–7 wireless on/off light 1–28