Philips TDA8928J Datasheet

DA T A SH EET Preliminar y specification Supersedes data of 2004 F eb 04 2004 Ma y 05 INTEGRA TED CIRCUITS TDA8928J Power stage 2 x 10 or 1 x 20 W class-D audio amplifier
2004 May 05 2 Philips Semiconductors Preliminary specification P o wer stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 Power stage 8.2 Protection 8.2.1 Maximum temperature 8.2.2 Maximum current 9 LIMITING VALUES 10 THERMAL CHARACTERISTICS 11 QUALITY SPECIFICATION 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 SWITCHING CHARACTERISTICS 15 TEST AND APPLICATION INFORMATION 15.1 SE application 15.2 Package ground connection 15.3 Output power 15.4 Reference design 15.4.1 Printed-circuit board 15.4.2 Bill of materials 15.5 Curves measured in reference design 16 PACKAGE OUTLINE 17 SOLDERING 17.1 Introduction to soldering through-hole mount packages 17.2 Soldering by dipping or by solder wave 17.3 Manual soldering 17.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods 18 DATA SHEET STATUS 19 DEFINITIONS 20 DISCLAIMERS
2004 May 05 3 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 1 FEA TURES • High efficiency (> 90 %) • Supply voltage from ± 7.5 V to ± 30 V • Very low quiescent current • High output power • Diagnostic output • Usable as a stereo Single-Ended (SE) amplifier • Electrostatic discharge protection (pin to pin) • No heatsink required. 2 APPLICA TIONS • Television sets • Home-sound sets • Multimedia systems • All mains fed audio systems. 3 GENERAL DESCRIPTION The TDA8928J is a switching power stage for a high efficiency class-D audio power amplifier system. With this power stage a compact 2 × 10 W self oscillating digital amplifier system can be built, operating with high efficiency and very low dissipation. No heatsink is required. The system operates over a wide supply voltage range from ±7.5 V up to ±30 V and consumes a very low quiescent current. 4 QUICK REFERENCE D A T A 5 ORDERING INFORMA TION SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT General V P supply voltage ±7.5 ±12.5 ±30 V I q(tot) total quiescent current no load connected; V P = ±12.5 V − 25 45 mA η efficiency P o = 10 W; R L =8 Ω ; V P = ±12.5 V − 90 − % Stereo single-ended configuration P o output power R L =8 Ω ; THD = 10 %; V P = ±12.5 V 9 10 − W R L =1 6 Ω ; THD = 10 %; V P = ±12.5 V − 5 − W TYPE NUMBER P A CKA GE NAME DESCRIPTION VERSION TD A8928J DBS17P plastic DIL-bent-SIL power pac kage; 17 leads (lead length 7.7 mm) SO T243-3 TD A8928ST RDBS17P plastic rectangular DIL-bent-SIL power pac kage; 17 leads (row spacing 2.54 mm) SO T577-2
2004 May 05 4 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 6 BLOCK DIA GRAM MGX377 handbook, full pagewidth CONTROL AND HANDSHAKE DRIVER HIGH TDA8928J TEMPERATURE SENSOR AND CURRENT PROTECTION DRIVER LOW temp current 4 7 V SS1 V SS1 V SS2 V DD2 6 1 2 9 81 0 V DD2 V DD1 13 5 CONTROL AND HANDSHAKE DRIVER HIGH DRIVER LOW 14 11 12 17 16 3 15 EN1 DIAG REL1 SW1 SW2 REL2 POWERUP EN2 BOOT1 OUT1 STAB OUT2 BOOT2 Fig.1 Block diagram.
