HP nx6130 Maintenance And Service Manual

Main tenan ce and Ser vice Gu id e HP C om paq nx613 0 Noteboo k P C Doc ument P art Number: 3 9 6 3 2 6 -001 June 200 5 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi v e information on identifying notebook features, components, and spare parts; troubleshooting notebook problems; and performing notebook disassembly procedures.
© Copyright 2005 He wlett-P ackard Dev elopment Compan y , L.P . Microsoft and W indows are U.S. re gistered trademarks of Microsoft Corporation. Intel, Pentium, and Celeron are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Bluetooth is a trademark o wned by its proprietor and used by He wlett-Packard Company under licen se. SD Logo is a trademark of its proprietor . The information contained herein is su bject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompan ying such products and services. Nothing herein should be construed as constituting an additional warranty . HP shall not be liable for technical or editorial errors or omissions contained herein. Maintenance and S ervi ce Gui de HP Co mpaq nx6130 Notebook P C F irst E dition June 200 5 Document P ar t Numb er : 3 9 6 3 2 6 -001
Maintenance and S ervi ce Guide iii Cont e nt s 1 Product Description 1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Resetting the Notebook . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5 1.4 External Components . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.5 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–22 2 Troubleshooting 2.1 Computer Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1 Accessing Computer Setup . . . . . . . . . . . . . . . . . . . . 2–2 Computer Setup Defaults . . . . . . . . . . . . . . . . . . . . . 2–2 Selecting from the File Menu . . . . . . . . . . . . . . . . . . 2–3 Selecting from the Security Menu . . . . . . . . . . . . . . 2–4 Selecting from the Tools Menu . . . . . . . . . . . . . . . . . 2–5 Selecting from the Advanced Menu . . . . . . . . . . . . . 2–6 2.2 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . . 2–7 3 Software Update and Recovery Downloading a BIOS Update . . . . . . . . . . . . . . . . . . 3–3 Installing a BIOS Update . . . . . . . . . . . . . . . . . . . . . 3–4 Recovering the BIOS . . . . . . . . . . . . . . . . . . . . . . . . 3–5
i v Maintenance and S ervi ce Guide Cont en ts 4 Illustrated Parts Catalog 4.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 4–2 4.3 Miscellaneous Plastics Kit . . . . . . . . . . . . . . . . . . . . 4–8 4.4 Miscellaneous Cable Kit . . . . . . . . . . . . . . . . . . . . . . 4–9 4.5 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . . 4–10 4.6 Miscellaneous (Not Illustrated) . . . . . . . . . . . . . . . . 4–11 4.7 Sequential Part Number Listing . . . . . . . . . . . . . . . 4–13 5 Removal and Replacement Preliminaries 5.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1 5.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 5–2 Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.3 Preventing Damage to Removable Drives . . . . . . . . 5–3 5.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 5–4 5.5 Packaging and Transporting Precautions . . . . . . . . . 5–5 5.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 5–6 5.7 Grounding Equipment and Methods . . . . . . . . . . . . . 5–6 6 Removal and Replacement Procedures 6.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2 6.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 6–2 6.3 Preparing the Notebook for Di sassembly . . . . . . . . . 6–4 6.4 Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6 6.5 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–9 6.6 Bluetooth Board . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–10
Cont en ts Maintenance and S ervi ce Guide v 6.7 External Memory Module . . . . . . . . . . . . . . . . . . . . 6–12 6.8 Mini PCI Communications Card . . . . . . . . . . . . . . . 6–14 6.9 Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–16 6.10 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–18 6.11 Switch Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–22 6.12 LED Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–24 6.13 Fan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–26 6.14 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–27 6.15 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–30 6.16 Internal Memory Module . . . . . . . . . . . . . . . . . . . 6–32 6.17 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–34 6.18 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 6–35 6.19 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–38 6.20 Speaker . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–42 6.21 Modem Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–44 6.22 Digital Media Board . . . . . . . . . . . . . . . . . . . . . . . 6–46 6.23 USB/Audio Board . . . . . . . . . . . . . . . . . . . . . . . . . 6–48 6.24 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–50 6.25 Serial Connector Module . . . . . . . . . . . . . . . . . . . 6–55 7 Specifications
v i Maintenance and S ervi ce Guide Cont en ts A Connector Pin Assignments B Power Cord Set Requirements C Screw Listing Index
Maintenance and S ervi ce Guide 1–1 1 Pr oduc t D esc ription The HP Compaq nx6130 Notebook PC of fers adv anced modularity , Intel® Pentium® M and Celeron® M processors, and extensi ve multimedia support. HP Co mpaq nx6130 Notebook P C
1–2 Maintenance and Serv ice Gui de Product D escr ipt ion 1.1 F e a t u r e s ■ The follo wing processors are a v ailable, v arying b y notebook model: ❏ Intel Pentium M 2.13-, 2.00-, 1.86-, 1.73-, 1.60-, or 1.30-GHz processor , ❏ Intel Celeron M 1.5- or 1.4-GHz ■ The follo wing displays are a v ailable, v arying by notebook model: ❏ 15.0-inch, SXGA WV A, TFT (1400 × 1050) with ov er 16.8 million colors ❏ 15.0-inch, XGA, TFT (1024 × 768) with ov er 16.8 million colors ❏ 14.1-inch, XGA, TFT (1024 × 768) with ov er 16.8 million colors ■ 80-, 60-, or 40-GB high-capacity hard dri v e, v arying by notebook model ■ 256-MB DDR2 synchronous DRAM (SDRAM) at 533 MHz, expandable to 2.0 GB ■ Microsoft® W indo ws® XP Home Edition SP2, W indows XP Professional SP2, or FreeDOS, v arying b y notebook model ■ Full-size W indows k e yboard with embedded numeric ke ypad ■ T ouchPad pointing de vice, including a dedicated v ertical scroll region ■ Integrated 10/100/1000 PCI-based Ethernet local area network (LAN) netw ork interface card (NIC) with RJ-45 jack ■ Integrated high-speed 56K modem with RJ-11 jack
Product D escr ipt ion Maintenance and S ervi ce Guide 1–3 ■ Integrated wireless support for Mini PCI IEEE 802.11b/g or 802.11a/b/g WLAN de vice ■ Support for one or two T ype II PC Card slots, with support for both 32-bit (CardBus) and 16-bit PC Cards, v arying by notebook model ■ External 65-watt A C adapter with 3-wire po wer cord, v arying by notebook model ■ 6-cell Li-Ion battery pack ■ Stereo speakers ■ Support for the follo wing optical dri v es: ❏ D VD±R W and CD-R W Dual Layer Combo Dri ve, LightScribe ❏ D VD±R W and CD-R W Combo Dri ve ❏ D VD/CD-R W Combo Dri ve ❏ D VD-R OM dri ve ■ Uni versal Serial Bus ports (4) ■ PC Card slots (2) ■ V olume up, volume mute, and v olume down b uttons ■ Info Center b utton ■ Infrared port ■ 6-in-1 Digital Media Slot ■ Serial port ■ Parallel port ■ S-V ideo-out jack ■ Docking connector
1–4 Maintenance and Serv ice Gui de Product D escr ipt ion ■ Connectors: ❏ Audio-out (headphone) ❏ Audio-in (microphone) ❏ Uni versal Serial Bus (USB) v . 2.0 (4 ports) ❏ Po wer ❏ External monitor ❏ RJ-11 (modem) ❏ RJ-45 (network) ❏ IEEE 1394 ❏ T rav el battery ❏ Infrared ❏ Digital Media Slot ❏ Parallel port ❏ S-V ideo-out ❏ Docking connector ❏ Serial port 1 .2 Resettin g t he N otebook If the notebook you are servicing has an unkno wn password, follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the notebook for disassembly (refer to Section 6.3, “Preparing the Notebook for Disassembly , ” for more information). 2. Remov e the real-time clock (R TC) battery (refer to Section 6.17, “R TC Battery , ” for more information on removing and replacing the R TC battery).
Product D escr ipt ion Maintenance and S ervi ce Guide 1–5 3. W ait approximately 5 minutes. 4. Replace the R TC battery and reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert an y battery packs at this time. 6. T urn on the notebook. All passwords and all CMOS settings ha v e been cleared. 1. 3 P o w e r M a n a g e m e n t The notebook comes with po wer management features that extend battery operating time and conserv e po wer . The notebook supports the follo wing po wer management features: ■ Standby ■ Hibernation ■ Setting customization by the user ■ Hotke ys for setting the le ve l of performance ■ Battery calibration ■ Lid switch standby/resume ■ Po wer/standby b utton ■ Adv anced Conf iguration and Po wer Management (A CPM) compliance
1–6 Maintenance and Serv ice Gui de Product D escr ipt ion 1 .4 Exter nal C om ponents The external components on the front of the notebook are sho wn belo w and described in T able 1-1. F r ont Component s Ta b l e 1 - 1 Fr ont Components Item Component Function 1 Infrared por t Provides wireless comm unication between the notebook and an optional IrD A-compliant de vice. 2 Stereo speakers (2) Produce stereo sound. 3 Displa y release latch Opens the notebook. 4 Wireless light On: an integrated wireless de vice has been enabled. 5 P ower/standb y light ■ Green: The notebook is on. ■ Blinking green: The notebook is in standby mode . ■ Off: The notebook is off or in hiber nation.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–7 6 Batter y light ■ Amber : A batter y pac k is charging. ■ Green: A batter y pack is close to full charge capacity . ■ Blinking amber : A batter y pac k that is the only a vailab l e po wer source has reached a low-battery condition. When the batter y reaches a critical lo w-batter y condition, the batter y light begins blinking more quickly . ■ Off: If the notebook is connected to an e xter nal po wer source, the light is turned off when all batteries in the notebook are fully charged. If the notebook is not connected to an e xternal power source , the light is tur ned off until the battery reaches a low-battery condition. 7 Integra ted Dr iv e Electronics (IDE) drive light Blinking: The hard drive or optical drive is being accessed. 8 6-in-1 Digital Media Slot Suppor ts 6 optional digital memor y card f or mats: SD (Secure Digital) Memor y Card, MultiMediaCard, Memor y Stick, Memory Stick Pro , Smar tMedia, and xD-Picture Card. 9 6-in-1 Digital Media Slot light On: A digital memor y card is being accessed. Ta b l e 1 - 1 Fr ont Components (Continued) Item Component Function
1–8 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the right side of the notebook are sho wn belo w and described in T able 1-2. R igh t -Si de Com ponents
Product D escr ipt ion Maintenance and S ervi ce Guide 1–9 Ta b l e 1 - 2 Right-Side Components Item Component Function 1A u d i o - o u t (headphone) jack Connects optional headphones or pow ered stereo speake rs. Also connects the audio function of an audio/v ideo de vice such as a tele vision or VCR. 2A u d i o - i n (microphone) jack Connects an optional monaural microphone. 3 USB por ts (2) Connect USB 1.1- and 2.0-compliant de vices to the notebo ok using a standard USB cable , or connect an optional Exter nal MultiBa y II to the notebook. The MultiBa y II must also be connected to an e xternal pow er source. 4 Optical drive Suppor ts an opti cal disc. The type of optical drive v ar ies by model. 5 Serial por t Connects an optional serial device .
1–10 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the left side of the notebook are sho wn belo w and described in T able 1-3. Left -Side Components Ta b l e 1 - 3 Left-Side Components Item Component Function 1 USB por ts (2) Connect USB 1.1- and 2.0-compliant de vices to the notebook using a standard USB cab le, or connect an optional External MultiBa y II to the notebook. The MultiBa y II must also be connected to an e xternal pow er source. 2 Exter nal monitor por t Connects an optional V GA external monitor or projector .
Product D escr ipt ion Maintenance and S ervi ce Guide 1–11 3 Exhaust v ent Pro vides airflow to cool internal components. Ä T o pre vent ov erheating, do not obstruct vents . Do not allow a hard surf ace, such as a printer , or a soft surf ace, such as pillo ws , thick rugs, or clothing, to bloc k airflow . 4 RJ-11 (modem) jack Conn ects the modem cab le. 5 RJ-45 (network) jack Connects an optional network cable . 6 1394 por t Connects an opti onal 1394a de vice such as a scanner , digital camera, or digital camcorder . 7 PC Card slots (2) Suppor t an optional T ype I, T ype II, or T ype III 32-bit (CardBus) or 16-bit PC Card. 8 PC Card eject buttons (2) Eject an optional PC Card from the PC Card slot. Ta b l e 1 - 3 Left-Side Components (Continued) Item Component Function
1–12 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the rear panel of the notebook are sho wn belo w and described in T able 1-4. Re ar P a ne l Co mp o n en t s
Product D escr ipt ion Maintenance and S ervi ce Guide 1–13 T able 1-4 Rear P anel Components Item Component Function 1 Security cable slot Attaches an op tional security cable to the notebook. Ä Security solutions are designed to act as deterrents. These deterrents ma y not pre v ent a product from being mishandled or stolen. 2 Batter y ba y Holds a batter y pac k. 3 P ower connector Connects an A C adapter or an optional automobile or aircraft adapter . 4 P arallel por t Connects an optional parallel de vice, such as an e xter nal disk ette drive or a printer . 5 S-Video-out jack Connects an optional S-Video de vice, such as a tele vision, VCR, camcorder , projector , or video capture card.
1–14 Maintenance and Serv ice Gui de Product D escr ipt ion The standard ke yboard components of the notebook are sho wn belo w and described in T able 1-5. St andar d K ey board C omponen ts
Product D escr ipt ion Maintenance and S ervi ce Guide 1–15 T able 1-5 Standar d Ke yboar d Components Item Component Function 1 f1 to f12 ke ys (12) P erform system and application tasks. When combined with the fn key , seve ra l ke ys and b uttons perf or m additional tasks as hotk eys . 2 caps lock ke y Enables caps loc k and turns on the caps loc k light. 3 fn ke y Ex ecutes frequently used system functions when pressed in combination with a function ke y or the esc key . 4 Windows logo k e y In Window s , displa ys the Windo ws Star t menu. 5W i n d o w s applications ke y In Windows , displa ys a shor tcut menu f or items beneath the pointer . 6 Arrow k e ys Mov e the cursor around the screen. 7 K eypad ke ys (15) In Windows , can be used like the k eys on an e xter nal numeric k eypad. 8 num lock ke y Enables n umeric lock, tur ns on the embedded numeric ke ypad, and turns on the num loc k light.
