HP PAVILLION ZD7000 Maintenance And Service Manual

Main tenan ce and S er vice Guide HP P a v ili on W ide sc r een Not ebook zd7 000 D o c u m e n t P a r t N u m b e r : 33362 1 - 0 0 1 Aug u st 20 03 This guide is a troubleshooting reference used for maintaining and servicing the notebook. It provides comprehensi ve information on identifying note book features, components, and spare parts; troubleshooting no tebook problems; and performi ng notebook disassembly procedures. 3336 21-001 .boo k Page i Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
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© 2003 Hewlett-P ackard De velopment Compan y , L.P . Microsoft and W indows are trademar ks of Microsoft C orporation in the U.S. and/or other countri es. Intel and Pentium are tradem arks of Intel Corporation in the U.S. and/or othe r countries. SD Logo is a trademark. The information contained herein is s ubject to change without notice. The only warranties for HP produc ts and services are set forth in the e xpress warranty statem ents accompan ying su ch products and services. Nothin g herein should be construe d as constituting an addi tional warranty . HP shall not be liable for technica l or editorial errors or omissions contained herein. Maintenance and Se rvice Guide HP P av ilion Wide scr een Notebook zd7 000 Fi r s t Ed i t i o n A u g u s t 2 0 03 Doc ument P art Number : 3 33 6 21-001 3336 21-001 .boo k Page ii Wed n es day, Septem b er 17, 20 03 1 2 :2 4 PM
Maintenance and S ervi ce Guide iii Cont ent s 1 Product Description 1.1 Models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4 1.3 Clearing a Password . . . . . . . . . . . . . . . . . . . . . . . . . 1–6 1.4 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7 1.5 External Components . . . . . . . . . . . . . . . . . . . . . . . . 1–8 1.6 Design Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18 2 Troubleshooting 2.1 Computer Setup and Diagnostics Utilities . . . . . . . . 2–1 Using Computer Setup. . . . . . . . . . . . . . . . . . . . . . . . 2–2 Selecting from the File Menu . . . . . . . . . . . . . . . . . . 2–3 Selecting from the Security Menu . . . . . . . . . . . . . . . 2–4 Selecting from the Advanced Menu . . . . . . . . . . . . . 2–5 2.2 Using Diagnostics for Windows . . . . . . . . . . . . . . . . 2–7 Obtaining, Saving, or Printing Configuratio n Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–7 Obtaining, Saving, or Printing Di agnostic Test Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8 2.3 Troubleshooting Flowcharts . . . . . . . . . . . . . . . . . . 2–10 3336 21-001 .boo k Page iii Wednesda y, Sept em ber 17, 2003 12: 24 PM
iv Maintenance a nd Service Guide Conte nt s 3 Illustrated Parts Catalog 3.1 Serial Number Location . . . . . . . . . . . . . . . . . . . . . . 3–1 3.2 Notebook Major Components . . . . . . . . . . . . . . . . . . 3–2 3.3 Miscellaneous Plastics Kit Components . . . . . . . . . . 3–8 3.4 Miscellaneous Cable Kit Componen ts . . . . . . . . . . . 3–9 3.5 Mass Storage Devices . . . . . . . . . . . . . . . . . . . . . . . 3–10 3.6 Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–11 4 Removal and Replacement Preliminaries 4.1 Tools Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1 4.2 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . 4–2 Plastic Parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . 4–2 4.3 Preventing Damage to Remova ble Drives . . . . . . . . 4–3 4.4 Preventing Electrostatic Damage . . . . . . . . . . . . . . . 4–4 4.5 Packaging and Transporting Precautions . . . . . . . . . 4–4 4.6 Workstation Precautions . . . . . . . . . . . . . . . . . . . . . . 4–5 4.7 Grounding Equipment and Methods . . . . . . . . . . . . . 4–6 5 Removal and Repla cement Procedures 5.1 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–2 5.2 Disassembly Sequence Chart . . . . . . . . . . . . . . . . . . 5–3 5.3 Preparing the Notebook for Disassembly . . . . . . . . . 5–4 5.4 Notebook Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.5 Memory Expansion Board . . . . . . . . . . . . . . . . . . . . 5–8 5.6 Mini PCI Communications Board . . . . . . . . . . . . . . 5–10 5.7 Optical Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11 5.8 Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12 5.9 Keyboard Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–16 3336 21-001 .boo k Page iv Wedn e s d ay, Septem b er 1 7, 20 03 1 2 :24 PM
Cont ent s Maintenance and S ervi ce Guide v 5.10 Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . 5–18 5.11 Top Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–20 5.12 System Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–23 5.13 RTC Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27 5.14 Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–28 5.15 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–32 5.16 SD Card Slot/Infrared Module . . . . . . . . . . . . . . . 5–34 5.17 Speakers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–36 6 Specifications A Connector Pin Assignments B Power Cord Set Requirements 3-Conductor Power Cord Set . . . . . . . . . . . . . . . . . . . . . . B–1 General Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1 Country-Specific Requirements . . . . . . . . . . . . . . . . . . . . B–2 C Screw Listing Index 3336 21-001 .boo k Page v Wednesday, Sept ember 17, 2003 12: 24 PM
Maintenance and S ervi ce Guide 1–1 1 Product D esc ription The HP Pa vilion Wi descreen Note book zd7000 of fers adv anced modularity , Intel Mobile Pentiu m DT processors with 64-bit architecture, industry-leading NVIDIA graphics controllers, and extensi ve multimedia support. HP P av ilion Wide scr een Notebook zd7 000 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
1–2 Mainten ance and Service Guide Produ ct Desc r iption 1.1 M o d e l s Notebook mode l information is shown in T ables 1-1 and 1-2. T able 1-1 HP P avili on Widescreen Notebook zd7000 Model Naming Con ventions Key V P 320 Y7 80 Y Gg 10 H XXXXXX-XXX 12 3 4 5 6 7 8 9 1 0 Ke y Description Options 1 Brand/Series designator V = P avilion 2 Processor type P = Intel P entium 4 DT 3 Processor speed 320 = 3.20 GHz 306 = 3.06 GHz 280 = 2.80 GHz 266 = 2.66 GHz 4 Displa y type/ size/resolution Y = wide SXGA (1680 × 1050) W = wide XGA (1280 × 800) 7 = 17.1 in 5 = 15.4 in 5 Hard drive size 80 = 80 GB 60 = 60 GB 6 Optical drive designator Y = D VD-R W W = D VD-ROM / CD-R W combo 7 Integrated communication/ wireless device G = combination modem GB NIC g = 802.11g Bluetooth N = none 8 RAM 10 = 1024 MB 76 = 768 MB 51 = 512 MB 9 Operating system H = Windows X P Home 10 SKU# 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–3 T able 1-2 HP P avili on Widescreen Notebook zd7000 All HP P avilion zd7000 mo dels feature: ■ T ouchP ad p ointing device ■ 12-cell, lithium ion (Li-Ion) batter y pack ■ 1-year w arranty on par ts and labor V7999 P 320 Y7 80 Y Gg 10 H United States DP446U ABA V7001 P 320 Y7 80 Y Gg 76 H Fr a n c e Ger many Italy DP353E ABF DP763E ABD DP353E UUZ Spain Switzerland United Kingdom DP353E ABE DP353E ABZ DP353E ABU V7020 P 280 Y7 80 Y Gg 51 H United States DR089U ABA V7030 P 306 Y7 80 Y Gg 10 H United States DM790A ABA V7001 P 306 Y7 80 Y GN 51 H United States DM793A ABA V7020 P 280 Y7 80 Y Gg 51 H United States DM794A ABA V7005 P 280 Y7 60 Y Gg 51 H United States DP448U ABA V7040 P 280 Y7 60 W GN 51 H Fr a n c e Ger many Italy DP761E ABF DP762E ABD DP761E ABZ Spain Switzerland United Kingdom DP761E ABE DP761E UUZ DP761E ABU V7010 P 266 Y7 60 W Gg 51 H United States DM788A ABA V7998 P 266 W5 60 W Gg 51 H United States DP447U ABA 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
1–4 Mainten ance and Service Guide Produ ct Desc r iption 1. 2 F e a t u r e s ■ The follo wing processors, all with 512-KB L2 cache, are a vailable, v arying by notebo ok model: ❏ Intel Pentium 4 DT 3.2-GHz processor with Hyper-Threading front-side b us (FSB) ❏ Intel Pentium 4 DT 3.2-, 3.0-, and 2.8-GHz processors with 800-MHz FSB ❏ Intel Pentium 4 DT 3.06-, 2.8-, and 2.66-GHz processo rs with 533-MHz FSB ■ 17.0- or 15.4-inch wide XGA (1490×900) TFT display with ov er 16.7 million colors, v a rying by notebook model ■ NVIDIA GeFor ce FX Go5000 with 128-MB vid eo memory , NVIDIA GeForce FX Go50 00 with 64-MB video memory , or NVIDIA GeForce 4 440 Go w ith 64-MB video memory , v arying b y notebook model ■ 80-, 60-, or 40-GB h igh-capacity hard dri ve, v arying b y notebook model ■ 256-MB DDR Synchro nous DRAM (SDRAM) at 333 MHz, expandable to 2.0 GB ■ Microsoft W in do ws XP Home or XP Pro, varying b y notebook model ■ Full-size W indows 98 ke yboard with inte grated numeric keypad ■ T ouchPad p ointing de vice with on/off b utton and dedicated vertical scroll up/do wn pad ■ Integrated Secure Digita l (SD) flash media slot ■ Integrated 10/100B ASE-T Ethernet local area network (LAN) network interface card (NIC) with RJ-45 connector ■ Integrated wireless support for Mini PCI 802.11b/g and Bluethumb LAN devices 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–5 ■ Support for one T ype II PC Card slot with support for both 32-bit (CardBus) and 16-bit PC Cards ■ External 135-watt A C adapter with po wer cord ■ 12-cell Li-Ion battery p ack ■ Harman/Kardon stereo speakers ■ Support for the follo wing optical dri ves: ❏ 24X Max D VD /CD-R W combination driv e ❏ 8X Max D VD-R W driv e ❏ 24X Max CD-R OM dri ve ■ Connectors: ❏ SD Card ❏ Infrared ❏ 1 T ype II PC Card slot ❏ RJ-11 (modem) ❏ RJ-45 (network interface card, [NIC] ) ❏ 4 Uni versal Serial Bus (USB) v . 2.0 ❏ S-V ideo ❏ Parallel ❏ External monitor ❏ DC po wer ❏ Docking ❏ IEEE 1394 digital ❏ Microphone ❏ Stereo speaker/headphone 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
1–6 Mainten ance and Service Guide Produ ct Desc r iption 1 .3 C learin g a P assw ord If the notebook you are serv icing has an unkno wn password , follo w these steps to clear the password. These steps also clear CMOS: 1. Prepare the noteboo k for disa ssembly (refer to Section 5.3, “Preparing the Notebook fo r Disassembly , ” for more information). 2. Remov e the real time clock (R TC) battery (refer to Section 5.13, “R TC Battery”). 3. W ait approximately 5 minutes. 4. Replace the R TC battery a nd reassemble the notebook. 5. Connect A C power to the notebook. Do not reinsert any battery packs at this time. 6. T urn on the notebook. All passw ords and a ll CMOS settings ha ve been cleared. 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–7 1. 4 P o w e r M a n a g e m e n t The notebook comes with power management features that extend battery operating ti me an d conserve po wer . The notebook supports the follo wing power management features: ■ Standby ■ Hibernation ■ Setting customiza tion by the user ■ Hotke ys for setting the le vel of performance ■ Battery calibration ■ Lid switch Standby /resume ■ Po wer/Standby b utton ■ Adv anced Conf iguration and Po wer Management (A CPM) complian ce 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
1–8 Mainten ance and Service Guide Produ ct Desc r iption 1. 5 E x t e r n a l C o m p o n e n t s The external components on the fro nt panel an d right side of the notebook are sho wn below an d described in T able 1-3. F r ont P anel and R ight-Si de Componen ts 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–9 T able 1-3 Fron t and Right Side Components Item Component Function 1 Display release latch Opens the notebook. 2 Stereo speakers (2) Produce stereo sound. 3 Integrated Drive Electronics (IDE) drive light On: The inter nal hard dr ive or optical drive is being accessed. 4 Battery light ■ On: The notebook i s receiving batter y power . ■ Amber : A batter y pack is charging. ■ Green: A battery pack is fully charged. ■ Flashing: A batter y pack is malfunctioning and mi ght need to be replac ed. 5 AC po wer light On: The notebook i s receiving AC pow er . 6 P ower/Standby light O n: Notebook is tur ned on. Flashing: Notebook is in Standby . 7 Digital Media slot Suppor ts SD , MMC, Memory Stick, and Smar tMedia. 8 Infrared por t Provides wireless communication between the notebook and an optional IrD A-compliant de vice. 9 Optical drive Suppor ts an optica l disc. 10 PC Card eject button Ejects an optional PC Card from the PC Card slot. 11 PC Card slot Suppor ts an optional T ype I or T ype II 32-bit (CardBus) or 16-bit PC Card. 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
1–10 Maintenance and Ser vi ce Guide Produ ct Desc r iption The e xternal comp onents on the re ar panel and le ft side are sho wn below and described in T able 1-4. Rear P anel and Left-Side Co mponents T able 1-4 Rear P anel and Left-Side Components Item Component Function 1 Security cable slot Attaches an optional secur ity cable to the notebook. ✎ The pur pose of security solu tions is to act as a deterrent. These solutions do not prev en t the product from being mishandled or stolen. 2 RJ-11 telephone jack Connects a modem cable. 3 RJ-45 network jack Connects an Ether net network cable . 4 USB connectors (3) Connect optional 2.0 -compliant USB devices . 5 S-Video jack Connects an optional S-Video device, such as a television, VCR, camcorder , projector, or video capture card. 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–11 6 P arallel connector Connects an opti onal parallel device such as a printer . 7 Exter nal monitor connector Connects an optional V GA exter nal monitor or projector . 8 V en ts (3) Allow airflow to cool internal compone nts. Ä T o pre vent ov erheating, use the not ebook only on hard surfaces that cannot obstruct the vents . Do not allow a soft surf a ce, such as bedding, clothing, or a th ick rug, to b lock airflow . 9 P ower connector Connects an AC adapter cable. 10 HP notebook expansion base connector Connects to an optional expansion base. 11 USB connector Connects optional 2.0-complian t USB devices . 12 1394 connector Connects an opti onal 1394 device such as a camcorder or digital camera. 13 Microphone jack Connects an opti onal monaural or ste reo microphone. 14 Audio line-out jack Conn ects optional he adphone or p owered stereo speakers. Also connects the audio function of an aud io/video device such as a television or VCR. T able 1-4 Rear P anel and Left-Side Components (Continued) Item Component Function 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