2004 May 05 5 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 7 PINNING SYMBOL PIN DESCRIPTION SW1 1 digital switch input; channel 1 REL1 2 digital control output; channel 1 DIA G 3 digital open-drain output for ov er temperature and ov ercurrent repor t EN1 4 digital enable input; channel 1 V DD1 5 positive pow er supply; channel 1 BOO T1 6 bootstrap capacitor ; channel 1 OUT1 7 PWM output; channel 1 V SS1 8 negative pow er supply; channel 1 ST AB 9 decoupling inter nal stabilizer f or logic supply V SS2 10 negative po wer supply; channel 2 OUT2 11 PWM output; channel 2 BOO T2 12 bootstrap capacitor; channel 2 V DD2 13 positive po wer supply; channel 2 EN2 14 digital enable input; channel 2 PO WERUP 15 enable input f or s witching on internal reference sources REL2 16 digital control output; channel 2 SW2 17 digital s witch input; channel 2 handbook, halfpage TDA8928J MGX378 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 V SS1 V SS2 V DD2 V DD1 EN1 DIAG REL1 SW1 SW2 REL2 POWERUP EN2 BOOT1 OUT1 STAB OUT2 BOOT2 Fig.2 Pin configuration.
2004 May 05 6 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 8 FUNCTIONAL DESCRIPTION The TDA8928J is a two-channel audio power amplifier system using class-D technology. The power stage TDA8928J is used for driving the loudspeaker load. It performs a level shift from the low-power digital PWM signal, at logic levels, to a high-power PWM signal that switches between the main supply lines. A 2nd-order low-pass filter converts the PWM signal into an analog audio signal across the loudspeaker. 8.1 P ower stage The power stage contains high-power DMOS switches, drivers, timing and handshaking between the power switches and some control logic (see Fig.1). The following functions are available: • Switch (pins SW1 and SW2): digital inputs; switching from V SS to V SS 12 V and driving the power DMOS switches • Release (pins REL1 and REL2): digital outputs; switching from V SS to V SS 12 V; follow pin SW1 and SW2 with a small delay. Note: for self oscillating applications this pin is not used • Power-up (pin POWERUP): must be connected to a continuous supply voltage of at least V SS 5 V with respect to V SS • Enable (pins EN1 and EN2): digital inputs; at a level of V SS the power DMOS switches are open and the PWM outputs are floating; at a level of V SS 12 V the power stage is operational • Diagnostics (pin DIAG): digital open-drain output; pulled down to V SS if the maximum temperature or maximum current is exceeded. 8.2 Pr otection Temperature and short-circuit protection sensors are included in the TDA8928J. The diagnostic output is pulled down to V SS in the event that the maximum current or maximum temperature is exceeded. The system shuts itself down when pin DIAG is connected to pins EN1 and EN2. 8.2.1 M AXIMUM TEMPERA TURE Pin DIAG becomes LOW if the junction temperature (T j ) exceeds 150 °C. Pin DIAG becomes HIGH again if T j is dropped to approximately 130 °C, so there is a hysteresis of approximately 20 °C. 8.2.2 M AXIMUM CURRENT When the loudspeaker terminals are short-circuited this will be detected by the current protection. Pin DIAG becomes LOW if the output current exceeds the maximum output current of 2 A. Pin DIAG becomes HIGH again if the output current drops below 2 A. The output current is limited at the maximum current detection level when pin DIAG is connected to pins EN1 and EN2.