1–16 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are sho wn belo w and described in T able 1-6. T op C omponents , P ar t 1 T able 1-6 T op Components, P ar t 1 Item Component Function 1 P ower/standb y b utton When the notebook is: ■ Off , press to turn on the notebook. ■ On, briefly press to initiate hiber nation. ■ In standb y , br iefly press to resume from standby . ■ In hiber nation, briefly press to restore from hiber nation. If the system has st opped responding and Windows shutdo wn procedures cannot be used, press and hold f or 5 seconds to tur n off the notebook.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–17 2 Displa y lid s witch ■ If the notebook is closed while on, tur ns off the displa y . ■ If the notebook is opened while in standby , turns on the notebook (resumes from standby). 3 Inf o Center b utton Launches Inf o Center . 4 Wireless button T urns the wireless functionality on or off, but does not create a wireless connection. ✎ To establish a wireless connection, a wireless network must already be set up. 5 Presentation mode bu tt o n T urns on Presentation mode. 6 Caps lock light On: caps lock is on. 7 Num loc k light On: num loc k or the numeric ke ypad is on. T able 1-6 T op Components, P ar t 1 (Continued) Item Component Function
1–18 Maintenance and Serv ice Gui de Product D escr ipt ion The notebook top components are continued belo w and described in T able 1-7. T op C omponents , P ar t 2
Product D escr ipt ion Maintenance and S ervi ce Guide 1–19 T able 1-7 T op Components, P ar t 2 Item Component Function 1 V olume mute bu tton Mutes or restores system volume . 2 V olume down b utton Decreases system v olume. 3 V olume up button Increases system v olume. 4 T ouchP ad Mov es the pointer and selects or activates items on the screen. Ca n be set to perf orm other mouse functions, such as scrolling, selecting, and double-clic king. 5 Left/right T ouchP ad bu tt o n s Function lik e the left and ri ght b uttons on an e xternal mouse. 6 T ouchP ad scroll zone Scrolls up or down.
1–20 Maintenance and Serv ice Gui de Product D escr ipt ion The external components on the bottom of the notebook are sho wn belo w and described in T able 1-8. Bot tom Component s Ta b l e 1 - 8 Bottom Components Item Component Function 1 Primar y batter y ba y Holds the primar y batter y pack. 2 Primar y batter y locking latch Secures the primar y batter y pack into the batter y ba y . 3 Docking connector Connects the notebook to an optional doc king de vice.
Product D escr ipt ion Maintenance and S ervi ce Guide 1–21 4 Memor y module compar tment Mini PCI compar tment Contains 1 memor y sl ot that suppor ts a replaceable memory module. Holds an optional wireless LAN de vice. Ä T o pre vent an unresponsiv e system and the displa y of a warning message, install only a Mini PCI de vice authorized f or use in your notebook b y the gov er nmental agency that regulates wireless de vices in y our countr y . If you install a de vice and then receiv e a warning message, remov e the device to restore notebook functionality . Then contact Customer Care. 5 Hard drive ba y Holds the primar y hard dr iv e. 6 Primar y batter y release latch Releases the primar y batter y pack from the batter y ba y . 7 T ra vel batter y connector Connects an optional tra v el batter y . 8 F an Provides airflo w to cool inter nal components. Ä T o pre vent ov erheating, do not obstruct fans . Do not allow a hard surf ace, such as a printer , or a soft surf ace, such as pillo ws, thic k rugs, or clothing, to bloc k airflo w . Ta b l e 1 - 8 Bottom Components (Continued) Item Component Function
1–2 2 Maintenance and Serv ice Gui de Product D escr ipt ion 1. 5 D e s i g n O v e r v i e w This section presents a design ov ervie w of key parts and features of the notebook. Refer to Chapter 4, “Illustrated Pa rts Catalog, ” to identify replacement parts, and Chapter 6, “Remo v al and Replacement Procedures, ” for disassembly steps. The system board provides the follo wing device connections: ■ Audio ■ Display ■ Hard dri v e ■ Intel Pentium M and Celeron M processors ■ K e yboard and T ouchPad ■ Memory module ■ Mini PCI communications de vices ■ PC Card Ä CA UTION: T o pr operl y v entilate the n otebook , allo w at least a 7 .6 -cm (3-inc h) c lear ance on the left and r ight si des of the note book . The notebook uses an electric fan for v entilation. The fan is controlled by a temperature sensor and is designed to be turned on automatically when high temperature conditions exist. These conditions are af fected b y high external temperatures, system po wer consumption, po wer management/battery conserv ation conf igurations, battery fast char ging, and software applications. Exhaust air is displaced through the ventilation grill located on the left side of the notebook.
Maintenance and S ervi ce Guide 2–1 2 T r oubl eshooting Å W ARN ING: Only author iz ed techni c ians tr ained by HP should r epair this equipmen t . All tr ouble shooting and r epair pr ocedur es ar e detailed to allo w onl y subass embly-/module-lev el r epair . Because o f the comple x ity of the indi v idual boar ds and subas sembli es , do not attempt to mak e r epair s at the component le vel or modif icati ons to an y printed w ir ing boar d. Im pr oper r epairs can c r eate a safety ha z ard . An y indicati on of component r eplacement or pr inted w ir ing boar d modif icati on may v oid an y warr ant y or e x change allo wances . 2. 1 Comp uter Setu p Computer Setup is a preinstalled, R OM-based utility that can be used e ven when the operating system is not w orking or will not load. If the operating system is working, the notebook restarts the operating system after you exit Computer Setup. ✎ Pointing de vices are not supporte d in Computer Setup; you must use the ke yboard to na vigate and make selections. The menu tables later in this chapter provide an o v ervie w of Computer Setup options.
2–2 Maintenance and Serv ice Gui de T r oublesh ooting Acce ssing Compute r Set up The information and settings in Computer Setup are accessed from the File, Security , T ools, and Adv anced menus. 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner of the screen. ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . ❏ T o return to the Computer Setup menu, press esc . 2. Select the File , Security , T ools , or Advanced menu. 3. T o exit Computer Setup, choose one of the follo wing: ❏ T o exit without sa ving any changes, use the arro w keys to select File > Ignor e changes and exit , and then follo w the instructions on the screen. ❏ T o exit and sa ve all the settings you ha ve entered, use the arro w ke ys to select File > Sa ve changes and exit , and then follo w the instructions on the screen. Y our preferences are set when you exit Computer Setup and tak e ef fect when the notebook restarts. Com puter Setu p Defaults T o return all settings in Computer Setup to the values that were set at the factory: 1. Open Computer Setup by turning on or restarting the notebook. Press f10 while the F10 = Based Setup message is displayed in the lo wer -left corner of the screen. ❏ T o change the language, press f2 . ❏ T o view na vigation information, press f1 . 2. Use the arro w ke ys to select File > Restor e defaults . 3. Select the Restore Defaults check box.
T r oubleshooting Maintenance and S ervi ce Guide 2–3 4. T o confirm the restoration, press f10 . 5. Select File > Sa ve changes and exit , and then follo w the instructions on the screen. When the computer restarts, the factory settings are restored, and any identif ication information you hav e entered is sa ved. Sele c ti ng fr om the F ile Menu Ta b l e 2 - 1 File Menu Select T o Do This System Inf or mation ■ View identification information about the notebook and an y batter y packs in the system. ■ View specification information about the processor , memor y and cache size, video revision, keyboard controller version, and system ROM. Sav e to floppy Sav e system configuration settings to a diskette . Restore from flopp y Restore system configuration settings from a diskette . Restore def aults Replace configurat ion settings in Computer Setup with f actor y def ault se ttings. (Identification inf or mation is retained.) Ignore changes and e xit Cancel ch anges entered during the current session. Then e xit an d restar t the notebook. Sav e changes and exit Sav e changes entered during the current session. Then e xit and restar t the notebook. The changes you sa v e are in eff ect when the notebook restar ts.
2–4 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting fr om t he Securit y Menu Ta b l e 2 - 2 Security Menu Select T o Do This Administrator pass word Enter , change , or delete an HP Administrator pass word. P ower-on pass word Enter , change , or delete a power-on pass word. P a ss word options ■ Enable/Disable stringent security . ■ Enable/Disable required password on restart. DriveLoc k pass words Enable/disab le DriveLoc k; change a Dr iv eLock user or master pass word. ✎ DriveLock Settings are accessible only when you enter Comput er Setup by turning on (not restarting) the notebook. Smar t Card Secur ity Enable/disab le powe r-on suppor t for smar t cards. ✎ This f eature is suppor ted by select smar t card readers only . De vice security ■ Enable/Disable devices in the system. ■ Enable NIC for inclusion in MultiBoot. System IDs Enter user-defin ed identification v alues.
T r oubleshooting Maintenance and S ervi ce Guide 2–5 Selec ting fr om t he T ools Menu Ta b l e 2 - 3 To o l s M e n u Select T o Do This HDD Self T est options Run a quick or comprehensiv e self-test on any hard drive in the system. Batter y Inf or mation Vie w inf or matio n about an y batter y packs in the notebook. Memor y Check ■ Run a self-test on memory modules in the notebook. ■ View information about memor y modules installed in the notebook.
2–6 Maintenance and Serv ice Gui de T r oublesh ooting Selec ting from th e Ad v an ced Menu Ta b l e 2 - 4 Adv anced Menu Select T o Do This Language (or press f2 ) Change the Computer Setup language. Boot options ■ Enable/Disable MultiBoot, which sets a startup sequence that can include most bootable devices and media in the system. ■ Set the boot order . De vice options ■ Swap the functions of the fn key and left ctrl key . ■ Enable/Disable multiple pointing devices at startup. (T o set the notebook to support only a single, usually nonstandard, pointing device at startup, select Disable .) ■ Enable/Disable USB legacy support for a USB keyboard, mouse, and hub. When USB legacy support is enabled ❐ A USB k eyboard, mouse , and hub work e v en when a Windows operating system is not loaded. ❐ The notebook star ts from a bootable hard drive , disk ette drive disk ette, or CD , CD-R W , or D VD inser ted into a drive connected b y a USB connector to the notebook or to an optional docking de vice . ■ Select a parallel port mode: EPP (Enhanced Parallel P ort), standard, bidirectional, or ECP (Enhanced Capabilities Port). ■ Enable/Disable all settings in the SpeedStep window. (When Disable is selected, the notebook runs in Batter y Optimized mode.)
T r oubleshooting Maintenance and S ervi ce Guide 2–7 2.2 T roubl eshooting Flo wc har ts Ta b l e 2 - 5 T roubleshooting Flo wchar ts Overview Flowchart Description 2.1 “Flowchar t 2.1—Initial T roubleshooting” 2.2 “Flowchar t 2.2—No P owe r , P ar t 1” 2.3 “Flowchar t 2.3—No P owe r , P ar t 2” 2.4 “Flowchar t 2.4—No P owe r , P ar t 3” 2.5 “Flowchar t 2.5—No P owe r , P ar t 4” 2.6 “Flowchar t 2.6—No Video , P ar t 1” 2.7 “Flowchar t 2.7—No Video , P ar t 2” 2.8 “Flowchar t 2.8—Nonfunctioning Do c king De vice (if applicab le)” 2.9 “Flowchar t 2.9—No Operating System (OS) Loading” 2.10 “Flowchar t 2.10—No OS Loading, Hard Drive , P ar t 1” 2.11 “Flowchar t 2.11—No OS Loading, Hard Drive , P ar t 2” 2.12 “Flowchar t 2.12—No OS Loading, Hard Drive , P ar t 3” 2.13 “Flowchar t 2.13—No OS Loading, Disk ette Dr iv e”
2–8 Maintenance and Serv ice Gui de T r oublesh ooting Flowchart Description 2.14 “Flowchar t 2.14—No OS Loading, Optical Drive” 2.15 “Flowchar t 2.15—No A udio , P ar t 1” 2.16 “Flowchar t 2.16—No A udio , P ar t 2” 2.17 “Flowchar t 2.17—Nonfunctioning De vice” 2.18 “Flowchar t 2.18—Nonfunctioning K eyboard” 2.19 “Flowchar t 2.19—Nonfunctioning P ointing De vice” 2.20 “Flowchar t 2.20—No Network/Modem Connection” Ta b l e 2 - 5 T roubleshooting Flo wchar ts Overview (Continued)
T r oubleshooting Maintenance and S ervi ce Guide 2–9 Flo wc h art 2. 1—Initi al T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there video? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device work- ing? Go to “Flowchart 2.17—Nonfunction- ing Device.” Go to “Flowchart 2.2—No Po we r , Par t 1 . ” Go to “Flowchart 2.6—No Video, Part 1.” All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to “Flowchart 2.9—No Operating System (OS) Loading.” Go to “Flowchart 2.15—No Audio, Par t 1. ” Go to “Flowchart 2.18—Nonfunction- ing Keyboard” or “Flowchart 2.19—Nonfunction- ing Pointing Device.” Check LED board, speaker connections. Go to “Flowchart 2.20—No Net- work/Modem Con- nection.”
2–10 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.2—N o P o w er , P ar t 1 1. Reseat the power cables in the docking device and at the AC outlet. 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from docking device (if applicable). Po we r u p on batter y power? Po we r u p on AC power? Power up in docking device? Po we r up on batter y power? Po we r u p in docking device? Done Reset power .* Reset power .* Po we r u p on AC power? N Y Y N N Y N N Y Y YN 1. On select models, there is a separate reset button. 2. On select models, the notebook can be reset using the standby switch and either the lid switch or the main po wer switch. *NOTES Go to “Flowchart 2.4—No Po we r , Pa rt 3 .” Go to “Flowchart 2.3—No Po we r , Par t 2 . ” Go to “Flowchart 2.8—Non- functioning Docking Device (if applicable).” No power (power LED is off).
T r oubleshooting Maintenance and S ervi ce Guide 2–11 Flo wc h art 2.3—No P o w er , P ar t 2 Continued from “Flowchart 2.2—No Po we r , Par t 1 . ” Visually check for debris in batter y socket and cl ean if necessary . Done N Y Po we r o n ? Check batter y by recharging it, moving it to another notebook, or replacing it. Po we r o n ? Done Y Replace power supply (if applicable). N Po we r o n ? Done Y N Go to “Flowchart 2.4—No Po we r , Par t 3 .”
2–12 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.4—N o P o w er , P ar t 3 Continued from “Flowchart 2.3—No Po we r , Par t 2 .” Reseat AC adapter in notebook and at po wer sou rc e. Internal or external AC adapter? Done Done Done Done Po we r o n ? Po we r o n ? Po we r o n ? Plug directly into AC outlet. Po we r L E D on? Po we r o u tl et active? T r y different outlet. Replace external AC adapter . Replace power cord. Y N Y Y Y Y N N N N External Internal Go to “Flowchart 2.5—No Po we r , Par t 4 . ”
T r oubleshooting Maintenance and S ervi ce Guide 2–13 Flowc ha r t 2.5 —N o P o w er , P ar t 4 Y N Continued from “Flowchart 2.4—No Po we r , Par t 3 . ” Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts? Y Close notebook and retest. Po we r on ? Done N Replace the following items (if ap plicable). Check notebook operation after each replacement: 1. Internal DC-DC converter* 2. Internal AC adapter 3. Processor board* 4. System board* *NOTE: Replace these items as a set to prevent shorting out among components.