1–12 Maintenance and Ser vi ce Guide Produ ct Desc r iption The noteboo k ke yboard compon ents are sho wn below and described in T able 1-5 . Ke y b o a r d C o m p o n e n t s 3336 21-001 .boo k Page 12 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–13 Ta b l e 1 - 5 Ke yboar d Components Item Component Function 1 fn ke y Ex ecutes frequently used system functions when pressed in combination with another ke y . 2 caps lock ke y Enables caps lock and turns on the caps lock light. 3 f1 through f12 function keys P erform system and application tasks. When c ombined wi th the fn k ey , the function keys f1 and f3 through f12 perf or m additional tasks as h otke ys. 4 K eypad k eys (17) Standard numeric keypad. 5 Cursor control keys Move the cursor around the screen. 6 Applications ke y Displa ys a shor tcut menu for items beneath the pointer. 7 Microsoft logo ke y Displays the Windo ws Star t menu. 3336 21-001 .boo k Page 13 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
1–14 Maintenance and Ser vi ce Guide Produ ct Desc r iption The notebook top compo nents are shown belo w and described in T able 1-6. To p C o m p o n e n t s T able 1-6 T op Components Item Component Function 1 P ower button When the noteboo k is: ■ Off, press to tu rn on the n otebook. ■ On, briefl y press to initiate Hiber nation. ■ In Standby , briefly press to re sume from Standby . ■ In Hiber nation, br iefly press to restore from Hibern ation. P ower/Standby light ■ On: Notebook is tur ned o n. ■ Flashing: Notebook is in Standby . 2 V ol ume control buttons (2) Increase or decrease system v o lume. 3336 21-001 .boo k Page 14 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–15 3 Mute button Mutes or restores v olume. Mute light On: V olume is muted. 4 Media button Laun ches a multimedia application. 5 Picture button Launches a digital imaging application . ✎ The settings for the media and picture bu ttons can be changed. Refer to the “Using Custom Assignments and Schemes” section in Chapter 3 of the Star tup and Refe rence Gu ide f or inf or mation on reassigning these buttons to other applications. 6 Wireless on/off button T ur ns the wireless networ k de vice on and off. Wireless on/off ligh t On: an integrated wireless de vice has been enabled. 7 Caps lock light On: Caps lock is on. 8 Num lock light On: Num lock is on. 9 T ouchP ad on/off butt on Enab les/disab les the T ouchP ad. 10 T ouchP ad scro ll zone Scrolls upward or downw ard. 11 Left and right T ouchP ad buttons Function like the left and righ t buttons on an e xter nal mouse. 12 T ouchP ad Mov es the pointer and selects or activates items on the screen. 13 T ouchP ad lig ht On: T ouchPad is enab led. T able 1-6 T op Components (Continued) Item Component Function 3336 21-001 .boo k Page 15 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
1–16 Maintenance and Ser vi ce Guide Produ ct Desc r iption The external components on th e bottom of the notebook are sho wn belo w and described in T able 1-7. Bottom Components 3336 21-001 .boo k Page 16 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Pr oduc t Desc r iptio n Maintenance and S ervi ce Guide 1–17 T able 1-7 Bottom Components Item Co mponent Function 1 Labels area Contains the notebook ser ial number and other applicable regulator y labels. 2 Hard drive ba y Holds the inter nal hard dr ive . 3 V ents (3) Allow airflow to cool inter nal components. Ä T o prev ent ov erheating, do not o bst ruct vents. Using the notebook on a soft surf ace, such as a pillow , blanket, rug, or thick clothing, can bloc k airflow . 4 Memory expansion/Mini PCI communication compar tment Contains two memory slots for optional 256-, 512-, or 1024-MB memor y modules and one slot for a Mini PCI wireless card. 5 F an compar tment Contains the heat sink and the two system f ans . 6 Battery release latch Releases a batter y pack from the batter y ba y . 7 Battery b ay Holds the batter y p ack. 3336 21-001 .boo k Page 17 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
1–18 Maintenance and Ser vi ce Guide Produ ct Desc r iption 1. 6 D e s i g n O v e r v i e w This section presents a design ov ervie w of key parts and features of the notebook. Refer to Chapte r 3, “Illustrated Parts Catalog, ” to identify replacement parts, and Chapter 5, “Remov a l and Replacement Procedures, ” for disa ssembly steps. The system board pro vides the following de vice connections: ■ Memory expansio n board ■ Mini PCI communications d evices ■ Hard dri ve ■ Display ■ K eyboard an d T ouchPad ■ Audio ■ Intel Pentium 4 DT processors ■ Fan ■ PC Card The notebook uses an electrical f an for ventilation. T he fan is controlled b y a temperature sensor and is designed to turn on automatically when hi gh temperature conditions exist. These conditions are affected b y high external temperatures, system po wer consumption, po wer mana gement/battery conservation confi gurations, battery f ast chargi ng, and softw are applications. Exhaust air is displaced through the ve ntilation grill located on the left side of the notebook. Ä CAUT ION: T o proper ly v entilate the notebook, allo w at least a 7 .6 -cm (3-inch) c l earance on the le ft and ri ght sides of the notebook . 3336 21-001 .boo k Page 18 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide 2–1 2 Tr o u b l e s h o o t i n g Å W ARN ING: Only author i z ed technic ians trained b y HP should r e pair this equipment . All tr oubleshooting and r e pair procedur es are detailed to allo w only subas sembly/module le ve l repair . Because o f the comple xity of the indi v idual boa r ds and subas sembli es , do not atte mpt to mak e r epairs at the component le vel or modifi cations to an y printed w iring boar d. Im proper r epairs can create a saf ety haz ard . An y indicati on of component r eplac ement or printed wir ing board modifi cation ma y vo id an y w arr anty or ex change allow ances. 2. 1 Comp uter Setu p and Di agnos tics Utiliti es The notebook features two system management utilities: ■ Computer Setup —A system informatio n and customization utility that can be used e ven wh en your operating system i s not working or will not load. This ut ility includes settings that are not av ailable in W indows. 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
2–2 Mainten ance and Service Guide T rou bleshooting ■ Diagnostics for W indows —A system information and diagnostic utility that is used within the W i ndo ws operating system. Use this utility whene ver possible to: ❏ Display system information. ❏ T est system components. ❏ T roubleshoot a device conf iguration problem in W indows XP Professional or W indo ws XP Home. ✎ It is not necessary to conf ig ure a device connected to a USB connector on the notebook or to an optional e xpansion base. Using C omp uter S etup Information and settings in Co mputer Setup are accessed from the File, Security , or Advanced menus: 1. T urn on or restart the not ebook. Press f10 while the F10 = R OM-Based Setup message is displayed in the lower left corner of the screen. ❏ T o change the langu age, press f2. ❏ T o view na vigation information, press f1. ❏ T o return to the Comp uter Setup menu, press esc. 2. Select the File, Security , or Adv anced menu. 3. T o close Comp uter Setup and restart the notebook : ❏ Select File > Sa ve Changes and Exit and press enter . -or- ❏ Select File > Ignore Changes and Exit an d press enter . 4. When you are prompted to conf irm your action, press f10. 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–3 Selecting f ro m the Fi le Menu Ta b l e 2 - 1 File Menu Select T o Do This System Information ■ View identification inform ation about the notebook, an expansion base, and any batter y packs in the system. ■ View specification inf or mation about the processor , memor y and cache size , and system ROM. Sav e to Floppy Sav e system configuration settings to a disk ette. Restore from Flopp y Restore system configuration settings from a diskette . Restore Defaults Replace configuration settings in Computer Setup with factor y default settings. Identificat ion information is retained. Ignore Changes and Exit Cancel changes entered dur ing the current session, then exit and restar t the notebook. Sav e Change s and Exit Save changes entered during the current session, then exit and restar t the notebook. 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
2–4 Mainten ance and Service Guide T rou bleshooting Selecting fr om the Security Menu Ta b l e 2 - 2 Security Menu Select T o Do This Setup P ass word En ter , change, or delete a Setup password. The Setup passw ord is called an administrator passw ord in Computer Security , a program accessed from the Wind ows Co ntrol P anel. P ower-on P ass word Enter , change, or delete a power-on pass word. DriveLock P assw ords Enable/disable Driv eLock; change a DriveLock User or Master passw ord. ✎ DriveLock Settings are accessible onl y when you ente r Computer Setu p by turning on (not restarting) the notebook. P ass word Options (P ass word options can be selected only when a power-on pass word has been set.) Enable/disable: ■ QuickLoc k ■ QuickLoc k on Standby ■ QuickBlank ✎ To enable QuickLock on Standby or QuickBlank, you must first enable QuickLock. De vice Security Enable/disab le: ■ P or ts or diskette drives* ■ Disk ette write* ■ CD-ROM or diskette star tup ✎ Settings for a DVD-ROM can be entered in the CD-ROM field. System IDs Enter identificat ion numbers for the notebook, an expansion base, and all batter y packs in the system. *Not applicable to SuperDisk LS-120 drives. 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–5 Selec tin g from t he Adv anced M enu Ta b l e 2 - 3 Adv anced Menu Select T o Do This Language Change the Computer Setup languag e. Boot Opti ons Enable/ disab le: ■ QuickBoot, which starts the noteb ook more quickly b y eliminating some star tup te sts. (If you suspect a memory failure and want to test memor y automatica lly during star tup, disab le Quic kBoot.) ■ MultiBoot, which sets a star tu p sequence that can include most bootable devices and media in the system. De vice Options ■ Enable/disable the embedded numeric ke ypad at star tup. ■ Enable/disable m ultiple standard pointing de vices at star tup . (T o set the notebook to suppor t only a single, usually nonstandard , pointing de vice at st ar tup, select Disable .) ■ Enable/disable USB legacy suppor t f or a USB ke yboard. (When USB legacy suppor t is enabled, the k eyboard works e ven when a Windows oper ating system is not loaded.) ■ Set an optional external moni tor or ov erhead projector connected to a video card in an e xpansion base as the pr imar y de vice. (When the notebook display is set as secondar y , the notebook must be shut down before undoc king from an expansion base.) 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
2–6 Mainten ance and Service Guide T rou bleshooting De vice Options (continued) ■ Change the p arallel por t mode from Enhanced P arallel P or t (EPP , the def ault setting) to standard , bidirectional, EPP , or Enhanced Capabili ties P or t (ECP). ■ Set video-out mode to NTSC (default), P AL, NTSC-J , or P AL-M.* ■ Enable/disable all settings in the SpeedStep window . (When Disable is selected, the notebook ru ns in Batter y Optimized mode.) ■ Specify how the notebook recognizes multiple identical expansion bases that are identically equipped. Select Disa ble to recognize the expansion bases as a single e xpansion base; select Ena ble to recognize the expansion bases individually , by ser ial numbe r . ■ Enable/disable the reporti ng of the processor serial number by the processor to the software . HDD Self T est Options Run a quick comprehensive self test on hard drives in the system t hat suppor t the test f eatures. *Video modes vary ev en within regions. Howe ver , NTSC is common in Nor th America; P AL, in Europe, Africa, and the Middle East; NTSC-J, in J apan; and P A L-M, in Brazil. Other South and Central American regions can use NTSC, P AL, or P AL-M. Ta b l e 2 - 3 Adv anced Menu (Continued) Select T o Do This 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–7 2.2 Using Di agn ostic s for Windo w s When you access Diagnostics for W indows, a scan of all system components is displayed on th e screen before the diagno stics windo w opens. Y ou can display more or less in formation from anywhere within Diagnostics for W indows b y sel ecting Level on the menu bar . Diagnostics for W indows is desi gned to test HP components. If non-HP components are te sted, the results might be inconclusi ve. Obtaining , Saving, or Printing Configura tion Information 1. Access Diagnostics for W indo ws by selecting Start > Settings > Control Panel > Diagnostics for W indo ws. 2. Select Categories, then select a category from the drop-down list. ❏ T o sa ve the information, select File > Sav e As. ❏ T o print the information, select File > Print. 3. T o close Diagnostics for W indows, select File > Exit. 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