2004 May 05 7 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 9 LIMITING V ALUES In accordance with the Absolute Maximum Rate System (IEC 60134). Notes 1. Human Body Model (HBM); R s = 1 500 Ω; C = 100 pF. 2. Machine Model (MM); R s =1 0 Ω ; C = 200 pF; L = 0.75 µ H. 10 THERMAL CHARA CTERISTICS 11 QU ALITY SPECIFICA TION In accordance with “SNW-FQ611” if this device is used as an audio amplifier. SYMBOL P ARAMETER CONDITIONS MIN. MAX. UNIT V P supply voltage −± 30 V V P(sc) supply voltage f or shor t-circuits across the load −± 30 V I ORM repetitive peak current in output pins − 2A T stg storage temperature −55 150 °C T amb ambient temperature −40 85 °C T vj vir tual junction temperature − 150 °C V esd(HBM) electrostatic discharge voltage (HBM) note 1 all pins with respect to V DD (class 1a) −500 500 V all pins with respect to V SS (class 1a) −1 500 1 500 V all pins with respect to each other (class 1a) − 1 500 1 500 V V esd(MM) electrostatic discharge voltage (MM) note 2 all pins with respect to V DD (class B) −250 250 V all pins with respect to V SS (class B) −250 250 V all pins with respect to each other (class B) − 250 250 V SYMBOL P ARAMETER CONDITIONS V ALUE UNIT R th(j-a) thermal resistance from junction to ambient in free air 40 K/W R th(j-c) thermal resistance from junction to case in free air 1.5 K/W
2004 May 05 8 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 12 DC CHARA CTERISTICS V P = ±12.5 V ; T amb =2 5 ° C; measured in test diagram of Fig.4; unless otherwise specified. Note 1. Temperature sensor or maximum current sensor activated. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT Supply V P supply voltage ±7.5 ±12.5 ±30 V I q(tot) total quiescent current no load connected − 25 45 mA outputs floating − 51 0 m A Internal stabilizer logic supply (pin ST AB) V O(ST AB) stabilizer output v oltage ref erenced to V SS 11.7 13 14.3 V Switch inputs (pins SW1 and SW2) V IH HIGH-le vel input v oltage referenced to V SS 10 − 15 V V IL LO W-le vel input v oltage referenced to V SS 0 − 2V Control outputs (pins REL1 and REL2) V OH HIGH-le vel output v oltage ref erenced to V SS 10 − 15 V V OL LO W-le vel output v oltage ref erenced to V SS 0 − 2V Diagnostic output (pin DIA G, open-drain) V OL LO W-le vel output v oltage I DIAG = 1 mA; note 1 0 − 1.0 V I LO output leakage current no error condition −−50 µA Enable inputs (pins EN1 and EN2) V IH HIGH-le vel input v oltage referenced to V SS 9 − 15 V V IL LO W-le vel input v oltage referenced to V SS 05 − V V EN(hys) h ysteresis voltage − 4 − V I I(EN) input current −−300 µA Switching-on input (pin PO WERUP) V POWER UP operating v oltage ref erenced to V SS 5 − 12 V I I(POWER UP) input current V POWER UP =1 2V − 100 170 µ A T emperature protection T diag temperature activ ating diagnostic V DIAG =V DIAG(LO W) 150 −−° C T hys h ysteresis on temperature diagnostic V DIAG =V DIAG(LO W) − 20 −° C Current protection I O(ocpl) ov ercurrent protection lev el − 2.1 − A
2004 May 05 9 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 13 A C CHARA CTERISTICS V P = ±12.5 V ; T amb =2 5 ° C; unless otherwise specified. Notes 1. V P = ±12.5 V; R L =8 Ω ; f i = 1 kHz; f osc = 310 kHz; R s = 0.1 Ω (series resistance of filter coil); T amb =2 5 ° C; measured in reference design (SE application) shown in Fig.5; unless otherwise specified. 2. Indirectly measured; based on R ds(on) measurement. 3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. Measured using the typical application circuit, given in Fig.5. 4. Efficiency for power stage. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT Single-ended application; note 1 P o output power R L =8 Ω THD = 0.5 % 7 (2) 8 − W THD = 10 % 9 (2) 10 − W R L =1 6 Ω THD = 0.5 % − 4 − W THD = 10 % − 5 − W THD total harmonic distor tion P o = 1 W; note 3 f i = 1 kHz − 0.05 0.1 % f i = 10 kHz − 0.2 − % η efficiency endstage P o =2 × 10 W; f i = 1 kHz; note 4 − 90 − %
2004 May 05 10 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 14 SWITCHING CHARA CTERISTICS V P = ±12.5 V ; T amb =2 5 ° C; measured in Fig.4; unless otherwise specified. SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT PWM outputs (pins OUT1 and OUT2) ; see Fig.3 t r rise time − 30 − ns t f f all time − 30 − ns t blank blanking time − 70 − ns t PD propagation dela y from pin SW1 (SW2) to pin OUT1 (OUT2) − 200 − ns t W(min) minimum pulse width − 220 270 ns R ds(on) on-resistance of the output transistors − 0.2 0.4 Ω handbook, full pagewidth MGW145 PWM output (V) V DD V SS 0 V t blank t f t r 1/ f osc 100 ns V STAB V SS V SW (V) t PD V STAB V SS V REL (V) Fig.3 Timing diagram PWM output, switch and release signals.
