HP Compaq nx6325 Maintenance And Service Manual

Main tenan ce and Ser vice Gu id e HP C om paq nx6 3 2 5 Not ebook P C HP C ompaq nx6 315 Notebook P C Doc ument P ar t Number : 417 9 6 7 -001 June 2006 This guide is a troubleshooting reference used for maintaining and servicing the computer . It prov ides comprehensi ve information on identifying computer features, components, and spare parts; troubleshooting computer problems; and performing computer disassembly procedures.
© Copyright 2006 He wlett-P ackard Dev elopment Compan y , L.P . Microsoft and W indo ws are U.S. re gistered trademarks of Microsoft Corporation. AMD, Sempron, T urion, and combinations thereof, are trademarks of Adv anced Micro De vices, Inc. Bluetooth is a trademark o wned by its proprietor and used b y He wlett-Packard Compan y under license. Intel is a trademark or registered trademark of Intel Corporation in the United States and other countries. SD Logo is a trademark of its proprietor . Jav a is a trademark of Sun Microsystems, Inc. The information contained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompan ying such products and services. Nothing herein should be construed as constituting an additional warranty . HP shall not be liable for technical or editorial errors or omissions contained herein. Maintenance and S erv ice Gui de HP Co mpaq nx6 3 2 5 Notebook PC HP Co mpaq nx6 315 Noteboo k P C F irst E dition: June 2006 Document P ar t Number: 417 9 6 7 -001
Maintenance and Serv ice Gui de iii Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Computer . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.5 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–22 2 Troubleshooting 2.1 Computer Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1 Computer Setup Defaults . . . . . . . . . . . . . . . . . . . . . 2–3 Computer Setup Menus . . . . . . . . . . . . . . . . . . . . . . . 2–4 2.2 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . 2–10
i v Maintenance and Serv ice Guide Con ten ts 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Computer Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Plastics Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–12 3.4 Cable Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–13 3.5 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . . 3–14 3.6 Miscellaneous (Not Illustrated) . . . . . . . . . . . . . . . . 3–15 3.7 Sequential Part Number Listing . . . . . . . . . . . . . . . 3–18 4 Removal and Replacement Preliminaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2 Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.3 Preventing Damage to Removable Drives . . . . . . . . 4–3 4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4 4.5 Packaging and Transporting Precautions . . . . . . . . . 4–5 4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 4–6 4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–7
Cont ent s Maintenance and Serv ice Gui de v 5 Removal and Replacement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Computer for Disassembly . . . . . . . . . 5–4 5.4 Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6 5.5 Computer Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–10 5.6 Bluetooth Module . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11 5.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 5–12 5.8 Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14 5.9 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16 5.10 Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–20 5.11 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–21 5.12 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–24 5.13 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–26 5.14 Mini Card WLAN Module . . . . . . . . . . . . . . . . . . 5–27 5.15 Internal Memory Module . . . . . . . . . . . . . . . . . . . 5–29 5.16 Switch Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–31 5.17 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–33 5.18 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–36 5.19 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–40 5.20 Microphone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–42 5.21 Modem Module . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–44 5.22 USB/Audio Board . . . . . . . . . . . . . . . . . . . . . . . . . 5–46 5.23 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–48
v i Maintenance and Serv ice Guide Con ten ts 6 Specifications A Screw Listing B Backup and Recovery C Display Component Recycling D Connector Pin Assignments E Power Cord Set Requirements Index
Maintenance and Serv ice Gui de 1–1 1 Pr oduc t D esc ription The HP Compaq nx6325 Notebook PC and HP Compaq nx6315 Notebook PC of fer adv anced modularity , AMD T u rion™ Mobile 64 T echnology and Mobile AMD Sempron™ processors, and extensi ve multimedia support. HP Compaq nx6 3 2 5 Notebook P C and HP Compaq nx6 315 Notebook P C
1–2 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1.1 F e a t u r e s ■ The follo wing processors are a v ailable, v arying b y computer model: ❏ AMD T urion 64 ML-60 (2.00-GHz) ❏ AMD T urion 64 ML-56 (1.80-GHz) ❏ AMD T urion 64 ML-52 (1.60-GHz) ❏ AMD T urion 64 ML-50 (1.60-GHz) ❏ Mobile AMD Sempron 3500 (1.80-GHz) ❏ Mobile AMD Sempron 3400 (1.80-GHz) ❏ Mobile AMD Sempron 3200 (1.60-GHz) ■ 15.0-inch, SXGA WV A, TFT (1400 × 1050) or 15.0-inch, XGA, TFT (1280 × 800) with ov er 16.8 million colors, v arying b y computer model ■ 100-, 80-, 60-, and 40-GB high-capacity hard dri v e, v arying by computer model ■ 256-MB DDR2 synchronous DRAM (SDRAM) at 533 MHz, expandable to 2.0 GB ■ Microsoft® W indows® XP Professional ■ Full-size W indows k eyboard with embedded numeric k e ypad ■ T ouchP ad pointing de vice ■ Integrated 10 Base-T/100 Base-TX/1000 Base-T Ethernet local area network (LAN) netw ork interface card (NIC) with RJ-45 jack ■ Integrated high-speed 56K modem with RJ-11 jack ■ Integrated wireless support for Mini Card IEEE 802.11a/b/g or 802.11b/g W ireless LAN (WLAN) device ■ Support for one optional T ype I or T ype II 32-bit (CardBus) or 16-bit PC Card, v arying b y computer model
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–3 ■ External 65-watt A C adapter with 3-wire po wer cord ■ 6-cell Li-Ion battery ■ Stereo speakers ■ V olume up, vo lume mute, and volume do wn buttons ■ Support for the follo wing optical dri v es: ❏ D VD±R W and CD-R W Combo Driv e with LightScribe ❏ D VD±R W and CD-R W Combo Driv e ❏ D VD/CD-R W Combo Dri ve ❏ CD-R OM dri ve ■ Connectors: ❏ Accessory battery ❏ Audio-in (microphone) ❏ Audio-out (headphone) ❏ Digital Media Slot (HP Compaq nx6325 models only) ❏ Docking connector (HP Compaq nx6325 models only) ❏ ExpressCard ❏ External monitor ❏ IEEE 1394 ❏ PC Card ❏ Po wer ❏ RJ-11 (modem) ❏ RJ-45 (network) ❏ S-V ideo-out (HP Compaq nx6325 models only) ❏ Uni versal Serial Bus (USB) v . 2.0 (two or three, v arying by computer model)
1–4 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .2 Resettin g t he C omp uter If the computer you are servicing has an unkno wn password, follo w the steps belo w to reset the password. These steps also clear CMOS. ✎ The follo wing steps will not clear an unkno wn password if the stringent security option has been enabled in the BIOS. If stringent security is enabled, the system board must be replaced to reset an unkno wn password. Refer to Section 5.13, “R TC Battery , ” for more information on replacing the system board. Before replacing the system board, perform the steps belo w to be sure that stringent security has been properly enabled. Enabling stringent security provides enhanced protection for the po wer -on password and administrator passw ord and other forms of po wer -on authorization. Stringent security is enabled/disabled by accessing the P assword Options menu in the Computer Setup utility . Refer to Section 2.1, “Computer Setup, ” for more information. 1. Prepare the computer for disassembly (refer to Section 5.3, “Preparing the Computer for Disassembly , ” for more information). Remov e the real-time clock (R TC) battery (refer to Section 5.13, “R TC Battery , ” for more information on removing and replacing the R TC battery). 2. W ait approximately 5 minutes. 3. Replace the R T C battery and reassemble the computer . 4. Connect A C power to the computer . Do not reinsert any batteries at this time. 5. T urn on the computer . All passwords and all CMOS settings ha v e been cleared.
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–5 1. 3 P o w e r M a n a g e m e n t The computer comes with po wer management features that extend battery operating time and conserv e po wer . The computer supports the follo wing po wer management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys for setting the le v el of performance ■ Battery calibration ■ Lid switch standby/resume ■ Po wer b utton ■ Adv anced Conf iguration and Po wer Management (A CPM) compliance
1–6 Maintenance and Serv ice Gui de Pr oduct Desc r iption 1 .4 Exter nal C om ponents The external components on the front of the computer are sho wn belo w and described in T able 1-1. F r ont C omponents Ta b l e 1 - 1 Fr ont Components Item Component Function 1 Displa y release latch Opens the computer . 2 Wireless light On: An integrat ed wireless de vice, such as a wireless local area network (LAN) de vice and/or a Bluetooth® de vice, is turned on. 3P o w e r l i g h t ■ On: The computer is on. ■ Blinking: The computer is in standby . ■ Off: The computer is o ff or in hiber nation.
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–7 4 Batter y light ■ Amber : A batter y is charging. ■ Green: A batter y is close to full charge capacity . ■ Blinking amber : A batter y that is the only av ailable pow er source has reached a low-battery condition. When the batter y reaches a critical lo w-batter y condition, the batter y light begins blinking more quickly . ■ Off: If the computer is plugged into an e xter nal pow er source, the light is turned off when all batteries in the computer are fully charged. If the computer is not plugged into an e xter nal po wer source, the light sta ys off until the batter y reaches a low-battery condition. 5 Drive light Blinking: The hard drive or optical drive is being accessed. 6 Speakers (2) Produce computer sound. 7 Digital Media Slot (HP Compaq nx6325 models only) Suppor ts optional digital card f or mats: SD (Secure Digital) Memor y Card, MultiMediaCard, Memor y Stick, Memory Stick Pro , Memor y Stic k Duo (with adapter), Smar tMedia card, and xD-Picture Card. 8 Digital Media Slot light (HP Compaq nx6325 models only) On: A digital card is being accessed. Ta b l e 1 - 1 Fr ont Components (Continued) Item Component Function
1–8 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the right side of the computer are sho wn belo w and described in T able 1-2. R igh t-Side C ompo nents
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1 USB por t (HP Compaq nx6325 models only) Connects optional USB de vices. 2 1394 por t Connects an optional IEEE 1394 de vice such as a camcorder . 3 RJ-11 (modem) jack Connects a modem cab le. 4 Optical drive Reads an optical disc.
1–10 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the left side of the computer are sho wn belo w and described in T able 1-3. Lef t -S ide Com po ne nt s Ta b l e 1 - 3 Left-Side Components Item Component Function 1 RJ-45 (network) jack Connects a networ k cable . 2 Exter nal monitor por t Connec ts an e xternal monitor . 3 Exhaust v ent Enab les airf lo w to cool inter nal components. Ä T o pre v ent ov erheating, do not obstruct vents . Use the computer only on a hard, flat surf ace. Do not allow another hard surf ace, such as an adjoining optional printer , or a soft surf ace, such as pillo ws or thick rugs or clothing, to bloc k airflo w . ✎ The computer fan starts up automatically to cool internal components and prevent overheating. It is normal for the internal fan to cycle on and off during routine operation.
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–11 4 USB por ts (2) Connect optional USB de vices. 5A u d i o - o u t (headphone) jack Produces system stereo sound when connected to optional pow ered stereo speake rs, headphones , ear buds , a headset, or tele vision audio . 6A u d i o - i n (microphone) jack Connects an optional headset microphone or a monaural microphone . 7 ExpressCard slot (HP Compaq nx6325 models only) Suppor ts optional ExpressCard/54 or ExpressCard/34 cards. 8 PC Card slot (select models only) or smar t card slot (select models only) Suppor ts optional T ype I/II PC Cards, 16-bit PC Cards, and 32-bit (CardBus) or industry standard smar t cards including Java™ Ca r ds. Ta b l e 1 - 3 Left-Side Components (Continued) Item Component Function
1–12 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the rear panel of the computer are sho wn belo w and described in T able 1-4. Re a r P a ne l Co m p on e n t s
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–13 T able 1-4 Rear P anel Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the computer . Ä The security cable is designed to act as a deterrent, but it ma y not pre v ent the computer from being mishandled or stolen. 2 Batter y ba y Holds the primar y batter y . 3 Smar t adapter power connector Connects an A C adapter . 4S - V i d e o - o u t j a c k (HP Compaq nx6325 models only) Connects an optional S-Video de vice, such as a tele vision, VCR, camcorder , ov erhead projector , or video capture card.
1–14 Maintenance and Serv ice Gui de Pr oduct Desc r iption The standard ke yboard components of the computer are sho wn belo w and described in T able 1-5. St andar d K ey boar d Co mponents
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–15 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 f1 to f12 ke ys (12) Ex ecute frequently used system functions when pressed in combination with the fn key . 2 caps lock ke y Enables caps loc k and turns on the caps loc k light. 3 fn ke y Ex ecutes frequently used system functions when pressed in combination with a function ke y or the esc key . 4 Windows logo k e y Displa ys the Windows Star t menu. 5W i n d o w s applications ke y Displa ys a shor tcut menu f or items beneath the pointer . 6 Arrow k e ys Mov e s the cursor around the screen. 7 Embedded numeric ke ypad keys (15) Can be used like the ke ys on an e xternal numeric ke ypad. 8 num lock ke y Enables n umeric lock, tur ns on the embedded numeric ke ypad, and turns on the num loc k light.
1–16 Maintenance and Serv ice Gui de Pr oduct Desc r iption The computer top components are sho wn belo w and described in T a ble 1-6. T op Co mponents , P art 1 T able 1-6 T op Components, Part 1 Item Component Function 1 P ower b utton When the computer is ■ Off , press to turn on the computer . ■ In standby , briefly press to exit standb y . ■ In hiber nation, briefly press to exit hiber nation. If the computer ha s stopped responding and Windows shutdo wn procedures cannot be used, press and hold the pow er button f or at least 5 seconds to tur n off the computer . 2 Displa y s witch Initiates standb y if the displa y is closed while the computer is on.
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–17 3 Inf o Center b utton (HP Compaq nx6325 models only) Launches Inf o Center , which enables y ou to open v arious software solutions. 4 Wireless button T ur ns the wire less f eature on or off , b ut does not create a wireless connection. ✎ To establish a wireless connection, a wireless network must already be set up. 5 Presentation button (HP Compaq nx6325 models only) Star ts the presentation feature . 6 Caps lock light On: caps lock is on. 7 Num loc k light On: num lock or the numeric ke ypad is on. 8 V olume mute button (HP Compaq nx6325 models only) Mutes and restores speaker v olume. 9 V olume down button (HP Compaq nx6325 models only) Decreases speake r volume . 10 V olume up button (HP Compaq nx6325 models only) Increases speake r volume . 11 Inter nal microphone (HP Compaq nx6325 models only) Records sound. T able 1-6 T op Components, P ar t 1 (Continued) Item Component Function
1–18 Maintenance and Serv ice Gui de Pr oduct Desc r iption The computer top components are continued belo w and described in T able 1-7. T op Co mponents , P art 2
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–19 T able 1-7 T op Components, Part 2 Item Component Function 1 T ouchP a d Mov es the pointer and selects or activ ates items on the screen. Ca n be set to perf orm other mouse functions, such as scrolling, selecting, and double-clic king. 2 Left and right T ouchP ad bu tt o n s Function lik e the left and ri ght b uttons on an e xternal mouse. 3 T ouchP ad scroll z one Scrolls up or down. 4 Finger print reader (HP Compaq nx6325 models only) Allows a fingerpr int logon to Windows instead of a pass word logon.