2–14 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2.6—N o Video, P ar t 1 A N Stand-alone or docking device? No video. Replace the following one at a time. T est after each replacement. 1. Cable between notebook and notebook display (if applicable) 2. Display 3. System board Internal or external display*? Adjust brightness. Video OK? Done Docking Device Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid swi tc h to en su re operation. Video OK? D one Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N *NOTE: T o change from internal to external display , use the hotkey combi- nation. Y Go to “Flowchart 2.7—No Video, Part 2.”
T r oubleshooting Maintenance and S ervi ce Guide 2–15 Flo wc h art 2.7—N o Video, P ar t 2 Y N Continued from “Flowchart 2.6—No Video, Part 1.” Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in docking device, for bent pins on cable, and for monitor connection. Go to “A ” in “Flowchart 2.6—No Video, Part 1.” Check brightness of external monitor . T r y another external monitor . Internal and external video OK? Go to “Flowchart 2.8—Non- functioning Docking Device (if applicable).” Y Y Y N N N Remove notebook from dock- ing device, if connected.
2–16 Maintenance and Serv ice Gui de T r oublesh ooting F lo wcha rt 2 . 8— No n f u nct io n i ng Do ck ing De v i c e (i f appl icable) Y N Reseat power cord in docking device and power outlet. N Check voltage setting on docking device. Reset monitor cable connector at docking device. Reinstall notebook into dock- ing device. Docking device operating? Docking device operating? Done Done Y Nonfunctioning docking device. Remove notebook, replace docking device. T est replacement docking device with new notebook.
T r oubleshooting Maintenance and S ervi ce Guide 2–17 Flo wc h art 2.9—N o Opera ting S y stem (OS) Loadin g No OS loading from hard drive, go to “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat po wer cord in docking device and power outlet. No OS loading.* *NOTE: Before beginning troubleshooting, always check cable connections, cable ends, and drives for bent or damaged pins. No OS loading from diskette drive, go to “Flowchart 2.13—No OS Loading, Diskette Drive.” No OS loading from optical drive, go to “Flowchart 2.14—No OS Loading, Opti- cal Drive.” No OS loading from network, go to “Flowchart 2.20—No Network/Modem Con- nection.”
2–18 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 0—N o OS Loadin g, H ard Driv e, Pa r t 1 Go to “Flowchart 2.17—Non- functioning Device.” Y Done N OS not loading from hard drive. Nonsystem disk message? Go to “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Reseat external hard drive. OS loading? Done Boot from CD? Go to “Flowchart 2.13—No OS Loading, Diskette Drive.” Boot from hard drive? Boot from diskette? Change boot priority through the Setup utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order .
T r oubleshooting Maintenance and S ervi ce Guide 2–19 Flowc h ar t 2. 1 1—N o O S Lo a din g , H ard D rive, Pa r t 2 Load OS using Oper- ating System disc (if applicable). Continued from “Flowchart 2.10—No OS Loading, Hard Drive, Part 1.” Reseat hard drive. Done Disc or diskette in drive? 1. Replace hard drive. 2. Replace system board. Go to “Flowchart 2.13—No OS Loading, Diskette Drive.” Format hard drive and bring to ab o o t a b l e C:\ prompt. Create partition, and then format hard drive to boot- able C:\ prompt. Boot from diskette drive? Remove disc or diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible? Y N Hard drive accessible? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Notebook booted? Done Y N Go to “Flowchart 2.12—No OS Loading, Hard Drive, Part 3.” Go to “Flowchart 2.12—No OS Loading, Hard Drive, Part 3.”
2–20 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 2—No OS Loa ding , Ha rd Dri v e, Pa r t 3 Y System files on hard drive? Continued from “Flowchart 2.11—No OS Loading, Hard Drive, Part 2.” Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on disc or diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix ba d sectors. Boot from hard drive? Replace hard drive. Done
T r oubleshooting Maintenance and S ervi ce Guide 2–21 Flo wc h art 2. 1 3—No OS Loa ding , Disk et te Driv e Replace the following components individually , retesting after each replacement: ■ Diskette drive Done Y N Reseat diskette drive. OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system files. Tr y d i f f e r e n t diskette. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot notebook. Is diskette drive boot order cor- rect? Change boot priority using the Setup utility . Go to “Flowchart 2.17—Nonfunction- ing Device.” Diskette drive enabled in the Setup utility? Go to “Flowchart 2.17—Non- functioning Device.” Reset the notebook. Refer to Section 1.2, “Reset- ting the Notebook, ” for instructions.
2–2 2 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 4—N o OS Loading , O ptical Driv e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD-ROM or DVD-ROM drive. Install bootable disc and reboot notebook. Go to “Flowchart 2.17—Non- functioning Device.” Go to “Flowchart 2.17—Non- functioning Device.” Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T r y another bootable disc. Booting from another device? Booting order correct? Correct boot order using the Setup utility . Done Reseat drive. Y Y Y Y Y N N N N N Reset the notebook. Refer to Section 1.2, “Reset- ting the Notebook, ” for instructions.
T r oubleshooting Maintenance and S ervi ce Guide 2–2 3 Flo wc h ar t 2. 1 5—N o Audio, P art 1 No audio. N Notebook in docking device (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up audio internally or externally . Go to “Flowchart 2.16—No Audio, Par t 2. ” Go to “Flowchart 2.17—Non- functioning Device.” Y Y Y Y N N N Go to “Flowchart 2.16—No Audio, Par t 2. ” T est audio with a replacement dock- ing device and a new notebook.
2–2 4 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 6—No Au dio, P ar t 2 YN Continued from “Flowchart 2.15—No Audio, Part 1.” Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio board and speaker connections in notebook (if applicable). Replace the following components individually , retesting after each replacement: ■ Internal speakers. ■ Audio board (if applicable).
T r oubleshooting Maintenance and S ervi ce Guide 2–2 5 Flo wc h art 2. 1 7—N onfunc tioning De vice Done Any physical device detected? Y N Unplug the nonfunctioning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix o r replace broken item. Nonfunctioning device. Reattach device. Close notebook, plug in power , and reboot. Device boots properly? Go to “Flowchart 2.9—No Operating System (OS) Loading.” Device boots properly? Replace hard drive. Replace diskette drive. Replace NIC. If integrated NIC, replace system board. Y N Y N
2–2 6 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc h art 2. 1 8—Nonfun c tioning K e yboar d Y N Keyboard operating properly? Keyboard not operating prop- erly . External device works? Replace system board. Replace system board. Connect notebook to good external key- board. Reseat internal key- board connector (if applicable). Replace internal keyboard or cable. Y N Y N Done Done Keyboard operating properly?
T r oubleshooting Maintenance and S ervi ce Guide 2–2 7 Flo wc h art 2. 1 9—Nonfunc tionin g P oin ting De vic e Y N Pointing device not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace internal pointing device or cable. Y N Y N Done Done Pointing device operating properly? Pointing device operating properly?
2–2 8 Maintenance and Serv ice Gui de T r oublesh ooting Flo wc har t 2.20—No N et w ork/Modem Con nectio n Y Disconnect all power from the notebook and open. No network or modem connec- tion. N Done Digital line? Network or modem jack active? Replace jack or have jack acti- vated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers and recon- figure. Reseat NIC/modem (if applicable). Replace NIC/modem (if applicable). Replace system board. Done N N N N Y Y Y Y Network or modem connec- tion working? Network or modem connec- tion working?
Maintenance and S ervi ce Guide 3–1 3 Soft w are Upd a te and Rec o v er y Soft w are Upd ates T o stay current with the newest technolog y and maintain optimal performance, install the latest versions of HP softw are on your computer as they become a vailable. T o update HP software: 1. Identify your computer model, product category , and series or family . Prepare for a system BIOS update by identifying the BIOS version currently installed on the computer . Ä CA UTION: If y our computer is connec t ed to a netw ork , it is r ecommended that y ou consult with y our networ k administr ator bef or e installing an y softwar e updates , espec ially s yst em BIO S update s. ✎ The computer system BIOS is stored on the system R OM. The BIOS initializes the operating system, determines ho w the computer will interact with the hardware de vices, and provides for data transfer among hardware de vices, including the time and date. 2. Access the HP W eb site at http://www .hp.com to obtain the updates or purchase the Support Softwar e disc. 3. Install the updates.
3–2 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery Accessin g Com pu ter Inf orma tion Before you access the updates for your computer , collect the follo wing information: ■ The product cate gory is Notebook. ■ The product family name and series number are printed on the display bezel. ■ Model information is provided on the serial number label on the bottom of the computer . T o determine whether av ailable BIOS updates contain later BIOS versions than those currently installed on the computer , you need to kno w the v ersion of the system BIOS currently installed. BIOS version information (also kno wn as R OM date and System BIOS) can be displayed by pressing fn esc (if you are already in Microsoft W indows) or b y opening Computer Setup. T o use Computer Setup for displaying BIOS information: 1. Open Computer Setup by turning on or restarting the computer , and then pressing f10 while the “F10 = R OM Based Setup” message is displayed in the lo wer -left corner of the screen. 2. Use the arro w ke ys to select File > System Inf ormation , and then press enter . BIOS date information is displayed. 3. T o exit Computer Setup, use the arro w ke ys to select File > Ignor e changes and exit . Then follo w the instructions on the screen. Ob taining t he Su ppor t Sof t w a r e Disc The Support Softwar e disc provides HP software updates and installation instructions. The disc includes de vice dri vers, BIOS updates, and utilities. T o purchase the current Support Softwar e disc or a subscription that provides both the current v ers ion and future v ersions of the disc, visit the HP W eb site at http://www .hp.com .
Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–3 Soft w are Upd a tes and t he HP W eb Site Most software on the HP W eb site is packaged in compressed f iles called SoftP aq s. Some BIOS updates may be packaged in compressed f iles called RO M P a q s. Most do wnload packages contain a f ile named Readme.txt. A Readme.txt f ile contains information regarding installing and troubleshooting the f ile. The Readme.txt f iles included with R OMPaqs are provided in English only . Do wnloadin g a B IOS U pda te Ä CA UTION: T o pr ev ent damage to the computer or an unsucce ssf ul installati on , do w nload and install a BIO S updat e only w hen the computer is connected to r eliable e xternal po wer u sing the A C adapter . Do not do w nload or install a BIO S updat e while the co mputer is r unning on battery pow er , doc k ed in an optional doc king de v ice , or connected to an optional po wer s our ce . Dur ing the do w nload and installati on: ■ Do not disc onnect po w er f r om the compu ter b y unplugging the po w er cor d fro m the A C outlet . ■ Do not shut do wn the compu ter or initiate s tandb y or hibernatio n. ■ Do not insert , r emo v e , connect , or disconnec t an y dev ice , cable , or cord . T o download a BIOS update: 1. Access the page on the HP W eb site that provides software for your computer: ❏ Select Start > Help and Support , and then click a software update link. – or – ❏ V isit the HP W eb site at http://www .hp.com/support . 2. Follo w the instructions on the screen to identify your computer and access the BIOS update you want to do wnload.
3–4 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. At the do wnload area: a. Identify the BIOS update that is later than the BIOS version currently installed on your computer . Make a note of the date, name, or other identif ier . Y ou may need this information to locate the update later , after it has been do wnloaded to your hard dri v e. b . F ollo w the instructions on the screen to do wnload your selection to the hard dri ve. ✎ Make a note of the path to the location on your hard dri ve where the BIOS update will be do wnloaded. Y ou will need to access this path when you are ready to install the update. Installin g a B IOS Upd a te ✎ If your computer is connected to a network, it is recommended that you consult with your network administrator before installing any softw are updates, especially system BIOS updates. BIOS installation procedures v a ry . Follo w any instructions that are displayed on the screen after the do wnload is complete. If no instructions are displayed: 1. Open W indows Explorer b y clicking Start > All Pr ograms > Accessories > Windo ws Explor er . 2. In the left pane of the W indows Explorer windo w: a. Click My Computer and then your hard dri v e designation. ✎ The hard dri ve designation is typically Local Disk (C:). b . Using the hard dri ve path you recorded earlier , open the folder on your hard dri v e that contains the update.
Softw ar e Update and R ecov er y Maintenance and S ervi ce Guide 3–5 3. Double-click the f ile with an .ex e e xtension (for example, f ilename.ex e ). The BIOS installation begins. 4. Complete the installation by follo wing the instructions on the screen. ✎ After a message on the screen repor ts a successful installation, you may delete the do wnloaded f ile from your hard dri v e. Reco v e ring t he B IOS ✎ The BIOS recov ery procedure requires a USB disk ette dri ve and a formatted diskette. The BIOS can be recov ered if the flash memory is corrupted. Flash memory corruption can occur if the notebook po wers do wn while the BIOS is being updated. When the notebook is turned on, the boot block portion of the flash memory performs an integrity check on the rest of the BIOS image and enters recov ery mode if the image is corrupt. BIOS recov ery can be forced on a non-functioning notebook b y turning on the notebook while pressing and holding the W indows logo ke y B on the nonfunctioning notebook ke yboard until the caps lock light blinks. T o recov er the BIOS: 1. If the nonfunctioning notebook is docked in an optional docking de vice, undock the notebook. 2. Attach the USB diskette dri ve directly to a USB port on the nonfunctioning notebook. (USB hubs are not supported for BIOS recov ery).
3–6 Maintenance and Serv ice Gui de So ftwar e Update and R ecov ery 3. Insert the correct R OMPaq diskette for the product being updated. The BIOS image f ile must to be located in the root directory of the diskette and must be in contiguous sectors. The easiest way to ensure this is to visit http://www .hp.com , do wnload the Softpaq, and let the Softpaq create the R OMPaq diskette. 4. Press and hold the W indows logo k e y B on the notebook ke yboard (do not use an e xternal keyboard) and turn on the notebook and wait for the caps lock light to start blinking. 5. Release the W indows logo k e y B . The BIOS recov ery procedure takes approximately one minute to read the image from the diskette, and then an additional 15 seconds to pr ogram the image into flash memory . The notebook restarts when the BIOS recov ery procedure is complete. Do not attempt to turn of f the notebook after starting a recov ery . If the BIOS recov ery procedure stalls, the caps lock light will begin blinking. This situation can arise if the disk ette is corrupt or the incorrect R OMPaq is used. If the notebook does not restart after approximately 3 minutes, press and hold the po wer b utton, or slide and hold the po wer switch, for at least 5 seconds to force the notebook to turn itself of f. Then repeat the BIOS recov ery procedure.