2004 May 05 11 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 15 TEST AND APPLICA TION INFORMA TION d book, full pagewidth 12 k Ω 15 nF MGX379 15 nF 100 nF CONTROL AND HANDSHAKE DRIVER HIGH TDA8928J TEMPERATURE SENSOR AND CURRENT PROTECTION DRIVER LOW temp current 4 7 V SS1 V SS1 V REL2 V SS2 V DD2 6 1 2 9 81 0 V DD2 V DD1 13 5 CONTROL AND HANDSHAKE DRIVER HIGH DRIVER LOW 14 11 12 17 16 3 15 EN1 DIAG REL1 SW1 SW2 REL2 POWERUP EN2 BOOT1 2V P OUT1 STAB OUT2 V OUT2 V OUT1 BOOT2 12 V V V V V SW2 V REL1 V V SW1 V EN V DIAG V V STAB V 12 V 0 12 V 0 Fig.4 Test diagram.
2004 May 05 12 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 15.1 SE application For a SE application the application diagram as shown in Fig.5 can be used. 15.2 P ackage ground connection The heatsink of the TDA8928J is connected internally to V SS . 15.3 Output power The output power in SE self oscillating class-D applications can be estimated using the formula The maximum current should not exceed 2 A. Where: R L = load impedance R s = series resistance of filter coil P o(1%) = output power just at clipping. The output power at THD = 10 %: P o(10%) = 1.25 × P o(1%) . 15.4 Reference design The reference design for a self oscillating class-D system for the TDA8928J is shown in Fig.5. The Printed-Circuit Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.4.2. P o(1%) R L R L R ds(on) R s () ------------------------------------------------ V P × 2 2R L × --------------------------------------------------------------------- - = I O(max) V P [] R L R ds(on) R s ------------------------------------------- =
2004 May 05 13 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _ white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... mgx380 C24 1 µF C25 1 µF C10 220 nF C8 C9 220 nF 22 µF (100 V) R26 0 Ω 220 nF C34 220 nF C32 470 nF C12 15 nF LS1 8 Ω LS2 8 Ω R22 22 Ω C28 100 nF C27 22 µF (100 V) R19 5.6 Ω C28 560 pF C29 560 pF C30 560 pF C31 560 pF V SSP R30 39 k Ω L3 33 µH L4 33 µH U1 TDA8928J R31 39 k Ω 1 7 6 9 12 11 51 3 81 0 2 15 3 4 14 16 17 V SSP V DDP V DDP V DDP V DDP C35 220 nF C33 470 nF C13 15 nF R23 22 Ω R21 5.6 Ω C11 220 nF C38 100 nF S1 power-ON C37 220 pF STAB (U1,9) STAB (U1,9) DZ2 3.3 V DZ1 36 V R24 R16 1 k Ω R10 0 Ω C17 C15 100 nF 22 µF (100 V) C14 22 µF (100 V) C16 100 nF R28 0 Ω R29 0 Ω R4 1 k Ω R35 R34 3.9 k Ω R2 10 k Ω 150 Ω R8 3.9 k Ω R6 220 k Ω C22 2.2 nF C42 2.2 nF R32 100 Ω C39 2.2 nF C41 47 nF R7 3.9 k Ω C40 47 nF In1 In2 C21 2.2 nF R13 15 k Ω R9 1 k Ω R33 3.9 k Ω R1 10 k Ω R14 15 k Ω R25 2 k Ω R15 10 k Ω R17 5.6 k Ω R12 2 k Ω R11 2 k Ω Q2 BC856 Q1 BC848 0 Ω C6 470 µF (35 V) V SSP V SSP C7 470 µF (35 V) C5 V DD1 V DD2 V SS1 V SS2 V SSP V SSP V DDP V DDP V DDP U2A LM393 1 2 8 4 3 U2B LM393 7 5 6 V SSP V SSP V SSP J1 21 J3 2 1 J2 21 SW1 OUT1 BOOT1 STAB BOOT2 OUT2 REL1 POWERUP DIAG EN1 EN2 REL2 SW2 R5 220 k Ω R3 1 k Ω C20 2.2 nF C19 2.2 nF C1 100 nF 14.5 V − 14.5 V CON1 supply 1 2 3 C2 100 nF C3 470 µF (35 V) L1 bead bead L2 V DDP V SSP C4 470 µF (35 V) Fig.5 Single-ended self oscillating class-D system application diagram for TDA8928J.