1–20 Maintenance and Serv ice Gui de Pr oduct Desc r iption The external components on the bottom of the computer are sho wn belo w and described in T able 1-8. Bottom Components Ta b l e 1 - 8 Bottom Components Item Component Function 1 Batter y ba y Holds the primar y batter y . 2 Docking connector (HP Compaq nx6325 models only) Connects the an optional doc king de vice. 3 Primar y batter y release latches (2) Releases the primar y batter y from the batter y ba y .
Pr oduct De sc r iption Maintenance and Serv ice Gui de 1–21 4 Exhaust v ents Enable airf low to cool internal components. Ä T o pre v ent ov erheating, do not obstruct vents . Use the computer only on a hard, flat surf ace. Do not allow another hard surf ace, such as an adjoining optional printer , or a soft surf ace , such as pillows or thic k rugs or clothing, to b lock airflo w . ✎ The computer fan starts up automatically to cool internal components and prevent overheating. It is normal for the internal fan to cycle on and off during routine operation. 5 Hard drive ba y Holds the hard drive . 6 Expansion memor y module compar tment Contains the e xpansion memor y module slot. 7 Accessor y batter y connector (e xposed when cov e r is pushed to the rig ht ) Connects an optional accessor y batter y . Ta b l e 1 - 8 Bottom Components (Continued) Item Component Function
1–2 2 Maintenance and Serv ice Guide Pr oduct Desc r iption 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of ke y parts and features of the computer . Refer to Chapter 3, “Illustrated P arts Catalog, ” to identify replacement parts, and Chapter 5, “Remo v al and Replacement Procedures, ” for disassembly steps. The system board provides the follo wing device connections: ■ AMD T urion 64 or Mobile AMD Sempron processors ■ Audio ■ Display ■ ExpressCard ■ Fingerprint reader board (HP Compaq nx6325 models only) ■ Hard dri v e ■ K e yboard and T ouchPad ■ Memory module ■ Mini Card module ■ PC Card Ä CA UTION: T o pr operl y v entilate the com puter , allo w at least a 7 .6 -cm (3-inc h) c lear ance on the left and r igh t sides o f the compu ter . The computer uses an electric fan for v entilation. The fan is controlled by a temperature sensor and is designed to turn on automatically when high temperature conditions exist. These conditions are af fected b y high external temperatures, system po wer consumption, po wer management/battery conserv ation conf igurations, battery fast char gi ng, and software. Exhaust air is displaced through the ventilation grill located on the left side of the computer .
Maintenance and Serv ice Gui de 2–1 2 T roubleshooting Å W ARN IN G: Onl y author i z ed techni c i ans tr ained b y HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e detailed to allo w onl y subas sembl y-/module -lev el r epair . Because o f the comple x ity of the indi v idual boar ds and suba ssembli es , do not attempt to mak e r epair s at the componen t lev el or modifi cations to an y printed w ir ing boar d. Im pr oper r epairs can c r eate a safety ha z ard . An y indicati on of component r eplacement or pr inted w ir ing boar d modif icati on may v oid an y w ar r anty or ex c hange allo wance s. 2. 1 Comp uter Setu p Computer Setup is a preinstalled, R OM-based utility that can be used e ven when the operating system is not w orking or will not load. ✎ Some of the Computer Setup menu items listed in this guide may not be supported by your computer . Pointing de vices are not supported in Computer Setup. Y ou must use the ke yboard to na vigate and make selections. An external k e yboard connected by USB can be used with Computer Setup only if USB leg acy support is enabled. The information and settings in Computer Setup are accessed from the File, Security , Diagnostics, and System Configuration menus.
2–2 Maintenance and Serv ice Gui de T roubleshooting 1. Open Computer Setup by turning on or restarting the computer , and then pressing f10 while the “F10 = R OM Based Setup” message is displayed in the lo wer -left corner of the screen. In Computer Setup, the follo wing shortcuts are a v ailable: ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . ❏ T o close open dialog boxes and return to the main Computer Setup screen esc . 2. Select the Files , Security , Diagnostics , or System Conf iguration menu. 3. T o exit Computer Setup, choose one of the follo wing methods: ❏ T o exit Computer Setup without sa ving your preferences, use the arro w ke ys to select File > Ignor e Changes and Exit . Then follo w the instructions on the screen. ❏ T o sav e your preferences and exit Computer Setup, use the arro w ke ys to select File > Sa ve Changes and Exit . Then follo w the instructions on the screen.
T roubleshooting Maintenance and Serv ice Gui de 2–3 Com pu ter Setup Defaults T o return all settings in Computer Setup to the v alues that were set at the factory: 1. Open Computer Setup by turning on or restarting the computer , and then pressing f10 while the “F10 = R OM Based Setup” message is displayed in the lo wer -left corner of the screen. In Computer Setup, the follo wing shortcuts are a v ailable: ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . ❏ T o close open dialog boxes and return to the main Computer Setup screen esc . 2. Use the arro w ke ys to select File > Restor e defaults , and then press enter . 3. When the conf irmation dialog box opens, press f10 . 4. Select the Restore defaults check box, and then press enter . 5. T o confirm the restoration, press f10 . 6. T o sav e your preferences and exit Computer Setup, use the arro w ke ys to select File > Sa ve Changes and Exit . Then follo w the instructions on the screen. Y our preferences go into ef fect when the computer restarts. ✎ Y our passw ord and security settings are not changed when you restore the factory def ault settings.
2–4 Maintenance and Serv ice Gui de T roubleshooting Comput er Set up Menu s The menu tables in this section provide an o v ervie w of Computer Setup options. ✎ Some of the Computer Setup menu items listed in this chapter may not be supported by your computer . Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ Vie w identification inf o r mation f or the computer and the batter y packs in the system. ■ Vie w specification inf or mation f or the processor , cache and memor y size, system ROM, video re vision, and ke yboard controller ver s i o n. Restore def aults Replace the config uration settings in Computer Setup with f actor y def ault settings. (P assw ord and security settings are not changed when you restore the f actor y def ault settings.) Ignore changes and e xit Cancel ch anges entered during the current session. Then e xit an d restar t the computer . Sav e changes and exit Sav e changes entered dur ing the current session. Then e xit and restar t th e computer . Y our changes go into eff ect when the computer restar ts.
T roubleshooting Maintenance and Serv ice Gui de 2–5 Ta b l e 2 - 2 Security Menu Select T o Do This Setup pass word Enter , change, or delete a setup pass word. P ower-on pass word Enter , change, or delete a pow er-on pass word. P ass w ord options ■ Enable/disab le str ingent security . ■ Enable/disab le passwo rd requirement on computer restar t. DriveLoc k pass words ■ Enable/disab le DriveLoc k on an y computer hard drive and optional MultiBa y hard drives . ■ Change a DriveLoc k user or master pass word. ✎ DriveLock settings are accessible only when you enter Comput er Setup by turning on (not restarting) the computer. Smar t Card secur ity Enable/disab le suppor t f or smar t card and Ja v a™ Card pow er-on authentication. ✎ Power-on authentication for smart cards is supported only on computers with optional smart card readers. TPM Embedded Secur ity Enable/disab le suppor t f or TPM (T rusted Platform Module) Embedded Security , which protects the computer from unauthorized access to owner functions in Embedded Secu rity for ProtectT ools . F or more inf ormation, refer to the ProtectT ools Security Manager Reference Guide located in the Help and Suppor t Center , or ref er to Credential Manager f or ProtectT ools online Help .
2–6 Maintenance and Serv ice Gui de T roubleshooting Ta b l e 2 - 2 Security Menu (Continued) Select T o Do This System IDs Enter user-defined computer asset and ownership tag. Disk Sanitizer Run Disk Sanitizer to destro y all existing data on the primar y hard dr iv e. The f o llo wing options are avai l abl e: ✎ Fast: Runs the Disk Sanitizer erase cycle once. ✎ Optimum: Runs the Disk Sanitizer erase cycle 3 times. ✎ Custom: Allows you to select the desired number of Disk Sanitizer erase cycles from a list. Ä If you run Disk Sanitizer , the data on the primar y hard dr iv e is destro yed per manently . Ta b l e 2 - 3 Diagnostics Men u Select T o Do This Memor y Check Run a comprehensiv e check on system memory . Hard Drive Self-T est options Run a comprehensiv e self-test on any hard driv e in the system or on any optional MultiBa y hard drive .
T roubleshooting Maintenance and Serv ice Gui de 2–7 Ta b l e 2 - 4 System Configuration Menu Select T o Do This Language (or press f2 ). Change the Comput er Setup language. Boot options ■ Set f9 , f10 , and f12 dela y when star ting up . ■ Enable/disab le CD-ROM boot. ■ Enable/disab le Flopp y boot. ■ Enable/disab le inter nal network adapter boot and set the boot mode (PXE or RPL). ■ Enable/disab le MultiBoo t, which sets a boot order that can include most boot de vices in the system. ■ Set the boot order .
2–8 Maintenance and Serv ice Gui de T roubleshooting De vice configurations ■ Swap the functions of the fn k e y and left ctrl key . ■ Enable/disab le m ultiple standard pointing de vices at star tup . (T o set the computer to suppor t only a single, usually nonstandard, pointing de vice at star tup , select Disable .) ■ Enable/disab le USB legacy suppor t. When enabled, USB legacy suppor t allows a USB ke yboard, mouse , and hub to work in Computer Setup e v en when a Microsoft Windows operating system is not loaded. ■ The computer to star t from bootable USB de vices, including a hard driv e, disk ette drive diskette , or optical drive connected b y a USB por t to the computer or to an optional docking de vice (select models only). ■ A utomatic/disable Intel® SpeedStep T echnolog y . ■ Select a parallel por t mode: EPP (Enhanced P ar allel P or t), standard, bidirectional, or ECP (Enhanced Capabilities P or t). ■ Enable/disab le BIOS DMA data transfers (select models only). ■ Enable/disab le the system f an when connected to an A C outlet. ■ Enable/disab le Intel or AMD PSAE Execution Disable . When enab led, the processor can disab le some vir us code e x ecution, which helps to improv e computer security . ■ Enable/disab le LAN P ow er Sa ve . When enabled, sa ves pow er b y tur ning off the LAN when not in use. Ta b l e 2 - 4 System Configuration Menu (Continued) Select T o Do This
T roubleshooting Maintenance and Serv ice Gui de 2–9 De vice configurations (Continued) ■ Enable/disab le SA T A Nativ e Suppor t. ■ Enable/disab le Dual Core CPU . ■ Enable/disab le Secondary Batter y F ast Charge. Built-In De vice Options ■ Enable/disab le embedded WW AN De vice Radio . ■ Enable/disab le embedded WLAN De vice Radio . ■ Enable/disab le embedded Bluetooth® De vice Radio . ■ Enable/disab le LAN/WLAN Switching. When enabled, s witches to a WLAN when a LAN is either unav ailable or disconnected. ■ Enable/disab le W ake on LAN from Off . ■ Enable/disab le the ambient light sensor . P or t Options ■ Enable/disable the serial por t. ■ Enable/disab le the par allel por t. ■ Enable/disab le the flash media reader . ■ Enable/disab le the USB por t. Ä Disabling the USB port also disables MultiBa y de vices and ExpressCard de vices on the adv anced por t replicator . ■ Enable/disab le the 1394 por t. ■ Enable/disab le the cardbus slot. ■ Enable/disab le the ExpressCard slot. ■ Enable/disab le the infrared por t. Ta b l e 2 - 4 System Configuration Menu (Continued) Select T o Do This
2–10 Maintenance and Serv ice Gui de T roubleshooting 2.2 T roub leshooting Flo wc h ar ts Ta b l e 2 - 5 T r oubleshooting Flo wcharts Over vie w Flowchart Description 2.1 “Flowchar t 2.1—Initial T roub leshooting” 2.2 “Flowchar t 2.2—No P ower , P ar t 1” 2.3 “Flowchar t 2.3—No P ower , P ar t 2” 2.4 “Flowchar t 2.4—No P ower , P ar t 3” 2.5 “Flowchar t 2.5—No P ower , P ar t 4” 2.6 “Flowchar t 2.6—No Video , Pa r t 1” 2.7 “Flowchar t 2.7—No Video , Pa r t 2” 2.8 “Flowchar t 2.8—Nonfunctioning Do c king De vice (if applicab le)” 2.9 “Flowchar t 2.9—No Operating System (OS) Loading” 2.10 “Flowchar t 2.10—No OS Loading, Hard Drive , P ar t 1” 2.11 “Flowchar t 2.11—No OS Loading, Hard Drive , P ar t 2” 2.12 “Flowchar t 2.12—No OS Loading, Hard Drive , P ar t 3” 2.13 “Flowchar t 2.13—No OS Loading, Disk ette Dr iv e” 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning De vice” 2.18 “Flowchar t 2.18—Nonfunctioning K eyboard” 2.19 “Flowchar t 2.19—Nonfunctioning P ointing Device” 2.20 “Flowchar t 2.20—No Network/Modem Connection”
T roubleshooting Maintenance and Serv ice Gui de 2–11 Flo wc h art 2. 1—Initial T roubleshootin g Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to “Flowchar t 2.17—Nonfunc- tioning De vice. ” Go to “Flowchar t 2.2—No P ower , Pa r t 1 . ” Go to “Flowchar t 2.6—No Video , Pa r t 1 . ” All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to “Flowchar t 2.9—No Operating System (OS) Loading. ” Go to “Flowchar t 2.15—No A udio , Pa r t 1 . ” Go to “Flowchart 2.18—Nonfunc- tioning K e yboard” or “Flowchart 2.19—Nonfunc- tioning P ointing De vice. ” Check LED board, speaker connections. Go to “Flowchar t 2.20—No Network/Modem Connection. ”
2–12 Maintenance and Serv ice Gui de T roubleshooting Flo wc h art 2.2—N o P o w er , P ar t 1 1. Reset the power cables in the docking device and at the AC outlet. 2. Be sure the AC power source is active. 3. Be sure that the power strip is working. Done Remove from docking device (if applicable). Po we r up on batter y power? Po we r up on AC power? Power up in docking device? Po we r u p on batter y power? Po we r up in docking device? Done Reset power .* Reset power .* Po we r up on AC power? N Y Y N N Y N N Y Y YN 1. On select computer models, there is a separate reset button. 2. On select computer models, the computer can be reset using th e standby switch and either the lid switch or the main power swit ch. *NOTES Go to “Flowchart 2.4—No P ower , Pa r t 3 . ” Go to “Flowchar t 2.3—No P ower , Pa r t 2 . ” Go to “Flowchar t 2.8—Nonfunctioning Docking De vice (if applicable). ” No power (power LED is off).
T roubleshooting Maintenance and Serv ice Gui de 2–13 Flo wc h ar t 2.3—No P o wer , P art 2 Continued from “Flowchar t 2.2—No P ower , Pa r t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r on ? Check batter y pack by recharging it, moving it to another computer , Po we r on ? Done Y Replace power supply (if applicable). N Po we r on ? Done Y N Go to “Flowchart 2.4—No P ower , Pa r t 3 . ”
2–14 Maintenance and Serv ice Gui de T roubleshooting Flo wc h art 2.4—N o P o w er , P ar t 3 Continued from “Flowchart 2.3—No P ower , Pa r t 2 . ” Reseat AC adapter in computer and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r on ? Po we r on ? Po we r on ? Plug directly into AC outlet. Po we r LE D on? Po we r ou tl e t active? T ry different outlet. Replace external AC adapter . Replace power cord. Y N Y Y Y Y N N N N External Internal Go to “Flowchar t 2.5—No P ower , Pa r t 4 . ”
T roubleshooting Maintenance and Serv ice Gui de 2–15 Flowc h ar t 2.5 —N o P ow er , P a r t 4 Y N Continued from “Flowchar t 2.4—No P ower , Pa r t 3 . ” Reseat loose components and boards and replace damaged items. Open computer . Loose or damaged parts? Y Close computer and retest. Po we r on ? Done N Replace the following items (if applicable). Check computer operation after each replacement: 1. Internal DC-DC converter* 2. Internal AC adapter 3. Processor board* 4. System board* *NOTE: Replace these items as a set to prevent shorting out among components.
