Philips TDA1519 Datasheet
DA T A SH EET Product speciï¬Âcation File under Integrated Circuits, IC01 May 1992 INTEGRA TED CIRCUITS TDA1519 2 x 6 W stereo car radio power amplifier
May 1992 2 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 GENERAL DESCRIPTION The TDA1519 is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power package. The device is primarily developed for car radio applications. Features ⢠Requires very few external components ⢠High output power ⢠Fixed gain ⢠Good ripple rejection ⢠Mute/stand-by switch ⢠Load dump protection ⢠AC and DC short-circuit-safe to ground and V P ⢠Thermally protected ⢠Reverse polarity safe ⢠Capability to handle high energy on outputs (V P = 0 V) ⢠No switch-on/switch-off plop ⢠Protected against electrostatic discharge ⢠Compatible with TDA1517 (except gain). QUICK REFERENCE DA T A P ACKAGE OUTLINE 9-lead SIL-bent-to-DIL; plastic (SOT110B); SOT110-1; 1996 July 19. P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Supply voltage range operating V P 6,0 14,4 18,0 V non-operating V P âÂÂâ 30 V load dump protected V P âÂÂâ 45 V Repetitive peak output current I ORM âÂÂâ 2,5 A T otal quiescent current I tot â 40 80 mA Stand-by current I sb â 0,1 100 õ A Switch-on current I sw âÂÂâ 40 õA Input impedance |Z I |5 0 âÂÂâ k ⦠Output power THD = 0,5%; 4 ⦠P o â 5 â W THD = 10%; 4 ⦠P o â 6 â W Channel separation ñ 40 âÂÂâÂÂdB Noise output voltage V no(rms) â 150 âÂÂõ V Supply voltage ripple rejection f = 100 Hz SVRR 40 âÂÂâÂÂdB f = 1 kHz to 10 kHz SVRR 48 âÂÂâÂÂdB Crystal temperature T c âÂÂâ 150 ðC
May 1992 3 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.1 Block diagram.
May 1992 4 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 PINNING FUNCTIONAL DESCRIPTION The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features: ⢠low stand-by current (< 100 õ A) ⢠low mute/stand-by switching current (low cost supply switch) ⢠mute condition. RA TINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) 1 INV1 non-inverting input 1 2 GND1 ground (signal) 3 SVRR supply voltage ripple rejection 4 OUT1 output 1 5 GND2 ground (substrate) 6 OUT2 output 2 7V P supply voltage 8 M/SS mute/stand-by switch 9 âÂÂINV2 non-inverting input 2 P ARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage operating V P â 18 V non-operating V P â 30 V load dump protected during 50 ms; t r âÂÂ¥ 2,5 ms V P â 45 V AC and DC short-circuit-safe voltage V PSC â 18 V Reverse polarity V PR â 6V Energy handling capability at outputs V P = 0 V â 200 mJ Non-repetitive peak output current I OSM â 4A Repetitive peak output current I ORM â 2,5 A T otal power dissipation see Fig.2 P tot â 15 W Crystal temperature T c â 150 ð C Storage temperature range T stg â 55 150 ð C
May 1992 5 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.2 Power derating curve. DC CHARACTERISTICS (note 1) V P = 14,4 V ; T amb = 25 ðC; unless otherwise speciï¬Âed P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Supply Supply voltage range note 2 V P 6,0 14,4 18,0 V Quiescent current I P â 40 80 mA DC output voltage note 3 V O â 6,95 â V Mute/stand-by switch Switch-on voltage level see Fig.3 V ON 8,5 âÂÂâ V Mute condition V mute 3,3 â 6,4 V Output signal in mute position V I = 1 V (max.); f = 20 Hz to 15 kHz V O âÂÂâ 20 mV Stand-by condition V sb 0 â 2V DC current in stand-by condition I sb âÂÂâ 100 õA Switch-on current I sw â 12 40 õ A
May 1992 6 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 AC CHARACTERISTICS (note 1) V P = 14,4 V ; R L = 4 â¦; f = 1 kHz; T amb = 25 ðC; unless otherwise speciï¬Âed Notes to the characteristics 1. All characteristics are measured using the circuit shown in Fig.4. 2. The circuit is DC adjusted at V P = 6 V to 18 V and AC operating at V P = 8,5 V to 18 V. 3. At 18 V < V P < 30 V the DC output voltage ⤠V P /2. 4. Output power is measured directly at the output pins of the IC. 5. Frequency response externally fixed. 6. Ripple rejection measured at the output with a source impedance of 0 ⦠(maximum ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. 7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 8. Noise output voltage independent of R S (V I = 0 V). P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Output power note 4; THD = 0,5% P o 45 âÂÂW THD = 10% P o 5,5 6,0 â W T otal harmonic distortion P o = 1 W THD â 0,1 â % Low frequency roll-off note 5; â 3 dB f L â 45 â Hz High frequency roll-off âÂÂ1 dB f H 20 âÂÂâÂÂkHz Closed loop voltage gain G v 39 40 41 dB Supply voltage ripple rejection note 6 ON f = 100 Hz SVRR 40 âÂÂâÂÂdB ON f = 10 Hz to 10 kHz SVRR 48 âÂÂâÂÂdB mute SVRR 48 âÂÂâÂÂdB stand-by SVRR 80 âÂÂâÂÂdB Input impedance |Z i | 5 06 07 5k ⦠Noise output voltage note 7; ON R S = 0 ⦠V no(rms) â 150 âÂÂõ V ON R S = 10 k ⦠V no(rms) â 250 500 õ V mute note 8 V no(rms) â 120 âÂÂõ V Channel separation R S = 10 k â¦ñ 40 âÂÂâÂÂdB Channel balance | âÂÂG v | â 0,1 1 dB
May 1992 7 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.3 Stand-by, mute and ON conditions.