2004 May 05 14 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 15.4.1 P RINTED- CIRCUIT BOARD The printed-circuit board dimensions are 8.636 × 5.842 cm; single-sided copper of 35 µm; silk screen on both sides; 79 holes; 94 components (32 resistors and 41 capacitors). handbook, full pagewidth MDB615 Bottom silk C37 R15 C45 C36 R33 R34 R3 C19 C50 C17 C40 C41 R8 R16 IN2 IN1 Q1 C38 R25 Q2 C2 C12 C13 V DD R28 R14 R13 R29 C11 C10 R26 R24 pin 1 R30 C28 R11 R12 R2 R31 C25 C24 C8 C9 C26 C31 C26 C31 C26 C30 R9 R35 R32 R1 GND 22 V OUT1 R23 C35 R22 C34 OUT2 C1 C16 R4 C22 C21 R6 R10 R17 R7 R5 U2 − − C37 R15 R19 R21 R19 R21 Fig.6 Printed-circuit board (bottom silk) layout for TDA8928J. handbook, full pagewidth MDB617 Bottom copper Fig.7 Printed-circuit board (bottom copper) layout for TDA8928J.
2004 May 05 15 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J mgx381 Top silk TDA8928ST In1 In2 Con3 C32 C33 L2 L1 L4 L3 C4 C3 DZ1 C14 C15 J3 C6 C7 C27 C5 U1 J2 J1 Con2 Con1 CO2 CO1 S1 DZ2 power_on GND Out1 Out2 V DD V SS state of D art V P typ /- 12.5 V 2 x 10 W in 8 Ω single layer demo PCB v2r4 RL 1 2003 Fig.8 Printed-circuit board (top silk) layout for TDA8928ST. 15.4.2 B ILL OF MA TERIALS COMPONENT DESCRIPTION TYPE COMMENTS U1 TD A8928ST Philips Semiconductors, SO T577-2 U2 LM393AD National, SO8 alternatives: TI semiconductors and On semiconductors DZ1 36 V Zener diode BZX-79C36V , DO-35 used as jumper DZ2 3.3 V Zener diode BZX-79C3V3, DO-35 used as jumper , optional Q1 BC848 transistor NPN, SO T23 Q2 BC856 transistor PNP , SO T23 L1, L2 bead Murata BL01RN1-A62 used as jumper L3, L4 33 µH coil T oko 11RHBP-330M ws totally shielded S1 power-on s witch PCB s witch, SACME 09-03290-01 optional Con1 V SS , GND , V DD connector A ugat 5KEV -03 optional Con2, Con3 Out2, Out1 connector A ugat 5KEV -02 optional CO1, CO2 In1, In2 connector Cinch F ar nell 152-396 optional J1, J2, J3 wire Jumpers , D = 0.5 mm Capacitors C37 220 pF , 50 V SMD0805 C28, C29, C30, C31 560 pF , 100 V SMD0805 50 V is OK