2–16 Maintenance and Serv ice Gui de T roubleshooting Flo wc h art 2.6—N o Video, P ar t 1 A N Stand-alone or docking device? No video. Replace the following one at a time. T est after each replacement. 1. Cable between computer and computer display (if applicable) 2. Display 3. System board Internal or external display*? Adjust brightness. Video OK? Done Docking Device Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid swi tc h to en su re operation. Video OK? Done Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N *NOTE: T o change from internal to external display , use the hotkey combination. Y Go to “Flowchar t 2.7—No Video , Pa r t 2 . ”
T roubleshooting Maintenance and Serv ice Gui de 2–17 Flo wc h art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video , Pa r t 1 . ” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that computer is properly seated in docking device, for bent pins on cable, and for monitor connection. Go to “A ” in “Flowchart 2.6—No Video , Pa r t 1 . ” Check brightness of external monitor . T ry another external monitor . Internal and external video OK? Go to “Flowchar t 2.8—Nonfunctioning Docking De vice (if applicable). ” Y Y Y N N N Remove computer from docking device, if connected.
2–18 Maintenance and Serv ice Gui de T roubleshooting F l o w ch a rt 2 . 8 — N on fu n ct i o n i ng D o ck i ng De vi c e (i f appl icable) Y N Reset power cord in docking device and power outlet. N T est replacement docking device with new computer . Check voltage setting on docking device. Reset monitor cable connector at docking device. Reinstall computer into docking device. Docking device operating? Docking device operating? Replace docking device. Done Done Y Nonfunctioning docking device.
T roubleshooting Maintenance and Serv ice Gui de 2–19 Flo wc h art 2.9—N o Opera ting Sy s tem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive , P ar t 1. ” Reset power cord in docking device and power outlet. No OS loading.* *NOTE: Before beginning troubleshooting, always check cable connections, cable ends, and drives for bent or damaged pins. No OS loading from diskette drive, go to “Flowchart 2.13—No OS Loading, Diskette Driv e. ” No OS loading from CD-ROM or DVD-ROM drive, go to “Flowchar t 2.14—No OS Loading, Optical Drive. ” No OS loading from network, go to “Flowchar t 2.20—No Network/Modem Connection. ”
2–20 Maintenance and Serv ice Gui de T roubleshooting Flo wc h ar t 2. 1 0—No OS Loa ding , H ard Driv e, Pa r t 1 Go to “Flowchart 2.17—Nonfunctioning De vice. ” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchar t 2.11—No OS Loading, Hard Drive, P ar t 2. ” Reseat external hard drive. OS loading? Done Boot from CD? Go to “Flowchar t 2.13—No OS Loading, Diskette Driv e. ” Boot from hard drive? Boot from diskette? Change boot priority through the Setup Utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order .
T roubleshooting Maintenance and Serv ice Gui de 2–21 Flowc h ar t 2. 1 1—N o OS Lo ad in g , H a rd D rive, Pa r t 2 Load OS using Operating System disc (if applicable). Continued from “Flowchar t 2.10—No OS Loading, Hard Drive, P ar t 1. ” Reseat hard drive. Done CD or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to “Flowchar t 2.13—No OS Loading, Diskette Driv e. ” Format hard drive and bring to ab o o t a b l e C:\ prompt. Create partition, and then format hard drive to bootable C:\ prompt. Boot from diskette drive? Remove diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible? Y N Hard drive accessible? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Computer booted? Done Y N Go to “Flowchart 2.12—No OS Loading, Hard Drive, P ar t 3. ” Go to “Flowchar t 2.12—No OS Loading, Hard Drive , P ar t 3. ”
2–2 2 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2. 1 2—No OS Loa ding , Hard Driv e, Pa r t 3 Y System files on hard drive? Continued from “Flowchar t 2.11—No OS Loading, Hard Drive, P ar t 2. ” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix ba d sectors. Boot from hard drive? Replace hard drive. Done
T roubleshooting Maintenance and Serv ice Gui de 2–2 3 Flo wc h art 2. 1 3—No OS Loa ding , Disk et te Driv e Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot computer . Check diskette for system files. Tr y d i f f e r e n t diskette. 1. Replace diskette drive. 2. Replace system board. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot computer . Is diskette drive boot order correct? Change boot priority using the Setup Utility . Go to “Flowchar t 2.17—Nonfunc- tioning De vice. ” Diskette drive enabled in the Setup Utility? Go to “Flowchart 2.17—Nonfunctioning De vice. ” Reset the computer . Refer to Section 1.2, “Resetting the Computer , ” for instructions.
2–2 4 Maintenance and Serv ice Guide T roubleshooting Flo wc h ar t 2. 1 4—No OS Loa ding , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot computer . Go to “Flowchar t 2.17—Nonfunctioning De vice. ” Go to “Flowchar t 2.17—Nonfunctioning De vice. ” Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T ry another bootable disc. Booting from another device? Booting order correct? Correct boot order using the Setup Utility . Done Reseat drive. Y Y Y Y Y N N N N N Reset the computer . Refer to Section 1.2, “Resetting the Computer , ” for instructions.
T roubleshooting Maintenance and Serv ice Gui de 2 –2 5 Flo w ch ar t 2. 1 5—N o Audio, P a rt 1 No audio. N Computer in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchar t 2.16—No A udio , Pa r t 2 . ” Go to “Flowchar t 2.17—Nonfunctioning De vice. ” Y Y Y Y N N N Go to “Flowchar t 2.16—No A udio , Pa r t 2 . ” Replace the docking device.
2–2 6 Maintenance and Serv ice Guide T roubleshooting Flo wc h ar t 2. 1 6—N o Audio, P ar t 2 YN Continued from “Flowchart 2.15—No A udio , Pa r t 1 . ” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio board and speaker connections in computer (if applicable). 1. Replace internal speakers. 2. Replace audio board (if applicable). 3. Replace system board.
T roubleshooting Maintenance and Serv ice Gui de 2–2 7 Flo wc h ar t 2. 1 7—N onfunc tioning D e vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the computer and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix o r replace broken item. Nonfunctioning device. Reattach device. Close computer , plug in power , and reboot. Device boots properly? Go to “Flowchart 2.9—No Operating System (OS) Loading. ” Device boots properly? Replace hard drive. Replace diskette drive. Replace NIC. If integrated NIC, replace system board. Y N Y N
2–2 8 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2. 1 8—Nonfun c tioning K e yboar d Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect computer to good external keyboard. Reseat internal keyboard connector (if applicable). Replace internal keyboard or cable. OK? Y N Y N Done Done
T roubleshooting Maintenance and Serv ice Gui de 2–2 9 Flo wc h art 2. 1 9—N onfunc tioning P oin ting De vic e Y N OK? Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect computer to good external pointing device. Reseat internal pointing device connector (if applicable). Replace internal pointing device or cable. OK? Y N Y N Done Done
2–30 Maintenance and Serv ice Guide T roubleshooting Flo wc h art 2.20—N o Net w ork/Modem Conn ectio n Y Disconnect all power from the computer and open. No network or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers and reconfigure. Reseat NIC/modem (if applicable). Replace the NIC/modem (if applicable). Replace system board. OK? OK? Done N N N N Y Y Y Y
Maintenance and Serv ice Gui de 3–1 3 I llus trated P a rts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 3. 1 Serial N umber Loca tion When ordering parts or requesting information, provide the computer serial number and model number located on the bottom of the computer . Ser ial Numb er L ocation
3–2 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g 3.2 Comp uter M ajor Com ponen ts Com put er Major C om ponents
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–3 Ta b l e 3 - 1 Spare P arts: Computer Major Components Item Description Spare P art Number 1 Displa y assemblies (include wireless antenna transceiv ers and cab les) 15.0-inch, SXGA WV A, TFT 15.0-inch, XGA, TFT , with Br ightView 15.0-inch, XGA, TFT 430869-001 430868-001 430867-001 2 Switch co ver s (include LED board and LED board cable) F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430878-001 430877-001 3 K eyboar ds Belgium Brazil Czech Repub lic Denmark Europe Fr a n c e F rench Canada Ger many Greece Hungar y Iceland Israel Italy Ja pa n Ko r e a Latin America 416039-A41 416039-201 416039-221 416039-081 416039-021 416039-051 416039-121 416039-041 416039-151 416039-211 416039-DD1 416039-BB1 416039-061 416039-291 416039-AD1 416039-AB1 Norwa y P or tugal Russia Saudi Arabia Slov akia Slov enia Spain Sweden Switzerland Ta i w a n Thailand Tu r k e y The United Kingdom The United States 416039-091 416039-131 416039-251 416039-171 416039-231 416039-BA1 416039-071 416039-B71 416039-111 416039-AB1 416039-281 416039-141 416039-031 416039-001
3–4 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g Com put er Major C om ponents
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–5 Ta b l e 3 - 1 Spare P arts: Computer Major Components (Continued) Item Description Spare P art Number 4 T op cover s (include T ouchPad, br ac ket, and cab le) F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430866-001 430865-001 Fingerprint reader board (not illustrated; includes finger print reader board cable) 431964-001 5 Fan 413696-001 6 Mini Car d modules 802.11a/b/g WLAN module f or use in the United States and Canada 407254-001 802.11a/b/g WLAN module f or use in Japan 407254-291 802.11a/b/g WLAN module f or use in the countries listed below . These countr ies are categor ized as the rest of the world (RO W). 407254-002 China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela 802.11b/g WLAN module f or use in the United States and Canada 407253-001 802.1b/g WLAN module f or use in Ja pan 407253-291 802.11b/g WLAN module f or use in the R O W countries listed below: 407253-002 China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela
3–6 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g Com put er Major C om ponents
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–7 Ta b l e 3 - 1 Spare P arts: Computer Major Components (Continued) Item Description Spare P art Number Plastics Kit 430884-001 7a 7b 7c 7d Includes: ExpressCard bezel PC Card bezel Hard drive co ver (includes 2 captiv e screws, secured b y C-clips) Memor y module compar tment cov er (includes 1 captiv e screw , captured b y a C-clip) Not illustrated: Computer f eet (6) 8a 8b Modem module (includes modem module cable) Modem module cable (included with modem module and also included in the Cab les Kit, spare par t number 430883-001) 430881-001 9 Heat sink (includes thermal paste) 430885-001 Thermal Grease Kit (not illustrated) 413706-001 10 Memory modules PC2-5300 1024-MB 512-MB 256-MB 414046-001 414045-001 414044-001
3–8 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g Com put er Major C om ponents
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–9 Ta b l e 3 - 1 Spare P arts: Computer Major Components (Continued) Item Description Spare P art Number 11 Processor s (include ther mal paste) AMD T ur ion 64 ML-60 (2.00-GHz) AMD T ur ion 64 ML-56 (1.80-GHz) AMD T ur ion 64 ML-52 (1.60-GHz) AMD T ur ion 64 ML-50 (1.60-GHz) 430876-001 430875-001 430874-001 430873-001 Mobile AMD Sempron 3500 (1.80-GHz) Mobile AMD Sempron 3400 (1.80-GHz) Mobile AMD Sempron 3200 (1.60-GHz) 430872-001 430871-001 430870-001 Thermal Grease Kit (not illustrated) 413706-001 12 System boards (include PC Card/ExpressCard assemb ly) F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430864-001 430863-001 13 USB/audio boards (include USB/audio board cab le) F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430882-001 431965-001 14 Speaker 413697-001 15 Base enclosures F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430880-001 430879-001 16 Batteries 6-cell, 5.1-Ah 6-cell, 4.0-Ah 415306-001 393652-001 17 Bluetooth® module (includes Bluetooth module cable) 398393-001
3–10 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g Com put er Major C om ponents
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–11 Ta b l e 3 - 1 Spare P arts: Computer Major Components (Continued) Item Description Spare P art Number 18 Hard drives (all 540 rpm, include frame) 100-GB 80-GB 60-GB 40-GB 413853-001 413852-001 413851-001 413850-001 19 Optical drives (include bezel and optical driv e brac k et) 8X Max D VD±R W and CD-R W Combo Drive 4X Max D VD±R W and CD-R W Combo Drive 24X Max D VD/CD-R W Combo Driv e 24X Max CD-ROM driv e 431963-001 431961-001 431962-001 431960-001
3–12 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g 3. 3 Plas tic s Kit T able 3-2 Plastics Kit Spare P art Number Information Item Description Spare P art Number Plastics Kit Includes: 430884-001 1 Memor y module compar tment cov e r (includes 1 captiv e screw , secured b y a C-clip) 2 Hard drive co v er (includes 2 capt iv e screws , secured b y C-clips) 3P C C a r d b e z e l 4 ExpressCard bezel 5 R TC batter y 6 Computer f eet (6)
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–13 3.4 Ca bl e Kit Ta b l e 3 - 3 Cable Kit Spare P art Number Information Item Description Spare P art Number Cable Kit Includes: 430883-001 1 Microphone (for use only with HP Compaq nc6325 models) 2 Modem module cable 3 Bluetooth module cable
3–14 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g 3.5 M a s s St ora g e De vi ce s T able 3-4 Mass Storage De vices Spare P art Number Information Item Description Spare P art Number 1 Har d drives (include frame) 100-GB 80-GB 60-GB 40-GB 413853-001 413852-001 413851-001 413850-001 2 Optical drives (include bez el) 8X Max D VD±R W and CD-R W Combo Drive 4X Max D VD±R W and CD-R W Combo Drive 24X Max D VD/CD-R W Combo Driv e 24X Max CD-ROM driv e 431963-001 431961-001 431962-001 431960-001
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–15 3.6 Miscell an eous (Not I llus trated) Ta b l e 3 - 5 Miscellaneous (Not Illustrated) Spare P art Information Description Spare P art Number 8-cell travel battery 367456-001 65-watt A C adapter 381090-001 External MultiBa y II 366143-001 External MultiBa y II power cable and stand 366144-001 HP Doc king Station 413267-001 HP Doc king Station 120 W A C adapter 391174-001 HP Doc king Station Miscellaneous Plastics Kit 380089-001 MultiBay 8X D VD-ROM Drive (f or use in Exter nal MultiBay II and HP Docking Station) 373314-001 MultiBay 24X D VD/CD-R W Combo Drive (f or use in Exter nal MultiBa y II an d HP Doc king Station) 373315-001 D V D±R W and CD-R W Double-La yer Combo Drive (f or use in Exter nal MultiBa y II and HP Docking Station) 375557-001 Nylon carrying case 325815-002
3–16 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g Po w e r c o r d s Fo r u s e i n : A ustralia 246959-011 Belgium, Europe, Finland, Germany , Greece, the Netherlands, Norwa y , P or tugal, Spain, and Sweden 246959-021 Brazil 246959-201 Canada, F rench Canada, La tin Amer ica, T aiwan, and the United States 246959-001 Denmark 246959-081 Hong K ong and the United Kingdom 246959-031 Israel 246959-BB1 Italy 246959-061 Japan 246959-291 K orea 246959-AD1 Sweden 246959-A G1 Ta b l e 3 - 5 Miscellaneous (Not Illustrated) Spare P art Information (Continued) Description Spare P art Number