2–8 Mainten ance and Service Guide T rou bleshooting Obtaining , Saving, or Printing Dia gnostic Te s t I n f o r m a t i o n 1. Access Diagnostics for W indo ws by selecting Start > Settings > Control Panel > Diagnostics for W indo ws. 2. Select the T est tab . 3. In the scroll box, select the cate gory or de vice you want to test. 4. Select a test type: ❏ Quick T est —Runs a quick, general test on each de vice in a selected category . ❏ Complete T est —Performs maximum testing o n each de vice in a selected category . ❏ Custom T est —Performs maximum tes ting on a sele cted device. ◆ T o run all test s for your se lected device, select the Check All button. ◆ T o run only the tests you select, select the Uncheck All button, then select the check box for each test you want to run. 5. Select a test mode: ❏ Interactive Mode —Pro vides maximum control ov er the testing process. Y ou determ ine whether the test was passed or failed . Y ou might be prompted to insert or remov e devices. ❏ Unattended Mode —Does not display prompts. If errors are found, they are displaye d when testing is complete. 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–9 6. Select the Begin T esting b utton. 7. Select a tab to view a test report: ❏ Status tab —Summarizes the tests run, passed, and failed during the current testing session. ❏ Log tab —Lists tests run on the system, the number of times each test has run, the number of errors found on each test, and the total run time of each test. ❏ Error tab —Lists all errors found in the notebook with the correspon ding error codes. 8. Select a tab to sav e the report: ❏ Log tab —Select the Log tab Sav e button. ❏ Error tab —Select the Error tab Sa ve button. 9. Select a tab to print the report: ❏ Log tab —Select File > Sa ve As, then print the f ile from your folder . 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
2–10 Maintenance and Ser vi ce Guide T rou bleshooting 2.3 T roub leshooting Flo wch ar ts T able 2- 4 T roubles hooting Flo wcharts Overview Flowc hart Description 2.1 Initial troubleshooting 2.2 No po wer , par t 1 2.3 No po wer , par t 2 2.4 No po wer , par t 3 2.5 No po wer , par t 4 2.6 No video , par t 1 2.7 No video , par t 2 2.8 Nonfunctioning expansion base 2.9 No operating syst em (OS) loading 2.10 No OS loading from hard dr ive , par t 1 2.11 No OS loading from hard dr ive , par t 2 2.12 No OS loading from hard dr ive , par t 3 2.13 No OS loading from diskette drive 2.14 No OS loading from CD- or D VD-ROM drive 2.15 No audio, part 1 2.16 No audio, part 2 2.17 Nonfunctioning device 2.18 Nonfunctioning keyboard 2.19 Nonfunctioning pointing de vice 2.20 No networ k or modem connection 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–11 Flo wch art 2. 1—Initia l T roubl eshooting Connecting to network or modem? Begin troubleshooting. Is there power? Is the OS loading? Is there vi deo? (no boot) Is there sound? Beeps, LEDs, or error messages? Keyboard/ pointing device working? Go to Flowchart 2.17, Nonfunctioning Device. Go to Flowchart 2.2, No Power . Go to Flowchart 2.6, No Video. All drives working? Y Y Y Y Y Y Y Y N N N N N End N N N Go to Flowchart 2.9, No OS Loading. Go to Flowchart 2.15, No Audio. Go to Flowchart 2.18, Nonfunctioning Keyboard or Flowchart 2.19, Nonfunctioning Pointing Device. Check LED board, speaker connections. Go to Flowchart 2.20, No Network or Modem. 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–12 Maintenance and Ser vi ce Guide T rou bleshooting F lo wcha rt 2. 2—N o P o w er , P art 1 1. Reseat the power cables in the expansion base and at the AC outlet . 2. Ensure the AC power source is active. 3. Ensure that the power strip is working. Done Remove from expansion base (if applic able). Power up on battery power? Power up on AC power? Power up in expansion base? Power up on battery power? Power up in expansion base? Done *Reset power . *Reset power . Power up on AC power? N Y Y N N Y N N Y Y YN 1. On some m odels, there is a separat e reset button. 2. On some models, the notebook can be reset using the Standby switch and either the lid switch or the main power switch. *NOTES: Go to Flowchart 2.4, No Power , Part 3. Go to Flowchart 2.3, No Power , Part 2. Go to Flowchart 2.8, Nonfunctioning Expansion Base. No power (power LED is off). 3336 21-001 .boo k Page 12 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–13 Flo wchar t 2.3—No P ow er , P ar t 2 Continued from Flowchart 2.2, No Power , Part 1. Visually check for debris in battery socket and clean if necessar y . Done N Y Power on? Check batter y by recharging it, moving it to another notebook, or replacing it. Power on? Done Y Replace power supply (if applicable). N Power on? Done Y N Go to Flowchart 2.4, No Power , Part 3. 3336 21-001 .boo k Page 13 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–14 Maintenance and Ser vi ce Guide T rou bleshooting F lo wcha rt 2. 4—N o P o w er , P art 3 Continued from Flowchart 2.3, No Power , Part 2. Reseat AC adapte r in notebook and at power source. Internal or external AC adapter? Done Done Done Done Power on? Power on? Power on? Plug directly into AC outlet. Power LED on? Power outlet active? T ry different outlet. Replace extern al AC adapter . Replace power cord. Y N Y Y Y Y N N N N Extern al Internal Go to Flowchart 2.5, No Power , Part 4. 3336 21-001 .boo k Page 14 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–15 Flo wch art 2.5—No P o w er , P art 4 Y N Continued from Flowchart 2.4, No Power , Part 3. Reseat loose components and boards and replace damaged items. Open notebook. Loose or damaged parts ? Y Close notebook and retest. Power on? Done N Replace the following it ems (if applicable). Check notebook opera tion after each replacement : 1. Internal DC-DC converter* 2. Internal AC adap ter 3. Processor board* 4. System board* * NOTE: Replace these items as a set to prevent shorting out among components. 3336 21-001 .boo k Page 15 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–16 Maintenance and Ser vi ce Guide T rou bleshooting Flowch art 2. 6—No Vi deo, P a rt 1 A N Stand-alone or expansion base? No video. Replace the fol lowing one at a tim e. T est after each replacement. 1. Cable between notebook and no tebook display (if applicable) 2. Inverter board (if applicable) 3. Display 4. System board Internal or external display*? Adjust brightness. Video OK? Done Expansion Base Internal Stand-alone External Adjust brightness. Video OK? Done Y Press lid switch to ensure operation. Video OK? Done Y N Video OK? Done Done N Check for bent pins on cable. Tr y another display . Internal and external video OK? Replace system board. YY N N * NOTE: T o change from internal to external display , use the hotkey combination. Y Go to Flowchart 2.7, No Video, Part 2. 3336 21-001 .boo k Page 16 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–17 Flowch art 2. 7—No Vi deo, P a rt 2 Y N Continued from Flowchart 2.6, No Video, Part 1. Done Adjust external monitor display . Video OK? Adjust display brightness. Video OK? Video OK? Done Done Check that notebook is properly seated in expansion base, for bent pins on cable, and for monitor connection. Go to “A” in Flowchart 2.6, No Video, Part 1. Check brightness of external monitor . T ry another external monitor . Internal and external video OK? Go to Flowchart 2.8, Nonfunctioning Expansion Base. Y Y Y N N N Remove notebook from expansion base, if connected. 3336 21-001 .boo k Page 17 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–18 Maintenance and Ser vi ce Guide T rou bleshooting Flo wchar t 2.8—Nonfunc tioning Expansion B ase (if applicable ) Y N Reseat power cord in expansion base and power outlet. N Replace the followi ng expansion base components one at a time. Check notebook operation after each replacement. 1. Power supply 2. I/O board 3. Backplane board 4. Switch box 5. Expansion base motor mechanism Check voltage setting on expansion base. Reset monitor cable connector at expansion base. Reinstall notebook into expansion base. Expansion base operating? Expansion base operating? Remove notebook, reseat all internal parts, and replace any damaged items in expansion base. Done Done Y Nonfunctioning expansion base. 3336 21-001 .boo k Page 18 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–19 Flo wc har t 2.9—No Operating Sy stem (OS) Loa ding No OS loading from hard drive, go to Flowchart 2.10, No OS Loading, Hard Drive, Part 1. Reseat power cord in expansion base and power outlet. No OS loading.* * NOTE: Before beginning troubleshooting, always check cable connections, cable e nds, and drives for bent or damaged pins. No OS loading from diskette drive, go to Flowchart 2.13, No OS Loading, Diskette Drive. No OS loading from CD- or DVD-ROM drive, go to Flowchart 2.14, No OS Loading, CD- or DVD-ROM Drive. No OS loading from network, go to Flowchart 2.20, No Network/Modem Connection. 3336 21-001 .boo k Page 19 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–20 Maintenance and Ser vi ce Guide T rou bleshooting Flo wch art 2. 1 0—N o OS Loadin g, H ard Driv e, P art 1 Go to Flowchart 2.17, Nonfunctioning Device. Y Done N OS not loading from hard drive. Nonsystem disk message? Go to Flowchart 2.11, No OS Loading from Hard Drive, Part 2. Reseat external hard drive. OS loading? Done Boot from CD? Go to Flowchart 2.13, No OS Loading from Diskette Drive . Boot from hard drive? Boot from diskette? Change boot priority through the Setup utility and reboot. Boot from hard drive? Y Y Y Y Y N N N N N Check the Setup utility for correct booting order . 3336 21-001 .boo k Page 20 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–21 Flo wch art 2. 1 1—No OS Loading , H ard Driv e, Part 2 Continued from Flowchart 2.10, No OS Loading from Hard Drive, Part 1. Reseat hard drive. Done CD or diskett e in drive? 1. Replace hard drive. 2. Replace sy stem board. Go to Flowchart 2.13, No OS Loading from Disket te Drive. Load OS using System R estore CD (if applicable). Format hard drive and bring to a boot able C:\ prompt. Create partition, then format hard drive to bootable C:\ prompt. Boot from diskette drive? Remove diskette and reboot. Y N Boot from hard drive? Y N Y N Hard drive accessible? Y N Hard drive accessible? Done Run FDISK. Y N Hard drive partitioned? Hard drive formatted? Y N Y N Notebook booted? Done Y N Go to Flowchart 2.12, No OS Loading from Hard Drive, Part 3. Go to Flowchart 2.12, No OS Loading from Hard Drive, Part 3. 3336 21-001 .boo k Page 21 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–2 2 Maintenance and Ser vi ce Guide T rou bleshooting Flo wch art 2. 1 2—No OS Loadin g, H ard Driv e, Part 3 Y System files on hard drive? Continued from Flowchart 2.11, No OS Loading from Hard Drive, Part 2. Clean virus. Done N Install OS and reboot. Virus on hard drive? OS loading from hard drive? Y N Y N Y N Diagnostics on diskette? Replace hard drive. Run diagnostics and follow recommendations. Run SCANDISK and check for bad sectors. Can bad sectors be fixed? Replace hard drive. Y N Y N Fix bad sectors. Boot from hard drive? Replace hard drive. Done 3336 21-001 .boo k Page 22 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–2 3 Flo wc har t 2. 1 3—No OS Loading, Diskette Driv e Done Y N Reseat diskett e drive . OS not loading from diskette drive. Done Y Y Y Y Y Y Y N N N N N N N OS loading? Nonsystem disk message? Bootable diskette in drive? Install bootable diskette and reboot notebook. Check diskette for system files. T ry different diskette. 1. Replace diskette drive. 2. Replace syst em board. Nonsystem disk error? OS loading? Boot from another device? Enable drive and cold boot notebook. Is diskette drive boot order correct? Change boot priority using the Setup utility . Go to Flowchart 2.17, Nonfunctioning Device. Diskette drive enabled in the Se tup utility? Go to Flowchart 2.17, Nonfunctioning Device. Clear CMOS. Refer to Section 1.2, “Clearing a Password,” for instructions. 3336 21-001 .boo k Page 23 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–2 4 Maintenance and Ser vi ce Guide T rou bleshooting Flo wc har t 2. 1 4—No OS Loadin g, CD- or D VD-ROM Dri v e Y Done N Bootable disc in drive? Disc in drive? No OS loading from CD- or DVD-ROM Drive . Install bootable disc and reboot notebook. Go to Flowchart 2.17, Nonfunctioning Device. Go to Flowchart 2.17, Nonfunctioning Device. Install bootable disc. Boots from CD or DVD? Boots from CD or DVD? T ry another bootable disc. Booting from another device? Booting order correct? Correct boot order using the Setup utility . Done Reseat drive. Y Y Y Y Y N N N N N Clear CMOS. Refer to Section 1.2, “Clear ing a Password,” for instructions. 3336 21-001 .boo k Page 24 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2 –2 5 Flo wch art 2. 1 5—No Au dio, P ar t 1 No audio. N Notebook in expansion base (if applicable)? Internal audio? Audio? Done Undock Audio? Done T urn up au dio internally or externally . Go to Flowchart 2.16, No Audio, Part 2. Go to Flowchart 2.16, No Audio, Part 2. Go to Flowchart 2.17, Nonfunctioning Device. Replace the followi ng expansion base components one at a time, as applicable. Check audio status aft er each change. 