Maintenance and S ervi ce Guide 4–1 4 I llus trated P ar ts C a talog This chapter provides an illustrated parts breakdo wn and a reference for spare part numbers. 4. 1 Seria l Number Loca tion When ordering parts or requesting information, provide the notebook serial number and model number located on the bottom of the notebook. Ser ial Number L ocation
4–2 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.2 Notebook Major C omp onents Noteboo k Major Components
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–3 Ta b l e 4 - 1 Spare P arts: Notebook Major Components Item Description Spare P art Number 1 Displa y assemblies (include wireless antenna boards and cab les) 15.0-inch, SXGA WV A, TFT 15.0-inch, XGA, TFT 14.1-inch, XGA, TFT 395459-001 395458-001 395457-001 2 Switch co ver 378232-001 3 LED boar d 378228-001 4 K eyboar ds Ko r e a Ta i w a n 397243-AD1 397243-AB1 Thailand United States 397243-281 397243-001 5 Fan 378233-001 6 Heat sink (includes thermal paste) 379799-001 7 Processor s (include thermal paste) Intel P entium M 2.13-GHz Intel P entium M 2.00-GHz Intel P entium M 1.86-GHz Intel P entium M 1.73-GHz Intel P entium M 1.60-GHz Intel P entium M 1.30-GHz 378224-001 378223-001 378222-001 378221-001 378220-001 378219-001 Intel Celeron M 1.5-GHz Intel Celeron M 1.4-GHz 378218-001 378217-001 8 T op cover (includes T ouchP ad) 395463-001
4–4 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–5 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number Miscellaneous Plastics Kit 378236-001 9a 9b 9c Includes: R TC batter y Memor y module/Mini PCI compar tment cov er (includes 1 captiv e screw) Hard drive co ver (includes 2 captiv e screws) Not illustrated: Notebook f eet PC Card slot space sav ers (2) 10 Modem board 325521-001 11 Memory modules (533-MHz DDR2) 1024 MB 512 MB 256 MB 373121-001 373120-001 373119-001 12 Speaker 378237-001 13 USB/audio board 378226-001 14 System boards With 64 MB of video RAM With 32 MB of video RAM 395461-001 395460-001 15 Digital media board 395462-001 16 Base encl osure 395464-001 17 Serial connector module 378227-001
4–6 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Noteboo k Major Components
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–7 Ta b l e 4 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P art Number 18 Mini PCI comm unications cards 802.11b/g WLAN card, f or us e in most of the world 802.11b/g WLAN card, f or us e in the rest of the world 381582-001 381583-001 802.11a/b/g combin ation WLAN card, f or use in the Asia P acific region 802.11a/b/g combin ation WLAN card, f or use in the rest of the world 373900-021 373901-002 19 Battery packs 6-cell, 4.8-AHr 6-cell, 4.8-AHr 8-cell, tra v el batter y pack 372772-001 367457-001 367456-001 20 Optical drives (include bezel) 8X Max D VD-ROM drive D VD/CD-RW Combo Driv e 8X Max D VD±RW and CD-R W Combo Dr ive 8X Max D VD±RW and CD-R W Dual Lay er Combo Drive , LightScribe 380770-001 380772-001 380773-001 397247-001 21 Br oadcomm Bluetooth® wireless board (includes Bluetooth board cable) 367871-001 22 Hard drives (include fr ame and connector) 5400-r pm 80-GB 60-GB 40-GB 380108-001 378215-001 380107-001 4200-r pm, 60-GB 378213-001
4–8 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.3 Miscell an eous P l a stic s Kit T able 4-2 Miscellaneous Plastics Kit Spare P art Number 378236-001 Item Description 1 Memor y module/Mini PC I compar tment cov er (includes 1 captiv e screw) 2 Hard drive co v er (includes 2 captive scre ws) 3 R TC batter y (includes cab le) 4 Notebook f eet (4) 5 PC Card slot space sa vers (2)
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–9 4.4 Miscell an eous Ca bl e Kit Ta b l e 4 - 3 Miscellaneous Cable Kit Spare P art Number 395465-001 Item Description 1 Bluetooth board cable 2 LED board cable 3 RJ-11 connector module and cable 4 Audio board cab le 5 USB board cable 6 Ser ial connector module cable
4–10 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 4.5 Mas s Storag e De vices Ta b l e 4 - 4 Mass Storage Devices Spare P art Number Information Item Description Spare P art Number 1 Har d drives (include frame and connector) 5400-r pm 80-GB 60-GB 40-GB 380108-001 378215-001 380107-001 4200-r pm 60-GB 378213-001 2 Optical drives (include bezel) 8X Max D VD-ROM drive D VD/CD-RW Combo Driv e 8X Max D VD±RW and CD-R W Combo Dr ive 8X Max D VD±RW and CD-R W Dual Lay er Combo Drive , LightScribe 380770-001 380772-001 380773-001 397247-001
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–11 4.6 Miscell an eous (Not I llus trated) Ta b l e 4 - 5 Miscellaneous (Not Illustrated) Spare P art Information Description Spare P art Number 65 watt A C adapter 239704-001 HP Adv anced Doc king Station 374804-001 HP Doc king Station 374803-001 Docking Station Miscellaneous Plastics Kit 380089-001 Carrying cases Nylon top-load Nylon entr y-le v el 325815-001 and 325815-002 325814-001 External MultiBa y II 366143-001 External MultiBa y II power cable and stand 366144-001 8-cell travel battery 367456-001 USB 1.1 diskette drive 359118-001 Po w e r c o r d s Fo r u s e i n : Canada, F rench Canada, Latin Amer ica, T aiwan, Thailand, and the United States 246959-001 Hong K ong and the United Kingdom 246959-031 K o rea 246959-AD1 P eople’ s Republic of China 246959-AA1
4–12 Maintenance and Serv ice Gui de Illustr ated P arts Catalog Screw Kit (includes the f ollowing screws; ref er to Appendix C, “Screw Listing, ” f or more inf or mation on specifications and usage 378235-001 ■ He x sock e t HM5.0×9.0 scre w loc k ■ Phillips PM2.5×13.0 spring-loaded scre w ■ Phillips PM2.5×4.0 shoulder screw ■ Phillips PM2.5×4.0 screw ■ Phillips PM2.0×8.0 shoulder screw ■ Phillips PM2.0×7.0 screw ■ Phillips PM2.0×4.0 screw ■ Phillips PM2.0×3.0 screw ■ Phillips PM1.5×4.0 screw ■ Phillips PM1.5×3.5 screw ■ T orx T8M2.0×9.0 screw ■ T orx T8M2.0×4.0 screw ■ T orx T8M2.0×2.0 screw Ta b l e 4 - 5 Miscellaneous (Not Illustrated) Spare P art Information (Continued) Description Spare P art Number
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–13 4.7 Sequ enti al P ar t N umber Listin g Ta b l e 4 - 6 Sequential P art Number Listing Spare P art Number Description 239704-001 65 watt A C adapter 246959-001 P ower cord f or use in Can ada, F rench Canada, Latin America, T aiwan, Thailand, and the United States 246959-031 P ower cord f or use in Hong K ong and the United Kingdom 246959-AA1 P ow er cord f or use in P eople’ s Republic of China 246959-AD1 P ower cord f or use in K orea 325521-001 Modem board 325814-001 Nylon entr y-le v el carr ying case 325815-001 Nylon top-load carr ying case 325815-002 Nylon top-load carr ying case 359118-001 USB 1.1 diskette driv e 366143-001 Exter nal MultiBa y II 366144-001 Exter nal MultiBa y II pow er cab le and stand 367456-001 8-cell, tra v el batter y pack 367457-001 6-cell, 4.8-AHr batter y pac k 367871-001 Broadcomm Bluetooth wi reless board (includes Bluetooth board cable) 372772-001 6-cell, 4.8-AHr batter y pac k 373119-001 256-MB memor y module (533-MHz DDR2) 373120-001 512-MB memor y module (533-MHz DDR2) 373121-001 1024-MB memor y module (533-MHz DDR2)
4–14 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 373900-021 802.11a/b/g combination WLAN Mini PCI communications card, f or use in the Asia P acific region 373901-002 802.11a/b/g co mbination WLAN card, f or use in the rest of the w orld 374803-001 HP Docking Station 374804-001 HP Adva nced Docking Station 378213-001 4200-r pm, 60-GB hard drive (includes frame and connector) 378215-001 5400-r pm, 60-GB hard drive (includes frame and connector) 378217-001 Intel Celeron M 1.4-GHz processor (includes ther mal paste) 378218-001 Intel Celeron M 1.5-GHz processor (includes ther mal paste) 378219-001 Intel P entium M 1.30-GHz processor (includes ther mal paste) 378220-001 Intel P entium M 1.60-GHz processor (includes ther mal paste) 378221-001 Intel P entium M 1.73-GHz processor (includes ther mal paste) 378222-001 Intel P entium M 1.86-GHz processor (includes ther mal paste) 378223-001 Intel P entium M 2.00-GHz processor (includes ther mal paste) 378224-001 Intel P entium M 2.13-GHz processor (includes ther mal paste) 378226-001 USB/audio board 378227-001 Serial connector module 378228-001 LED board 378232-001 Switch cov e r 378233-001 F an 378235-001 Screw Kit 378236-001 Miscella neous Plastics Kit Ta b l e 4 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
Illustr ated P arts Catalog Maintenance and S ervi ce Guide 4–15 378237-001 Speaker 379799-001 Heat sink (i ncludes ther mal paste) 380089-001 Docking Station Mi scellaneous Plastics Kit 380107-001 5400-r pm, 40-GB hard drive (includes frame and connector) 380108-001 5400-r pm, 80-GB hard drive (includes frame and connector) 380770-001 8X Max D VD-ROM drive (includes bez el) 380772-001 D VD/CD-RW Combo Drive (includes bez el) 380773-001 8X Max D VD±RW and CD-R W Combo Dr ive (includes bez el) 381582-001 802.11b/g WLAN Mini PCI communications card, f or use in most of the world 381583-001 802.11b/g WLAN Mini PCI communications card, f or use in the rest of the world 395457-001 14.1-inch, XGA, TFT disp la y assembly (includes wireless antenna boards and cables) 395458-001 15.0-inch, XGA, TFT disp la y assembly (includes wireless antenna boards and cables) 395459-001 15.0-inch, SXGA WV A, TFT display assemb ly (includes wireless antenna boards and cables) 395460-001 System board with 32 MB of video RAM 395461-001 System board with 64 MB of video RAM 395462-001 Digital media board 395463-001 T op cov er (include T ouchP ad) 395464-001 Base enclosure 395465-001 Miscellaneous Cable Kit Ta b l e 4 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
4–16 Maintenance and Serv ice Gui de Illustr ated P arts Catalog 397243-001 K eyboard f or us e in the United States 397243-281 K eyboard f o r use in Thailand 397243-AB1 K eyboard f or use in T aiwan 397243-AD1 K e yboard f or use in K orea 397247-001 8X Max D VD±RW and CD-R W Dual Lay er Combo Drive , LightScribe (includes bezel) Ta b l e 4 - 6 Sequential P art Number Listing (Continued) Spare P art Number Description
Maintenance and S ervi ce Guide 5–1 5 Remo v al and Repl a cement Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 5 . 1 T ools Required Y ou will need the follo wing tools to complete the remov al and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 scre wdri v er ■ 5.0-mm socket wrench for system board scre w locks ■ Flat-bladed scre wdri v er ■ T ool kit—includes connector remov al tool, loopback plugs, and case utility tool
5–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .2 Ser vice C onsid erations The follo wing sections include some of the considerations that you should keep in mind during disassembly and assembly procedures. ✎ As you remov e each subassembly from the notebook, place the subassembly (and all accompanying scre ws) away from the work area to pre vent damage. Pl a s t i c Pa r t s Using excessi ve force during disassembly and reassembly can damage plastic parts. Use care when handling the plastic parts. Apply pressure only at the points designated in the maintenance instructions. C abl es and Conn ec tors Ä CA UTION: When se rvic ing the notebook, e nsure that ca bles ar e placed in their pr oper locations dur ing the r e as sembl y pr oces s. Impr oper ca ble placement can damage the noteboo k. Cables must be handled with extreme care to a void damage. Apply only the tension required to unseat or seat the cables during remov al and insertion. Handle cables by the connector whene ver possible. In all cases, a void bending, twisting, or tearing cables. Ensure that cables are routed in such a way that they cannot be caught or snagged b y parts being remo ved or replaced. Handle flex cables w ith e xtreme care; these cables tear easily .
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–3 5 . 3 P r e v enti ng Damage to R emo v able Dr i v es Remov able driv es are fragile components that must be handled with care. T o prev ent damage to the notebook, damage to a remov able driv e, or loss of information, observ e the follo wing precautions: ■ Before removing or inserting a hard dri ve, shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the notebook on, and then shut it do wn through the operating system. ■ Before removing a disk ette dri v e or optical dri ve, ensure that a diskette or disc is not in the dri ve and ensure that the optical dri ve tray is closed. ■ Before handling a dri ve, ensure that you are dischar ged of static electricity . While handling a driv e, a v oid touching the connector . ■ Handle dri ves on surf aces co vered with at least one inch of shock-proof foam. ■ A v oid dropping dri ves from an y height onto any surface. ■ After removing a hard dri ve, an optical dri v e, or a diskette dri ve, place it in a static-proof bag. ■ A v oid exposing a hard dri ve to products that ha ve magnetic f ields, such as monitors or speakers. ■ A v oid exposing a dri ve to temperature e xtremes or liquids. ■ If a dri ve must be mailed, place the dri ve in a b ubble pack mailer or other suitable form of protecti ve packaging and label the package “FRA GILE: Handle W ith Care. ”
5–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .4 Pre v entin g Elec trosta tic D ama ge Many electronic components are sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks b uilt into many inte grated circuits provide some protection, b ut in many cases, the dischar ge contains enough po wer to alter de vice parameters or melt silicon junctions. A sudden dischar ge of static electricity from a finger or other conductor can destroy static-sensiti ve de vices or microcircuitry . Often the spark is neither felt nor heard, b ut damage occurs. An electronic de vice e xposed to electrostatic discharge might not be af fected at all and can work perfectly throughout a normal cycle. Or the de vice might function normally for a while, then degrade in the internal layers, reducing its life e xpectanc y .