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–17 Screw Kit (includes the f ollowing screws; ref er to Appendix A, “Screw Listing, ” for more inf ormation on specifications and usage) 413705-001 and 432160-001 ■ He x sock et HM5.0×9.0 scre w loc k ■ Phillips PM2.5×13.0 spring-loaded scre w ■ Phillips PM2.5×4.0 shoulder screw ■ Phillips PM2.5×4.0 screw ■ Phillips PM2.0×8.0 shoulder screw ■ Phillips PM2.0×7.0 screw ■ Phillips PM2.0×4.0 screw ■ Phillips PM2.0×3.0 screw ■ Phillips PM1.5×4.0 screw ■ Phillips PM1.5×3.5 screw ■ T orx8 T8M2.0×9.0 screw ■ T orx8 T8M2.0×4.0 screw ■ T orx8 T8M2.0×2.0 screw Ta b l e 3 - 5 Miscellaneous (Not Illustrated) Spare P art Information (Continued) Description Spare P art Number
3–18 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g 3.7 Sequ enti al P a rt N umber Listin g Ta b l e 3 - 6 Sequential P art Number Listing Spare P art Number Description 246959-001 P ower cord f o r use in Canad a, F rench Canada, Latin Amer ica, T aiwan, and the United States 246959-011 P ower cord f or use in A ustralia 246959-021 P ower cord f or use in Be lgium, Europe , Finland, Ger many , Greece, the Netherlands, Norw a y , P or tugal, Spain, and Sweden 246959-031 P ower cord f or use in Hong K ong and the United Kingdom 246959-061 P ower cord f or use in Italy 246959-081 P ower cord f or use in Denmar k 246959-201 P ower cord f or use in Brazil 246959-291 P ower cord f or use in Japan 246959-AD1 P ower cord f or use in Korea 246959-A G1 P ower cord f or use in Sweden 246959-BB1 P ower cord f or use in Israel 325815-002 Nylon carr ying case 366143-001 Exter nal MultiBa y II 366144-001 Exter nal MultiBa y II po wer cab le and stand 367456-001 8-cell tra v el batter y 373314-001 MultiBa y 8X D VD-R OM Drive (f or use in Exter nal MultiBay II and HP Docking Station) 373315-001 MultiBa y 24X D VD/CD-RW Co mbo Driv e (f or use in Exter nal MultiBa y II and HP Doc king Station)
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–19 375557-001 D VD±R W and CD-R W Double La y er Combo Drive (f or use in External MultiBay II and HP Doc king Station) 380089-001 HP Docking Statio n Miscellaneous Plastics Kit 381090-001 65-watt A C adapter 391174-001 HP Docking Station 120 W A C adapter 393652-001 6-cell, 4.0-Ah batter y 398393-001 Bluetooth module (i ncludes Bluetooth module cable) 407253-001 802.11b/g WLAN Mini Card module f or use in the United States and Canada 407253-002 802.11b/g WLAN Mini Card module f or use in the RO W countries listed below: China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela 407253-291 802.11b/g WLAN Mini Card module f or use Japan 407254-001 802.11a/b/g WLAN Mini Card module f or use in the United States and Canada 407254-002 802.11a/b/g WLAN Mini Card module f or use in the RO W countries listed below: China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela 407254-291 802.11a/b/g WLAN Mini Card module f or use J apan 413267-001 HP Docking Station 413696-001 F an 413697-001 Speaker Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
3–20 Maintenance and Serv ice Gui de Illustrated P ar ts Catalo g 413705-001 Screw Kit 413706-001 Ther mal Grease Kit 413850-001 5400-r pm, 40-GB hard drive (includes frame) 413851-001 5400-r pm, 60-GB hard drive (includes frame) 413852-001 5400-r pm, 80-GB hard drive (includes frame) 413853-001 5400-r pm, 100-GB hard drive (includes frame) 414044-001 PC2-5300, 256-MB memor y module 414045-001 PC2-5300, 512-MB memor y module 414046-001 PC2-5300, 10 24-MB memor y module 415306-001 6-cell, 5.1-Ah batter y 430863-001 System board f or use with HP Compaq nx6315 models 430864-001 System board or us e with HP Compaq nx6325 models 430865-001 T op cov er f or use with HP Compaq nx6315 models (includes T ouchP ad, brac ket, and cab le) 430866-001 T op cov er f or use with HP Compaq nx6325 models (includes T ouchP ad, brac ket, and cab le) 430867-001 15.0-inch XGA, TFT displa y assemb ly (includes wireless antenna transceiv ers and cab les) 430868-001 15.0-inch XGA, TFT disp la y assemb ly with BrightView (includes wireless antenna transceiv ers and cab les) 430869-001 15.0-inch, SXGA WV A, TFT display assemb ly (includes wireless antenna transceiv ers and cab les) 430870-001 Mobile AMD Sempron 3200 (1.60-GHz) processor 430871-001 Mobile AMD Sempron 3400 (1.80-GHz) processor Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–21 430872-001 Mobile AMD Sempron 3500 (1.80-GHz) processor 430873-001 AMD T ur ion TL-60 (1.60-GHz) processor 430874-001 AMD T ur ion TL-56 (1.60-GHz) processor 430875-001 AMD T ur ion TL-52 (1.80-GHz) processor 430876-001 AMD T ur ion TL-50 (2.00-GHz) processor 430877-001 Switch cov e r f or use with HP Compaq nx6315 models (includes LED board and LED board cab le) 430878-001 Switch cov e r f or use with HP Compaq nx6325 models (includes LED board and LED board cab le) 430879-001 Base enclosure f or us e with HP Compaq nx6315 models 430880-001 Base enclosure f or us e with HP Compaq nx6325 models 430881-001 Modem module (inc ludes modem module cab le) 430882-001 USB/audio board f or us e with HP Compaq nx6325 models (includes USB/au dio board cab le) 430883-001 Screw Kit 430885-001 Heat sink (i ncludes ther mal paste) 431960-001 24X Max CD-ROM driv e 431961-001 4X Max D VD±R W and CD-R W Combo Dr ive 431962-001 24X Max D VD/CD-R W Combo Drive 431963-001 8X Max D VD±R W and CD-R W Combo Dr ive 431964-001 Finger print reader board (includes finger print reader board cable) 431965-001 USB/audio board f or us e with HP Compaq nx6315 models (includes USB/au dio board cab le) Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
3–2 2 Maintenance and Serv ice Guide Illustrated P ar ts Catalo g 432160-001 Plastics Kit 416039-001 K e yboard f or use with models with T ouchP ad and finger print reader in the United States 416039-021 K e yboard f or use with models with T ouchP ad and finger print reader in Europe 416039-031 K e yboard f or use with models with T ouchP ad and finger print reader in the United Kingdom 416039-041 K e yboard f or use with models with T ouchP ad and finger print reader in Ger many 416039-051 K e yboard f or use with models with T ouchP ad and finger print reader in F rance 416039-061 K e yboard f or use with models with T ouchP ad and finger print reader in Italy 416039-071 K e yboard f or use with models with T ouchP ad and finger print reader in Spain 416039-081 K e yboard f or use with models with T ouchP ad and finger print reader in Denmark 416039-091 K e yboard f or use with models with T ouchP ad and finger print reader in Norwa y 416039-111 K e yboard f or use with models with T ouchP ad and finger print reader in Switzerland 416039-121 K e yboard f or use with models with T ouchP ad and finger print reader in F rench Canada 416039-131 K e yboard f or use with models with T ouchP ad and finger print reader in P or tugal 416039-141 K e yboard f or use with models with T ouchP ad and finger print reader in T ur ke y Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
Illustr ated P a rts Catalog Maintenance and Serv ice Gui de 3–2 3 416039-151 K e yboard f or use with models with T ouchP ad and finger print reader in Greece 416039-161 K e yboard f or use with models with T ouchP ad and finger print reader in Latin America 416039-171 K e yboard f or use with models with T ouchP ad and finger print reader in Saudi Arabia 416039-201 K e yboard f or use with models with T ouchP ad and finger print reader in Brazil 416039-211 K e yboard f or use with models with T ouchP ad and finger print reader in Hungar y 416039-221 K e yboard f or use with models with T ouchP ad and finger print reader in the Czech Repub lic 416039-231 K e yboard f or use with models with T ouchP ad and finger print reader in Slov akia 416039-251 K e yboard f or use with models with T ouchP ad and finger print reader in Russia 416039-281 K e yboard f or use with models with T ouchP ad and finger print reader in Thailand 416039-291 K e yboard f or use with models with T ouchP ad and finger print reader in Japan 416039-A41 K e yboard f or use with models with T ouchP ad and finger print reader in Belgium 416039-AB1 K e yboard f or use with models with T ouchP ad and finger print reader in T aiwan 416039-AD1 K e yboard f or use with models with T ouchP ad and finger print reader in K orea 416039-B71 K e yboard f or use with models with T ouchP ad and finger print reader in Sweden Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
3–2 4 Maintenance and Serv ice Guide Illustrated P ar ts Catalo g 416039-BA1 K e yboard f or use with models with T ouchP ad and finger print reader in Slov enia 416039-BB1 K e yboard f or use with models with T ouchP ad and finger print reader in Israel 416039-DD1 K e yboard f or use with mode ls with T ouchP ad and finger print reader in Iceland 432160-001 Screw Kit Ta b l e 3 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
Maintenance and Serv ice Gui de 4–1 4 Remo v al an d R ep l acemen t Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 4. 1 T oo ls Required Y ou will need the follo wing tools to complete the remov al and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 scre wdri v er ■ T orx8 scre wdri ver ■ 5.0-mm socket for system board scre wlocks ■ Flat-bladed scre wdri v er
4–2 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminarie s 4.2 Ser vice C onsidera tions The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassembly from the computer , place the subassembly (and all accompanying scre ws) away from the work area to pre v ent damage. Pl a s t i c Pa r t s Using excessi ve force during disassembly and reassembly can damage plastic parts. Use care when handling the plastic parts. Apply pressure only at the points designated in the maintenance instructions. Ca bl es and C onnec tors Ä CA UTION: When se rvi c ing the compute r , be sure that cable s ar e placed in their pr oper locations dur ing the r eas sembl y pr oces s. Impr oper ca ble placement can damage the com puter . Cables must be handled with extreme care to a void damage. Apply only the tension required to unseat or seat the cables during remov al and insertion. Handle cables by the connector whene ver possible. In all cases, a void bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be caught or snagged b y parts being remo ved or replaced. Handle flex cables w ith e xtreme care; these cables tear easily .
Re mov al and R eplacement Pr eliminar ie s Maintenance and Serv ice Gui de 4–3 4. 3 P r e v enting Damage to R emo v able Dri v e s Remov able driv es are fragile components that must be handled with care. T o pre v ent damage to the computer , damage to a remov able driv e, or loss of information, observ e the follo wing precautions: ■ Before removing or inserting a hard dri ve, shut do wn the computer . If you are unsure whether the computer is of f or in hibernation, turn the computer on, and then shut it do wn through the operating system. ■ Before removing a disk ette dri v e or optical dri ve, be sure that a diskette or disc is not in the dri ve and be sure that the optical dri ve tray is closed. ■ Before handling a dri ve, be sure that you are dischar ged of static electricity . While handling a driv e, a v oid touching the connector . ■ Handle dri ves on surf aces co vered with at least one inch of shock-proof foam. ■ A void dropping dri ves from an y height onto any surf ace. ■ After removing a hard dri ve, an optical dri v e, or a diskette dri ve, place it in a static-proof bag. ■ A void e xposing a hard dri v e to products that ha ve magnetic f ields, such as monitors or speakers. ■ A void e xposing a dri v e to temperature extremes or liquids. ■ If a dri ve must be mailed, place the dri ve in a b ubble pack mailer or other suitable form of protecti ve packaging and label the package “FRA GILE: Handle W ith Care. ”
4–4 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminarie s 4.4 Pr e v enting Elec trosta tic D ama ge Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks b uilt into many inte grated circuits provide some protection, b ut in many cases, the dischar ge contains enough po wer to alter de vice parameters or melt silicon junctions. A sudden dischar ge of static electricity from a finger or other conductor can destroy static-sensiti ve de vices or microcircuitry . Often the spark is neither felt nor heard, b ut damage occurs. An electronic de vice e xposed to electrostatic discharge might not be af fected at all and can work perfectly throughout a normal cycle. Or the de vice might function normally for a while, then degrade in the internal layers, reducing its life e xpectanc y .
Re mov al and R eplacement Pr eliminar ie s Maintenance and Serv ice Gui de 4–5 4.5 P a c k a ging an d T ranspor ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o a v oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrostatic-sensiti ve parts and assemblies with conducti ve or appro v ed containers or packaging. ■ K eep electrostatic-sensiti v e parts in their containers until the parts arri ve at static-free w orkstations. ■ Place items on a grounded surface before remo ving items from their containers. ■ Alw ays be properly grounded when touching a sensiti ve component or assembly . ■ Store reusable electrostatic-sensiti ve parts from assemblies in protecti ve packaging or nonconducti ve foam. ■ Use transporters and con veyors made of antistatic belts and roller b ushings. Be sure that mechanized equipment used for moving materials is wired to ground and that proper materials are selected to a v oid static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
4–6 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminarie s 4.6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 4-2, “Static-Shielding Materials” ). ■ Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and equipment. ■ Use conducti ve field service tools, such as cutters, scre wdri vers, and v acuums. ■ When f ixtures must directly contact dissipati ve surf aces, use f ixtures made only of static-safe materials. ■ K eep the work area free of nonconducti ve materials, such as ordinary plastic assembly aids and Styrofoam. ■ Handle electrostatic-sensiti ve components, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A void contact with pins, leads, or circuitry . ■ T urn off po wer and input signals before inserting or removing connectors or test equipment.
Re mov al and R eplacement Pr eliminar ie s Maintenance and Serv ice Gui de 4–7 4.7 Groundin g E quip ment an d Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o provide proper ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips to connect a wrist strap. ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots. On conducti ve floors or dissipati ve floor mats, use foot straps on both feet with a minimum of one megohm resistance between the operator and ground. T o be ef fecti v e, the conducti ve strips must be w orn in contact with the skin. Other grounding equipment recommended for use in pre v enting electrostatic damage includes ■ Antistatic tape. ■ Antistatic smocks, aprons, and slee ve protectors. ■ Conducti ve bins and other assembly or soldering aids. ■ Nonconducti ve foam. ■ Conducti ve tabletop w orkstations with ground cords of one megohm resistane. ■ Static-dissipati ve tables or floor mats with hard ties to the ground. ■ Field service kits. ■ Static aw areness labels. ■ Material-handling packages. ■ Nonconducti ve plastic bags, tubes, or box es. ■ Metal tote boxes. ■ Electrostatic v oltage le vels and protecti ve materials.