1. Reseat expansi on base audio cable. 2. Replace audio cable. 3. Replace speaker . 4. Replace expansi on base audio board. 5. Replace backplane board. 6. Replace I/O board. Y Y Y Y N N N 3336 21-001 .boo k Page 25 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–2 6 Maintenance and Ser vi ce Guide T rou bleshooting Flo wch art 2. 1 6—No Audio, P art 2 YN Continued from Flowchart 2.15, No Audio, Part 1. Reload audio drivers. Audio driver in OS configured? Audio? Y Y Y N N N Correct drivers for application? Connect to external speaker . Load drivers and set configuration in OS. Audio? Done Replace audio board and speaker connections in notebook (if applicable). 1. Replace internal speakers. 2. Replace audio board (if applicable). 3. Replace system board. 3336 21-001 .boo k Page 26 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–2 7 Flo wch art 2. 1 7—Nonfun ctionin g De vice Done Any physical device detected? Y N Unplug the nonfuncti oning device from the notebook and inspect cables and plugs for bent or broken pins or other damage. Reseat device. Clear CMOS. Done Fix or replace broken item. Nonfunctioning device. Reattach devi ce. Close notebook, plug in power , and reboot. Device boots properly? Go to Flowchart 2.9, No OS Loading. Device boots properly? Replace hard drive. Replac e diskette drive . Replace NIC. If integrated NIC, replace system board . Y N Y N 3336 21-001 .boo k Page 27 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–2 8 Maintenance and Service Guide T rou bleshooting Flo wch art 2. 1 8—Nonfunc tionin g K e yboard Y N OK? Keyboard not operating properly . External device works? Replace system board. Replace system board. Connect notebook to good external keyboard. Reseat int ernal keyboard connector (if applicable). Replace internal keyboard or cable. OK? Y N Y N Done Done 3336 21-001 .boo k Page 28 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
T rou bleshooting Maintenance and S ervi ce Guide 2–29 Flo wch art 2. 1 9—N onfunc tioning Pointing De vice Y N OK? Pointing device not operating properly . External device works? Replace system board . Replace system board. Connect notebook to good external pointing device. Reseat internal pointing device connector (if applicable). Replace intern al pointing device or cable. OK? Y N Y N Done Done 3336 21-001 .boo k Page 29 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
2–30 Maintenance and Ser vi ce Guide T rou bleshooting Flo wch art 2.20—N o Net wor k/Modem C onnec tion Y Disconnect all power from the notebook and open. No netw ork or modem connection. N Done Digital line? Network or modem jack active? Replace jack or have jack activated. Connect to nondigital line. NIC/modem configured in OS? Reload drivers and reconfigure. Reseat NIC/modem (if applicable). Replace NIC/modem (if applicable). Replace system board. OK? OK? Done N N N N Y Y Y Y 3336 21-001 .boo k Page 30 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide 3–1 3 I llustrated P ar ts Ca talog This chapter provides an illustrated parts breakdown and a reference for spare part numbers and option part numbers. 3 . 1 Seria l Nu mb er Lo cati on When ordering parts or requ es ting information, provide the notebook serial numb er and model number located on the bottom of the notebook. Seri al Num ber Location 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
3–2 Mainten ance and Service Guide Illustr ated P ar ts Catalog 3.2 Notebook Ma jor Com ponen ts Noteboo k Major Co mponents 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 3–3 Ta b l e 3 - 1 Spare P ar ts: Notebook Major Components Item Description Spare P ar t Number 1 Display assemblies 17.0-inch, WXGA 15.4-inch, WXGA 344894-001 344893-001 Miscellaneous Plastics Kit , include s: 344852-001 2a 2b 2c 2d 2e 2f K e yboard cov er R TC batter y SD Card slot/infrared module bezel F an cover Memor y expansion/Mini PCI compar tment cover Hard drive cov er Notebook feet (not illustrated) 3 Keybo ard s F rance F rench Canada Ger many Italy 344898-051 344898-121 344898-041 344898-061 Spain Switzerland United Kingdom United States and Canada 344898-071 344898-111 344898-031 344898-001 4 T op cover 344876-001 5 System boards (include the f ollowing video controllers and video memor y) NVIDIA GeForce FX Go5000 with 128-MB video memor y NVIDIA GeForce FX Go5000 with 64-MB video memor y NVIDIA GeForce 4 440 Go with 64-MB video memor y 344879-001 344878-001 344877-001 6 Heat sink (includes large and small fans and ther mal paste) 344872-001 Thermal Paste Kit 346178-001 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
3–4 Mainten ance and Service Guide Illustr ated P ar ts Catalog Noteboo k Major Co mponents 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 3–5 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P ar t Number 7 Processor s (includes ther mal paste) Intel P entium 4 DT wi th Hyper-Threading T echnolo g y FSB 3.2-GHz 344890-001 Intel P entium 4 DT wi th 800-MHz FSB 3.2-GHz 3.0-GHz 2.8-GHz 344889-001 344888-001 344887-001 Intel P entium 4 DT wi th 533-MHz FSB 3.06-GHz 2.8-GHz 2.66-GHz 344886-001 344885-001 344884-001 Thermal Paste Kit 346178-001 8 SD Card slot/ infrared module (includes cab le) 344880-001 9 Base enclosure (includes r ight and left speakers) 344883-001 10 Memory e xpansion boar ds, 333-MHz 1024-MB DDR 512-MB DDR 256-MB DDR 324702-001 324701-001 324700-001 11 Mini PCI communication s boards Mini PCI 802.11b wi reless LAN Mini PCI 802.11g wi reless LAN 344864-001 344863-001 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
3–6 Mainten ance and Service Guide Illustr ated P ar ts Catalog Noteboo k Major Co mponents 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 3–7 Ta b l e 3 - 1 Spare P arts: Notebook Major Components (Continued) Item Description Spare P ar t Number 12 Har d drives 80-GB (5400-r pm) 80-GB (4200-r pm) 60-GB (5400-r pm) 60-GB (4200-r pm) 40-GB (4200-r pm) 344858-001 344856-001 344857-001 344855-001 344854-001 13 Optical drives 8X Max D VD-ROM/CD-R W combinati on drive 8X Max D VD-ROM drive 24X Max D VD RW drive 344860-001 344859-001 344861-001 14 Battery pack, 12-cell, 14.8-volt 342661-001 Wireless LAN antennae (no t illustrated) 344875-001 Miscellaneous Cable Kit (not illustrated), incl udes: 344851-001 SD Card slot/infra red module cable Displa y cable LED board cable 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
3–8 Mainten ance and Service Guide Illustr ated P ar ts Catalog 3. 3 M iscellaneous Plas tics Kit Com ponents Miscellaneous P lastics K it Components Ta b l e 3 - 2 Miscellaneous Plastics Kit Components Spare P art Number 344852-001 Item Description 1 K eyboard co ver 2F a n c o v e r 3R T C b a t t e r y 4 Memor y expansion/Mini PCI compar tment cover 5F e e t ( 5 ) 6 Hard drive cov er 7 SD Card slot/infrared module bezel 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 3–9 3.4 Miscell aneous C ab le Kit Comp one nts Miscellaneous Cable K it Components Ta b l e 3 - 3 Miscellaneous Cab le Kit Components Spare P a rt Number 344851-001 Item Description 1 SD Card slot/infrared module cable 2D i s p l a y c a b l e 3 LED board cable 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
3–10 Maintenance and Ser vi ce Guide Illustr ated P ar ts Catalog 3.5 M a s s St ora g e D evic es Mass S tor age D ev ices T able 3-4 Mass Storage Devices Spare P ar t Number Inf ormation Item Description Spare P art Number 1 Hard drives (includ e hard driv e bezel and frame) 80-GB (5400-r pm) 80-GB (4200-r pm) 60-GB (5400-r pm) 60-GB (4200-r pm) 40-GB (4200-r pm) 344858-001 344856-001 344857-001 344855-001 344854-001 2 Optical drives 8X Max D VD-ROM/CD-R W combination drive 8X Max D VD-ROM drive 24X Max D VD R W driv e 344860-001 344859-001 344861-001 USB v .1.1 disk ette drive (not illustrated) 344897-001 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Illustr ated P ar ts Catalog Maintenance and S ervi ce Guide 3–11 3.6 Miscellan eous T able 3-5 Spare P arts: Miscellaneous (not illustrated) Description Spare P art Number Logo Kit 347990-001 120-watt A C adapter with power cord (f or use in Canada, F re nch Canada, and United States) 344895-001 135-watt A C adapter (f or use in F rance, Germany , Italy , Spain, Switzerland, and United Kingd om with the f ollowing power cords) 346958-001 Pow e r c o rd s (f or use in the following countri es with the 135 W AC adapter listed abov e) Fr a n c e Ger many Italy Spain Switzerland United Kingdom 344895-051 344895-041 344895-061 344895-071 344895-111 344895-031 Screw Kit (includes the f ollowing scre ws; refer to Appendix C, “Scre w Listing, ” f or more information on screw specifications and usage.) 344850-001 ■ PM2.5×8.0 screw ■ PM2.5×5.0 screw ■ PM2.5×4.0 screw ■ PM1.5×4.0 screw ■ Slotted M1.5×10.0 shoulder screw ■ HM5.0×9.0 standoffs ■ PM1.5×12.0 spring-loa ded shoulder screw 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide 4–1 4 Remo v a l and Rep l acem ent Preliminaries This chapter provides essential information for proper and safe remov al and replacement service. 4. 1 T oo ls Required Y ou will need the follo wing tool s to complete the remo va l and replacement procedures: ■ Magnetic scre wdri ver ■ Phillips P0 screwdr iv er ■ 5.0-mm socket for system board standof fs ■ Flat-bladed scre wdri ver ■ T ool kit (includes conn ector re mov al tool, loopback plugs, and case utility tool) 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
4–2 Mainten ance and Service Guide Remo val and Replacement P r eliminaries 4.2 S er vice Con sidera tions The follo wing sections include so me of the considerations that you should keep in mind during disassembly a nd assembly procedures. ✎ As you remo ve each subassembl y from the notebook, place the subassembly (and all accompanying scre ws) away from the w ork area to prev ent damage. Pl a s t i c Par t s Using excessi v e force during di sassembly a nd reassembly can damage plastic parts. Use care when handling the plastic parts. Apply pressure only at the po ints designated in the maintena nce instructions. Ca bles and C onnectors Cables must be handled with ext reme care to a void dama ge. Apply only the tension required to unseat or seat the cables during remov al and insertion. Ha ndle cables by the co nnector whene ver possible. In all cases, av oid bending, twisting, or tearing cables. Ensure that cables are routed in such a way that they cannot be caught or snagged by parts being removed or replaced. Handle flex cables with e xtreme care; these cables tear easily . Ä CAUT ION: When ser vicing th e notebook, ensure that cables are placed in their prop er locations dur ing the reassembly process. Improper cable placement can damage the notebook. 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Remo val and Replacement Preliminar ies Maintenance and S ervi ce Guide 4–3 4. 3 Pre v enti ng Da mage t o Re mo v able Dr i v es Remov able dri ves are frag ile components that must be handled with care. T o pre vent damage to the notebook, damage to a remov able d ri ve, or loss of in formation, observ e the follo wing precautions: ■ Before removing or inserting a hard dri ve, shut do wn the notebook. If you are unsure whether the notebo ok is of f or in Hibernation, turn th e notebook o n, then shut it do wn. ■ Before removin g a diskette dri ve or opti cal dri ve, ensure that a diskette or disc is not in th e drive. Ensure that the optical dri v e tray is cl osed. ■ Before handling a dri ve, ensure that you are dischar ged of static electricity . While handling a driv e, av oid touching the connector . ■ Handle dri ves on surf aces that hav e at least one inch of shock-proof foam. ■ A void dropp ing dri ves from an y height onto an y surface. ■ After removing a hard dri ve, CD-R OM drive, or a diskette dri ve, place it in a static-proof bag. ■ A void e xposing a hard dri ve to products that ha ve magnetic fi elds, such as monitors or speak ers. ■ A void e xposing a dri ve to temperature e xtremes or liquids. ■ If a dri ve must be mailed, place the dri ve in a b ubble pack mailer or other suit able form of protecti ve packaging and label the package, “Frag ile: Handle W ith Care. ” 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