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–5 5 .5 P a c k agin g and T ranspor tin g Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrostatic-sensiti ve parts and assemblies with conducti ve or appro v ed containers or packaging. ■ K eep electrostatic-sensiti v e parts in their containers until the parts arri ve at static-free w orkstations. ■ Place items on a grounded surface before remo ving items from their containers. ■ Alw ays be properly grounded when touching a sensiti ve component or assembly . ■ Store reusable electrostatic-sensiti ve parts from assemblies in protecti ve packaging or nonconducti ve foam. ■ Use transporters and con ve yors made of antistatic belts and roller b ushings. Ensure that mechanized equipment used for moving materials is wired to ground and that proper materials are selected to a v oid static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
5–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies 5 .6 W orksta tion Precautions Use the follo wing grounding precautions at workstations: ■ Cov er the workstation with appro v ed static-shielding material (refer to T able 5-2, “Static-Shielding Materials” ). ■ Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and equipment. ■ Use conducti ve f ield service tools, such as cutters, scre wdri vers, and v acuums. ■ When f ixtures must directly contact dissipati ve surf aces, use f ixtures made only of static-safe materials. ■ K eep the work area free of nonconducti ve materials, such as ordinary plastic assembly aids and Styrofoam. ■ Handle electrostatic-sensiti ve components, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A v oid contact with pins, leads, or circuitry . ■ T urn off po wer and input signals before inserting or removing connectors or test equipment. 5 .7 G r oundin g E quip ment an d Methods Grounding equipment must include either a wrist strap or a foot strap at a grounded workstation. ■ When seated, wear a wrist strap connected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o provide proper ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug connectors, use alligator clips to connect a wrist strap.
R emo val and R eplacement Pr eliminar ie s Maintenance and S ervi ce Guide 5–7 ■ When standing, use foot straps and a grounded floor mat. Foot straps (heel, toe, or boot straps) can be used at standing workstations and are compatible with most types of shoes or boots. On conducti ve floors or dissipati ve floor mats, use foot straps on both feet with a minimum of one megohm resistance between the operator and ground. T o be effecti ve, the conducti ve strips must be w orn in contact with the skin. Other grounding equipment recommended for use in pre v enting electrostatic damage includes: ■ Antistatic tape ■ Antistatic smocks, aprons, and slee ve protectors ■ Conducti ve bins and other assembly or soldering aids ■ Nonconducti ve foam ■ Conducti ve tabletop w orkstations with ground cords of one megohm resistance ■ Static-dissipati ve tables or floor mats with hard ties to the ground ■ Field service kits ■ Static aw areness labels ■ Material-handling packages ■ Nonconducti ve plastic bags, tubes, or box es ■ Metal tote boxes ■ Electrostatic v oltage le vels and protecti ve materials
5–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr eliminar ies T able 5-1 shows ho w humidity affects the electrostatic v oltage le ve ls generated by dif ferent activities. T able 5-2 lists the shielding protection provided b y antistatic bags and floor mats. Ta b l e 5 - 1 T ypical Electrostatic V oltage Levels Relative Humidity Event 10% 40% 55% W alking across car pet 35,000 V 15,000 V 7,500 V W alking across vinyl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 14,500 V 5,000 V 3,500 V Removing b ubb le pac k from PCB 26,500 V 20,000 V 7,000 V P acking PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 V. Ta b l e 5 - 2 Static-Shielding Materials Material Use V oltage Pr otection Level Antistatic plastic Bags 1,500 V Carbon-loaded plastic F loor mats 7,500 V Metallized laminate Floor mats 5,000 V
Maintenance and S ervi ce Guide 6–1 6 Remo v al and Repl a cement Pr ocedure s This chapter provides remo v al and replacement procedures. There are 64 scre ws and scre w locks, in 11 dif ferent sizes, that must be remov ed, replaced, or loosened when servicing the notebook. Make special note of each scre w and screw lock size and location during remov al and replacement. Refer to Appendix C, “Scre w Listing, ” for detailed information on scre w and scre w lock sizes, locations, and usage.
6–2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 Serial N umber Report the notebook serial number to HP when requesting information or ordering spare parts. The serial number is located on the bottom of the notebook. Ser ial Number L ocation 6 .2 D isassem bl y Seque nce C hart Use the chart belo w to determine the section number to be referenced when removing notebook components. Disassembl y Sequence Char t Section Description # of Screws Remo ved 6.3 Preparing the notebook f or disassemb ly Batter y pack 0
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 6.4 Hard driv e 2 loosened to remov e the hard drive co ver 1 loosened to remov e the hard drive 6 to disassemble the hard drive 6.5 Notebook f eet 0 6.6 Bluetooth board 0 6.7 External memor y module 1 loosened to remov e the memor y module/Mini PCI compar tment cov er 6.8 Mini PCI Comm unications Card 1 loosened to remov e the memor y module/Mini PCI compar tment cov er Å T o prev ent an unresponsive system and the displa y of a warning message, install only a Mini PCI de vice authorized f or use in your notebook b y the go vernmental agency that regulates wireless de vices in y our countr y . If you install a de vice and then receiv e a warning message, remov e the de vice to restore notebook functionality . Then contact Customer Care. 6.9 Optical driv e 1 6.10 K eyboard 2 6.11 Switch co v er 2 6.12 LED board 4 6.13 F an 2 loosened 6.14 Heat sink 4 loosened 6.15 Processor 1 loosened 6.16 Internal memor y module 0 6.17 R TC batter y 0 6.18 Displa y assembly 6 Disassembl y Sequence Char t (Continued)
6–4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 3 Preparing t he Notebook for Di sassem bl y Before you begin an y remo v al or installation procedures: 1. Shut do wn the notebook. If you are unsure whether the notebook is of f or in hibernation, turn the computer on, and then shut it do wn through the operating system. 2. Disconnect all external de vices connected to the notebook. 3. Disconnect the po wer cord. 6.19 T op cov er 15 6.20 Speak er 6 6.21 Modem board 2 6.22 Digital media board 0 6.23 USB/audio board 1 6.24 System board 1 scre w 4 screw loc ks 6.25 Serial connector module 2 scre w locks Disassembl y Sequence Char t (Continued) Battery P ack Spare P ar t Number Inf ormation 6-cell, 4.8-AHr 6-cell, 4.8-AHr 8-cell, tra v el batter y pack 372772-001 367457-001 367456-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 4. Remov e the battery pack b y follo wing these steps: a. T urn the notebook upside do wn with the rear panel to ward you. b . Slide and hold the battery pack lock latch 1 to the right. c. Slide the battery pack release latch 2 to the right. (The battery pack disengages from the notebook.) d. Slide the battery pack straight back 3 and remov e it. R emo v ing the Battery P ack Re v erse the abov e procedure to install the battery pack.
6–6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.4 Hard Driv e 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Loosen the two PM2.0×4.0 scre ws 1 that secure the hard dri v e cov er to the notebook. 3. Lift the left side of the hard dri ve co v er and swing it to the right 2 . 4. Remov e the hard dri ve cov er . ✎ The hard dri ve co v er is included in the Miscellaneous Plastics Kit, spare part number 378236-001. R emo v ing the Har d Dr i v e C o ve r Har d Drive Spare P art Number Information 5400-r pm 80-GB 60-GB 40-GB 380108-001 378215-001 380107-001 4200-r pm 60-GB 378213-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–7 5. Loosen the PM2.5×13.0 spring-loaded hard dri v e retention scre w 1 . 6. Grasp the mylar tab 2 on the hard dri v e and slide the hard dri v e to the right 3 to disconnect it from the system board. 7. Remov e the hard dri ve from the hard dri ve bay 4 . R emo v ing the Har d Dr i v e
6–8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 8. Remov e the two PM2.5×4.0 hard dri ve frame shoulder scre ws 1 from each side of the hard dri v e. 9. Remov e the two PM2.5×4.0 hard dri ve frame scre ws 2 from each side of the hard dri v e. 10. Remov e the two PM1.5×3.5 hard dri ve frame scre ws 3 from the front of the hard dri v e. 11. Lift the frame straight up 4 to remov e if from the hard dri v e. 12. Remov e the hard dri ve connector 5 from the hard dri ve. R emo v ing the Har d Dr i v e F rame and C onnec tor Re v erse the abov e procedure to install and reassemble the hard dri ve.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–9 6.5 Notebook F eet The notebook feet are adhesi v e-backed rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 378236-001. R eplac ing the Notebook F eet
6–10 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.6 Bluetooth B oard 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Remov e the hard dri ve ( Section 6.4 ). Bluetooth Boar d Spare P art Number Information Broadcomm Bluetooth wireless board (includes Bluetooth board cab le) 367871-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–11 3. Slide the Bluetooth board out of the clip 1 in the hard dri ve compartment. 4. Disconnect the Bluetooth board cable 2 from the board. R emo v ing the Blueto oth Boar d Re v erse the abov e procedure to install a Bluetooth board.
6–12 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.7 Ex ternal Memor y Module 1. Prepare the notebook for disassembly (refer to Section 6.3 ). 2. Position the notebook with the front to ward you. 3. Loosen the PM2.0×4.0 scre w 1 that secures the memory module/Mini PCI compartment cov er to the notebook. 4. Lift the rear edge of the cov er up and swing it to ward you 2 . 5. Remov e the memory module/Mini PCI compartment co ver . ✎ The memory module/Mini PCI compartment cov er is included in the Miscellaneous Plastics Kit, spare part number 378236-001. R emo v ing the Memory Module/Mini PCI C ompar tment C o v er Memory Module Spare P ar t Number Inf ormation 1024 MB 512 MB 256 MB 373121-001 373120-001 373119-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–13 6. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.) 7. Slide the module aw ay from the socket at an angle 2 . 8. Remov e the memory module board. ✎ Memory modules are slotted 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Memory Module Re v erse the abov e procedure to install a memory module.
6–14 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.8 Mini PCI Communi ca tions Card 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the front to ward you. Mini PCI Comm unications Card Spare P art Number Information 802.11b/g WLAN card, f or us e in most of the world 802.11b/g WLAN card, f or us e in the rest of the world 381582-001 381583-001 802.11a/b/g combination WLAN card , f or use in the Asia P acific region 802.11a/b/g combination WLAN ca rd, f or use in the rest of the w orld 373900-021 373901-002
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–15 4. Disconnect the auxiliary and main antenna cables 1 from the Mini PCI communications card. ✎ Make note of which antenna cable is attached to which antenna clip on the Mini PCI communications card before disconnecting the cables. 5. Spread the 2 retaining tabs 2 on each side of the Mini PCI socket to release the Mini PCI communications card. (The edge of the card opposite the socket rises a way from the notebook.) 6. Remov e the Mini PCI communications card b y pulling the card aw ay from the socket at a 45-de gree angle 3 . ✎ The Mini PCI communications card is slotted 4 to pre vent incorrect installation. R emo v ing a Mini P CI Comm unicati ons Ca r d Re v erse the abov e procedure to install a Mini PCI communications card.
6–16 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.9 Optical Driv e 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Position the notebook with the left side to ward you. Optical Drive Spare P art Number Information 8X Max D VD-ROM drive D VD/CD-RW Combo Driv e 8X Max D VD±RW and CD-R W Combo Dr iv e 8X Max D VD±RW and CD-R W Dual Lay er Combo Drive , LightScribe 380770-001 380772-001 380773-001 397247-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–17 4. Remov e the T8M2.0×9.0 scre w 1 that secures the optical dri v e to the notebook. 5. Insert a thin tool, such as an unbent paper clip 2 , into the media tray release hole and release the media tray . 6. Use the media tray to slide the optical dri ve to the left and out of the notebook 3 . 7. Remov e the optical dri ve. R emo v ing the Opti cal Dr i v e Re v erse the abov e procedure to install an optical dri v e.
6–18 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 0 K e yb oa rd 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the memory module/Mini PCI compartment co ver ( Section 6.7 ). 3. Remov e the tw o T8M2.0×9.0 scre ws that secure the ke yboard to the notebook. ✎ The left ke yboard retention scre w is also used to secure the optical dri ve. R emo v ing the K e y boar d Sc r e ws Ke yboar d Spare P ar t Number Information F or use in K orea F or use in T aiwan 397243-AD1 397243-AB1 F or use in Thailand F or use in the United States 397243-281 397243-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–19 4. T urn the notebook display-side up with the front to ward you. 5. Open the notebook as far as possible. 6. Slide the 4 ke yboard retaining latches to ward you. R eleasing the K e y boar d L atc hes
6–20 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 7. Lift the rear edge of the ke yboard up and swing it to ward you until it rests on the palm rest. R eleasing the K e y boar d
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–21 8. Release the zero insertion force (ZIF) connector 1 to which the ke yboard cable is attached and disconnect the ke yboard cable 2 . Disconnec ting the K e y boar d Cable 9. Remov e the ke yboard. Re v erse the abov e procedure to install the ke yboard.
6–2 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 1 S wit c h C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Close the notebook. 4. T urn the notebook upside do wn with the rear panel to ward you. 5. Remov e the two T8M2.0×2.0 scre ws that secure the switch cov er to the notebook. R emo v ing the S w itc h Co ver S cr ew s Switch Co ver Spare P ar t Number Information Switch cov er 378232-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 3 6. T urn the notebook display-side up with front to ward you. 7. Open the notebook as far as possible. 8. Disconnect the LED board cable 1 from the system board. 9. Insert a flat-bladed scre wdri v er into the four notches 2 on the front edge of the switch cov er and lift up 3 until the co ver disengages from the notebook. 10. Remov e the switch co ver . R emo v ing the S w itc h Co ver Re v erse the abov e procedure to install the switch cov er .
6–2 4 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 2 LED Board 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the switch co ver ( Section 6.11 ). 4. T urn the notebook upside do wn with the rear panel to ward you. 5. T urn the switch cov er upside do wn. LED Boar d Spare P art Number Information LED board (includes LED board cable) 378228-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 5 6. Remov e the four PM1.5×4.0 scre ws 1 that secure the LED board to the switch cov er . 7. Remov e the LED board 2 . R emo v ing the LED Boar d Re v erse the abov e procedure to install the LED board.
6–2 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 3 F an 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Disconnect the fan cable 1 from the system board. 4. Loosen the 2 PM2.0×7.0 scre ws 2 that secure the fan to the notebook. 5. Remov e the f an 3 . R emo v ing the F an Re v erse the abov e procedure to install the fan. F an Spare P art Number Information F an 378233-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–2 7 6. 1 4 Hea t Sink 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the f an ( Section 6.13 ). Heat Sink Spare P art Number Information Heat sink (includes ther mal paste) 379799-001
6–2 8 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. Loosen the four PM2.0×8.0 shoulder scre ws 1 that secure the heat sink to the notebook. 5. Lift the right side of the heat sink 2 to disengage it from the processor . 6. Slide the heat sink up and to the right 3 to remov e it. ✎ Due to the adhesi v e quality of the thermal paste located between the heat sink and processor , it may be necessary to mov e the heat sink from side to side to detach the heat sink from the processor . R emo v ing the Heat Sink
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–29 ✎ The thermal paste should be thoroughly cleaned from the surfaces of the heat sink 1 and processor 2 each time the heat sink is remov ed. Thermal paste should be reapplied to both surfaces before the heat sink is reinstalled. Thermal paste is included with all heat sink and processor spare part kits. R eplac ing the T hermal P ast e Re v erse the abov e procedure to install the heat sink.