4–8 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr eliminarie s T able 4-1 shows ho w humidity af fects the electrostatic v oltage le ve ls generated by dif ferent activities. T able 4-2 lists the shielding protection provided by antistatic bags and floor mats. Ta b l e 4 - 1 T ypical Electr ostatic V oltage Levels Relative Humidity Event 10% 40% 55% W alking across carpet 35,000 V 15,000 V 7,500 V W alking across vin yl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 14,500 V 5,000 V 3,500 V Removing b ubb le pac k from PCB 26,500 V 20,000 V 7,000 V P ac king PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 V. Ta b l e 4 - 2 Static-Shielding Materials Material Use V oltage Protection Le vel Antistatic plastic Bags 1,500 V Carbon-loaded plastic F loor mats 7,500 V Metallized laminate Floor mats 5,000 V
Maintenance and Serv ice Gui de 5–1 5 Remo v al an d R ep l acemen t Pr ocedure s This chapter provides remo v al and replacement procedures. There are as many as 50 scre ws and screw locks, in 9 dif ferent sizes, that must be remov ed, replaced, or loosened when servicing the computer . Make special note of each scre w and screw lock size and location during remov al and replacement. Refer to Appendix A, “Scre w Listing” for detailed information on scre w and scre w lock sizes, locations, and usage.
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 . 1 Serial N umber Report the computer serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the computer . Ser ial Numb er L ocation
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 5 .2 Disassem bl y Seque nce Chart Use the chart belo w to determine the section number to be referenced when removing computer components. Disassembl y Sequence Chart Section Description # of Screws Remo ved 5.3 Preparing the Computer f or Disassemb ly Batter y 0 5.4 Hard Driv e 2 loosened to remov e the hard drive co ver 1 loosened to remov e the hard drive 4 to remov e the hard drive frame 5.5 Computer F eet 0 5.6 Bluetooth Module 0 5.7 External Memor y Module 1 loosened to remov e the memor y module compar tment cov er 5.8 Optical Driv e 1 to remov e the optical drive 2 to remov e the optical drive brac k et 5.9 Key b o a r d 2 5.10 Fa n 2 loosened 5.11 Heat Sink 4 5.12 Processor 1 loosened 5.13 RT C B a t t e r y 0
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .3 Preparing t h e Com pu ter for Di sassem bl y Before you begin an y remo v al or installation procedures: 1. Shut do wn the computer . If you are unsure whether the computer is of f or in hibernation, turn the computer on, and then shut it do wn through the operating system. 2. Disconnect all external de vices connected to the computer . 3. Disconnect the po wer cord. Section Description # of Screws Remo ved 5.14 Mini Card WLAN Module 2 Å T o prev ent an unresponsiv e system and the displa y of a warning message, install only a Mini Card de vice authorized f or use in your computer b y the gov er nmental agency that regulates wireless de vices in yo ur countr y . If you install a de vice and then receive a w ar ning message, remov e the de vice to restore computer functionality . Then contact Customer Care. 5.15 Inter nal Memor y Module 0 5.16 Switch Cov e r 2 5.17 Displa y Assemb ly 6 5.18 To p C o v e r 15 5.19 Speaker 0 5.20 Microphone 0 5.21 Modem Module 2 5.22 USB/A udio Board 1 5.23 System Board 2 screw loc ks Disassembl y Sequence Char t (Continued)
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–5 4. Remov e the battery b y follo wing these steps: a. T urn the computer upside do wn with the rear panel to ward you. b . Slide the battery release latch on the right 1 and then the battery release latch on the left 2 to release the battery . c. Slide the battery 3 straight back and remov e it. R emo v ing the Battery Re v erse the abov e procedure to install the battery . Battery Spare P ar t Number Inf ormation 6-cell, 5.1-Ah 6-cell, 4.0-Ah 415306-001 393652-001
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .4 H ard Dri v e 1. Prepare the computer for disassembly (refer to Section 5.3 ). 2. Position the computer with the front to ward you. Har d Drive Spare P art Number Information Hard drives (all 540 rpm, include frame) 100-GB 80-GB 60-GB 40-GB 413853-001 413852-001 413851-001 413850-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–7 3. Loosen the two Phillips PM2.0×5.0 scre ws 1 that secure the hard dri ve co v er to the computer . 4. Lift the right side of the hard dri v e cov er 2 and swing it up and to the left. 5. Remov e the hard dri ve cov er . ✎ The hard dri ve co v er is included in the Plastics Kit, spare part number 430884-001. R emo v ing the Har d Dr i v e Co ver
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 6. Loosen the Phillips PM2.5×13.0 spring-loaded hard dri v e retention scre w 1 . 7. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e 3 to the right to disconnect it from the system board. 8. Remov e the hard dri ve 4 from the hard driv e bay . R emo v ing the Har d Dr i v e
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–9 9. Remov e the four Phillips PM3.0×4.0 hard dri v e frame scre ws 1 from each side of the hard dri v e. 10. Lift the frame 2 straight up to remov e if from the hard dri v e. R emo v ing the Har d Dr i v e F r ame Re v erse the abov e procedure to reassemble and install the hard dri ve.
5–10 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 5 C o m p u t e r Fe e t The computer feet are adhesi v e-backed rubber pads. The feet are included in the Plastics Kit, spare part number 430884-001. Re p la ci n g th e C om p ut e r Fee t
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–11 5 .6 Bluetoot h Modul e 1. Prepare the computer for disassembly (refer to Section 5.3 ). 2. Remov e the hard dri ve ( Section 5.4 ). 3. Slide the Bluetooth module 1 out of the clip in the hard dri v e compartment. 4. Disconnect the Bluetooth cable 2 from the module. R emo v ing the Bluetooth Module Re v erse the abov e procedure to install a Bluetooth module. Bluetooth Module Spare P art Number Information Bluetooth module (includes Blue tooth module cab le) 398393-001
5–12 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .7 External Memor y Module 1. Prepare the computer for disassembly (refer to Section 5.3 ). 2. Position the computer with the front to ward you. 3. Loosen the Phillips PM2.0×5.0 scre w 1 that secures the memory module compartment cov er to the computer . 4. Lift the rear edge of the cov er 2 up and swing it to ward you. 5. Remov e the memory module compartment co ver . ✎ The memory module compartment cov er is included in the Plastics Kit, spare part number 430884-001. R emo v ing the Memory Module C ompartment Co v er Memory Module Spare P ar t Number Inf ormation PC2-5300 1024-MB 512-MB 256-MB 414046-001 414045-001 414044-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–13 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The edge of the module opposite the socket rises a way from the computer .) 7. Slide the module 2 aw ay from the socket at an angle. 8. Remov e the memory module. ✎ Memory modules are designed with a notch 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Memory Module Re v erse the abov e procedure to install a memory module.
5–14 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .8 O ptical Driv e 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Position the computer with the right side to ward you. 3. Remov e the T orx8 T8M2.0×9.0 screw 1 that secures the optical dri ve to the computer . 4. Insert a flat-bladed dri v er into the slot 2 on the bottom of the computer and push the tab . 5. Remov e the optical dri ve 3 from the computer . R emo v ing the Optical Dr i ve Optical Drive Spare P art Number Information 8X Max D VD±R W and CD-R W Combo Drive 4X Max D VD±R W and CD-R W Combo Drive 24X Max D VD/CD-R W Combo Drive 24X Max CD-R OM drive 431963-001 431961-001 431962-001 431960-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–15 6. If it is necessary to replace the optical dri ve brack et, remov e the two Phillips PM2.0×4.0 scre ws 1 that secure the brack et to the optical dri v e. 7. Remov e the optical dri ve bracket 2 . R emo v ing the Optical Dr i ve Re v erse the abov e procedure to reassemble and install an optical dri ve.
5–16 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 9 K eyb o a r d 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Remov e the memory module compartment co ver ( Section 5.7 ). Ke yboar d Spare P ar t Number Information Belgium Brazil Czech Repub lic Denmark Europe F rance F rench Canada Ger many Greece Hungar y Iceland Israel Italy Ja pan Ko r e a 416039-A41 416039-201 416039-221 416039-081 416039-021 416039-051 416039-121 416039-041 416039-151 416039-211 416039-DD1 416039-BB1 416039-061 416039-291 416039-AD1 Latin America Norwa y P or tugal Russia Saudi Arabia Slov akia Slov enia Spain Sweden Switzerland Ta i w a n Thailand Tu r k e y The United Kingdom The United States 416039-161 416039-091 416039-131 416039-251 416039-171 416039-231 416039-BA1 416039-071 416039-B71 416039-111 416039-AB1 416039-281 416039-141 416039-031 416039-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–17 3. Remov e the two T orx8 T8M2.0×9.0 scre ws that secure the ke yboard to the computer . R emo v ing the K ey board Sc r ew s
5–18 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 4. T urn the computer display-side up with the front to ward you. 5. Open the computer as far as possible. 6. Slide the four ke yboard retaining latches 1 to ward you. 7. Lift the rear edge of the ke yboard 2 and swing it forward until it rests on the palm rest. Re le a s i n g th e Keybo a rd
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–19 8. Release the ZIF connector 1 to which the pointing stick cable is attached and disconnect the pointing stick cable 2 . Disconnecting the K e y boar d Ca ble 9. Remov e the ke yboard. Re v erse the abov e procedure to install the ke yboard.
5–20 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5. 1 0 Fa n 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). 3. Disconnect the fan cable 1 from the system board. 4. Loosen the two Phillips PM2.0×7.0 scre ws 2 that secure the fan to the computer . 5. Remov e the f an 3 . R emo v ing the F a n Re v erse the abov e procedure to install the fan. F an Spare P art Number Information F an 413696-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–21 5 . 1 1 H eat Sink 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). 3. Remov e the f an ( Section 5.10 ). Heat Sink Spare P art Number Information Heat sink (includes ther mal paste) 430885-001 Ther mal Grease Kit (not illustrated) 413706-001
5–2 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 4. Remov e the four Phillips PM2.0×6.0 scre ws 1 that secure the heat sink to the computer . 5. Lift the right side of the heat sink 2 to disengage it from the processor . 6. Slide the heat sink 3 to the right to remov e it. ✎ Due to the adhesi v e quality of the thermal paste located between the heat sink and processor , it may be necessary to mov e the heat sink from side to side to detach the heat sink from the processor . R emo v ing the Heat Sink
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 3 ✎ The thermal paste and thermal pads should be thoroughly cleaned from the surfaces of the heat sink 1 and system board components 2 each time the heat sink is remov ed. Thermal paste and pads are included with the heat sink and all processor spare part kits. T hermal P aste and P ad Locations Re v erse the abov e procedure to install the heat sink.
5–2 4 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 1 2 P r o c e s s o r 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). 3. Remov e the f an ( Section 5.10 ). 4. Remov e the heat sink ( Section 5.11 ). Pr ocessor Spare P art Number Information AMD T u rion 64 ML-60 (2.00-GHz) AMD T u rion 64 ML-56 (1.80-GHz) AMD T u rion 64 ML-52 (1.60-GHz) AMD T u rion 64 ML-50 (1.60-GHz) 430876-001 430875-001 430874-001 430873-001 Mobile AMD Sempro n 3500 (1.80-GHz) Mobile AMD Sempro n 3400 (1.80-GHz) Mobile AMD Sempro n 3200 (1.60-GHz) 430872-001 430871-001 430870-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 5 5. Use a flat-bladed scre wdri v er to turn the processor locking scre w 1 one-half turn counterclockwise until you hear a click. 6. Lift the processor 2 straight up and remov e it. ✎ The gold triangle 3 on the processor should be located in the left-rear corner of the processor socket when you install the processor. R emo v ing the Pr ocess or Re v erse the abov e procedure to install the processor .
5–2 6 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 1 3 R TC B a t t e r y ✎ The R T C battery is included in the Plastics Kit, spare part number 430884-001. 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). 3. Remov e the R TC battery from the socket on the system board. R emo v ing the R T C Battery Re v erse the abov e procedure to install the R TC battery . Be sure that the R T C battery is installed with the “ ” sign facing up.
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 7 5 . 1 4 Mini C ard WL AN Module 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). 3. Position the computer with the front to ward you. Mini Car d WLAN Module Spare P art Number Information 802.11a/b/g WLAN module f or us e in the United States and Canada 407254-001 802.11a/b/g WLAN module f or use in Ja pan 407254-291 802.11a/b/g WLAN module f or use in the R O W countries listed below: 407254-002 China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela 802.11b/g WLAN module f or us e in the United States and Canada 407253-001 802.1b/g WLAN module f or use in Japan 407253-291 802.11b/g WLAN module f or use in the R O W countries listed below: 407253-002 China Ecuador Haiti Honduras Pa k i s t a n Pe r u Qatar South K orea Uruguay V enezuela
5–2 8 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 4. Make note of which antenna cable is attached to which antenna clip on the Mini Card WLAN module before disconnecting the cables, then disconnect the auxiliary and main antenna cables 1 from the module. 5. Remov e the two Phillips PM2.5×4.0 scre ws 2 that secure the Mini Card WLAN module to the computer . 6. Remov e the Mini Card WLAN module 3 b y pulling the module from the socket at an angle. ✎ Mini Card WLAN modules are designed with a notch 4 to pre v ent incorrect installation. R emo v ing a Mini C ar d WL AN Module Re v erse the abov e procedure to install a Mini Card WLAN module.
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–2 9 5 . 1 5 Internal M emor y Module 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Release the ke yboard ( Section 5.9 ). Memory Module Spare P ar t Number Inf ormation PC2-5300 1024-MB 512-MB 256-MB 414046-001 414045-001 414044-001
5–30 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module. (The edge of the module opposite the socket rises a way from the computer .) 4. Slide the module 2 aw ay from the socket at an angle. 5. Remov e the memory module. ✎ Memory modules are designed with a notch 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Memory Module Re v erse the abov e procedure to install a memory module.
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–31 5. 1 6 Sw i t c h C ove r ✎ Both switch cov er spare part kits include an LED board and LED board cable. 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Remov e the ke yboard ( Section 5.9 ). 3. T urn the computer upside do wn with the rear panel to ward you. 4. Remov e the two T orx8 T8M2.5×2.0 scre ws that secure the switch cov er to the computer . R emo v ing the S wit ch C o v er S cr ew s Switch Co ver Spare P ar t Number Information F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430878-001 430877-001
5–3 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. T urn the computer display-side up with front to ward you. 6. Open the computer as far as possible. 7. Disconnect the LED board cable 1 from the system board. 8. Insert a flat-bladed scre wdri v er into the four notches 2 on the front edge of the switch cov er 3 and lift up until the co ver disengages from the computer . 9. Remov e the switch co ve r . R emo v ing the S wit ch C o v er Re v erse the abov e procedure to install the switch cov er .