2004 May 05 16 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J C19, C20, C21, C22, C39, C42 2.2 nF , 50 V SMD0805 C12, C13 15 nF , 50 V SMD0805 C40, C41 47 nF , 50 V SMD1206 C1, C2, C16, C17, C26, C38 100 nF , 50 V SMD0805 C8, C9, C10, C11, C34, C35 220 nF , 50 V SMD1206 C8 to C11 used as jumper C32, C33 470 nF , 63 V MKT C24, C25 1 µF , 16 V SMD1206 1206 due to supply range C7, C14, C15, C27 22 µF , 100 V P anasonic NHG Ser ies ECA1JHG220 63 V is OK C3, C4, C5, C6 470 µF , 35 V P anasonic M Series ECA1VM471 C18, C23, C36 these capacitors have been remov ed Resistors R10, R26, R28, R29 0 Ω SMD1206 used as jumpers R24 0 Ω SMD0805 shor t-circuited in a new printed-circuit board lay out R19, R21 5.6 Ω, 0.25 W SMD1206 1 206 due to dissipation R22, R23 22 Ω, 1 W SMD2512 2 512 due to dissipation R35 150 Ω SMD1206 used as jumper R32 100 Ω SMD1206 used as jumper R9 1 k Ω SMD1206 used as jumper R3, R4, R16 1 k Ω SMD0805 R11, R12 2 k Ω SMD1206 used as jumpers R25 2 k Ω SMD0805 R7, R8, R33, R34 3.9 k Ω SMD0805 R17 5.6 k Ω SMD0805 R1, R2, R15 10 k Ω SMD0805 R13, R14 15 k Ω SMD0805 R30, R31 39 k Ω SMD0805 R5, R6 220 k Ω SMD0805 R18, R20, R27 these resistors have been remov ed COMPONENT DESCRIPTION TYPE COMMENTS
2004 May 05 17 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 15.5 Curves measured in reference design handbook, halfpage MGX383 10 − 2 10 − 1 11 0 1 0 2 THD N (%) 10 2 10 1 10 − 1 10 − 2 10 − 3 P o (W) (2) (1) (3) Fig.9 THD N as function of output power. 2 × 8 Ω SE; V P = ±12.5 V. (1) 6 kHz. (2) 1 kHz. (3) 100 Hz. handbook, halfpage MGX384 10 10 2 10 3 10 4 10 5 10 2 10 1 10 − 1 10 − 3 10 − 2 f i (Hz) THD N (%) (1) (2) Fig.10 THD N as function of frequency. 2 × 8 Ω SE; V P = ±12.5 V. (1) P o =1 0W . (2) P o =1W . handbook, halfpage 01 0 100 0 20 40 60 80 2468 η (%) P o (W) MGX385 Fig.11 Efficiency as function of output power. 2 × 8 Ω SE; V P = ±12.5 V; f i = 1 kHz. handbook, halfpage (4) MGX386 SVRR (dB) − 60 − 50 − 30 − 40 − 20 − 10 0 f i (Hz) 10 10 2 10 3 10 4 10 5 (2) (1) (3) Fig.12 SVRR as function of frequency. V P = ±12.5 V; V ripple(p-p) =2V . (1) Both supply lines in phase. (2) One supply line (V SS ) rippled. (3) One supply line (V DD ) rippled. (4) Both supply lines in antiphase.