6–30 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 5 P roces s or 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Remov e the f an ( Section 6.13 ). 4. Remov e the heat sink ( Section 6.14 ). Pr ocessor Spare P art Number Information Intel P entium M 2.13-GHz Intel P entium M 2.00-GHz Intel P entium M 1.86-GHz Intel P entium M 1.73-GHz Intel P entium M 1.60-GHz Intel P entium M 1.30-GHz 378224-001 378223-001 378222-001 378221-001 378220-001 378219-001 Intel Celeron M 1.5-GHz Intel Celeron M 1.4-GHz 378218-001 378217-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–31 5. Use a flat-bladed scre wdri v er to turn the processor locking scre w one-quarter turn counterclockwise 1 until you hear ac l i c k . 6. Lift the processor straight up and remov e it 2 . ✎ The gold triangle 3 on the processor should be aligned in the front-right corner when you install the processor. R emo v ing the Pr ocessor Re v erse the abov e procedure to install the processor .
6–3 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6. 1 6 Internal Memor y Module 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). Memory Module Spare P ar t Number Inf ormation 1024 MB 512 MB 256 MB 373121-001 373120-001 373119-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–33 3. Spread the retaining tabs 1 on each side of the memory module socket to release the memory module board. (The edge of the module opposite the socket rises a way from the notebook.) 4. Slide the module aw ay from the socket at an angle 2 . 5. Remov e the memory module board. ✎ Memory modules are slotted 3 to pre vent incorrect installation into the memory module socket. R emo v ing the Memory Module Re v erse the abov e procedure to install a memory module.
6–3 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 7 RT C B a t t er y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 378236-001. 1. Prepare the notebook for disassembly ( Section 6.3 ). 2. Remov e the ke yboard ( Section 6.10 ). 3. Disconnect the R TC battery cable 1 from the system board. 4. Remov e the R TC battery 2 from the clip in the top cov er . R emo v ing the R T C Bat tery Re v erse the abov e procedure to install an R TC battery .
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–35 6 . 1 8 Displa y Assem bl y 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) 2. Disconnect the wireless antenna cables from the Mini PCI communications board ( Section 6.8 ). 3. T urn the notebook display-side up with the front to ward you. 4. Open the notebook as far as possible. Displa y Assembl y Spare P a rt Number Information 15.0-inch, SXGA WV A, TFT 15.0-inch, XGA, TFT 14.1-inch, XGA, TFT 395459-001 395458-001 395457-001
6–3 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 5. Disconnect the display cable 1 from the system board. 6. Remov e the wireless antenna cables from the Mini PCI compartment and the top cov er clips 2 . 7. Remov e the two T8M2.0×9.0 scre ws 3 that secure the display assembly to the notebook. Disconnec ting the Displa y Cable and R emov ing the Display Sc re ws
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 7 8. Swing the display assembly into a partially closed position. 9. Position the notebook with the rear panel to ward you. Ä CA UTION: Support the display as sembl y w hen r emo v ing the fo llo w ing sc r e ws . F ailure to su pport the display as sembl y can r esult in damage to the displa y asse mbly and other not ebook components . 10. Remov e the four T8M2.0×9.0 scre ws 1 that secure the display assembly to the notebook. 11. Lift the display assembly straight up and remov e it 2 . R emo v ing the Displa y Assembl y Re v erse the abov e procedure to install the display assembly .
6–3 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6. 1 9 T op C o v er 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) e. R TC battery ( Section 6.17 ) f. Display assembly ( Section 6.18 ) 2. T urn the notebook upside do wn with the front to ward you. T op Cover Spare P ar t Number Information T op cov er (includes T ouchP ad) 395463-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–3 9 3. Remov e the thirteen T8M2.0×9.0 scre ws that secure the top cov er to the notebook. R emo v ing the T op Co v er Sc re ws , P ar t 1
6–40 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 4. T urn the notebook right-side up with the front to ward you. 5. Remov e the two T8M2.0×9.0 scre ws 1 that secure the top cov er to the notebook. 6. Disconnect the T ouchPad cable 2 from the system board. R emo v ing the T op Co v er Sc re ws , P ar t 2
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–41 7. Lift up the rear edge of the top cov er 1 until it disengages from the base enclosure. 8. Swing the top cov er to ward you 2 until the left and right sides of the top cov er disengage from the base enclosure. 9. Lift up on the left 3 and right sides 4 of the top cov er until the top cov er disengages from the base enclosure. R eleasing the T op Co v er 10. Lift the top cov er straight up until the front edge of the top cov er disengages from the base enclosure and remo v e the top cove r . Re v erse the abov e procedure to install the top cov er .
6–4 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 0 S pe ak er 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) e. Display assembly ( Section 6.18 ) f. T op cov er ( Section 6.19 ) 2. Disconnect the speaker cable from the system board. Disconnec ting the Speak er Cable Speaker Spare P art Number Information Speak er 378237-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–43 3. Remov e the six T8M2.0×4.0 scre ws 1 that secure the speaker to the notebook. 4. Lift the speaker up 2 until it clears the system board. 5. Slide the speaker to ward you 3 and remov e it. R emo v ing the S peak er Re v erse the abov e procedure to install the speaker .
6–44 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 6.2 1 M od em B o ard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) e. Display assembly ( Section 6.18 ) f. T op cov er ( Section 6.19 ) g. Speaker ( Section 6.20 ) Modem Boar d Spare P art Number Information Modem board 325521-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–45 2. Remov e the two PM2.0×3.0 scre ws 1 that secure the modem board to the notebook. 3. Lift the front edge of the modem board 2 to disconnect it from the system board. 4. Disconnect the modem cable 3 from the modem board. 5. Remov e the modem board. R emo v ing the Modem Boar d Re v erse the abov e procedure to install the modem board.
6–4 6 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 2 Digital M edia B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) e. Display assembly ( Section 6.18 ) f. T op cov er ( Section 6.19 ) g. Speaker ( Section 6.20 ) Digital Media Boar d Spare P art Number Information Digital media board (includes digi tal media board cab le) 395462-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 7 2. Release the ZIF connector to which the digital media board cable is attached and disconnect the digital media board cable 1 from the system board. 3. Remov e the digital media board 2 . R emo v ing the Digit al Media Boar d Re v erse the abov e procedure to install the digital media board.
6–4 8 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.2 3 US B/Audio B oard 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Memory module/Mini PCI compartment cov er ( Section 6.7) b . Optical dri ve ( Section 6.9 ) c. K eyboard ( Section 6.10 ) d. Switch cov er ( Section 6.11 ) e. Display assembly ( Section 6.18 ) f. T op cov er ( Section 6.19 ) USB/A udio Boar d Spare P a rt Number Information USB/audio board 378226-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–4 9 2. Position the notebook with the rear panel to ward you. 3. Disconnect the USB cable 1 and audio cable 2 from the system board. 4. Remov e the PM1.5×3.0 scre w 3 that secures the USB/audio board and shield to the base enclosure. 5. Remov e the cables from the clips 4 in the base enclosure. 6. Remov e the USB/audio board 5 . R emo v ing the U SB/Audi o Boar d Re v erse the abov e procedure to install the USB/audio board.
6–5 0 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 6.24 S y s te m B o ard ✎ When replacing the system board, ensure that the follo wing components are remov ed from the defecti ve system board and installed on the replacement system board: ■ Memory modules ( Section 6.7 and Section 6.16 ) ■ Mini PCI communications card ( Section 6.8 ) ■ Processor ( Section 6.15 ) ■ Modem board ( Section 6.21 ) System Boar d Spare P art Number Information With 64 MB of video RAM With 32 MB of video RAM 395461-001 395460-001
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–51 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri ve ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Switch cov er ( Section 6.11 ) f. Fan ( Section 6.13 ) g. Heat sink ( Section 6.14 ) h. R TC battery ( Section 6.17 ) i. Display assembly ( Section 6.18 ) j. T op cov er ( Section 6.19 ) k. Speaker ( Section 6.20 ) l. Digital media board ( Section 6.22 ) m. USB/audio board ( Section 6.23 ) 2. T urn the notebook upside do wn with the rear panel to ward you.
6–5 2 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Disconnect the serial connector cable 1 and the Bluetooth cable 2 from the system board. 4. Remov e the T8M2.0×4.0 scre w 3 that secures the system board to the base enclosure next to the RJ-11 connector . 5. Remov e the two HM5.0×9.0 scre w locks 4 on each side of the parallel connector . 6. Remov e the two HM5.0×9.0 scre w locks 5 on each side of the external monitor connectors. R emo v ing the S ys tem Boar d Scr ew s and Scr ew L ocks
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 3 7. Use the optical dri ve connector to lift the system board up 1 until the po wer connector 2 is clear of the base enclosure. 8. Slide the system board to the left 3 at an angle and remov e it. R emo v ing the S ys tem Boar d
6–5 4 Maintenance and S ervi ce Guide Re mo val and R eplacemen t Pr ocedur es 9. If necessary , disconnect the RJ-11 connector module cable from the system board and remov e the RJ-11 connector module and cable. R emo v ing the RJ-11 C onnect or Module and Ca ble Re v erse the abov e procedures to install the system board.
R emo v al and Replace ment Pr ocedure s Maintenance and S ervi ce Guide 6–5 5 6.2 5 Serial C onnec tor Modul e 1. Prepare the notebook for disassembly ( Section 6.3 ), and then remov e the following components: a. Hard dri ve ( Section 6.4 ) b . Bluetooth board ( Section 6.6 ) c. Optical dri ve ( Section 6.9 ) d. K e yboard ( Section 6.10 ) e. Switch cov er ( Section 6.11 ) f. Fan ( Section 6.13 ) g. Heat sink ( Section 6.14 ) h. Modem board ( Section 6.21 ) i. Display assembly ( Section 6.18 ) j. T op cov er ( Section 6.19 ) k. Speaker ( Section 6.20 ) l. Digital media board ( Section 6.22 ) m. USB/audio board ( Section 6.23 ) n. System board ( Section 6.24 ) 2. T urn the base enclosure upside do wn with the rear panel to ward you. Serial Connector Module Spare P art Number Information Serial connector module (i ncludes ser ial connector module cable) 378227-001
6–5 6 Maintenance and Serv ice Gui de Re mo val and R eplacemen t Pr ocedur es 3. Remov e the two HM5.0×9.0 scre w locks 1 on each side of the serial connector . 4. Lift the serial connector module and cable out of the base enclosure 2. 5. Disconnect the serial connector module cable from the system board 3 . R emo v ing the Se ri al C onnect or Module Re v erse the abov e procedures to install the serial connector module.
Maintenance and S ervi ce Guide 7–1 7 Spec ifica tions This chapter provides physical and performance specif ications. Ta b l e 7 - 1 Notebook Dimensions Metric U .S. Height Width Depth 32.8 cm 26.7 cm 3.1 cm 12.91 10.51 1.22 W eight 2.66 kg 5.86 lbs Input P ower Operating v oltage Operating current 18.5 V dc @ 3.5 A - 65 W 3.5 A T emperature Operating (not writing to optical disc) Operating (writing to optical disc) Nonoperating 0°C to 35°C 5°C to 35°C -20°C to 60°C 32°F to 95°F 41°F to 95°F -4°F to 140°F Relative humidity (noncondensing) Operating Nonoperating 10% to 90% 5% to 95% 10% to 90% 5% to 95%
7–2 Maintenance and Serv ice Gui de Spe cificat ion s Maximum altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) -15 m to 3,048 m -15 m to 12,192 m -50 ft to 10,000 ft -50 ft to 40,000 ft Shock Operating Nonoperating 125 g, 2 ms, half-sine 200 g, 2 ms, half-sine Random Vibration Operating Nonoperating 0.75 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min s weep r ate 1.50 g zero-to-peak, 10 Hz to 500 Hz, 0.5 oct/min s weep r ate ✎ Applicable product safety standards specify thermal limits for plastic surfaces. The notebook operates well within this range of temperatures. Ta b l e 7 - 1 Notebook (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–3 Ta b l e 7 - 2 15.0-inch, SXGA WV A, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 300:1 Brightness 180 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1400 × 1050 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 5.5 W Viewing angle /-35° horizontal, 15/-35° v er tical typical
7–4 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 3 15.0-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 30.0 cm 22.9 cm 38.1 cm 11.8 in 9.0 in 15.0 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.264 × 0.264 mm 1024 × 768 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 5.5 W Viewing angle /-35° horizontal, 15/-35° v er tical typical
Spe cificat ion s Maintenance and S ervi ce Guide 7–5 Ta b l e 7 - 4 14.1-inch, XGA, TFT Displa y Dimensions Height Width Diagonal 28.5 cm 21.3 cm 35.8 cm 11.2 in 8.4 in 14.1 in Number of colors Up to 16.8 million Contrast ratio 250:1 Brightness 150 nits typical Pixel resolution Pitch Fo r m a t Configuration 0.279 × 0.279 mm 1024 × 768 RGB v er tical str ipe Backlight Edge lit Character display 80 × 25 T otal power consumption 4.0 W Viewing angle /-40° horizontal, 20/-40° v er tical typical
7–6 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 5 Har d Drives 80-GB* 60-GB* 60-GB* 40-GB* Dimensions Height Width We i g h t 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99 g Interface type ATA - 6 ATA - 6 ATA - 6 ATA - 6 T ransfer rate Synchronous (maximum) Security 100 MB/sec A T A security 100 MB/sec A T A security 100 MB/sec ATA s e c u r i t y 100 MB/sec A T A security Seek times (typical read, including setting) Single trac k Ave r a g e Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms Logical bloc ks † 156,301,488 117,210,240 117,210,240 76,140,160 Disc rotational speed 5400 r pm 5400 r pm 4200 r pm 5400 r pm Operating temperature 5°C to 55°C (41°F to 131°F) ✎ Certain restrictions and exclusi ons apply. Consult Customer Care for details. *1 GB = 1 billion b ytes when ref erring to hard dr iv e storage capacity . Actual accessible capacity is less . † Actual drive specificatio ns ma y differ slightly .