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 3 5 . 1 7 Displa y Assem bl y 1. Prepare the computer for disassembly ( Section 5.3 ). 2. Remov e the ke yboard ( Section 5.9 ). 3. Disconnect the wireless ante nna cables from the Mini Card WLAN module ( Section 5.14 ). 4. Remov e the switch co ve r ( Section 5.16 ). Displa y Assembl y Spare P art Number Information 15.0-inch, SXGA WV A, TFT 15.0-inch, XGA, TFT , with Br ightView 15.0-inch, XGA, TFT 430869-001 430868-001 430867-001
5–34 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. Remov e the four T orx8 T82.5×9.0 scre ws that secure the display assembly to the computer . R emo v ing the Displa y Assembl y Sc r e w s
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 5 6. T urn the computer display-side up with the front to ward you. 7. Open the computer as far as possible. Ä CA UTION: Support the display a ssembl y w hen r emo v ing the fo llo w ing sc r e ws . F ailure to su pport the display as sembl y can r esult in damage to the displa y asse mbly and other com puter components . 8. Disconnect the display cable 1 from the system board. 9. Remov e the wireless antenna cables 2 from the clips in the top cov er . 10. Remov e the two T orx8 T8M2.5×9.0 scre ws 3 that secure the display assembly to the computer . 11. Lift the display assembly 4 straight up and remov e it. R emo v ing the Displa y Assembl y Re v erse the abov e procedure to reassemble and install the display assembly
5–3 6 Maintenance and S ervi ce Guide Re mo val and R eplacement Pr ocedure s 5. 1 8 T o p C ove r 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) 2. T urn the computer upside do wn with the front to ward you. T op Co ver Spare P art Number Information F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430866-001 430865-001 Finger print reader board (not il lustrated; includes finger print reader board cable) 431964-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 7 3. Remov e the thirteen T orx8 T8M2.5×9.0 scre ws that secure the top cov er to the computer . R emo v ing the T op C o ve r Sc r e w s, P art 1
5–3 8 Maintenance and S ervi ce Guide Re mo val and R eplacement Pr ocedure s 4. T urn the computer right-side up with the front to ward you. 5. Disconnect the follo wing cables from the system board: 1 T ouchPad cable 2 Fingerprint reader board cable (HP Compaq nx6325 models only) 3 Microphone cable 6. Remov e the two T orx8 T8M2.5×9.0 screws 4 that secure the top cov er to the computer . R emo v ing the T op C o ve r Sc r e w s, P art 2
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–3 9 7. Lift up the rear edge of the top cov er 1 until it disengages from the base enclosure. 8. Swing the top cov er 2 to ward you until the left and right sides of the top cov er disengage from the base enclosure. 9. Lift up on the left 3 and right sides 4 of the top cov er until the top cov er disengages from the base enclosure. R eleasing the T op C o ve r Re v erse the abov e procedure to install the top cov e r and T ouchPad.
5–40 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 1 9 S p e a ke r 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) f. T op cov er ( Section 5.18 ) Speaker Spare P art Number Information Speak er 413697-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–41 2. Disconnect the speaker cable 1 from the system board. 3. Remov e the speak er 2 . R emo v ing the Speak er Re v erse the abov e procedure to install the speaker .
5–4 2 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5. 2 0 M i c r o p h o n e ✎ The microphone is included in the Cable Kit, spare part number 430883-001, and is for use only with HP Compaq nx6325 models. 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) f. T op cov er ( Section 5.18 )
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Guide 5–43 2. Disconnect the microphone cable 1 from the system board and remov e the microphone 2 from the computer . 3. If it is necessary to replace the Bluetooth module cable, disconnect the cable 3 from the system board, remov e the cable 4 from the clips in the base enclosure, and then remove the cable 5 from computer . R emo v ing the Mi cr ophone and Bluetooth Module Ca ble Re v erse the abov e procedure to install the microphone.
5–44 Maintenance and Serv ice Gui de Re mo val and R eplacement Pr ocedure s 5 .2 1 Mod em Module 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) f. T op cov er ( Section 5.18 ) Modem Module Spare P art Number Information Modem module (includes mode m module cab le) 430881-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 5 2. Remov e the two Phillips PM2.5×4.0 scre ws 1 that secure the modem module to the system board. 3. Lift the front of the modem module 2 to disconnect it from the system board. 4. Disconnect the modem module cable 3 from the modem module. 5. Disconnect the modem cable 4 from the system board. 6. Remov e the modem connector 5 from the clip in the base enclosure. ✎ The modem module cable is included with the modem module spare part kit and is also a v ailable in the Cable Kit, spare part number 430883-001. R emo v ing the Modem Module and Cable Re v erse the abov e procedure to install the modem module.
5–46 Maintenance and Serv ice Guide Re mo val and R eplacement Pr ocedure s 5 .2 2 US B/Audio B oard 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) f. T op cov er ( Section 5.18 ) USB/A udio Boar d Spare P a rt Number Information Includes USB/audio board cable F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430882-001 431965-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 7 2. Position the computer with the rear panel to ward you. 3. Release the ZIF connector to which the USB/audio board cable is connected and disconnect the USB/audio board cable 1 from the system board. 4. Remov e the Phillips PM2.0×3.0 scre w 2 that secures the USB/audio board to the base enclosure. 5. Remov e the cable from the clips 3 in the base enclosure. 6. Remov e the USB/audio board 4 . 7. Release the ZIF connector to which the USB/audio board cable is connected and disconnect the USB/audio board cable 5 USB/audio board. R emo v ing the U SB/Audi o Boar d Re v erse the abov e procedure to install the USB/audio board.
5–4 8 Maintenance and S ervi ce Guide Re mo val and R eplacement Pr ocedure s 5. 23 Sys t e m B o a r d ✎ When replacing the system board, be sure that the follo wing components are remov ed from the defecti ve system board and installed on the replacement system board: ■ Memory modules ( Section 5.7 and Section 5.15 ) ■ Fan ( Section 5.10 ) ■ Heat sink ( Section 5.11 ) ■ Processor ( Section 5.12 ) ■ R T C battery ( Section 5.13) ■ Mini Card WLAN module ( Section 5.14 ) ■ Modem module and cable ( Section 5.21 ) 1. Prepare the computer for disassembly ( Section 5.3 ), and then remov e the follo wing components: a. Hard dri ve ( Section 5.4 ) b . Optical dri ve ( Section 5.8 ) c. K eyboard ( Section 5.9 ) System Boar d Spare P art Number Information System boards (include PC Card/ExpressCard assembly) F or use with HP Compaq nx6325 models F or use with HP Compaq nx6315 models 430864-001 430863-001
Re mov al and R eplacement Pr ocedur es Maintenance and Serv ice Gui de 5–4 9 d. Switch cov er ( Section 5.16 ) e. Display assembly ( Section 5.17 ) f. T op cov er ( Section 5.18 ) g. Speaker ( Section 5.19 ) h. Microphone ( Section 5.20 ) i. USB/audio board ( Section 5.22 ) 2. Remov e the two HM5.0×9.0 scre w locks on each side of the external monitor connector . R emo v ing the S ys tem Boar d Sc r e w Loc ks
5–5 0 Maintenance and S ervi ce Guide Re mo val and R eplacement Pr ocedure s 3. Use the optical dri ve connector 1 to lift the right side of the system board 2 until the po wer connector 3 is clear of the base enclosure. 4. Slide the system board 4 to the right at an angle and remov e it from the base enclosure. R emo v ing the S yst em Boar d Re v erse the abov e procedures to install the system board.
Maintenance and Serv ice Gui de 6–1 6 Spec ific ations This chapter provides physical and performance specif ications. Ta b l e 6 - 1 Computer Dimensions Metric U.S. Height Width Depth (v aries from front to back) < 32.8 cm < 26.7 cm < 3.0 to 3.6 cm < 12.9 in < 10.5 in < 1.2 to < 1.4 in W eight With 15.0-inch displa y , optical drive , and 6-cell batter y pack < 2.7 kg < 6.0 lbs Input P ower Operating v oltage Operating current 18.5 V dc @ 3.5 A - 65 W 3.5 A T emperature Operating (not writing to optical disc) Operating (writing to optical disc) Nonoperating 0°C to 35°C 5°C to 35°C -20°C to 60°C 32°F to 95°F 41°F to 95°F -4°F to 140°F
6–2 Maintenance and Serv ice Gui de Spe cificat ion s Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95% Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.75 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min s weep r ate 1.50 g zero-to-peak, 10 Hz to 500 Hz, 0.5 oct/min s weep r ate ✎ Applicable product safety standards specify thermal limits for plastic surfaces. The computer operates well within this range of temperatures. Ta b l e 6 - 1 Computer (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–3 Ta b l e 6 - 2 15.0-inch, SXGA WV A, TFT Display Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1400 × 1050 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 5.5 W Viewing angle /-35° horizontal, 15/-35° v er tical typical
6–4 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 6 - 3 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1024 × 768 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 5.5 W Viewing angle /-35° horizontal, 15/-35° v er tical typical
Spe cificat ion s Maintenance and Serv ice Gui de 6–5 Ta b l e 6 - 4 Har d Drives 100-GB* 80-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 102 g Interface type SA T A SA T A SA T A SA T A T ransfer rate Synchronous (maximum) Security 100 MB/sec ATA security 100 MB/sec ATA security 100 MB/sec ATA security 100 MB/sec ATA security Seek times (typical read, including setting) Single trac k Ave r a g e Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms Logical bloc ks † 195,363,650 156,301,488 117,210,240 78,140,160 Disc rotational speed 5400 r pm 5400 r pm 7200 and 5400 r pm 5400 r pm Operating temperature 5°C to 55°C (41°F to 131°F) ✎ Certain restrictions and exclusi ons apply. Consult Customer Care for details. *1 GB = 1 billion b ytes when ref erring to hard dr iv e storage capacity . Actual accessible capacity is less . †Actual drive specificatio ns ma y diff er slightly .
6–6 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 6 - 5 Primary 6-cell, Li-Ion Batter y Dimensions Height Width Depth We i g h t 2.00 cm 9.40 cm 13.40 cm 0.34 kg 0.79 in 3.70 in 5.28 in 0.75 lb Energ y V oltage Amp-hour capacity W att-hour capacity 11.1 V 4.4 Ah 48 Wh T emperature Operating Nonoperating 5°C to 45°C 0°C to 60°C 41°F to 113°F 32°F to 140°F
Spe cificat ion s Maintenance and Serv ice Gui de 6–7 Ta b l e 6 - 6 D VD/CD-R W Combo Drive Applicable disc Read: D VD-R, D VD-RW , D VD-R OM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R, CD-R W Photo CD (single and mult ise ssi on) CD-Bridge Write: CD-R and CD-R W Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in)
6–8 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full strok e < 110 ms < 210 ms < 130 ms < 225 ms A udio output level Line-out, 0.7 V r ms Cache b uffer 2 MB Data transfer rate CD-R (24X) CD-R W (10X) CD-R OM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rate) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds Ta b l e 6 - 6 D VD/CD-R W Combo Drive (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–9 Ta b l e 6 - 7 D VD±R W and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-R OM (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1 8 ) , CD-R OM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F orm 1 and 2) CD-I ready (Mode 2, F orm 1 and 2) CD-R, CD-R W Photo CD (single and multisession) CD-Bridge Write: CD-R and CD-R W D VD-R and DV D - R W Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in)
6–10 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full strok e < 175 ms < 285 ms < 230 ms < 335 ms A udio output level A udio-out, 0.7 Vr ms Cache b uffer 2 MB Data transfer rate CD-R (16X) CD-R W (8X) CD-R OM (24X) DV D ( 8 X ) D VD-R (4X) DV D - R W ( 2 X ) Multiword DMA mode 2 2,400 KB/s (150 KB/s at 1X CD rate) 1,200 KB/s (150 KB/s at 1X CD rate) 3,600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate) 5,400 KB/s (1,352 KB/s at 1X D VD rate) 2,700 KB/s (1,352 KB/s at 1X D VD rate) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds Ta b l e 6 - 7 D VD±R W and CD-R W Combo Drive (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–11 Ta b l e 6 - 8 CD-R OM Drive Applicable disc CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-RCD-R W Photo CD (single and multisession) CD-Bridge Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in) Disc thickness 1.2 mm (0.047 in)
6–12 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 6 - 9 System DMA Hard ware DMA S ystem Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 Not applicable DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
Spe cificat ion s Maintenance and Serv ice Gui de 6–13 T able 6-10 System Interrupts Hard ware IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natur al K eyboard IRQ2 Cascaded IRQ3 82801DB/DBM U SB2 Enhanced Host Controller—24CD IRQ4 COM1 IRQ5* Cone xant A C—Link A udio 82801DB/DBM SMBus Controller—24C3 Data F ax Modem with Smar tCP IRQ6 Disk ette drive IRQ7* P arallel port IRQ8 System CMOS/real-time cloc k IRQ9* Microsoft A CPI-compliant system IRQ10* USB UHCI controller—24C2 82852/82855 GM/GME Graphic Controller Realtek R TL8139 F amily PCI f ast Ether net Controller
6–14 Maintenance and Serv ice Gui de Spe cificat ion s IRQ11 USB EHCI controller—24CD USB UHCI controller—24C4 USB UHCI controller—24C7 Pro/Wireless 2200BG TI OHCI 1394 host controller TI PCI1410 CardBus controller IRQ12 Synaptics PS/2 T ouchP ad IRQ13 Numer ic data processor IRQ14 Pri mar y IDE channel IRQ15 Secondar y IDE channel *Def ault configuration; audio possib le configurations are IRQ5, IRQ7, IRQ9, IRQ10, or none. ✎ PC Cards may assert IRQ3, IRQ4, IR Q5, IRQ7, IRQ9, IRQ10, IRQ11, or IRQ15. Either the infrared or the se rial port may assert IRQ3 or IRQ4. T able 6-10 System Interrupts (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–15 T able 6-11 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interrupt controller no . 1 022 - 024 Opti chipset configur ation registers 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration f or CPU 040 - 05F Counter/timer registers 044 - 05F Unused 060 K eyboard controller 061 P or t B 062 - 063 Un used 064 K eyboard controller 065 - 06F Unused 070 - 071 N MI enable/R TC 072 - 07F Unused 080 - 08F DMA page registers 090 - 091 Un used 092 P or t A 093 - 09F Unused 0A0 - 0A1 Interrupt controller no . 2
6–16 Maintenance and Serv ice Gui de Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 S econdar y fix ed disk controller 178 - 1EF Unused 1F0 - 1F7 Primar y fixed disk controller 1F8 - 200 Unused 201 Joystic k (decoded in ESS1688) 202 - 21F Unused 220 - 22F Enter tainment audio 230 - 26D Unused 26E - 26 Unused 278 - 27F Unused 280 - 2AB Unused 2A0 - 2A7 Unused 2A8 - 2E7 Unused 2E8 - 2EF Reser v ed serial por t T able 6-11 System I/O Addresses (Continued)
Spe cificat ion s Maintenance and Serv ice Gui de 6–17 I/O Address (he x) System Function (shipping configuration) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 S econdar y diskette driv e controller 378 - 37F P arallel por t (LPT1/def ault) 380 - 387 Un used 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Reser v ed (parallel por t/no EPP suppor t) 3C0 - 3DF V GA 3E0 - 3E1 PC Card controller in CPU 3E2 - 3E3 Unused 3E8 - 3EF Inter nal modem 3F0 - 3F7 “A” diskette controller 3F8 - 3FF Serial por t (COM1/def ault) CF8 - CFB PCI configuration inde x register (PCIDIV O-1) CFC - CFF PCI configuration data register (PCIDIV O-1) T able 6-11 System I/O Addresses (Continued)
6–18 Maintenance and Serv ice Gui de Spe cificat ion s T able 6-12 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Video memory 48 KB 000C0000-000CBFFF Video BIOS 160 KB 000C8000-000E7FFF Un used 64 KB 000E8000-000FFFFF System BIOS 15 MB 00100000-00FFFFFF Extended memor y 58 MB 01000000-047FFFFF Super e xtended memor y 58 MB 04800000-07FFFFFF Unused 2 MB 08000000-080FFFFF Video memor y (direct access) 4 GB 08200000-FFFEFFFF Unused 64 KB FFFF0000-FFFFFFFF System BIOS
Maintenance and Serv ice Gui de A–1 A Sc r e w L ist ing This appendix provides specif ication and reference information for the scre ws and scre w locks used in the computer . All screws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part numbers 413705-001 and 432160-001.