May 1992 8 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 APPLICA TION INFORMA TION Fig.4 Application circuit diagram.
May 1992 9 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 P ACKAGE OUTLINE UNIT A A max. 2 A 3 b 1 D 1 b 2 bc D (1) E (1) Z max. (1) eL P P 1 q 1 q 2 q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 18.5 17.8 3.7 8.7 8.0 A 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 SOT110-1 92-11-17 95-02-25 0 5 10 mm scale 0.25 w D E A A c A 2 3 A 4 q 1 q 2 L Q w M b b 1 b 2 D 1 P q 1 Z e 19 P seating plane pin 1 index SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
May 1992 10 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our âÂÂIC Package Databookâ (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 ðC; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max ). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 ðC it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 ðC, contact may be up to 5 seconds. DEFINITIONS LIFE SUPPORT APPLICA TIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective speciï¬Âcation This data sheet contains target or goal speciï¬Âcations for product development. Preliminary speciï¬Âcation This data sheet contains preliminary data; supplementary data may be published later . Product speciï¬Âcation This data sheet contains ï¬Ânal product speciï¬Âcations. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciï¬Âcation is not implied. Exposure to limiting values for extended periods may affect device reliability . Application information Where application information is given, it is advisory and does not form part of the speciï¬Âcation.
May 1992 2 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 GENERAL DESCRIPTION The TDA1519 is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power package. The device is primarily developed for car radio applications. Features ⢠Requires very few external components ⢠High output power ⢠Fixed gain ⢠Good ripple rejection ⢠Mute/stand-by switch ⢠Load dump protection ⢠AC and DC short-circuit-safe to ground and V P ⢠Thermally protected ⢠Reverse polarity safe ⢠Capability to handle high energy on outputs (V P = 0 V) ⢠No switch-on/switch-off plop ⢠Protected against electrostatic discharge ⢠Compatible with TDA1517 (except gain). QUICK REFERENCE DA T A P ACKAGE OUTLINE 9-lead SIL-bent-to-DIL; plastic (SOT110B); SOT110-1; 1996 July 19. P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Supply voltage range operating V P 6,0 14,4 18,0 V non-operating V P âÂÂâ 30 V load dump protected V P âÂÂâ 45 V Repetitive peak output current I ORM âÂÂâ 2,5 A T otal quiescent current I tot â 40 80 mA Stand-by current I sb â 0,1 100 õ A Switch-on current I sw âÂÂâ 40 õA Input impedance |Z I |5 0 âÂÂâ k ⦠Output power THD = 0,5%; 4 ⦠P o â 5 â W THD = 10%; 4 ⦠P o â 6 â W Channel separation ñ 40 âÂÂâÂÂdB Noise output voltage V no(rms) â 150 âÂÂõ V Supply voltage ripple rejection f = 100 Hz SVRR 40 âÂÂâÂÂdB f = 1 kHz to 10 kHz SVRR 48 âÂÂâÂÂdB Crystal temperature T c âÂÂâ 150 ðC
May 1992 3 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.1 Block diagram.