Spe cificat ion s Maintenance and S ervi ce Guide 7–7 Ta b l e 7 - 6 Primary 6-cell, Li-Ion Batter y P ack Dimensions Height Width Depth We i g h t 2.00 cm 5.30 cm 20.30 cm 0.34 kg 0.79 in 2.10 in 8.00 in 0.74 lb Energ y V oltage Amp-hour capacity W att-hour capacity 10.8 V 4.8 Ah 51 Wh T emperature Operating Nonoperating 0°C to 45°C -20°C to 60°C 32°F to 113°F -4°F to 140°F
7–8 Maintenance and Serv ice Gui de Spe cificat ion s Ta b l e 7 - 7 DV D - R O M D r i v e Applicable disc DV D - R O M ( DV D - 5 , DV D - 9 , DV D - 1 0 , DV D - 1 8 ) CD-R OM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F orm 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R CD-R W Photo CD (single and multisession) CD-Bridge Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in) Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full strok e < 100 ms < 175 ms < 125 ms < 225 ms A udio output level Line-out, 0.7 Vrms Cache b uffer 512 KB Data transfer rate CD-R (24X) CD-R W (10X) CD-R OM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate) 16.6 MB/s Star tup time < 10 seconds Stop time < 3 seconds
Spe cificat ion s Maintenance and S ervi ce Guide 7–9 Ta b l e 7 - 8 D VD/CD-R W Combo Drive Applicable disc Read: D VD-R, D VD-R W , D VD-ROM (D VD-5, D VD-9, D VD-10, DV D - 1 8 ) , CD-ROM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F or m 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R, CD-R W Photo CD (single and mult ise ssio n) CD-Bridge Write: CD-R and CD-R W Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in)
7–10 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD media D VD media Random Full strok e < 110 ms < 210 ms < 130 ms < 225 ms A udio output level Line-out, 0.7 V r ms Cache b uffer 2 MB Data transfer rate CD-R (24X) CD-R W (10X) CD-R OM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rate) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds Ta b l e 7 - 8 D VD/CD-R W Combo Drive (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–11 Ta b l e 7 - 9 D VD±R W and CD-R W Combo Drive Applicable disc Read: DV D - R , DV D - R W, D VD-ROM (D VD-5, DV D - 9 , DV D - 1 0 , DV D - 1 8 ) , CD-R OM (Mode 1 and 2) CD Digital A udio CD-XA ready (Mode 2, F orm 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R, CD-R W Photo CD (single and multisession) CD-Bridge Write: CD-R and CD-R W D VD-R and DV D - R W Center hole diameter 1.5 cm (0.59 in) Disc diameter Standard disc Mini disc 12 cm (4.72 in) 8 cm (3.15 in)
7–12 Maintenance and Serv ice Gui de Spe cificat ion s Disc thickness 1.2 mm (0.047 in) T rack pitch 0.74 µm Access time CD D VD Random Full strok e < 175 ms < 285 ms < 230 ms < 335 ms A udio output level Audio-out, 0.7 Vrms Cache b uffer 2 MB Data transfer rate CD-R (16X) CD-R W (8X) CD-R OM (24X) DV D ( 8 X ) D VD-R (4X) DV D - R W ( 2 X ) Multiword DMA mode 2 2,400 KB/s (150 KB/s at 1X CD rate) 1,200 KB/s (150 KB/s at 1X CD rate) 3,600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1,352 KB/s at 1X D VD rate) 5,400 KB/s (1,352 KB/s at 1X D VD rate) 2,700 KB/s (1,352 KB/s at 1X D VD rate) 16.6 MB/s Star tup time < 15 seconds Stop time < 6 seconds Ta b l e 7 - 9 D VD±R W and CD-R W Combo Drive (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–13 T able 7-10 System DMA Hard ware DMA System Function DMA0 Not applicable DMA1* Not applicable DMA2* Not applicable DMA3 SMC IrCC - F ast Infrared P or t DMA4 Direct memor y access controller DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller ca n use DMA 1, 2, or 5.
7–14 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-11 System Interrupts IRQ System Function IRQ0 System timer IRQ1 Standard 101-/102-K ey or Microsoft Natural K eyboard IRQ2 Cascaded IRQ3 SMC IrCC - F ast Infrared P or t IRQ4 COM1 IRQ5* Not assigned IRQ6 Diskette driv e IRQ7* P arallel por t IRQ8 System CMOS/real-time clock IRQ9* Microsoft A CPI-compliant system IRQ10* Mobile Intel 915GM/PM Expre ss PCI Express Root P or t - 2591 Intel 82801FB/FBM USB Univ er sal Host Controller - 2658 Intel 82801FB/FBM USB Univ er sal Host Controller - 265B Intel 82801FB/FBM USB2 Enhanc ed Host Controller - 265C Intel 82801FB/FBM PCI Express Root P or t - 2660 A TI MOBILILITY RADEON X300 SD A Standard Compliant Secure Digital Host Controller TI OHCI Compliant IEEE 1394 Host Controller TI PCI GemCore based Smar tCard Controller TI PCIxx21 Integrated FlashMedia Controller TI PCIxx21/x515 Cardbus controller Agere System A C '97 Modem
Spe cificat ion s Maintenance and S ervi ce Guide 7–15 IRQ11* Intel 82801FB/FBM USB Univ ersal Host Controller - 2659 Intel 82801FB/FBM USB Univ er sal Host Controller - 265A Broadcom NetXtreme Gigabit Ether net #2 SoundMAX Integrated Digital A udio IRQ12 Synaptics PS/2 T ouchP ad IRQ13 Numer ic data processor IRQ14 Primar y IDE channel IRQ15* Not assigned *Def ault configuration; audio possib le configurations are IRQ5, IRQ7, IRQ9, IRQ10, or none. ✎ PC Cards may assert IRQ3, IRQ4, IR Q5, IRQ7, IRQ9, IRQ10, IRQ11, or IRQ15. Either the infrared or the se rial port may assert IRQ3 or IRQ4. T able 7-11 System Interrupts (Continued) T able 7-12 System I/O Addresses I/O Address (he x) System Function (shipping configuration) 000 - 00F DMA controller no.1 010 - 01F System board resources 020 - 021 Interrupt controller no .1 022 - 023 U nused 024 - 03F System board resources 040 - 043 S ystem timer 044 - 04D Unused 04E - 04F System board resources 050 - 053 S ystem board resources
7–16 Maintenance and Serv ice Gui de Spe cificat ion s I/O Address (he x) System Function (shipping configuration) 054 - 059 U nused 060 K eyboard controller 061 System speak er 062 MS A CPI-Compliant embedded controller 063 System board resources 064 K eyboard controller 065 System board resources 066 MS A CPI-Compliant embedded controller 067 System board resources 068 Unused 070 - 071 R TC/CMOS 072 - 073 R TC/CMOS 074 - 077 M otherboard resources 078 - 079 U nused 080 - 08F DMA page registers 090 - 09F System board resources 0A0 - 0A1 Interrupt controller no .2 0A2 - 0A3 Unused 0A4 - 0BD System board resources 0BE - 0BF Unused 0C0 - 0DF DMA controller 2 0E0 - 0EF Unused 0F0 - 0FF Numeric data processor T able 7-12 System I/O Addresses (Continued)
Spe cificat ion s Maintenance and S ervi ce Guide 7–17 I/O Address (he x) System Function (shipping configuration) 100 - 10F SMC IrCC - F ast Infrared P or t 110 - 1EF Unused 1F0 - 1F7 Primar y IDE channel 1F8 - 377 Unused 378 - 37F P arallel por t (LPT1/defa ult) 380 - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Unused 3C0 - 3DF V GA 3E0 - 3E7 Unused 3E8 - 3EF SMC IrCC - F ast infrared por t 3F0 - 3F5 Unused 3F6 Pr imar y IDE channel 3F7 Unused 3F8 - 3FF Serial por t (COM1/def ault) CF8 - CFB PCI configuration inde x register CFC - CFF PCI configuration data register T able 7-12 System I/O Addresses (Continued)
7–18 Maintenance and Serv ice Gui de Spe cificat ion s T able 7-13 System Memory Map Size Memory Address System Function 640 KB 00000000 - 0009FFFF Base memor y 128 KB 000A0000 - 000BFFFF Video memor y 128 KB 000C0000 - 000DFFFF Video BIOS and other Optional ROM 128 KB 000E0000 - 000FFFFF System BIOS 2047 MB 00010000 - 7FFFFFFF Extended memor y 1 GB 80000000 - BFFFFFFF PCI Bus 32 MB C0000000 - C1FFFFFF Video memor y (direct access) 991 MB C2000000 - FFF00000 PCI Bus 1 MB FFF00000 - FFFFFFFF System BIOS
Maintenance and S ervi ce Guide A–1 A Co nnec tor P in As signm en ts Ta b l e A - 1 A udio-Out (Headphone) Pin Signal Pin Signal 1 A udio out, left channel 3 Ground 2 A udio out, right channel
A–2 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 2 A udio-In (Micr ophone) Pin Signal Pin Signal 1 A udio signal in 3 Ground 2 A udio signal in Ta b l e A - 3 Universal Serial Bus Pin Signal Pin Signal 1 5 VDC 3 Data 2 Data – 4 Ground
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 Serial Pin Signal Pin Signal 1 Carrier detect 6 Data set ready 2 Receive data 7 Ready to send 3 T ransmit data 8 Clear to send 4 Data ter minal ready 9 Ring indicator 5G r o u n d
A–4 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 5 P arallel P or t Pin Signal Pin Signal 1 Strobe 14 Auto linef eed 2 Data bit 0 15 Error 3 Data bit 1 16 Initialize printer 4 Data bit 2 17 Select in 5 Data bit 3 18 Ground 6 Data bit 4 19 Ground 7 Data bit 5 20 Ground 8 Data bit 6 21 Ground 9 Data bit 7 22 Ground 10 Ackno wledge 23 Ground 11 Busy 24 Ground 12 P aper end 25 Ground 13 Select Ground
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 6 7-Pin S-Video-Out Pin Signal Pin Signal 1 C (chrominance) 5 Composite video 2 Ground 6 Unused 3 Y (luminance) 7 Ground 4G r o u n d
A–6 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 7 External Monitor Pin Signal Pin Signal 1 Red analog 9 5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Horizontal sync 6 Ground analog 14 V er tical sync 7 Ground analog 15 DDC 2B clock 8 Ground analog
Connec tor P in Assignments Maintenance and S ervi ce Guide A–7 Ta b l e A - 8 RJ-11 (Modem) Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused
A–8 Maintenance and Serv ice Gui de Connec tor P in Assignments Ta b l e A - 9 RJ-45 (Netw ork) Pin Signal Pin Signal 1 T ransmit 5 Unused 2 T ransmit – 6 Receive – 3 Receive 7 Unused 4 Unused 8 Unused
Maintenance and S ervi ce Guide B–1 B P o w er Cord S et R eq uirements 3-Con duc tor P o w er Cord Set The wide range input feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 volts A C. The po wer cord set included with the notebook meets the requirements for use in the country where the equipment is purchased. Po wer cord sets for use in other countries must meet the requirements of the country where the notebook is used.
B–2 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Gen eral R equiremen ts The requirements listed belo w are applicable to all countries. ■ The length of the po wer cord set must be at least 1.5 m (5.0 ft) and a maximum of 2.0 m (6.5 ft). ■ All po wer cord sets must be approv ed by an acceptable accredited agency responsible for e valuation in the country where the po wer cord set will be used. ■ The po wer cord sets must ha ve a minimum current capacity of 10 amps and a nominal v oltage rating of 125 or 250 V A C, as required by each country’ s po wer system. ■ The appliance coupler must meet the mechanical conf iguration of an EN 60 320/IEC 320 Standard Sheet C13 connector for mating with the ap pliance inlet on the back of the notebook.
P ow er Cor d Set Requir ement s Maintenance and S ervi ce Guide B–3 Coun tr y-Spec ific Requir emen ts 3-Conductor P ower Cor d Set Requirements Country/Region Accredited Agency Applicable Note Number A ustralia EANSW 1 Au s t r i a OVE 1 Belgium C EBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 F rance UTE 1 Ger many VDE 1 Italy IMQ 1 Jap a n ME T I 3 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f o r e v aluation in the countr y where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equivalent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flex ible cord, and w all plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration.
B–4 Maintenance and Se rvi ce Guide P o w er Cor d Set R equirements Ko r e a E K 4 The Netherlands KEMA 1 Norwa y NEMK O 1 P eople’ s Repub lic of China CCC 5 Sweden SEMK O 1 Switzerland SEV 1 T aiwan BSMI 4 United Kingdom BSI 1 United States UL 2 ✎ NOTES: 1. The fle xible cord m ust be <HAR> T ype HO5VV -F , 3-conductor , 1.0 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mark of the agency responsible f o r e v aluation in the countr y where it will be used. 2. The fle xible cord m ust be T ype SPT -3 or equivalent, No . 18 A WG, 3-conductor . The wall plug must be a tw o-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6-15P (15 A, 250 V) configuration. 3. The appliance coupler , flex ible cord, and w all plug must bear a “T” mark and registration number in accordance with the J apanese Dentor i Law . The fle xib le cord must be T ype VCT or VCTF , 3-conductor , 1.00 mm² conductor size . The wall plug m ust be a two-po le grounding type with a J apanese Industrial Standard C8303 (7 A, 125 V) configuration. 4. The fle xible cord m ust be T ype VC TF , 3-conductor , 0.75 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mar k of the agency respon sible f or ev aluation in the countr y where it will be used. 5. The fle xible cord m ust be T ype R VV , 3-conductor , 0. 75 mm² conductor size . P ower cord set fittings (appliance coupler and w all plug) must bear the cer tification mar k of the agency respon sible f or ev aluation in the countr y where it will be used. 3-Conductor P ower Cor d Set Requirements (Continued) Country/Region Accredited Agency Applicable Note Number
Maintenance and S ervi ce Guide C–1 C Sc r e w Li sting This appendix provides specif ication and reference information for the scre ws and scre w locks used in the notebook. All scre ws and scre w locks listed in this appendix are a v ailable in the Scre w Kit, spare part number 378235-001.