A–2 Maintenance and Serv ice Gui de Scr e w Listing Phillips P M2 . 0×5 .0 S cr ew L ocati ons Ta b l e A - 1 Phillips PM2.0×5.0 Screw Color Qty . Length Thread Head Width Black 3 5.0 mm 2.0 mm 4.0 mm Where used: 1 T wo screws that secure the hard driv e cov er to the computer (screws are captured on the cov er by C-clips; documented in Section 5.4 ) 2 One scre w that secures the memor y module compar tment cov er to the computer (screw is captured on th e co v er b y a C-clip; documented in Section 5.7 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–3 Phillips P M2 . 5×13 . 0 Spr ing-L oaded Hard Dr iv e R ete ntion S cr ew Sc r e w L ocation Ta b l e A - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Scre w Color Qty . Length Thread Head Width Silv er 1 13.0 mm 2.5 mm 5.5 mm Where used: One screw that secures the hard driv e to the computer (screw is captured on the hard drive fr ame by a C-clip; documented in Section 5.4 ) mm
A–4 Maintenance and Serv ice Gui de Scr e w Listing Phillips P M3 . 0×4.0 S cr ew L ocati ons Ta b l e A - 3 Phillips PM3.0×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 3.0 mm 4.5 mm Where used: 4 screws that secure the hard driv e fram e to the hard drive (documented in Section 5.4 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–5 T orx8 T8M2 . 5×9 .0 Sc r e w L ocati ons Ta b l e A - 4 T orx8 T8M2.5×9.0 Screw Color Qty . Length Thread Head Width Black 24 9.0 mm 2.5 mm 4.0 mm Where used: 1 One scre w that secures the optical dr iv e to the computer (documented in Section 5.8 ) 2 T wo screws that secure the k e yboa rd to the computer (documented in Section 5.9 ) 3 F our scre ws that secure the displa y assembly to the computer (documented in Section 5.17 ) mm
A–6 Maintenance and Serv ice Gui de Scr e w Listing T orx8 T8M2 . 5×9 .0 Sc r e w L ocati ons Ta b l e A - 4 T orx8 T8M2.5×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.5 mm 4.0 mm Where used: 13 screws that secure the top co v er to the computer (documented in Section 5.18 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–7 T orx8 T8M2 . 5×9 .0 Sc r e w L ocati ons Ta b l e A - 4 T orx8 T8M2.5×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.5 mm 4.0 mm Where used: 1 T wo screws that secure the displa y as sembly to the computer (documented in Section 5.17 ) 2 T wo screws that secure the top co v er to the computer (documented in Section 5.18 ) mm
A–8 Maintenance and Serv ice Gui de Scr e w Listing Phillips P M2 . 0×3 . 0 Scr e w L ocati ons Ta b l e A - 5 Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Silv er 3 3.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the optical driv e bra c k et to the optical dr ive to the computer (documented in Section 5.8 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–9 Phillips P M2 . 0×3 . 0 Sc r ew L ocation Ta b l e A - 5 Phillips PM2.0×3.0 Screw (Continued) Color Qty . Length Thread Head Width Silv er 3 3.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the USB/au dio board to the base enclosure (documented in Section 5.22 ) mm
A–10 Maintenance and Serv ice Gui de Scr e w Listing T orx8 T8M2 . 5×2 . 0 Scr e w L ocations Ta b l e A - 6 T orx8 T8M2.5×2.0 Screw Color Qty . Length Thread Head Width Black 2 2.0 mm 2.5 mm 4.0 mm Where used: 2 screws that secure the s witch co v er to the computer (documented in Section 5.16 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–11 Phillips P M2 . 0×7 . 0 Scr ew L ocati ons Ta b l e A - 7 Phillips PM2.0×7.0 Screw Color Qty . Length Thread Head Width Silv er 6 7.0 mm 2.0 mm 5.0 mm Where used: 2 screws that secure the f an assemb ly to the computer (documented in Section 5.17 ) mm
A–12 Maintenance and Serv ice Gui de Scr e w Listing Phillips P M2 . 0×7 . 0 Scr ew L ocati ons Ta b l e A - 7 Phillips PM2.0×7.0 Screw (Continued) Color Qty . Length Thread Head Width Silv er 6 7.0 mm 2.0 mm 6.0 mm Where used: 4 screws that secure the heat sink to the to the computer (documented in Section 5.11 ) mm
S crew Li st i n g Maintenance and Serv ice Gui de A–13 Phillips P M2 . 5×4. 0 Sc r e w L ocations Ta b l e A - 8 Phillips PM2.5×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 2.5 mm 4.5 mm Where used: 1 T wo screws that secure the Mini Card WLAN to the computer (documented in Section 5.14 ) 2 T wo screws that secure the modem modu le to the computer (documented in Section 5.21 ) mm
A–14 Maintenance and Serv ice Gui de Scr e w Listing H ex S ocket H M5.0× 9 .0 S cre w Lock Lo c at io n s Ta b l e A - 9 Hex Soc ket HM5.0×9.0 Scre w Loc k Color Qty . Length Thread Head Width Silv er 2 9.0 mm 5.0 mm 5.0 mm Where used: 2 screw loc ks that secure the system board to the computer (documented in Section 5.23 ) mm
Maintenance and Serv ice Gui de B–1 B Ba ck up a n d R e c o v e ry Back up HP Backup and Recov ery Manager pro vides se veral w ays to back up the system and to recov er optimal system functionality . ✎ HP installed dri v ers, utilities, a nd applications can be copied to a CD or to a D VD using HP Backup and Recov ery Manager . ✎ Formatted D VD±R W discs and D VD±R W double-layer discs are not compatible with HP Backup and Recov ery Manager . ✎ The computer must be connected to external po wer before you perform backup and recov ery procedures. Safeguarding Y o ur Da ta T o safeguard your documents, store personal f iles in the My Documents folder and periodically create a backup copy of the folder .
B–2 Maintenance and Se rvice Gui de Back up and Reco very B ac kin g Up t h e S y s tem Using HP Backup and Restore Manager , you can ■ Back up specif ic files and folders. ■ Back up the entire system. ■ Back up modif ications since your last backup, using HP system restore points. ■ Schedule backups. Ba c king Up S pec ific Files or F old ers Y ou can back up specific f iles or folders to the hard driv e, to an optional external hard dri ve, or to discs. ✎ This process will take se v eral minutes, depending on the f ile size and the speed of the computer . T o back up specific f iles or folders: 1. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup and Recov ery Manager . 2. Click Next. 3. Click Back up to protect system settings and important data f iles , and then click Next . 4. Click Back up individual f iles and folders , and then click Next . The Backup W izard opens. 5. Click Next. 6. Click Backup selected f iles fr om most common locations (Recommended) . – or – Click Advanced Backup (Experienced users) to access adv anced f iltering techniques. 7. Click Next. 8. Follo w the on-screen instructions.
Back up and Reco v ery Maintenance and Serv ice Gui de B–3 B ac kin g Up t h e Entire Hard Driv e When you perform a complete backup of the hard dri v e, you are sa ving the full factory image, including the W indo ws operating system, software applications, and all personal f iles and folders. ✎ A copy of the entire hard dri v e image can be stored on another hard dri ve, on a netw ork dri v e, or on recov ery discs that you create. ✎ This process may take o v er an hour , depending on your computer speed and the amount of data being stored. T o back up your entire hard driv e: 1. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup and Recov ery Manager . 2. Click Next. 3. Click Back up to protect system settings and important data f iles , and then click Next . 4. Click Back up entire hard dri ve , and then click Next . The “Back up entire hard disk” page opens. 5. Click Next. 6. Select the location for the backup f iles, and then click Next . 7. Select the Protect data access with passw ord check box, and type your password in the Passw ord and Conf irm boxes. ✎ This step is optional. If you do not want to password-protect your data access, clear the Protect data access with passw ord check box. 8. Click Next. 9. Follo w the on-screen instructions.
B–4 Maintenance and Se rvice Gui de Back up and Reco very Ba c king U p Modifications M ad e to the S y st e m When you back up modif ications since your last backup, you are creating system recov ery points. This allo ws you to sa v e a snapshot of your hard dri v e at a specific point in time. Y ou can then recov er back to that point if you w ant to re verse subsequent changes made to your system. ✎ The f irst system recov ery point, a snapshot of the entire image, is automatically created the f irst time you perform a backup. Subsequent recov ery points mak e a copy of changes made after that time. HP recommends that you create recov ery points ■ Before you add or extensi vely modify software or hardw are. ■ Periodically , whenev er the system is performing optimally . ✎ Recov ering to an earlier reco very point does not af fect data f iles or e-mails created since that recov ery point. After you create a recov ery point, you are prompted to schedule subsequent recov ery points. Y ou can schedule recov ery points for a specif ic time or e vent in your system. T o create and schedule a system recovery point: 1. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup and Recov ery Manager . 2. Click Next. 3. Click Back up to protect system settings and important data f iles , and then click Next . 4. Click Create or manage Reco very P oints , and then click Next . The “Recov ery Point Manager” page opens. 5. Follo w the on-screen instructions.
Back up and Reco v ery Maintenance and Serv ice Gui de B–5 Sc heduling Ba c k ups T o schedule backups: 1. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup Scheduler . The “Backup Scheduler” page opens. 2. Click Next. 3. Schedule system recov ery points at specif ic interv als (no w , daily , weekly , or monthly) or at specif ic e vents, such as at system start or when you dock to an optional docking station (select computer models only), by clicking one of the a v ailable options. Click Next to further def ine the settings. A summary of your system recov ery point settings is displayed. 4. Follo w the on-screen instructions. Rec o v er y HP Backup and Recov ery Manager analyzes the hard dri v e and creates a dedicated hard dri v e rec ov ery partition on the hard dri v e large enough to store a cop y of the full factory image. Y ou can choose whether you want to store that cop y on the recov ery partition, on another dri v e, or on external reco v ery discs. ✎ Before using HP Backup and Recov ery Manager , try repairing the system by running Microsoft W indo ws System Restore. For more information, select Start > Help and Support , and then search for “System Restore. ”
B–6 Maintenance and Se rvice Gui de Back up and Reco very HP Backup and Recov ery Manager allo ws you to ■ Cr eate reco very discs (highly r ecommended) . The recov ery discs are used to start up your computer and to recov er the full f actory image (operating system and software) in case of system f ailure or instability . ✎ If you do not ha ve a CD or D VD b urner , a copy of the entire hard dri ve image can be stored on another hard dri ve or on a network dri v e. ■ P erf orm a r ecovery . Y ou can perform a full system recov ery or recov er important f iles from the reco very partition on the hard dri ve, from another dri ve, or from reco very discs that you create. Creating Reco v er y Disc s (Hi ghly Recommended) After setting up the computer for the f irst time, you can create a set of recov ery discs of the full factory image, using Reco v ery Media Creator in the HP Backup and Recov ery Manager . The recov ery discs are used to start up (boot) the computer and recov er the operating system and softwa re to factory settings in case of system failure or instability . Ä CA UTION: After y ou c r eate the r eco v ery discs, y ou can incr eas e the amount of a v ailable space on the har d dri v e b y deleting the r eco v ery partition . Ho w e v er , doing this is no t r ecommended. If y ou delete this partition , y ou w ill los e an y inf ormati on that is on the partition . ✎ Only one set of recov ery discs can be created for this computer .
Back up and Reco v ery Maintenance and Serv ice Gui de B–7 Before creating recov ery discs: ■ Obtain high-quality CD-R, D VD-R, or D VD R media, purchased separately . ✎ Formatted D VD±R W discs and D VD±R W double-layer discs are not compatible with HP Backup and Recov ery Manager . ■ Number each disc before inserti ng it into the optical dri v e of the computer . ■ If necessary , you can cancel Recovery Media Creator before you ha ve f inished creating the reco v ery discs. The next time you open Recov ery Media Creator , you will be prompted to continue the disc creation process where you left of f. T o create a set of recovery discs: 1. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup and Recov ery Manager . 2. Click Next. 3. Click Create factory softwar e recov ery CDs or D VDs to r ecover the system (Highly r ecommended) , and then click Next . The “Recov ery Media Creator” page opens. 4. Click Next. 5. Click Write to CD/D VD , and then click Next . 6. Follo w the on-screen instructions. Pe r f o r m i n g a R e c o v e r y P er f orming a Reco v er y from t he Reco very Dis cs T o perform a recovery from the reco v ery discs: 1. Back up all personal f iles. 2. Insert the f irst recov ery disc into the optical dri v e and restart the computer . 3. Follo w the on-screen instructions.
B–8 Maintenance and Se rvice Gui de Back up and Reco very P er f orming a Reco v er y from the H ard Driv e There are 2 ways to initiate a reco v ery from the hard dri ve: ■ From within W indows. ■ From the recov ery partition. Initia ting a Reco v ery in Win do ws T o initiate a recovery in W indo ws: 1. Back up all personal f iles. 2. Select Start > All Pr ograms > HP Backup & Recovery > HP Backup and Recov ery Manager . 3. Click Next. 4. Click Recov er important f iles or the entir e system , and then click Next . 5. Click a recov ery option, and then click Next . ✎ If you choose to recov er the system, the computer restarts and recov ery be gins. 6. Follo w the on-screen instructions. Initia ting a Reco v er y from t he Hard Driv e Reco v er y P ar tition T o initiate a recovery from the hard dri ve reco very partition: 1. Back up all personal f iles. 2. Restart the computer , and then press f11 before the W indows operating system loads. 3. Click a recov ery option, and then click Next . 4. Follo w the on-screen instructions.
Maintenance and Serv ice Gui de C–1 C Dis pl a y C ompon ent Recy c lin g Å W ARN IN G: T he backli ght contains mer cury . Ca ution sh ould be e x er c ised w hen remo ving and handling the bac klight t o av o id damaging this component and ca using e xposur e to the merc ury . Ä CA UTION: The pr ocedures in this a ppendi x can r esult in damage to displa y components . T he only compo nents intended f or r ecy c ling purpo ses ar e the liquid c rys tal displa y (L CD) panel and the backli ght . Car ef ul handling should be e x er c ised w hen r emo v ing these components . ✎ Materials Disposal This HP product contains mercury in the backlight in the display assembly that might require special handling at end-of-life. Disposal of mercury may be regulated because of en vironmental considerations. For disposal or rec ycling information, contact your local authorities or the Electronic Industries Alliance (EIA) at http://www .eiae.org .
C–2 Maint enance and Servi ce Guide Display C omponent R ecy cling This appendix provides disassembl y instructions for the display assembly . The display assembly must be disassembled to gain access to the backlight 1 and the liquid crystal display (LCD) panel 2. ✎ Disassembly procedures dif fer from one display assembly to another . The procedures provided in this appendix are general disassembly instructions. Specif ic details, such as scre w sizes, quantities, and locations, and co mponent shapes and sizes, can v ary from one computer model to another .