4–4 Mainten ance and Service Guide Remo val and Replacement P r eliminaries 4.4 Pre ve ntin g Elec trosta tic D am ag e Many electronic components ar e sensiti ve to electrostatic dischar ge (ESD). Circuitry design and structure determine the degree of sensiti vity . Networks built into many inte grated circuits provide some protection, b ut in many cases, the discharg e contains enough po wer to alter de vice parameters or melt silicon junctions. A sudden dischar ge of static electricity from a f inger or other conductor can destroy static-sensitiv e de vices or microcircuitry . Often the spark is neither felt nor heard, b ut damage occurs. An electronic device exposed to electrostatic d ischarge might not be af fected at all and can work perfectly throughout a normal cycle. Or the de vice might func tion normally for a while, then degrade in the internal layers , reducing its life expectanc y . 4.5 P a c k agin g and T rans por ting Precautions Use the follo wing grounding precautions when packaging and transporting equipment: ■ T o av oid hand contact, transport products in static-safe containers, such as tubes, bags, or boxes. ■ Protect all electrostatic-sensiti ve parts and assemblie s with conductiv e or approved containers or packaging. ■ K eep electrostatic-sensiti ve parts in their contai ners until the parts arri ve at static-free w orkstations. ■ Place items on a grounded surface before removing items from their containers. ■ Alw ays be properly grounded when touching a sensiti ve component or assembly . 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Remo val and Replacement Preliminar ies Maintenance and S ervi ce Guide 4–5 ■ Store reusable electrostatic-sen siti ve parts from assemblies in protecti ve p ackaging or no nconducti ve foam. ■ Use transpor ters and con ve yors made of antistatic belts and roller bushings. Ensure that mechanized equipment used for moving materials is wired to grou nd and that proper m aterials are selected to av oid static char ging. When grounding is not possible, use an ionizer to dissipate electric charges. 4.6 W orkstation Precau tions Use the follo wing grounding pr ecautions at workstations: ■ Cov er the workstation with appro v ed s tatic-shielding material (refer to T able 4-2). ■ Use a wrist strap connected to a properl y grounded work surface and u se properly ground ed tools and equipmen t. ■ Use conducti ve fiel d servic e tools, such as cutters, scre wdri vers, and v acuums. ■ When using f ixtures that must directly contact dissipati ve surfaces, only use f ixtures made of static-safe materials. ■ K eep the work area free of nonconducti ve materials, such as ordinary plastic assemb ly aids and Styrofoam. ■ Handle electrostatic-sensiti ve components, parts, and assemblies by the case or PCM laminate. Handle these items only at static-free workstations. ■ A void contact with pins, leads, or circuitry . ■ T urn off po wer and input signals befo re inserting or removing connectors or test equipment. 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
4–6 Mainten ance and Service Guide Remo val and Replacement P r eliminaries 4.7 G rounding Eq uipm ent an d Methods Grounding equipment must in clude either a wrist strap or a foot strap at a grounded w orkstation. ■ When seated, wear a wrist strap conn ected to a grounded system. Wrist straps are flexible straps with a minimum of one megohm ±10% resistance in the ground cords. T o provide pro per ground, wear a strap snugly against the skin at all times. On grounded mats with banana-plug connecto rs, use alligator clips to connect a wrist strap. ■ When standing, use foot straps and a g rounded floor mat. Foot straps (h eel, toe, or boot straps) can be used at standing workstations and are compatible with mo st types of shoes or boots. On conducti ve floors or dissipati ve floor mats, use foot straps on both feet with a minimum of one me gohm resistance between the operator and ground. T o be effecti ve, the conducti ve strips must be worn in contact with the skin. Other grounding equipme nt recommended for use in preventing electrostatic damage includes: ■ Antistatic tape ■ Antistatic smocks, aprons, and slee ve protectors ■ Conductiv e bins and other assembly or sold ering aids ■ Nonconducti ve foam ■ Conductiv e tabletop workstatio ns with grou nd cords of one megohm resistance ■ Static-dissipati ve tables or floor mat s with hard ties to the ground ■ Field service kits ■ Static aw areness labels ■ Material-handling packages ■ Nonconducti ve plastic bags, tubes, or box es 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Remo val and Replacement Preliminar ies Maintenance and S ervi ce Guide 4–7 ■ Metal tote boxes ■ Electrostatic voltage le vels and protecti ve mat erials T able 4-1 sho ws how humidity af fects the electrostatic voltage le vels generated b y dif ferent acti vities. T able 4-2 lists the shielding protec tion provided b y antistatic bags and floor mats. Ta b l e 4 - 1 T ypical Electr ostatic V oltage Levels Relative Humidity Event 10% 40% 55% W al king across car pet 35,000 V 15,0 00 V 7,500 V W al king across vinyl floor 12,000 V 5,000 V 3,000 V Motions of bench worker 6,000 V 800 V 400 V Removing DIPS from plastic tube 2,000 V 700 V 400 V Removing DIPS from vin yl tra y 11,500 V 4,000 V 2,000 V Removing DIPS from Styrof oam 1 4,500 V 5,000 V 3,500 V Removing bub ble pack from PCB 26,500 V 20 ,000 V 7,000 V P acking PCBs in f oam-lined bo x 21,000 V 11,000 V 5,000 V ✎ A product can be degraded by as little as 700 V. T able 4-2 Static-Shielding Materials Material Use V oltage Pr otection Le vel Antistatic plastic Bags 1,500 V Carbon-loaded plastic Floor mats 7,500 V Metallized laminate Floor mats 5,000 V 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
Maintenance and S ervi ce Guide 5–1 5 Remo v a l and Rep l acem ent Procedure s This chapter provides remov al and replac ement procedures. There are 66 screws and standoffs, in se ven dif ferent sizes, that must be remov ed, replaced, and loosened when servicing the notebook. Make special note of each scre w size and location during remov al and replacement. Refer to Appendix C, “Scre w Li sting, ” for detailed information on scre w sizes, locations, and usage. 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
5–2 Mainten ance and Service Guide Remo val and Replacement Procedur es 5. 1 S e r i a l N u m b e r Report the notebook serial number to HP when requ esting information or ordering spa re part s. The serial number is locat ed on the bottom of the notebook. Seri al Num ber Location 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–3 5 .2 Disasse mbl y Se quence Chart Use the chart belo w to determin e the section number to be referenced when remo ving notebook compo nents. Disassembl y Sequence Chart Section Description # of Screws Removed 5.3 Prepar ing the notebook for disassemb ly Batter y p ack Hard drive 0 4 loosened 5.4 Notebook feet 0 5.5 Memor y expansion board 2 loosened 5.6 Mini PCI communications board 2 loosened 5.7 Optical dr ive 2 5.8 Ke yboard 8 loosened on fan cov er, 2 remov ed f or ke yboard 5.9 Ke y board cov er 6 5.10 Displa y assembly 4 5.11 T op cover 13 5.12 System board 5 screws , 4 standoffs 5.13 R TC batter y 0 5.14 Heat sink F ans 4 loosened 6 remov ed 5.15 Processor 0 5.16 SD Card slot/in frared module 3 5.17 Speakers 3 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
5–4 Mainten ance and Service Guide Remo val and Replacement Procedur es 5 .3 Preparing t h e Notebook fo r Disa ssemb ly Perform the follo wing steps be fore disassembling the notebook: 1. T urn of f the notebook. 2. Disconnect the A C adapter and all external de vices. 3. Remov e the battery pack b y follo wing these steps: a. T urn the notebook upside do wn with the rear panel faci ng you. b . Slide and hold the battery release latch 1 to the left. The rear edge of the battery pack releases from the notebook. c. Lift the rear edge of the battery p ack up and swing it forward 2 . d. Remov e the battery pack. Rem ovi n g t h e B at te r y Pack Re verse the abo ve procedure to install the battery pack. Spare P art Number Information Batter y pack, 12-cell, 14.8-volt 342661-001 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–5 4. Remov e the hard dri ve by follo wing these steps: a. T urn the notebook upside do wn with the rear panel faci ng you. b . Loosen the four PM2.5×4.0 scre ws 1 that secure the hard driv e cov er to the notebook. c. Lift the cov er straight up 2 to remove it from the notebook. ✎ The hard dri ve co ver is included in the Miscellaneous Plastics Kit, spare part numb er 344852-001. R emo v ing the Har d Dr i ve C ov er Spare P art Number Information Hard drives 80-GB (5400-r pm) 80-GB (4200-r pm) 60-GB (5400-r pm) 60-GB (4200-r pm) 40-GB (4200-r pm) 344858-001 344856-001 344857-001 344855-001 344854-001 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
5–6 Mainten ance and Service Guide Remo val and Replacement Procedur es d. Use the Mylar tab 1 to slide the hard driv e to the right 2 to disconnect it from the system board. e. Lift the hard dri ve straight up 3 . f. Remov e the hard driv e. Rem ovi n g t h e H a rd D rive Re verse the abo ve procedure to install the hard dri ve. 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–7 5 .4 Notebook F eet The notebook feet are adhesiv e -b acked rubber pads. The feet are included in the Miscellaneous Plastics Kit, spare part number 344852-001. The feet attach to the base enclosure as illustrated below . R eplacin g the Notebook F eet 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
5–8 Mainten ance and Service Guide Remo val and Replacement Procedur es 5 .5 Memor y Expansion Board 1. Prepare the noteboo k for disa ssembly (refer to Section 5.3). 2. T urn the notebook upside do wn with the rear panel faci ng you. 3. Loosen the two P M2.5×4.0 scre ws 1 that secure the memory expansi on/Mini PCI compartment co ver to the notebook. 4. Slide the cov er forward 2 , then lift the cov er up 3 . 5. Remov e the cov er . ✎ The memory ex pansion/Mini PCI compartment co ve r is included in the Miscellaneous Plastics Kit, spare part number 344852 -001. R emov ing the Memor y Expansion/Mini P CI Compartment Co v er Spare P art Number Information 1024-MB DDR, 333-MH z 512-MB DDR, 333-MHz 256-MB DDR, 333-MHz 324702-001 324701-001 324700-001 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–9 6. Spread the retaining tabs 1 that secure the memory expansi on board to the sock et. The board rises up. 7. Pull the board away from the socket at a 45-degree angle 2 . R emo ving a Memory Expansion Boar d Re verse the abo ve procedure to install a memory expansion board. 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
5–10 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5 .6 M ini PCI Comm unica tions Board 1. Prepare the noteboo k for disassembly (Section 5.3). 2. Remov e the memory e xpansion/Mini PCI commun ications compartment cov er (Section 5.5). 3. Disconnect the two antenna cables 1 and 2 from the Mini PCI communications board. 4. Spread the retaining tabs 3 that secure the Mini PCI communications board to the sock et. The board rises up. 5. Pull the board away from the socket at a 45-degree angle 4 . R emo vin g a Mini P CI Comm unicati ons Boar d Re verse the abo ve procedure to install a Mini PCI communications boa rd. Spare P art Number Information Mini PCI 802.11b wireless LAN Mini PCI 802.11g wireless LAN 344864-001 344863-001 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–11 5. 7 O p t i c a l D r ive 1. Prepare the noteboo k for disassembly (Section 5.3). 2. Remov e the memory expansio n/Mini PCI compartment cov e r (Section 5.5). 3. Position the notebook so the front panel faces you. 4. Remove the PM2.5×5.0 screw 1 that secures the optical driv e in the memory expansion/Mini PCI compartment. 5. Remove the PM2.5×8.0 screw 2 that secures the optical driv e in the battery bay . 6. Push on the back of the optical dri ve 3 through the openin g on the left side of the memory e xpansion/Mini PCI compartment. 7. Remov e the optical dri ve 4 . R emo ving the Opti cal Dr i ve Re verse the abo ve procedure to install an optical dri ve. Spare P art Number Information 8X Max D VD-ROM/CD-R W combination drive 8X Max D VD-ROM dri ve 24X Max D VD R W drive 344860-001 344859-001 344861-001 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–12 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5 .8 K e y board 1. Prepare the noteboo k for disassembly (Section 5.3). 2. Remov e the memory expansio n/Mini PCI compartment cov e r (Section 5.5). 3. T urn the notebook upside do wn with the rear panel faci ng you. 4. Loosen the eight PM2 .5×5.0 scre ws 1 that secure the fan cov er to the notebook. 5. Remov e the fan co ver 2 . ✎ The fan co ver is included in the Miscellaneous Plastics Kit, spare part numb er 344852-001 . Rem ovi n g t h e Fan Cove r Spare P art Number Information Fr a n c e F rench Canada Ger many Italy 344898-051 344898-121 344898-041 344898-061 Spain Switzerland United Kingdom United States and Canada 344898-071 344898-111 344898-031 344898-001 3336 21-001 .boo k Page 12 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–13 6. Position the notebook so the front panel faces you. 7. Remov e the PM2.5×8.0 scre w 1 that sec ures the ke yboard in the memory expansion/Mini PCI compartment. 8. Remov e the PM2.5×5.0 scre w 2 that sec ures the ke yboard in the fan compartment. Rem ovi n g t h e Keyb o a rd Sc rews 3336 21-001 .boo k Page 13 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–14 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 9. T urn the notebook right-side up with the front facing you. 10. Open the co mputer . 11. Use a flat-bladed too l to pry forward o n the four ke yboard retaining tabs. The tabs are located abo ve the f1 and f2 ke ys, abov e the f6 and f7 ke ys, abov e the f11 and f12 keys , a nd a bove the end and pg up keys. R eleasing the K e y boar d 3336 21-001 .boo k Page 14 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–15 12. Lift up on the back of the ke yboard and swing it f orward 1 until it rests on the palm rest. 13. Release the zero inser tion force (ZIF) connector 2 to which the keyboard cable is connected and disconnect the cable 3 . 14. Remov e the keyboard. Rem ovi n g t h e Keybo a rd Rev erse the above procedure to install the ke yboard. 