C–2 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 0×4. 0 Scr ew L ocati ons Ta b l e C - 1 Phillips PM2.0×4.0 Screw Color Qty . Length Thread Head Width Black 3 4.0 mm 2.0 mm 4.0 mm Where used: 1 One scre w that secures the memor y module/Mini PCI compar tment cov er to the notebook (screw is captured on the co v er b y a C clip; documented in Section 6.7 ) 2 T wo screws that secure the hard driv e co ver to the notebook (scre ws are captured on the cov er by C clips; documented in Section 6.4 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–3 Philli ps P M2 .5×13 . 0 Scr ew L ocat ion Ta b l e C - 2 Phillips PM2.5×13.0 Spring-Loaded Har d Drive Retention Screw Color Qty . Length Thread Head Width Silv er 1 13.0 mm 2.5 mm 5.5 mm Where used: One screw that secures the hard driv e to the notebook (scre w is captured on the hard drive frame b y a C clip; documented in Section 6.4 ) mm
C–4 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 . 5×4. 0 Shoulder Sc r e w , Phillips P M2 .5×4. 0 Scr ew , and Phillips P M1. 5×3 . 5 Sc r ew L ocati ons Ta b l e C - 3 Phillips PM2.5×4.0 Shoulder Screw , Phillips PM2.5×4.0 Screw , and Phillips PM1.5×3.5 Screw Color Qty . Length Thread Head Width Silv er 2 4.0 mm 2.5 mm 4.0 mm Color Qty . Length Thread Head Width Silv er 2 4.0 mm 2.5 mm 4.5 mm Color Qty . Length Thread Head Width Black 2 3.5 mm 1.5 mm 4.5 mm Where used: 1 T wo shoulder screws that secure the hard driv e frame to the hard drive (documented in Section 6.4 ) 2 T wo screws that secure the hard driv e frame to the hard driv e (documented in Section 6.4 ) 3 T wo screws that secure the hard driv e frame to the hard driv e (documented in Section 6.4 ) mm mm mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–5 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio n Ta b l e C - 4 T orx T8M2.0×9.0 Screw Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the optical dr iv e to the notebook (documented in Section 6.9 ) mm
C–6 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the k eyboard to the notebook (documented in Section 6.10 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–7 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the displa y asse mbly to the notebook (documented in Section 6.18 ) mm
C–8 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 4 screws that secure the displa y asse mbly to the notebook (documented in Section 6.18 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–9 T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 13 screws that secure the top co v er to the notebook (documented in Section 6.19 ) mm
C–10 Maintenance and S ervi ce Guide Scr e w Listi ng T orx T8M2 . 0×9 . 0 Sc r ew L ocatio ns Ta b l e C - 4 T orx T8M2.0×9.0 Screw (Continued) Color Qty . Length Thread Head Width Black 24 9.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the top co v e r to the notebook (documented in Section 6.19 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–11 T orx T8M2 . 0×2 .0 S cr ew L o cati ons Ta b l e C - 5 T orx T8M2.0×2.0 Screw Color Qty . Length Thread Head Width Black 2 2.0 mm 2.0 mm 6.0 mm Where used: 2 screws that secure the s witch co v er to the notebook (documented in Section 6.11 ) mm
C–12 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M1. 5×4. 0 Sc r e w L ocati ons Ta b l e C - 6 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Silv er 4 4.0 mm 1.5 mm 4.0 mm Where used: 4 screws that secure the LED board to the s witch cov er (documented in Section 6.12 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–13 Phill ips P M2 . 0×7 . 0 Scr e w Locations Ta b l e C - 7 Phillips PM2.0×7.0 Screw Color Qty . Length Thread Head Width Silv er 2 7.0 mm 2.0 mm 4.5 mm Where used: 2 screws that secure the f an to the notebook (screws are captured on the f an assembly b y an O clip; documented in Section 6.13 ) mm
C–14 Maintenance and S ervi ce Guide Scr e w Listi ng Phillips P M2 .0×8. 0 Shoulder Sc r e w L ocati ons Ta b l e C - 8 Phillips PM2.0×8.0 Shoulder Screw Color Qty . Length Thread Head Width Silv er 4 8.0 mm 2.0 mm 5.0 mm Where used: 4 screws that secure the hea t sink to the notebook ( screws are captured on the heat sink by C clips; documented in Section 6.14 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–15 Philli ps P M2 .0×3 .0 Sc r e w Locations Ta b l e C - 9 Phillips PM2.0×3.0 Screw Color Qty . Length Thread Head Width Black 2 3.0 mm 2.0 mm 4.0 mm Where used: 2 screws that secure the modem boar d to the notebook (documented in Section 6.21 ) mm
C–16 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocations T able C-10 T orx T8M2.0×4.0 Screw Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: 6 screws that secure the speak er to the notebook (documented in Section 6.20 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–17 T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the USB/audio board the notebook (documented in Section 6.23 ) mm
C–18 Maintenance and S ervi ce Guide Scr e w Listi ng T or x T8M2 .0×4. 0 Sc r e w L ocation T able C-10 T orx T8M2.0×4.0 Screw (Continued) Color Qty . Length Thread Head Width Black 8 4.0 mm 2.0 mm 4.0 mm Where used: One screw that secures the system board the notebook (documented in Section 6.24 ) mm
Scr ew L isti ng Maintenance and S ervi ce Guide C–19 He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Lock Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 1 T wo screw loc ks that secure the system board to the notebook (documented in Section 6.24 ) 2 T wo screw loc ks that secure the system board to the notebook (documented in Section 6.24 ) mm
C–20 Maintenance and S ervi ce Guide Scr e w Listi ng He x Soc k et HM5 . 0×9 .0 S cr ew L ock L ocations T able C-11 Hex Soc ket HM5.0×9.0 Screw Loc k (Continued) Color Qty . Length Thread Head Width Silv er 6 9.0 mm 2.5 mm 5.0 mm Where used: 2 screw loc ks that secure the ser ial connector board to the system board (documented in Section 6.25 ) mm
Maintenance and S ervi ce Guide Inde x–1 In de x 1394 port 1–11 6-in-1 Digital Media Slot 1–7 6-in-1 Digital Media Slot light 1–7 A AC adapter, spare part numbers 4–11 , 4–13 arrow keys 1–15 audio board removal 6–48 spare part number 6–48 audio board cable 4–9 audio troubleshooting 2–23 audio-in jack location 1–9 pin assignments A–2 audio-out jack location 1–9 pin assignments A–1 B base enclosure, spare part number 4–5, 4–15 battery bay 1–13, 1–20 battery light 1–7 battery locking latch 1–20 battery pack removal 6–5 spare part numbers 4–7, 4–13 specifications 7–7 battery release latch 1–21 Bluetooth board removal 6–10 spare part number 4–7 , 4–13 , 6–10 Bluetooth board cable 4–9 bottom components 1–20 C cables, service considerations 5–2 caps lock key 1–15 caps lock light 1–17 components bottom 1–20 front 1–6 keyboard 1–12, 1–14 left-side 1–10 rear 1–10 right-side 1–8 top 1–16 , 1–18
Inde x–2 Mainten ance and Servi ce Guide Inde x Computer Setup Advanced Menu 2–6 File Menu 2–3 overview 2–1 Security Menu 2–4 Tools Menu 2–5 Computer Setup defaults 2–2 connector pin assignments audio-in A–2 audio-out A–1 external monitor A–6 headphone A–1 microphone A–2 modem A–7 monitor A–6 network A–8 parallel A–4 RJ-11 A–7 RJ-45 A–8 serial A–3 S-Video-out A–5 Universal Serial Bus (USB) A–2 connectors, service considerations 5–2 D design overview 1–22 digital media board removal 6–46 spare part number 4–5, 4–15 , 6–46 Digital Media Slot light, 6-in-1 1–7 Digital Media Slot, 6-in-1 1–7 disassembly sequence chart 6–2 diskette drive OS loading problems 2–21 precautions 5–3 display assembly removal 6–35 spare part numbers 4–3, 4–15 , 6–35 specifications 7–3, 7–4, 7–5 display lid switch 1–17 display release button 1–6 docking connector 1–20 docking device spare part number 4–11, 4–14 troubleshooting 2–16 docking station, spare part number 4–11, 4–14 drives, preventing damage 5–3 DVD/CD-RW Combo Drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7 , 4–10 , 4–15 , 6–16 specifications 7–9 DVD±RW and CD-RW Combo Drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7 , 4–10 , 4–15 , 4–16 , 6–16 specifications 7–11
Inde x Maintenance and S ervi ce Guide Inde x–3 DVD-ROM drive OS loading problems 2–17 precautions 5–3 removal 6–16 spare part number 4–7, 4–10 , 4–15 , 6–16 specifications 7–8 E electrostatic discharge 5–4, 5–8 exhaust vents 1–11 external monitor port location 1–10 pin assignments A–6 External MultiBay II, spare part number 4–11, 4–13 F f1 to f12 keys 1–15 fan location 1–21 removal 6–26 spare part number 4–3, 4–14 , 6–26 features 1–2 feet illustrated 4–8 locations 6–9 flowcharts, troubleshooting no audio 2–23, 2–24 no network/modem connection 2–28 no OS loading 2–17 no OS loading from diskette drive 2–21 no OS loading from hard drive 2–18, 2–19, 2–20 no OS loading from optical drive 2–22 no power 2–10 , 2–12 , 2–13 no video 2–14, 2–15 nonfunctioning device 2–25 nonfunctioning docking device 2–16 nonfunctioning keyboard 2–26 nonfunctioning pointing device 2–27 fn key 1–15 front components 1–6 G grounding equipment and methods 5–6 H hard drive OS loading problems 2–18 precautions 5–3 removal 6–6 spare part numbers 4–7, 4–10 , 4–14 , 4–15 , 6–6 specifications 7–6 hard drive bay 1–21 hard drive cover illustrated 4–8 removal 6–6 hard drive light 1–7 headphone jack location 1–9 pin assignments A–1
Inde x–4 Mainten ance and Servi ce Guide Inde x heat sink removal 6–27 spare part number 4–3, 4–15 , 6–27 I I/O address specifications 7–15 Info Center button 1–17 infrared port 1–6 interrupt specifications 7–14 K keyboard removal 6–18 spare part numbers 4–3, 4–16 , 6–18 troubleshooting 2–26 keyboard components 1–12 , 1–14 keypad keys 1–15 L LED board removal 6–24 spare part number 4–3, 4–14 , 6–24 LED board cable 4–9 left-side components 1–10 M mass storage devices, spare part numbers 4–10 memory map specifications 7–18 memory module removal 6–12, 6–32 spare part numbers 4–5, 4–13 , 6–12 , 6–32 memory module compartment 1–21 memory module/Mini PCI compartment cover illustrated 4–8 removal 6–12 microphone jack location 1–9 pin assignments A–2 Mini PCI communications card removal 6–14 spare part numbers 4–7, 4–14 , 4–15 Mini PCI compartment 1–21 Miscellaneous Cable Kit components 4–9 spare part number 4–9 , 4–15 Miscellaneous Plastics Kit components 4–5, 4–8, 4–14 spare part number 4–5 , 4–8 , 4–14 Miscellaneous Plastics Kit (for use with docking station), spare part number 4–11, 4–15 modem board removal 6–44 spare part number 4–5 , 4–13 , 6–44
Inde x Maintenance and S ervi ce Guide Inde x–5 modem cable illustrated 4–9 removal 6–54 modem jack location 1–11 pin assignments A–7 modem, troubleshooting 2–28 monitor port location 1–10 pin assignments A–6 N network jack location 1–11 pin assignments A–8 network, troubleshooting 2–28 nonfunctioning device, troubleshooting 2–16, 2–25 notebook feet illustrated 4–8 locations 6–9 notebook specifications 7–1 num lock key 1–15 num lock light 1–17 O optical drive location 1–9 OS loading problems 2–22 precautions 5–3 removal 6–16 spare part numbers 4–7, 6–16 specifications 7–8, 7–9, 7–11 P packing precautions 5–5 parallel port location 1–13 pin assignments A–4 PC Card eject buttons 1–11 PC Card slot space saver 4–8 PC Card slots 1–11 plastic parts 5–2 pointing device, troubleshooting 2–27 power connector 1–13 power cord set requirements B–2 spare part numbers 4–11, 4–13 power management features 1–5 power, troubleshooting 2–10 power/standby button 1–16 power/standby light 1–6 Presentation mode button 1–17 processor removal 6–30 spare part numbers 4–3, 4–14 , 6–30 R rear components 1–10 removal/replacement preliminaries 5–1 procedures 6–1 right-side components 1–8
Inde x–6 Mainten ance and Servi ce Guide Inde x RJ-11 connector module and cable illustrated 4–9 removal 6–54 RJ-11 jack location 1–11 pin assignments A–7 RJ-45 jack location 1–11 pin assignments A–8 RTC battery illustrated 4–8 removal 6–34 S Screw Kit contents C–1 spare part number 4–12, 4–14 , C–1 screw listing C–1 security cable slot 1–13 serial connector module removal 6–55 spare part number 4–5, 4–14 , 6–55 serial connector module cable, illustrated 4–9 serial number 4–1, 6–2 serial port location 1–9 pin assignments A–3 service considerations 5–2 speaker removal 6–42 spare part number 4–5, 4–15 , 6–42 speakers, location 1–6 specifications battery pack 7–7 display 7–3, 7–4, 7–5 DVD/CD-RW Combo Drive 7–9 DVD±RW and CD-RW Combo Drive 7–11 DVD-ROM drive 7–8 hard drive 7–6 I/O addresses 7–15 interrupts 7–14 memory map 7–18 notebook 7–1 optical drive 7–8, 7–9, 7–11 system DMA 7–13 static shielding materials 5–8 S-Video-out jack location 1–13 pin assignments A–5 switch cover removal 6–22 spare part number 4–3 , 4–14 spare part numbers 6–22 system board removal 6–50 spare part numbers 4–5, 4–15 , 6–50 system DMA 7–13 system memory map 7–18 T tools required 5–1 top components 1–16, 1–18
Inde x Maintenance and S ervi ce Guide Inde x–7 top cover removal 6–38 spare part number 4–3, 4–15 , 6–38 TouchPad 1–19 TouchPad buttons 1–19 TouchPad scroll zone 1–19 transporting precautions 5–5 travel battery connector 1–21 travel battery pack, spare part number 4–11, 4–13 troubleshooting audio 2–23 Computer Setup 2–2 docking device 2–16 flowcharts 2–7 keyboard 2–26 modem 2–28 network 2–28 nonfunctioning device 2–16 , 2–25 OS loading 2–17 overview 2–1 pointing device 2–27 power 2–10 video 2–14 U Universal Serial Bus (USB) board cable 4–9 Universal Serial Bus (USB) diskette drive, spare part number 4–11, 4–13 Universal Serial Bus (USB) port location 1–9, 1–10 pin assignments A–2 USB/audio board removal 6–48 spare part number 4–5 , 4–14 , 6–48 V video troubleshooting 2–14 volume buttons 1–19 W Windows applications key 1–15 Windows logo key 1–15 wireless button 1–17 wireless light 1–6, 1–17 workstation precautions 5–6