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–3 Perform the follo wing steps to disassemble the display assembly: 1. Remov e all scre w covers 1 and scre ws 2 that secure the display bezel to the display assembly . R emo v ing the Displa y Bez el Scr ew C o ve rs and Sc r e w s
C–4 Maint enance and Servi ce Guide Display C omponent R ecy cling 2. Lift up and out on the left and right inside edges 1 and the top and bottom inside edges 2 of the display bezel until the bezel disengages fro m the display assembly . 3. Remov e the display bezel 3 . R emo v ing the Displa y Bez el
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–5 4. Disconnect all display panel cables 1 from the display in verter and remo ve the in verter 2 . R emo v ing the Displa y In ve rter
C–6 Maint enance and Servi ce Guide Display C omponent R ecy cling 5. Remov e all scre ws 1 that secure the display panel assembly to the display enclosure. 6. Remov e the display panel assembly 2 from the display enclosure. R emo v ing the Displa y P anel Ass embl y
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–7 7. T urn the display panel assembly upside do wn. 8. Remov e all scre ws that secure the display panel frame to the display panel. R emo v ing the Displa y P anel F rame Sc r e w s
C–8 Maint enance and Servi ce Guide Display C omponent R ecy cling 9. Use a sharp-edged tool to cut the tape 1 that secures the sides of the display panel to the display panel frame. 10. Remov e the display panel frame 2 from the display panel. R emo v ing the Displa y F rame
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–9 11. Remov e the scre ws 1 that secure the backlight co ver to the display panel. 12. Lift the top edge of the backlight cov er 2 and swing it forward. 13. Remov e the backlight co ver . R emo v ing the Back light C o v er
C–10 Maint enance and Servi ce Guide Display C omponent R ecy cling 14. T urn the display panel right-side up. 15. Remov e the backlight cables 1 from the clip 2 in the display panel. R eleasing the Bac kligh t Cable s
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–11 16. T urn the display panel upside do wn. 17. Remov e the backlight frame from the display panel. R emo v ing the Back light F rame
C–12 Maint enance and Servi ce Guide Display C omponent R ecy cling Å W ARN IN G: T he backli ght contains mer cury . Ca ution sh ould be e x er c ised w hen remo ving and handling the bac klight t o av o id damaging this component and ca using e xposur e to the merc ury . 18. Slide the backlight out of the backlight frame. R emo v ing the Back light
Displa y Componen t Rec yc ling Maintenance and Serv ice Gui de C–13 19. Disconnect the display cable 1 from the LCD panel. 20. Remov e the scre ws 2 that secure the LCD panel to the display rear panel. 21. Release the LCD panel 3 from the display rear panel. 22. Release the tape 4 that secures the LCD panel to the display rear panel. R eleasing the L CD P anel
C–14 Maint enance and Servi ce Guide Display C omponent R ecy cling 23. Remov e the LCD panel. R emo v ing the L CD P anel 24. Recycle the LCD panel and backlight.
Maintenance and Serv ice Gui de D–1 D Co nnec tor P in As sig nmen ts Ta b l e D - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 Audio out, left channel 3 Ground 2 Audio out, right channel
D–2 Maintenance and Servi ce Guide Connec tor P in Assignments Ta b l e D - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 Audio signal in 3 Ground 2 Audio signal in Ta b l e D - 3 Universal Serial Bus Pin Signal Pin Signal 1 5 VDC 3 Data 2 Data – 4 Ground
Connec tor P in Assi gnments Maintenance and Serv ice Gui de D–3 Ta b l e D - 4 S-Video-Out Pin Signal Pin Signal 1 S-VHS color (C) signal 5 TV -CD 2 Composite video signal 6 S-VHS intensity ground 3 S-VHS intensity (Y) signal 7 Composite video ground 4 S-VHS color ground
D–4 Maintenance and Servi ce Guide Connec tor P in Assignments Ta b l e D - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Horizontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B cloc k 8 Ground analog
Connec tor P in Assi gnments Maintenance and Serv ice Gui de D–5 Ta b l e D - 6 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused
D–6 Maintenance and Servi ce Guide Connec tor P in Assignments Ta b l e D - 7 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit 5 Unused 2 T ransmit – 6 Receiv e – 3 Receive 7 Unused 4 Unused 8 Unused
Maintenance and Serv ice Gui de E–1 E P o w er C ord Set Requiremen ts 3-Con duc tor P o w er Cord Set The wide range input feature of the computer permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C. The po wer cord set included with the computer meets the requirements for use in the country where the equipment is purchased. Po wer cord sets for use in other countries must meet the requirements of the country where the computer is used.
E–2 Maintenance and Se rvice Gui de P o w er Cor d Set Requir ements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft). ■ All po wer cord sets must be approv ed by an acceptable accredited agency responsible for e valuation in the country where the po wer cord set will be used. ■ The po wer cord sets must ha ve a minimum current capacity of 10 amps and a nominal v oltage rating of 125 or 250 V A C, as required by each country’ s power system. ■ The appliance coupler must meet the mechanical conf iguration of an EN 60 320/IEC 320 Standard Sheet C13 connector for mating with the ap pliance inlet on the back of the computer .
P o w er Cor d Set R equirements Maintenance and Serv ice Gui de E–3 Coun tr y-Spec ific Requirements 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Ag ency Applicable Note Number A ustralia EANSW 1 Au s t r i a O VE 1 Belgium C EBC 1 Canada CSA 2 Denmark D EMK O 1 Finland FIMK O 1 F rance UTE 1 Ger many VDE 1 Italy IMQ 1 Jap a n ME T I 3 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f or e v aluation in the countr y where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equivalent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flex ible cord, and w all plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration.
E–4 Maintenance and Se rvice Gui de P o w er Cor d Set Requir ements Ko r e a E K 4 The Netherlands KEMA 1 Norwa y NEMK O 1 P eople’ s Repub lic of China CCC 5 Sweden SEMK O 1 Switzerland SEV 1 T a iw an BSMI 4 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f or e v aluation in the countr y where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equivalent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flex ible cord, and w all plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration. 4. The fle xible cord m ust be T ype R VV , 3-conductor , 0.75 mm² conductor siz e. P ower cord set fittings (appliance co upler and w all plug) must bear the cer tification mar k of the agency resp onsible f or e valuation in the countr y where it will be used. 5. The fle xible cord m ust be T ype VC TF , 3-conductor , 0.75 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mar k of the agency respon sible f or ev aluation in the country where it will be used. 3-Conductor P ower Cor d Set Requirements (Continued) Country/Region Accredited Ag ency Applicable Note Number
Maintenance and Serv ice Gui de Inde x–1 In de x 1394 port 1–9 A AC adapter, spare part number 3–15 , 3–19 accessory battery connector 1–21 arrow keys 1–15 audio troubleshooting 2–25 audio-in jack location 1–11 pin assignments D–2 audio-out jack location 1–11 pin assignments D–1 B base enclosure, spare part numbers 3–9, 3–21 battery removal 5–5 spare part numbers 3–9, 3–19 , 3–20 , 5–5 specifications 6–6 battery bay 1–13, 1–20 battery light 1–7 battery release latch 1–20 Bluetooth module removal 5–11 spare part number 3–9 , 3–19 , 5–11 Bluetooth module cable illustrated 3–13 removal 5–43 bottom components 1–20 C Cable Kit contents 3–13 spare part number 3–13 cables, service considerations 4–2 caps lock key 1–15 caps lock light 1–17 carrying case, spare part number 3–15, 3–18 CD-ROM drive precautions 4–3 removal 5–14 spare part number 3–11, 3–14 , 3–21 , 5–14 specifications 6–11 CMOS clearing 1–4
Inde x–2 Maintenance and Serv ice Guide Inde x components bottom 1–20 front 1–6 keyboard 1–12, 1–14 left-side 1–10 rear 1–10 right-side 1–8 top 1–16, 1–18 computer feet illustrated 3–12 locations 5–10 Computer Setup overview 2–1 computer specifications 6–1 connector pin assignments audio-in D–2 audio-out D–1 external monitor D–4 headphone D–1 microphone D–2 modem D–5 monitor D–4 network D–6 RJ-11 D–5 RJ-45 D–6 S-Video-out D–3 Universal Serial Bus (USB) D–2 connectors, service considerations 4–2 D design overview 1–22 Digital Media Slot 1–7 Digital Media Slot light 1–7 disassembly sequence chart 5–3 diskette drive OS loading problems 2–23 precautions 4–3 display assembly removal 5–33 spare part numbers 3–3, 3–20 , 5–33 specifications 6–3, 6–4 display component recycling C–1 display release button 1–6 display switch 1–16 docking connector 1–20 docking device, troubleshooting 2–18 docking station AC adapter, spare part number 3–15, 3–19 Docking Station, HP, spare part number 3–15, 3–19 drive light 1–7 drives, preventing damage 4–3 DVD/CD-RW Combo Drive OS loading problems 2–24 precautions 4–3 removal 5–14 spare part number 3–11, 3–14 , 3–15 , 3–18 , 3–21 , 5–14 specifications 6–7 DVD±RW and CD-RW Combo Drive OS loading problems 2–24 precautions 4–3
Inde x Maintenance and Serv ice Gui de Inde x–3 removal 5–14 spare part numbers 3–11, 3–14 , 3–15 , 3–19 , 3–21 , 5–14 specifications 6–9 DVD-ROM drive OS loading problems 2–24 spare part number 3–15, 3–18 E electrostatic discharge 4–4, 4–8 exhaust vents 1–10 ExpressCard bezel, illustrated 3–12 ExpressCard slot 1–11 external monitor port location 1–10 pin assignments D–4 External MultiBay II power cable and stand, spare part number 3–15, 3–18 External MultiBay II, spare part number 3–15, 3–18 F f1 to f12 keys 1–15 fan removal 5–20 spare part number 3–5, 3–19 , 5–20 features 1–2 feet illustrated 3–12 locations 5–10 fingerprint reader 1–19 fingerprint reader board cable, disconnection 5–38 fingerprint reader board, spare part number 3–5 , 3–21 , 5–36 flowcharts, troubleshooting no audio 2–25, 2–26 no network/modem connection 2–30 no OS loading 2–19 no OS loading from diskette drive 2–23 no OS loading from hard drive 2–20, 2–21, 2–22 no OS loading from optical drive 2–24 no power 2–12 , 2–14 , 2–15 no video 2–16, 2–17 nonfunctioning device 2–27 nonfunctioning docking device 2–18 nonfunctioning keyboard 2–28 nonfunctioning pointing device 2–29 fn key 1–15 front components 1–6 G grounding equipment and methods 4–7 H hard drive OS loading problems 2–20 precautions 4–3
Inde x–4 Maintenance and Serv ice Guide Inde x removal 5–6 spare part numbers 3–11, 3–14 , 3–20 , 5–6 specifications 6–5 hard drive bay 1–21 hard drive cover illustrated 3–12 removal 5–7 hard drive frame, removal 5–9 headphone jack location 1–11 pin assignments D–1 heat sink removal 5–21 spare part number 3–7, 3–21 , 5–21 HP Docking Station AC adapter, spare part number 3–15 , 3–19 HP Docking Station, spare part number 3–15, 3–19 I I/O address specifications 6–15 Info Center button 1–17 interrupt specifications 6–13 K keyboard removal 5–16 spare part numbers 3–3, 3–22 , 3–23 , 3–24 , 5–16 troubleshooting 2–28 keyboard components 1–12 , 1–14 keypad keys 1–15 L left-side components 1–10 M mass storage devices, spare part numbers 3–14 memory map specifications 6–18 memory module removal 5–12, 5–29 spare part numbers 3–7, 3–20 , 5–12 , 5–29 memory module compartment 1–21 memory module compartment cover illustrated 3–12 removal 5–12 microphone 1–17 disconnection 5–38 illustrated 3–13 microphone jack location 1–11 pin assignments D–2 Mini Card WLAN module removal 5–27 spare part numbers 3–5, 3–19 , 5–27 Miscellaneous Plastics Kit (for use with docking device), spare part number 3–15, 3–19 modem jack location 1–9 pin assignments D–5
Inde x Maintenance and Serv ice Gui de Inde x–5 modem module removal 5–44 spare part number 3–7, 3–21 , 5–44 troubleshooting 2–30 modem module cable illustrated 3–13 removal 5–45 monitor port location 1–10 pin assignments D–4 N network jack location 1–10 pin assignments D–6 network, troubleshooting 2–30 nonfunctioning device, troubleshooting 2–18, 2–27 num lock key 1–15 num lock light 1–17 O optical drive location 1–9 OS loading problems 2–24 precautions 4–3 removal 5–14 spare part numbers 3–11, 3–14 , 3–15 , 3–18 , 5–14 specifications 6–7, 6–9, 6–11 optical drive bracket, removal 5–15 P packing precautions 4–5 password clearing 1–4 PC Card bezel, illustrated 3–12 PC Card slot 1–11 plastic parts 4–2 Plastics Kit contents 3–12 spare part number 3–7 , 3–12 , 3–22 pointing device, troubleshooting 2–29 power button 1–16 power connector 1–13 power cord set requirements E–2 spare part numbers 3–16, 3–18 power light 1–6 power management features 1–5 power, troubleshooting 2–12 presentation button 1–17 processor removal 5–24 spare part numbers 3–9, 3–20 , 3–21 , 5–24 R rear components 1–10 removal/replacement preliminaries 4–1 procedures 5–1 right-side components 1–8
Inde x–6 Maintenance and Serv ice Guide Inde x RJ-11 jack location 1–9 pin assignments D–5 RJ-45 jack location 1–10 pin assignments D–6 RTC battery illustrated 3–12 removal 5–26 S Screw Kit contents A–1 spare part numbers 3–17, 3–20 , 3–21 , 3–24 , A–1 screw listing A–1 security cable slot 1–13 serial number 3–1, 5–2 service considerations 4–2 smart card slot 1–11 speaker location 1–7 removal 5–40 spare part number 3–9, 3–19 , 5–40 speaker cable, disconnection 5–41 specifications battery pack 6–6 CD-ROM drive 6–11 computer 6–1 display 6–3, 6–4 DVD/CD-RW Combo Drive 6–7 DVD±RW and CD-RW Combo Drive 6–9 hard drive 6–5 I/O addresses 6–15 interrupts 6–13 memory map 6–18 optical drive 6–7, 6–9, 6–11 system DMA 6–12 static shielding materials 4–8 stringent security 1–4 S-Video-out jack location 1–13 pin assignments D–3 switch cover removal 5–31 spare part numbers 3–3, 3–21 , 5–31 system board removal 5–48 spare part numbers 3–9, 3–20 , 5–48 system DMA 6–12 system memory map 6–18 T Thermal Grease Kit, spare part number 3–7, 3–9, 3–20, 5–21 thermal pad, replacement 5–23 thermal paste, replacement 5–23 tools required 4–1 top components 1–16, 1–18 top cover removal 5–36 spare part numbers 3–5, 3–20 , 5–36
Inde x Maintenance and Serv ice Gui de Inde x–7 TouchPad buttons 1–19 TouchPad cable, disconnection 5–38 TouchPad scroll zone 1–19 TouchPad, location 1–19 transporting precautions 4–5 travel battery, spare part number 3–15, 3–18 troubleshooting audio 2–25 docking device 2–18 flowcharts 2–10 keyboard 2–28 modem 2–30 network 2–30 nonfunctioning device 2–18 , 2–27 OS loading 2–19 overview 2–1 pointing device 2–29 power 2–12 video 2–16 U Universal Serial Bus (USB) port location 1–9, 1–11 pin assignments D–2 unknown password 1–4 USB/audio board removal 5–46 spare part numbers 3–9, 3–21 , 5–46 V vents 1–21 video troubleshooting 2–16 volume buttons 1–17 W Windows applications key 1–15 Windows logo key 1–15 wireless button 1–17 wireless light 1–6, 1–17 workstation precautions 4–6