3336 21-001 .boo k Page 15 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–16 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5 .9 K e y board Co v er ✎ The keyboard co ver is included in the Miscellaneous Plastics Kit, spare part number 344852 -001. 1. Prepare the noteboo k for disassembly (Section 5.3). 2. Remov e the ke yboard (Section 5.8). 3. T urn the notebook upside do wn with the rear panel faci ng you. 4. Remov e the four PM2.5×8.0 scre ws 1 that secure the ke yboard co ver to the notebook. 5. Remov e the two P M2.5×8.0 scre ws 2 that secure the ke yboard co ver to the notebook through the rear panel. Rem ovi n g t h e Keybo a rd Cove r S crews 3336 21-001 .boo k Page 16 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–17 6. T urn the notebook right-side up with the front facing you. 7. Open the notebook as far as it will open. 8. Lift up on the left and right sides 1 of th e key bo ar d c over to detach it from the not ebook. 9. Lift the ke yboard cov er up and swing it forward 2 to remov e it. Rem ovi n g t h e Ke yb o ard Cover Re verse the abo ve procedure to install the ke yboard cover . 3336 21-001 .boo k Page 17 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–18 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5. 1 0 D i s p l a y A s s e m b l y 1. Prepare the noteboo k for disassembly (Section 5.3). 2. Remov e the ke yboard (Section 5.8). 3. Remov e the ke yboard cover (Section 5 .9). 4. Disconnect the display cable 1 and remov e it from the retaining clip 2 in the top cov er . 5. Remov e the two antenna cables from the hole and routing channel in the top cov er 3 . 6. Remove the two PM2.5×8.0 scre ws 4 that secure the display assembly to the notebook. Remov i ng th e Di splay Assem bly Scr ew s Spare P art Number Information 17.0-inch, WXGA 15.4-inch, WXGA 344894-001 344893-001 3336 21-001 .boo k Page 18 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–19 7. Position the notebook so the rear panel faces you and the display is in an upr ight position . 8. Remove the two PM2.5×8.0 scre ws 1 that secure the display assembly to the notebook through the rear pa nel. 9. Lift the display assembly straight up 2 to remov e it. Remov i ng th e Di splay Assem bly Rev erse the above procedure to install the display assembly . 3336 21-001 .boo k Page 19 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–20 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5. 1 1 T o p C ove r 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) 2. T urn the notebook upside do wn with the front faci ng you. 3. Remov e the following: 1 T wo PM2.5×8.0 scre ws on the notebook front edge 2 Three PM2.5×5.0 scre ws in the battery bay 3 One PM2.5×8.0 scre w in the rear/right corner of th e battery bay 4 T wo PM2.5×5 .0 scre ws in the opt ical dri ve bay Rem ovi n g th e Top Cove r Screws Spare P art Number Information T o p cov er 344876-001 3336 21-001 .boo k Page 20 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–21 4. T urn the notebook right-side up with the front facing you. 5. Remove the three PM2.5×8.0 screws 1 that secure the top cov er to the notebook. 6. Remov e the two slotted M1.5×10.0 shoulder screws 2 that secure the top cov er to the notebook on each side of the docking connector . Rem ovi n g th e Top Cove r Screws ( c on t i nu e d ) 3336 21-001 .boo k Page 21 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–2 2 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 7. Disconnect the LED board cabl e 1 from the sy stem board and remov e the cable from the clip in the top co v er . ✎ The LED board ca ble is includ ed in the Miscellaneous Cable Kit, spare part number 344851-001. The LED board is included with the top cove r . 8. Disconnect the display lid switch module cable 2 from the display lid switch module. 9. Lift the front edge of the top co ver 3 until the T ouchPad cable 4 is accessible . 10. Disconnect the T ouchPad cable from the lo w insertion force (LIF) connector on the system board. 11. Remov e the top cov er 5 . Rem ovi n g th e Top Cove r Re verse the abo ve procedure to install the top co ver . 3336 21-001 .boo k Page 22 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–2 3 5. 1 2 S ys t e m B o a r d ✎ When replaci ng the syst em boar d, ensure that the follo wing components are remov ed from the defectiv e system boa rd and installed on the replacement system board: ■ Memory expansio n boards (Section 5.5) ■ Mini PCI communicatio ns board (Sectio n 5.6) ■ Real time clock battery (Section 5.13) ■ Heat sink (Section 5.14) ■ Processor (Section 5.15) 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) Spare P art Number Information NVIDIA GeForce FX Go5000 with 128-MB video memor y NVIDIA GeForce FX Go5000 with 64-MB video memor y NVIDIA GeForce 4 440 Go with 64-MB video memory 344879-001 344878-001 344877-001 3336 21-001 .boo k Page 23 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–2 4 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 2. Release the ZIF connector 1 to which the SD Card slot/infrared module cable is attached and disconnect the cable 2 . 3. Disconnect the right 3 and left 4 speaker cables from the system board. Disconnec ting the SD Card Slot/Inf r ar ed Module and Speak er Cable s fr om the Sy stem Board 3336 21-001 .boo k Page 24 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5 –2 5 4. Position the notebook so the rear panel faces you. 5. Remov e the six PM2.5×8.0 scre ws 1 that secure the system board to the notebo ok. 6. Use a 5.0-mm sock et to remov e the four HM5.0×9.0 standof fs 2 that secure the system board to the notebook on each side of the parallel and external monitor connectors. R emo ving the S y stem Boar d Sc r e ws and S tandoff s 3336 21-001 .boo k Page 25 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–2 6 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 7. Flex the right side of the base enclosure to the right 1 . 8. Lift the right side of the system board 2 until the connectors on the right side of the board cl ear the base e nclosure. 9. Flex the rear edge of the system board toward you 3 . 10. Lift the rear edge of the system board 4 until the connectors on the rear panel of the board clear the base enclosure. 11. Slide the system board to the right at an angle 5 and remov e it. Rem ovi n g t h e Syste m B o a rd Re verse the abo ve procedure to install the system board. 3336 21-001 .boo k Page 26 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–2 7 5. 1 3 RTC B a t t e r y ✎ The R TC battery is included in the Miscellaneous Plastics Kit, spare part number 344852 -001. 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) ❏ System board (Section 5.12 ) 2. T urn the system board upside do wn with the rear panel faci ng you. 3. Remov e the R TC battery from the socket. Rem ovi n g t h e RTC B at te r y Re verse the abo ve procedure to install the R TC battery . 3336 21-001 .boo k Page 27 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–2 8 Maintenance and Service Guide Remo val and Replacement Procedur es 5. 1 4 H e a t S i n k 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) ❏ System board (Section 5.12 ) 2. T urn the system board upside do wn with the rear panel faci ng you. Spare P art Number Information Heat sink (includes large and small fans and therma l paste) 344872-001 Ther mal Paste Kit 346178-001 3336 21-001 .boo k Page 28 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–29 3. Disconnect the fan cables 1 from the system board. 4. Loosen the four heat sink screws 2 . 5. Remov e the heat sink 3 . Rem ovi n g t h e H e a t Si n k 3336 21-001 .boo k Page 29 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–30 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es ✎ Carefully clean an y thermal paste residue from the heat sink 1 and processor surfaces 2 each time you remov e the heat sink. Apply ne w thermal paste to both surfaces. Thermal paste is included with the replacement heat sink and is also a vailable in the Thermal P aste Kit, spare part number 346178-001. R emo v ing the Th ermal P aste F r om the Heat Sink and Pr ocessor Re verse the abo ve procedure to install the heat sink. 3336 21-001 .boo k Page 30 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–31 If it is necessary to remov e one or both of the fa ns from the heat sink, follo w these steps: 1. Remov e the six PM1.5×4.0 scre ws 1 that secure the fans to the heat sink. 2. Remov e the fans 2 . Rem ovi n g t h e Fan s Re verse the abo ve procedure to install the fans. 3336 21-001 .boo k Page 31 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–3 2 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5. 1 5 P r o c e s s o r 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) ❏ System board (Section 5.12 ) ❏ Heat sink (Section 5.14) Spare P art Number Information Intel P entium DT 3.20-GHz with Hyper-Threading T e chnology FSB 344890-001 Intel P entium DT with 800-MHz FSB 3.20-GHz 3.00-GHz 2.80-GHz 344889-001 344888-001 344887-001 Intel P entium DT with 533-MHz FSB 3.06-GHz 2.80-GHz 2.66-GHz 344886-001 344885-001 344884-001 Ther mal Paste Kit 346178-001 3336 21-001 .boo k Page 32 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–33 2. Slide the processor release le ver to the right 1 until it disengages from the clip on the back of the processor socket. 3. Lift the le ver up and swing it to the back 2 until it is in an upright position. 4. Lift the processor straight up 3 to remov e it. ✎ Note that the gold triangle 4 on the processor should be aligned in the rear right corner wh en you install the processor . Rem ovi n g t h e P roc e ss or Re verse the abo ve procedure to install the processor . 3336 21-001 .boo k Page 33 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–34 Maintenance and Ser vi ce Guide Remo val and Replacement Procedur es 5 . 1 6 SD C ard Slot/Infrared Module 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) ❏ System board (Section 5.12 ) Spare P art Number Information SD Card slot/infrared module (in cludes cable) 344880-001 3336 21-001 .boo k Page 34 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–35 2. Disconnect the SD Card slot/infrared module cable 1 from the LIF connector on the module. ✎ The SD Card slot/infrared module cable is included with the SD Card slot/infrared module. It is also included in the Miscellaneous Cable Kit, spare part number 344851-001. 3. Remove the three PM2.5×8.0 screws 2 that secure the module to the notebook. 4. Remov e the module bezel 3 . ✎ The SD Card slot/infrared module bezel is included in the Miscellaneous Plastics Kit, spare part number 34 4852-001. 5. Remov e the module 4 . Re m ovi ng t h e S D C a rd S l o t / I n fra re d M o d u l e Re verse the abo ve procedure to in stall the SD Card slot/infrared module. 3336 21-001 .boo k Page 35 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
5–3 6 Maintenance and Service Guide Remo val and Replacement Procedur es 5. 1 7 S p e a ke r s ✎ The left and righ t speakers are included with the base enclosure, spare part number 344883 -001. 1. Prepare the noteboo k for disassembly (Section 5.3) and remov e the follo wing components: ❏ Optical dri ve (Section 5 .7) ❏ K eyboard (Secti on 5.8) ❏ K eyboard co ver (Section 5.9) ❏ Display assembly (Section 5.10) ❏ T op cover (Section 5.11) ❏ System board (Section 5.12 ) ❏ SD Card slot/infrared module (Section 5.16) 3336 21-001 .boo k Page 36 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Rem oval a nd Re p la ce m en t P ro ce du res Maintenance and S ervi ce Guide 5–3 7 2. Remov e the left speaker from the notebook 1 . 3. Remove the three PM2.5×5.0 screws 2 that secure the right speaker to the notebook. 4. Remov e the right speaker 3 . Rem ovi n g t h e Sp e a ker s Re verse the abo ve procedure to install the speakers. 3336 21-001 .boo k Page 37 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide 6–1 6 Specifications This chapter provides physical and performan ce specifications. T able 6-1 Notebook Dimensions Height Width Depth 56.38 cm 333.45 cm 477.62 cm 1.85 in 10.94 in 15.67 in We i g h t (varies by configuration) 4.22 kg 9.30 lbs Stand-alone power requirements Nominal operating vol t a g e A v erage operating power P eak operating power P ower in Standby mode P ower in Hibernation mode 14.4 VDC 15.8 W 38.0 W < 800 mW < 100 mW Te m p e r a t u r e Operating Nonoperating 10°C to 35°C -10°C to 60°C 50°F to 95°F 14°F to 140°F Relative humidity (nonconde nsing) Operating Nonoperating 10% to 90% 5% to 90%, 38.7°C (101.6°F) maximum wet b ulb temperature 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
6–2 Mainten ance and Service Guide Spe cifica tion s Altitude (unpressurized) Operating (14.7 to 10.1 psia) Nonoperating (14.7 to 4.4 psia) 0 to 3,048 m 0 to 9,144 m 0 to 10,000 ft 0 to 30,000 ft Shock Operating Nonoperating 10 G, 11 ms, half-sine 60 G, 11 ms, half-sine Vibration Operating Nonoperating 0.5 G zero-to-peak, 10 to 500 Hz, 0.25 oct/min s weep rate 1.0 G zero-to-peak, 10 to 500 Hz, 0.5 oct/min s weep rate ✎ Applicable product safe ty standards specify thermal limits for plastic surfaces. The notebook operate s well within this range of temperatures. T able 6-1 Notebook (Continued) 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–3 T able 6-2 15.4-inch, Wide SXGA , TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors up to 16.8 million Contrast ratio 200 :1 Brightness 180 nits typical Pixel resolu tion Pitch Fo r m a t Configuration 0.197 × 0.197 mm 1680 × 1050 RGB vertical stripe Backlight Edge lit Character display 80 × 25 Viewin g angle /-65° horizontal, /-50° vertical typical 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