May 1992 4 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 PINNING FUNCTIONAL DESCRIPTION The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features: ⢠low stand-by current (< 100 õ A) ⢠low mute/stand-by switching current (low cost supply switch) ⢠mute condition. RA TINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) 1 INV1 non-inverting input 1 2 GND1 ground (signal) 3 SVRR supply voltage ripple rejection 4 OUT1 output 1 5 GND2 ground (substrate) 6 OUT2 output 2 7V P supply voltage 8 M/SS mute/stand-by switch 9 âÂÂINV2 non-inverting input 2 P ARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT Supply voltage operating V P â 18 V non-operating V P â 30 V load dump protected during 50 ms; t r âÂÂ¥ 2,5 ms V P â 45 V AC and DC short-circuit-safe voltage V PSC â 18 V Reverse polarity V PR â 6V Energy handling capability at outputs V P = 0 V â 200 mJ Non-repetitive peak output current I OSM â 4A Repetitive peak output current I ORM â 2,5 A T otal power dissipation see Fig.2 P tot â 15 W Crystal temperature T c â 150 ð C Storage temperature range T stg â 55 150 ð C
May 1992 5 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.2 Power derating curve. DC CHARACTERISTICS (note 1) V P = 14,4 V ; T amb = 25 ðC; unless otherwise speciï¬Âed P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Supply Supply voltage range note 2 V P 6,0 14,4 18,0 V Quiescent current I P â 40 80 mA DC output voltage note 3 V O â 6,95 â V Mute/stand-by switch Switch-on voltage level see Fig.3 V ON 8,5 âÂÂâ V Mute condition V mute 3,3 â 6,4 V Output signal in mute position V I = 1 V (max.); f = 20 Hz to 15 kHz V O âÂÂâ 20 mV Stand-by condition V sb 0 â 2V DC current in stand-by condition I sb âÂÂâ 100 õA Switch-on current I sw â 12 40 õ A
May 1992 6 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 AC CHARACTERISTICS (note 1) V P = 14,4 V ; R L = 4 â¦; f = 1 kHz; T amb = 25 ðC; unless otherwise speciï¬Âed Notes to the characteristics 1. All characteristics are measured using the circuit shown in Fig.4. 2. The circuit is DC adjusted at V P = 6 V to 18 V and AC operating at V P = 8,5 V to 18 V. 3. At 18 V < V P < 30 V the DC output voltage ⤠V P /2. 4. Output power is measured directly at the output pins of the IC. 5. Frequency response externally fixed. 6. Ripple rejection measured at the output with a source impedance of 0 ⦠(maximum ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. 7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 8. Noise output voltage independent of R S (V I = 0 V). P ARAMETER CONDITIONS SYMBOL MIN. TYP . MAX. UNIT Output power note 4; THD = 0,5% P o 45 âÂÂW THD = 10% P o 5,5 6,0 â W T otal harmonic distortion P o = 1 W THD â 0,1 â % Low frequency roll-off note 5; â 3 dB f L â 45 â Hz High frequency roll-off âÂÂ1 dB f H 20 âÂÂâÂÂkHz Closed loop voltage gain G v 39 40 41 dB Supply voltage ripple rejection note 6 ON f = 100 Hz SVRR 40 âÂÂâÂÂdB ON f = 10 Hz to 10 kHz SVRR 48 âÂÂâÂÂdB mute SVRR 48 âÂÂâÂÂdB stand-by SVRR 80 âÂÂâÂÂdB Input impedance |Z i | 5 06 07 5k ⦠Noise output voltage note 7; ON R S = 0 ⦠V no(rms) â 150 âÂÂõ V ON R S = 10 k ⦠V no(rms) â 250 500 õ V mute note 8 V no(rms) â 120 âÂÂõ V Channel separation R S = 10 k â¦ñ 40 âÂÂâÂÂdB Channel balance | âÂÂG v | â 0,1 1 dB
May 1992 7 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 Fig.3 Stand-by, mute and ON conditions.
May 1992 8 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 APPLICA TION INFORMA TION Fig.4 Application circuit diagram.
May 1992 9 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 P ACKAGE OUTLINE UNIT A A max. 2 A 3 b 1 D 1 b 2 bc D (1) E (1) Z max. (1) eL P P 1 q 1 q 2 q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 18.5 17.8 3.7 8.7 8.0 A 4 15.8 15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48 0.38 21.8 21.4 21.4 20.7 6.48 6.20 3.4 3.2 2.54 1.0 5.9 5.7 4.4 4.2 3.9 3.4 15.1 14.9 Q 1.75 1.55 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2.75 2.50 SOT110-1 92-11-17 95-02-25 0 5 10 mm scale 0.25 w D E A A c A 2 3 A 4 q 1 q 2 L Q w M b b 1 b 2 D 1 P q 1 Z e 19 P seating plane pin 1 index SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1
May 1992 10 Philips Semiconductors Product speciï¬Âcation 2 x 6 W stereo car radio power ampliï¬Âer TDA1519 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our âÂÂIC Package Databookâ (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 ðC; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max ). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 ðC it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 ðC, contact may be up to 5 seconds. DEFINITIONS LIFE SUPPORT APPLICA TIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective speciï¬Âcation This data sheet contains target or goal speciï¬Âcations for product development. Preliminary speciï¬Âcation This data sheet contains preliminary data; supplementary data may be published later . Product speciï¬Âcation This data sheet contains ï¬Ânal product speciï¬Âcations. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciï¬Âcation is not implied. Exposure to limiting values for extended periods may affect device reliability . Application information Where application information is given, it is advisory and does not form part of the speciï¬Âcation.