2004 May 05 18 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J handbook, halfpage 0 100 20 40 60 80 MGX387 10 − 1 10 − 2 P o (W) S/N (dB) 11 0 1 0 2 Fig.13 S/N as function of output power. 2 × 8 Ω SE; V P = ±12.5 V. handbook, halfpage − 100 0 − 80 − 60 − 40 − 20 MGX388 10 2 10 f i (Hz) α cs (dB) 10 3 10 4 10 5 (1) (2) Fig.14 Channel separation as function of frequency. 2 × 8 Ω SE; V P = ±12.5 V. (1) P o =1W . (2) P o =1 0W . handbook, halfpage 10 35 15 20 25 30 MDB624 10 2 10 f i (Hz) G (dB) 10 3 10 4 10 5 Fig.15 Gain as function of frequency. 2 × 8 Ω SE; V P = ±12.5 V; V i = 100 mV. handbook, halfpage 10 (1) 20 24 4 8 12 16 20 12 P o (W) V P (V) 14 16 18 MGX389 (2) Fig.16 Output power as function of supply voltage. THD N = 10 %; f i = 1 kHz. (1) 2 × 8 Ω SE. (2) 2 × 16 Ω SE.
2004 May 05 19 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 16 P A CKA GE OUTLINE REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT243-3 0 5 10 mm scale D L E A c A 2 L 3 Q w M b p 1 d D Z e e x h 11 7 j E h non-concave 99-12-17 03-03-12 DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3 view B: mounting base side m 2 e v M B UNIT A e 1 A 2 b p cD (1) E (1) Z (1) de D h LL 3 m mm 17.0 15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 v 0.6 12.2 11.8 1.27 e 2 5.08 2.4 1.6 E h 6 2.00 1.45 2.1 1.8 3.4 3.1 4.3 8.4 7.0 Q j 0.25 w 0.03 x
2004 May 05 20 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J UNIT A e 1 e 2 A 2 b p cE (1) D (1) Z (1) de L L 1 REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 13.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 1.27 2.54 3.75 3.15 E h D h 6 2.00 1.45 2.1 1.8 3.4 3.1 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 3.75 3.15 SOT577-2 0 5 10 mm scale Q j 0.4 w 0.6 v 0.03 x D E A L 1 Q L c A 2 w M b p 1 d Z e 2 e e 11 7 j 01-01-05 03-03-12 RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) SOT577-2 v M D x h E h non-concave view B: mounting base side B
2004 May 05 21 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 17 SOLDERING 17.1 Introduction to soldering thr ough-hole mount packa ges This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 17.2 Soldering by dipping or b y solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg(max) ). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 17.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 17.4 Suitability of through-hole mount IC pac kages for dipping and wa ve soldering methods Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. P A CKA GE SOLDERING METHOD DIPPING W A VE CPGA, HCPGA − suitable DBS, DIP , HDIP , RDBS, SDIP , SIL suitable suitable (1) PMFP (2) − not suitable
2004 May 05 22 Philips Semiconductors Preliminar y specification P ow er stage 2 x 10 or 1 x 20 W class-D audio amplifier TD A8928J 18 D A T A SHEET ST A TUS Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. LEVEL D A T A SHEET ST A TUS (1) PRODUCT ST A TUS (2)(3) DEFINITION I Objective data De velopment This data sheet contains data from the objective specification f or product de velopment. Philips Semiconductors reserves the right to change the specification in any manner without notice . II Preliminar y data Qualification This data sheet contains data from the preliminary specification. Supplementar y data will be pub lished at a later date. Philips Semiconductors reser v es the right to change the specification without notice, in order to impro ve the design and supply the best possib le product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reser v es the right to make changes at any time in order to improv e the design, manuf actur ing and supply . Relev ant changes will be communicated via a Customer Product/Process Change Notification (CPCN). 19 DEFINITIONS Short-form specification  The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 20 DISCLAIMERS Life support applications  These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes  Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
© Koninklijke Philips Electronics N.V. 2004 SCA76 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductor s – a w orldwide compan y Contact information F or additional information please visit http://www .semiconductors.philips.com . F ax: 31 40 27 24825 F or sales offices addresses send e-mail to: sales.addresses@www .semiconductors.philips.com . Printed in The Netherlands R30/02/pp 23 Date of release: 2004 May 05 Document order number: 9397 750 13041