6–4 Mainten ance and Service Guide Spe cifica tion s T able 6-3 15.4-inch, Wide XGA , TFT Displa y Dimensions Height Width Diagonal 20.7 cm 33.1 cm 39.1 cm 8.1 in 13.0 in 15.4 in Number of colors up to 16.8 million Contrast ratio 200 :1 Brightness 180 nits typical Pixel resolu tion Pitch Fo r m a t Configuration 0.259 × 0.259 mm 1280 × 800 RGB vertical stripe Backlight Edge lit Character display 80 × 25 Viewin g angle /-65° horizontal, /-50° vertical typical 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–5 T able 6-4 Hard Drives 80-GB 60-GB (5400- rpm) 60-GB (4200- rpm) 40-GB User capac ity per drive 1 80 GB 60 GB 40 GB 30 GB Dimensions Height Width We ig ht 9.5 mm 70 mm 99 g 9.5 mm 70 mm 102 g 9.5 mm 70 mm 99 g 9.5 mm 70 mm 99g Interface type ATA - 5 ATA - 5 ATA - 5 ATA - 5 T r ansfer rate Synchronous (maximum) Security 100 MB/ sec A T A securi ty 100 MB/ sec A T A security 100 MB/ sec ATA s e c u r i t y 100 MB/ sec A T A security Seek times (typical read, including setting) Single track A verage Maximum 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms 3 ms 13 ms 24 ms Logical blocks 2 156,301,488 117,210,240 78,140,160 58, 605,120 Disk rotational speed 4200 r pm 5400 r pm 4200 r pm 4200 r pm Operating temperature 5°C to 55°C (41°F to 131°F) 5°C to 55°C (41°F to 131°F) 5°C to 55°C (41°F to 131°F) 5°C to 55°C (41°F to 131°F) 1 1 GB = 1,073,74 1,824 bytes. 2 Actual drive specifications ma y diff er slightly . Cer tain restr ictions and exclusions apply . Consul t the HP Custom er Suppor t Center f or details. 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
6–6 Mainten ance and Service Guide Spe cifica tion s Ta b l e 6 - 5 External A C Adapter We i g h t .304 kg 0.67 lb Pow e r s u p p l y Rated input voltage Rated input current Rated frequency 100 to 240 V AC RMS 1.7 A RMS 47 to 63 Hz Ta b l e 6 - 6 12-cell, Li-Ion Battery P ack Dimensions Height Width Depth We ig ht 13.4 cm 9.2 cm 1.9 cm .43 kg 5.25 in 3.63 in .75 in .96 lb Energy V oltage Amp-hour capa city W att-hour capacity 14.8 V 4.4 Ah 64 Wh Te m p e r a t u r e Operating Nonoperating 0 to 60°C -20 to 60°C 32 to 140°F -4 to 104°F Recharge time System in Standby mode System on (depending on system pow er consumption) 2 to 3 hours 2 to 5 hours 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–7 T able 6-7 24X D VD/CD-R W Drive Applicable disk DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disk diameter 12 cm, 8 cm 4.72 in, 3.15 in Disk thickness 1.2 mm 0.047 in T rack pitch 0.74 µm Access time Random Full stroke < 150 ms < 225 ms A udio output le vel Line-out, 0. 7 Vrms Cache buffer 128 KB/s Data transfer rate CD-R (24X) CD-R W (10X) CD-ROM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rate ) 16.6 MB/s Startup time < 15 seconds Stop time < 6 seconds 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
6–8 Mainten ance and Service Guide Spe cifica tion s T able 6-8 24X CD-R W Drive Applicable disk DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disk diameter 12 cm, 8 cm 4.72 in, 3.15 in Disk thickness 1.2 mm 0.047 in T rack pitch 0.74 µm Access time Random Full stroke < 150 ms < 225 ms A udio output le vel Line-out, 0. 7 Vrms Cache buffer 128 KB/s Data transfer rate CD-R (24X) CD-R W (10X) CD-ROM (24X) DV D ( 8 X ) Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 1500 KB/s (150 KB/s at 1X CD rate) 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rate ) 16.6 MB/s Startup time < 15 seconds Stop time < 6 seconds 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–9 T able 6-9 8X D VD-ROM Drive Applicable disk DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disk diameter 12 cm, 8 cm 4.72 in, 3.15 in Disk thickness 1.2 mm 0.047 in T rack pitch 0.74 µm Access time Random D VD media Full stroke D VD media Random CD media Full stroke CD media < 150 ms < 225 ms < 110 ms < 200 ms A udio output le vel Line-out, 0. 7 Vrms Cache buffer 512 KB/s Data transfer rate Max 24X CD Max 8X D VD Multiword DMA mode 2 3600 KB/s (150 KB/s at 1X CD rate) 10,800 KB/s (1352 KB/s at 1X D VD rate ) 16.6 MB/s Startup time < 10 seconds Stop time < 3 seconds 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
6–10 Maintenance and Ser vi ce Guide Spe cifica tion s T able 6-10 24X CD-R OM Drive Applicable disk DV D - 5 , DV D - 9 , DV D - 1 0 CD-ROM (Mode 1 and 2) CD Digital Audio CD-XA ready (Mode 2, Form 1 and 2) CD-I ready (Mode 2, F or m 1 and 2) CD-R (read only) CD Plus Photo CD (single/multisession) CD-Bridge Center hole diameter 1.5 cm 0.59 in Disk diameter 12 cm, 8 cm 4.72 in, 3.15 in Disk thickness 1.2 mm 0.047 in T rack pitch 1.6 µm Access time Random Full stroke < 150 ms < 300 ms A udio output le vel Line-out, 0. 7 Vrms Cache buffer 128 KB/s Data transfer rate Sustained (16X) Va r i a b l e Multiword DMA mode 2 2400 KB/s 1500 to 3600 KB/s (10X to 24X) 16.6 MB/s Startup time < 8 seconds Stop time < 4 seconds 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–11 T able 6-11 System DMA Hard ware DMA System Function DMA0 Av ai lable f or audi o DMA1* Entertain ment audio (default; alter nate = DMA0, DMA3, none) DMA2* Disk ette drive DMA3 ECP parallel por t LPT1 (default; alter nate = DMA0, none) DMA4 DMA controlle r cascading (not av ailable) DMA5* A vailab le f or PC Card DMA6 Not assigned DMA7 Not assigned *PC Card controller can use DMA 1, 2, or 5. 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
6–12 Maintenance and Ser vi ce Guide Spe cifica tion s T able 6-12 System Interrupts Hard ware IRQ System Function IRQ0 System time r IRQ1 K eyboard controller IRQ2 Cascaded IRQ3 COM2 IRQ4 COM1 IRQ5 Audio (def ault)* IRQ6 Diskette dr ive IRQ7 Par allel por t IRQ8 Real time clock (R TC) IRQ9 Infrared IRQ10 Syst em use IRQ11 Syst em use IRQ12 Inter nal point stick or external mouse IRQ13 Coproc essor (not av ailable to any peripheral) IRQ14 IDE in terface (hard drive and optical drive) IRQ15 Syst em use ✎ PC Cards may assert IRQ 3, IRQ4, IRQ5, I RQ7, IRQ9, IR Q10, IRQ11, or IRQ15. Either the infrared or the serial po r t ma y asser t IRQ3 or IRQ4. *Default configuration; audio possib le configurations are IRQ5, IRQ7, IR Q9, IRQ10, or none. 3336 21-001 .boo k Page 12 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–13 T able 6-13 System I/O Addresses I/O Address (hex) System Functi on (shipping configur ation) 000 - 00F DMA controller no . 1 010 - 01F Unused 020 - 021 Interr upt controller no. 1 022 - 024 Opti chipset configuration registe rs 025 - 03F Unused 02E - 02F 87334 “Super I/O” configuration f or CPU 040 - 05F Counter/timer registers 044 - 05F Unused 060 K eyboard controller 061 P or t B 062 - 063 Unused 064 K eyboard controller 065 - 06F Unused 070 - 071 NMI enable/R TC 072 - 07F Unused 080 - 08F DMA page registers 090 - 091 Unused 092 P or t A 093 - 09F Unused 0A0 - 0A1 Inter rupt controller no. 2 3336 21-001 .boo k Page 13 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
6–14 Maintenance and Ser vi ce Guide Spe cifica tion s I/O Address (hex) System Functi on (shipping configur ation) 0A2 - 0BF Unused 0C0 - 0DF DMA controller no . 2 0E0 - 0EF Unused 0F0 - 0F1 Coprocessor busy clear/reset 0F2 - 0FF Unused 100 - 16F Unused 170 - 177 Secondar y fixed disk controller 178 - 1EF Unused 1F0 - 1F7 Primar y fix ed disk controller 1F8 - 200 Unused 201 Jo ystick (decoded in ESS1688) 202 - 21F Unused 220 - 22F Entertainmen t audio 230 - 26D Unused 26E - 26 Unused 278 - 27F Unused 280 - 2AB Unused 2A0 - 2A7 Unused 2A8 - 2E7 Unused 2E8 - 2EF Reser ved serial por t T able 6-13 System I/O Addres ses (Continued) 3336 21-001 .boo k Page 14 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Spe cifica tion s Maintenance and S ervi ce Guide 6–15 I/O Address (hex) System Functi on (shipping configur ation) 2F0 - 2F7 Unused 2F8 - 2FF Infrared por t 300 - 31F Unused 320 - 36F Unused 370 - 377 Secondar y diskette drive controller 378 - 37F P arallel por t (LPT1/default) 380 - 387 Unused 388 - 38B FM synthesizer—OPL3 38C - 3AF Unused 3B0 - 3BB V GA 3BC - 3BF Reser ved (par allel port/no EPP suppor t) 3C0 - 3DF VGA 3E0 - 3E1 P C Card controller in CPU 3E2 - 3E3 Unused 3E8 - 3EF I nternal modem 3F0 - 3F7 “A” diskette controller 3F8 - 3FF Serial por t (COM1/default) CF8 - CFB PCI configuration index register (PCIDIV O-1) CFC - CFF PCI configuration data registe r (PCIDIV O -1) T able 6-13 System I/O Addres ses (Continued) 3336 21-001 .boo k Page 15 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
6–16 Maintenance and Ser vi ce Guide Spe cifica tion s T able 6-14 System Memory Map Size Memory Address System Function 640 KB 00000000-0009FFFF Base memor y 128 KB 000A0000-000BFFFF Vide o memor y 48 KB 000C0000-000CBFFF Video BIOS 160 KB 000C8000-000E7FFF Unused 64 KB 000E8000-000FFFFF System BIOS 15 MB 00100000-00FFFFFF Extended memory 58 MB 01000000-047FFFFF Super extended memory 58 MB 04800000-07FFFFFF Un used 2 MB 080000 00-080FFFFF Video me mor y (direct access) 4 GB 08200000-FFFEFFFF Unused 64 KB FFFF0000-FFFFFFFF System BIOS 3336 21-001 .boo k Page 16 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide A–1 A Con necto r P in Ass ignme nts Ta b l e A - 1 RJ-45 Network Interface Pin Signal Pin Signal 1 T ransmit 5 Unused 2 T ransmit – 6 Re ceive – 3 Receive 7 Unused 4 Unused 8 Unused 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
A–2 Maintenance a nd Service Guide Connec tor P in Assignments Ta b l e A - 2 RJ-11 Modem Pin Signal Pin Signal 1 Unused 4 Unused 2T i p 5U n u s e d 3 Ring 6 Unused Ta b l e A - 3 Universal Se rial Bus Pin Signal Pin Signal 1 5 VDC 3 Data 2 Data – 4 Ground 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Connec tor P in Assignments Maintenance and S ervi ce Guide A–3 Ta b l e A - 4 S-Video Pin Signal Pin Signal 1 Ground (Y) 3 Y -Lumi nance (Intensity) 2 Ground (C) 4 C-Chrominance (Colo r) Ta b l e A - 5 External Monitor Pin Signal Pin Signal 1 Red analog 9 5 VDC 2 Green analog 10 Ground 3 Blue analog 11 Monitor detect 4 Not connected 12 DDC 2B data 5 Ground 13 Horizontal sync 6 Ground analog 14 V er tical sync 7 Ground ana log 15 DDC 2B clock 8 Ground analog 1 2 43 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
A–4 Maintenance a nd Service Guide Connec tor P in Assignments Ta b l e A - 6 A udio Line-Out Pin Signal Pin Signal 1 Audio out 2 Ground Ta b l e A - 7 Micr ophone Pin Signal Pin Signal 1 Audio in 2 Ground 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Connec tor P in Assignments Maintenance and S ervi ce Guide A–5 Ta b l e A - 8 Pa r a l l e l Pin Signal Pin Signal 1 Strobe 14 A uto linefeed 2 Data bit 0 15 Error 3 Data bit 1 16 I nitialize paper 4 Data bit 2 17 Select in 5 Data bit 3 18 Groun d 6 Data bit 4 19 Groun d 7 Data bit 5 20 Groun d 8 Data bit 6 21 Groun d 9 Data bit 7 22 Groun d 10 Ackno wledge 23 Ground 11 Busy 24 Ground 12 P a per end 25 Ground 13 Select 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
Maintenance and S ervi ce Guide B–1 B P o w er Cord Set Requiremen ts 3-Con duc tor P o w er C ord Set The wide range inpu t feature of the notebook permits it to operate from any line v oltage from 100 to 120 or 220 to 240 v olts A C. The po wer cord set shipped w ith the notebook meets the requirements for use in the co untry where th e equipment is purchased. Po wer cord sets for use in ot her countries must meet the requirements of the country wh ere the notebook is used. F or more information on po wer cord set requirements, contact an HP authorized reseller or service pro vider . Gen eral Requiremen ts The requirements listed belo w ar e applicable to all countries: ■ The length of the po wer cord se t must be at least 1.5 meters (5.00 feet) and a maximum of 2.0 meters (6.50 feet). ■ All po wer cord sets must be approv ed by an acceptable accredited agency responsible for ev a luation in the country where the po wer cord set will be used. ■ The power cord set must ha ve a minimum current ca pacity of 10 amps and a nominal voltage rating of 125 or 250 volts A C, as required b y each country’ s power syst em. ■ The appliance coupler must meet the mechanical confi guration of an EN 60 320/IEC 320 Standard Sheet C13 connector for mating with the ap pliance inlet on the back of the notebook. 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
B–2 Mainten ance and Service Guide P ow er Cord Set Requir ements Coun tr y-S pec ific Requ iremen ts 3-Conductor P ower Cor d Set Requirements Country Accredited Agency Applicable Note Number A ustralia EANSW 1 A ustria O VE 1 Belgium CEBC 1 Canada CSA 2 Denmark DEMK O 1 Finland FIMK O 1 Fr a n c e U T E 1 Ger many VDE 1 Italy IMQ 1 Japan METI 3 The Netherl ands KEMA 1 Norwa y NEMK O 1 Sweden SEMK O 1 Switzerland SEV 1 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
P ow er Cord Set R equirements Maintenance and S ervi ce Guide B–3 United Kingdom BSI 1 United States UL 2 Notes 1. The flexible cord m ust be <HAR> T ype HO5VV -F , 3-co nductor , 1.0 mm 2 conductor size. P ower cord set fittings (appliance coupler and wall plug) must bear the cert ification mark of the agency responsible for e valuation in the countr y where it will be used. 2. The flexible cord m ust be T yp e SPT -3 or equivalent, No . 18 A WG, 3-conductor . The wall plug must be a 2-pole grounding type with a NEMA 5-15P (15 A, 125 V) or NEMA 6- 15P (15 A, 250 V) configuration. 3. The appliance coupler , flexib le cord, and wall plug must bear a “T” mark and registration number in accordan ce with the Japanese Dentori Law . The flexib le cord must be T ype VCT or VCTF , 3-conducto r , 1.00 mm 2 conductor size. The w all plug must be a 2-pole grounding type with a Japanese Industrial Standard C8303 (7 A, 12 5 V) configuration. 3-Conductor P ower Cord Set Re quirements (Continued) Country Accredited Agency Applicable Note Number 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
Maintenance and S ervi ce Guide C–1 C Sc re w Li sting This appendix provides specif i cation and reference information for the scre ws used in the notebo ok. All scre ws listed in this appendix are av ailable in the Mis cellaneous Scre w Kit, spare part number 344850-001. 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
C–2 Maintenance an d Service Guide Scre w List ing Phillips M2 . 5×4. 0 Sc re w Locati ons Ta b l e C - 1 Phillips PM2.5×4.0 Screw Color Qty . Length Thread Head Width Black 6 4.0 mm 2.5 mm 5.0 mm Where used: 1 Four scre ws that secure th e hard drive cov er to the notebook (documented in Section 5.3) 2 T wo scre ws that secure the memo ry e xpansion/Mini PCI compar tment cover to the noteb ook (document ed in Section 5.5) mm 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–3 Phillips M2 .5 ×5 . 0 Sc r ew L ocations Ta b l e C - 2 Phillips PM2.5×5.0 Screw Color Qty . Length Thread Head Width Black 18 5.0 mm 2.5 mm 5.0 mm Where used: Eight screws that secure the f an cover to the notebook (documented in Section 5.8) mm 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
C–4 Maintenance an d Service Guide Scre w List ing Phillips M2 .5 ×5 . 0 Sc r ew L ocations Ta b l e C - 2 Phillips PM2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 18 5.0 mm 2.5 mm 5.0 mm Where used: 1 One screw that secures the optical dr iv e to the notebook in the memor y ex pansion/Mini PCI compar tmen t (documented in Section 5.7) 2 One screw that secures the ke yboard to the noteboo k in the heat sink compar tment (documented i n Section 5.8) mm 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–5 Phillips M2 .5 ×5 . 0 Sc r ew L ocations Ta b l e C - 2 Phillips PM2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 18 5.0 mm 2.5 mm 5.0 mm Where used: 1 Three screws that secure the top co ver to the notebook in the battery bay (documented in Section 5.11) 2 T wo scre ws that secure the top cover to the notebook in the optical drive bay (documented in Section 5.11) mm 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
C–6 Maintenance an d Service Guide Scre w List ing Phillips M2 .5 ×5 . 0 Sc r ew L ocations Ta b l e C - 2 Phillips PM2.5×5.0 Screw (Continued) Color Qty . Length Thread Head Width Black 18 5.0 mm 2.5 mm 5.0 mm Where used: Three screws that secure the right speaker to the notebook (documented in Section 5.17) mm 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–7 Phillips M2 . 5×8. 0 Sc re w Locati ons Ta b l e C - 3 Phillips PM2.5×8.0 Screw Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: 1 One screw that secures the optical dr iv e to the notebook in the batter y bay (documented in Section 5.7) 2 One screw that secures the ke yboa rd to the noteboo k in the memor y ex pansion/Mini PCI compar tmen t (documented in Section 5.8) 3 Three screws that secure the top cov e r to the notebo ok (two on the front edge of the notebook, one in the batter y bay (documented in Section 5.11) mm 3336 21-001 .boo k Page 7 Wednesday, Sept ember 17, 2003 12: 24 PM
C–8 Maintenance an d Service Guide Scre w List ing Phillips M2 . 5×8. 0 Sc re w Locati ons Ta b l e C - 3 Phillips PM2.5×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: 1 Six screws that secure the ke ybo ard cov er to the notebook (documented in Section 5.9) 2 T wo screws that secure the di spla y assembly to the notebook (documented in Section 5.10) mm 3336 21-001 .boo k Page 8 Wednesday, Sept ember 17, 2003 12: 24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–9 Phillips M2 . 5×8. 0 Scr ew L ocation Ta b l e C - 3 Phillips PM2.5×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: T wo screws that secure the display assemb ly to the notebook (documented in Section 5.10) mm 3336 21-001 .boo k Page 9 Wednesday, Sept ember 17, 2003 12: 24 PM
C–10 Maintenance an d Service Guide Scre w List ing Phillips M2 . 5×8. 0 Sc re w Locati ons Ta b l e C - 3 Phillips PM2.5×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: Three screws that secure the top cov er to the notebook (documented in Section 5.11) mm 3336 21-001 .boo k Page 10 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–11 Phillips M2 . 5×8. 0 Scr ew L ocation Ta b l e C - 3 Phillips PM2.5×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: Five scre ws that secure the system board to the notebook (documented in Section 5.12) mm 3336 21-001 .boo k Page 11 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
C–12 Maintenance an d Service Guide Scre w List ing Phillips M2 . 5×8. 0 Sc re w Locati ons Ta b l e C - 3 Phillips PM2.5×8.0 Screw (Continued) Color Qty . Length Thread Head Width Black 26 8.0 mm 2.5 mm 5.0 mm Where used: Three screws that secure the SD Card slot/infrared module to the notebook (documented in Section 5.16) mm 3336 21-001 .boo k Page 12 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–13 Slotted M1. 5×10.0 Sh oulder Sc re w Locati ons Ta b l e C - 4 Slotted M1.5×10.0 Shoulder Scre w Color Qty . Length Thread Head Width Silver 2 10.0 mm 1.5 mm 3.0 mm Where used: T wo screws that secure the top cov er to the noteboo k (documented in Section 5.11) mm 3336 21-001 .boo k Page 13 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
C–14 Maintenance an d Service Guide Scre w List ing Phillips M2 . 5×3 . 0 Sc r e w Locati on Ta b l e C - 5 HM5.0×8.5 Standoff Color Qty . Length Thread Head Width Silver 4 8.5 mm 2.5 mm 5.0 mm Where used: F our standoffs that secure the system board to the note book (documented in Section 5.12) mm 3336 21-001 .boo k Page 14 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Screw Li s t i ng Maintenance and S ervi ce Guide C–15 Phillips M2 .5 ×15 . 0 Sc r ew L ocation Ta b l e C - 6 PM1.5×12.0 Spring-Loaded Shoulder Scre w Color Qty . Length Thread Head Width Silver 4 12.0 mm 1.5 mm 6.5 mm Where used: F our screws that secure the heat sink to the system board (documented in Section 5.14) mm 3336 21-001 .boo k Page 15 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
C–16 Maintenance an d Service Guide Scre w List ing Phillips M1. 5×4. 0 Scr ew L ocations Ta b l e C - 7 Phillips PM1.5×4.0 Screw Color Qty . Length Thread Head Width Black 6 4.0 mm 1.5 mm 3.5 mm Where used: Six scre ws that secure the f ans to the heat sink (documented in Secti on 5.14) mm 3336 21-001 .boo k Page 16 Wednesd ay , Sep t emb e r 17 , 200 3 12 :24 PM
Maintenance and S ervi ce Guide Index–1 Ind e x 1394 connector 1–11 A AC adapter spare part numbers 3–11 specifications 6–6 applications key 1–13 audio line-out jack location 1–11 pin assignments A–4 audio troubleshooting 2–25 B base enclosure, spare part number 3–5 battery bay 1–17 battery light 1–9 battery pack removal 5–4 spare part number 3–7, 5–4 specifications 6–6 battery release latch 1–17 Bluethumb wireless LAN, spare part number 3–5 bottom components 1–16 C cables, service considerations 4–2 caps lock key 1–13 caps lock light 1–15 CD-ROM drive OS loading problems 2–24 specifications 6–10 CD-RW drive, specifications 6–8 components bottom 1–16 front 1–8 keyboard 1–12 left side 1–10 rear panel 1–10 right side 1–8, 1–10 top 1–14 Computer Setup Advanced Menu 2–5 File Menu 2–3 overview 2–1 Security Menu 2–4 3336 21-001 .boo k Page 1 Wednesday, Sept ember 17, 2003 12: 24 PM
Index–2 Maintenance and Ser vice Guide Index connector pin assignments audio line-out jack A–4 external monitor connector A–3 microphone jack A–4 modem jack A–2 monitor connector A–3 network jack A–1 RJ-11 telephone jack A–2 RJ-45 network jack A–1 S-Video connector A–3 Universal Serial Bus (USB) connector A–2 connectors, service considerations 4–2 cursor control keys 1–13 D design overview 1–18 diagnostics configuration information 2–7 test information 2–8 Diagnostics for Windows 2–1 , 2–7 digital Media slot 1–9 disassembly sequence chart 5–3 diskette drive OS loading problems 2–23 spare part number 3–10 display assembly removal 5–18 spare part numbers 3–3, 5–18 specifications 6–3, 6–4 display cable 3–9 display release latch 1–9 DMA specifications 6–11 drives, preventing dama ge 4–3 DVD/CD-RW drive OS loading problems 2–24 DVD-ROM drive OS loading problems 2–24 specifications 6–9 E electrostatic discharge 4–4, 4–7 expansion base , troubleshooting 2–18 external monitor connector location 1–11 pin assignments A–3 F f1 through f12 functio n keys 1–13 fan compartment 1–17 fan cover illustrated 3–8 removal 5–12 fan, removal 5–31 features 1–4 feet illustrated 3–8 locations 5–7 fn key 1–13 front components 1–8 G grounding equip ment and methods 4–6 3336 21-001 .boo k Page 2 Wednesday, Sept ember 17, 2003 12: 24 PM
Inde x Maintenance and S ervi ce Guide Index–3 H hard drive illustrated 3–10 OS loading problems 2–20 removal 5–5 spare part numbers 3–7, 3–10 , 5–5 specifications 6–5 hard drive bay 1–17 hard drive cover illustrated 3–8 removal 5–5 heat sink removal 5–28 spare part number 3–3, 5–28 I I/O address specifications 6–13 infrared port 1–9 interrupt specifications 6–12 K keyboard components 1–12 removal 5–12 spare part numbers 3–3, 5–12 troubleshooting 2–28 keyboard cove r illustrated 3–8 removal 5–16 keypad ke ys 1–13 L labels area 1–17 LED board cable illustrated 3–9 removal 5–22 left side components 1–10 Logo Kit, spare part number 3–11 M mass storage devices, spare part numbers 3–10 media button 1–15 memory expansion bo ard removal 5–8 spare part numbers 3–5 memory expansion/Mini PCI compartment cover illustrated 3–8 location 1–17 removal 5–8 memory map specifications 6–16 microphone jack location 1–11 pin assignments A–4 Microsoft logo key 1–13 Mini PCI communications board removal 5–10 spare part numbers 3–5 Miscellaneous Cable Kit components 3–7, 3–9 spare part number 3–7, 3–9 3336 21-001 .boo k Page 3 Wednesday, Sept ember 17, 2003 12: 24 PM
Index–4 Maintenance and Ser vice Guide Index Miscellaneous Plastics Kit components 3–3, 3–8 spare part number 3–3, 3–8 models 1–2 modem jack, pin assign ments A–2 troubleshooting 2–30 monitor connector location 1–11 pin assignments A–3 mute button 1–15 mute light 1–15 N network jack, pin a ssignments A–1 network, troublesho oting 2–30 nonfunctioning device, troubleshooting 2–18, 2–27 notebook feet illustrated 3–8 locations 5–7 notebook specifications 6–1 num lock light 1–15 O operating system loading, troubleshooting 2–19 optical drive illustrated 3–10 location 1–9 OS loading problems 2–24 removal 5–11 spare part numbers 3–7, 3–10 P packing precautions 4–4 parallel connector location 1–11 pin assignments A–5 password, clearing 1–6 PC Card eject button 1–9 PC Card slot 1–9 picture button 1–15 plastic parts 4–2 pointing device, troubleshooting 2–29 power button 1–14 power connecto r 1–11 power cord, spare part numbers 3–11 power light 1–9 power manageme nt features 1–7 power, troubleshooting 2–12 power/Standby light 1–9 , 1–14 processor removal 5–32 spare part numbers 3–5, 5–32 R real time clock (RTC) battery illustrated 3–8 removal 5–27 rear panel components 1–10 removal preliminaries 4–1 procedures 5–1 3336 21-001 .boo k Page 4 Wednesday, Sept ember 17, 2003 12: 24 PM
Inde x Maintenance and S ervi ce Guide Index–5 replacement preliminaries 4–1 procedures 5–1 right side compone nts 1–8, 1–10 RJ-11 telephone jack location 1–10 pin assignments A–2 RJ-45 network jack location 1–10 pin assignments A–1 S Screw Kit, spare part number 3–11 SD Card slot/infrared module removal 5–34 spare part number 3–5, 5–34 SD Card slot/infrared module bezel illustrated 3–8 removal 5–35 SD Card slot/infrared module cable disconnecting 5–24 illustrated 3–9 security cab le slot 1–10 serial numb er 3–1, 5–2 service considerations 4–2 speaker, removal 5–36 speakers location 1–9 specifications AC adapter 6–6 battery pack 6–6 CD-ROM drive 6–10 CD-RW drive 6–8 display 6–3, 6–4 DMA 6–11 DVD-ROM drive 6–9 hard drive 6–5 I/O addresses 6–13 interrupts 6–12 memory map 6–16 notebook 6–1 static shielding materials 4–7 S-Video connecto r location 1–10 pin assignments A–3 system board spare part numbers 3–3 system board removal 5–23 system memory map 6–16 T Thermal Paste Kit spare part number 3–3, 3–5 , 5–28 , 5– 32 tools required 4–1 top components 1–14 top cover removal 5–20 spare part number 3–3, 5–20 TouchPad 1–15 TouchPad buttons 1–15 TouchPad light 1–15 TouchPad on/off button 1–15 TouchPad scroll zones 1–15 transporting precautions 4–4 3336 21-001 .boo k Page 5 Wednesday, Sept ember 17, 2003 12: 24 PM
Index–6 Maintenance and Ser vice Guide Index troubleshooting audio 2–25 Computer Setup 2–2 Diagnostics for Windows 2–7 expansion base 2–18 flowcharts 2–10 keyboard 2–28 modem 2–30 network 2–30 nonfunctioning dev ice 2–18 , 2–27 operating system loading 2–19 overview 2–1 pointing device 2–29 power 2–12 video 2–16 U Universal Serial Bus (USB) connector location 1–10 pin assignments A–2 universal serial bus (USB) connector location 1–11 V vent 1–11 video troublesh ooting 2–16 volume buttons 1–14 W wireless LAN antennae, spare part number 3–7 wireless LAN, spare part numbers 3–5 wireless on/off button 1–15 wireless on/off light 1–15 workstation precautions 4–5 3336 21-001 .boo k Page 6 Wednesday, Sept ember 17, 2003 12: 24 PM